JP2006339950A - Solid imaging apparatus and manufacturing method thereof, and camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid imaging camera using a CCD solid imaging device capable of reducing consumption of seal glass. <P>SOLUTION: The camera module 1 comprises a hollow package 4 in which a CCD solid imaging element 6 is installed, a flexible substrate 17 which closes an opening part 16 of the hollow package and connects the solid imaging element to other circuits, a lens 14 arranged above the hollow package, and a lens barrel part 3 supporting the lens. This flexible substrate has an opening part 10 formed in an area corresponding to an imaging portion X of the CCD solid imaging element, and the seal glass 11 made of a light-transmissive material is mounted so as to cover the opening part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device, a manufacturing method thereof, and a camera module. More specifically, the present invention relates to a solid-state imaging device using a semiconductor package base in which a solid-state imaging device is embedded, a manufacturing method thereof, and a camera module using such a solid-state imaging device.

  In recent years, a solid-state imaging camera module using a CCD imager or a CMOS imager is required to be mounted on a mobile terminal such as a mobile phone or a PDA (personal digital assistance) as a camera system including a signal processing system (for example, , See Patent Document 1).

Hereinafter, a conventional solid-state imaging camera module will be described with reference to the drawings.
FIG. 4 is a schematic cross-sectional view for explaining a conventional solid-state imaging camera module. The solid-state imaging camera module 101 shown here includes a CCD solid-state imaging device 102 and a lens barrel 103.

  In the CCD solid-state imaging device described above, a CCD solid-state imaging device 106 is mounted on a hollow package (semiconductor package base) 104 by a die paste 105, and an electrode (not shown) formed on the CCD solid-state imaging device and a hollow package are mounted. A wiring pattern (not shown) formed on the substrate is electrically connected by a bonding wire 107. Further, a sealing glass 110 is bonded by a sealing resin 109 so as to close the opening 108 of the hollow package.

  The lens barrel includes a lens 111 that forms an image on a CCD solid-state imaging device and an optical filter (not shown) that blocks infrared light, and is fixed to the CCD solid-state imaging device by a lens fixing resin 112. Yes.

  Furthermore, the CCD solid-state imaging device is connected to a flexible circuit board 114 that electrically connects the CCD solid-state imaging element and other circuits by solder bumps 113 formed on the bottom surface of the hollow package. Are mounted with electronic components 115 for circuit formation.

  FIG. 5 is a flowchart for explaining the manufacturing process of the above-described conventional solid-state imaging camera module. In the manufacturing process of the conventional solid-state imaging camera module, first, dicing is performed on the CCD solid-state imaging device formed on the wafer. After processing (wafer dicing) to obtain a single 403 state CCD solid state imaging device (see symbol A in FIG. 5), the single state CCD solid state imaging device is die-bonded to a predetermined region of the hollow package ( (See symbol B in FIG. 5).

  Next, after performing the wire bond process which electrically connects the electrode formed in the CCD solid-state image pickup device and the wiring pattern formed in the hollow package with a bonding wire (see reference C in FIG. 5), it is hollow. The package of the CCD solid-state imaging device can be obtained by sealing (closing) the opening of the package with a seal glass (see symbol D in FIG. 5). Note that the package inspection is performed when the package is obtained (see symbol E in FIG. 5).

  Further, a passive component is mounted on the flexible board in a separate process (see symbol F in FIG. 5), and a package that has passed the package inspection is solder-mounted on the flexible substrate on which the passive component is mounted (reference symbol G in FIG. 5). reference.).

  Thereafter, the lens barrel is mounted to form a camera module (see symbol H in FIG. 5), and the image quality inspection is performed before shipment.

JP 2004-335794 A

  However, since the conventional solid-state imaging camera module described above has a configuration in which the opening of the hollow package is closed with a sealing body (seal glass), a sealing body having the same size as the opening of the hollow package is provided. It is necessary and there is room for improvement in that the area of the sealing body, which is a relatively expensive material, is increased and the cost of the solid-state imaging device increases.

  The present invention was devised in view of the above points, and provides a solid-state imaging device capable of reducing the amount of use of a sealing body, a manufacturing method thereof, and a camera module using such a solid-state imaging device. It is intended to do.

  In order to achieve the above object, a solid-state imaging device according to the present invention is a light-transmitting material comprising a semiconductor package base in which a solid-state imaging element is housed and a light-transmitting material disposed above the solid-state imaging element. In the solid-state imaging device including a member and a flexible substrate that connects the solid-state imaging device and another circuit, the opening of the semiconductor package base has a hole in at least a region corresponding to the imaging unit of the solid-state imaging device And the hole is closed by the flexible substrate covered with the light transmissive member.

Here, the opening of the semiconductor package base is formed with a hole at least in a region corresponding to the imaging unit of the solid-state imaging device, and the hole is closed by a flexible substrate covered with a light transmissive member. Therefore, in other words, a hole is formed in a flexible substrate that closes the opening of the semiconductor package base at least in a region corresponding to the imaging unit of the solid-state imaging device, and the light transmitting member is formed so as to cover the hole. Since it is provided, the light-transmitting member only needs to have a size sufficient to cover the opening of the flexible substrate. Then, the size of the structure other than the light transmitting portion necessary for the solid-state imaging device is small compared to the case where the opening of the semiconductor package base is closed with a light transmissive member by using a flexible substrate. The member area of the light transmissive member can be reduced.
In addition, since the light transmissive member is made of a light transmissive material, even if the light transmissive member is disposed above the imaging unit, there is no influence on the imaging of the solid-state imaging device.

  In order to achieve the above object, a method for manufacturing a solid-state imaging device according to the present invention includes a semiconductor package base in which a solid-state imaging element is housed, and a light transmissive material disposed above the solid-state imaging element. And a flexible substrate for connecting the solid-state imaging device and another circuit, wherein the solid-state imaging device is mounted on the semiconductor package base, A step of electrically connecting a solid-state imaging device and a wiring layer connected to the flexible substrate provided on the semiconductor package base with a bonding wire; a step of covering the bonding wire with an insulating material; and the insulating material Injecting a resin material into a gap between the bonding wire coated with the semiconductor package base and the semiconductor A step of forming an opening in the package base at least in a region corresponding to the imaging unit of the solid-state imaging device, and closing the hole with the flexible substrate covered with the light-transmitting material; Is provided.

Here, by covering the bonding wire with an insulating material, the bonding wire can be protected by the insulating material, and the stopper can be used to determine the lower limit of the vertical drop of the flexible substrate. Further, it can also serve as a dam during the injection of the resin material in the subsequent steps.
Furthermore, by injecting a resin material into the gap between the bonding wire covered with the insulating material and the hollow package, the adhesion area with the flexible substrate is increased, thereby increasing the adhesion strength in the normal state and the above adhesion. The length of the flexible substrate that may be bent is shortened by increasing the distance from the adhesive end fixed to the rigid body to the sealing body, thereby shortening the length of the flexible substrate. The amount of depression can be suppressed.

  In order to achieve the above object, a camera module according to the present invention includes a semiconductor package base in which a solid-state image sensor is incorporated, and a light transmissive material including a light-transmitting material disposed above the solid-state image sensor. A solid-state imaging device having a conductive member, a flexible substrate for connecting the solid-state imaging device and another circuit, a lens disposed above the solid-state imaging device, and a lens barrel portion that supports the lens In the camera module, the opening portion of the semiconductor package base is formed with a hole portion at least in a region corresponding to the image pickup portion of the solid-state image pickup device, and the hole portion is covered with the light transmissive member. It is blocked by the substrate.

  Here, the opening of the semiconductor package base is formed with a hole at least in a region corresponding to the imaging unit of the solid-state imaging device, and the hole is blocked by a flexible substrate covered with a light transmissive member. Thus, the member area of the light transmissive member can be reduced.

  In the solid-state imaging device, the manufacturing method thereof, and the camera module of the present invention described above, the size of the light transmissive member (sealing body) can be reduced, so that the component cost can be suppressed and the manufacturing cost can be reduced. .

Hereinafter, embodiments of the present invention will be described with reference to the drawings to facilitate understanding of the present invention.
FIG. 1 is a schematic cross-sectional view for explaining an example of a solid-state imaging camera module which is an example of a camera module to which the present invention is applied. The solid-state imaging camera module 1 shown here includes a CCD solid-state imaging device 2 and a lens. A lens barrel 3 is provided.

  In the CCD solid-state imaging device described above, the CCD solid-state imaging device 6 is mounted on the hollow package 4 by the die paste 5, and the electrodes (not shown) formed on the CCD solid-state imaging device and the wiring formed on the hollow package. A pattern (not shown) is electrically connected by a bonding wire 7. The bonding wire is covered with a first resin material 8 having an insulating property, and is formed of a second resin material having an insulating property between the bonding wire covered with the first resin material and the hollow package. A support member 9 for supporting a flexible substrate described later is formed.

  In addition, a flexible substrate 17 is disposed so as to close the opening 16 of the hollow package, and the opening 10 is provided on the flexible substrate in a region corresponding to the imaging unit of the solid-state imaging device (a region indicated by a symbol X in FIG. 1). A sealing glass 11 made of quartz glass is mounted so as to close the opening. A passive component 12 such as LRC necessary for circuit formation is mounted around the seal glass.

  The wiring pattern formed in the hollow package and the flexible substrate are electrically connected via an ACF (anisotropic conductive film) or ACP (anisotropic conductive paste) 13, resulting in a CCD solid-state imaging device. Can exchange electric signals with an external circuit via a bonding wire, a wiring pattern formed in a hollow package, and a flexible substrate.

  The lens barrel includes a lens 14 that forms an image on a CCD solid-state imaging device and an optical filter (not shown) that blocks infrared rays, and a flexible substrate in which a hollow portion of the hollow package is closed by a lens fixing resin 15. It is fixed on the top.

Here, by adopting a configuration in which the opening formed in the flexible substrate is closed with the seal glass, the area of the required seal glass can be reduced, and the suppression of component costs can be realized. There is no need to cover the bonding wire with the first resin material or to form a support member between the bonding wire covered with the first resin material and the hollow package.
However, in the present invention, it is not a substrate made of a strong material as a base of the sealing glass (for example, a substrate formed of ceramic, plastic, metal, etc., which does not have material characteristics such as bending and deformation) and is flexible. Because of the flexible substrate that has a flexible substrate, the position of the sealing glass due to the flexibility of the flexible substrate (specifically, vertical drop or deflection) and the thermal expansion of the flexible substrate due to ambient temperature changes In addition, there is a risk of causing practical problems such as positional displacement due to thermal contraction and peeling of the sealing glass.

On the other hand, by covering the bonding wire with the first resin material, the first resin portion coated with the bonding wire can support the drop of the flexible substrate at a predetermined position and can suppress the drop amount. The above practical problems can be overcome.
In addition, the formation of the support member increases the adhesion area with the flexible substrate, that is, the area for supporting the flexible substrate increases, and as a result, the material strength of the flexible substrate can be complemented and the amount of sagging Can be suppressed, and the above practical problems can be overcome.
Therefore, in consideration of suppressing the drop of the flexible substrate, the bonding wire is covered with an insulating material, or a support member is formed between the bonding wire covered with the first resin material and the hollow package. Is preferred. In this embodiment, the sealing glass made of quartz glass has been described as an example of the sealing body. However, the sealing body is not made of a glass sealing body but is made of a lightweight material such as a plastic material. It is considered that the amount of sagging of the flexible substrate can be further suppressed by configuring the above.

Hereinafter, a manufacturing method of the solid-state imaging camera module configured as described above will be described. That is, a method for manufacturing a solid-state imaging camera module to which the present invention is applied will be described.
In the method of manufacturing a solid-state imaging camera module to which the present invention is applied, first, a CCD solid-state imaging device formed on a wafer is diced (wafer dicing) to obtain a single CCD solid-state imaging device (FIG. 2). The single solid state CCD solid-state imaging device is die-bonded to a predetermined region of the hollow package (see the reference symbol b in FIG. 2).

  Next, after performing the wire bonding process which electrically connects the electrode formed in the CCD solid-state image pickup device and the wiring pattern formed in the hollow package with a bonding wire (reference numeral c in FIG. 2 and FIG. ), And the bonding wire is covered with the first resin material (see reference numeral d in FIG. 2 and FIG. 3B).

  In addition, the passive component is mounted on the flexible substrate in a process different from the die bonding and wire bonding of the CCD solid-state imaging device (see symbol e in FIG. 2 and FIG. 3C) and closes the opening of the flexible substrate. A seal glass is mounted in the same manner (see reference numeral f in FIG. 2 and FIG. 3D).

  Subsequently, after injecting the second resin material into the gap between the bonding wire covered with the first resin material and the hollow package (see symbol g in FIG. 2 and FIG. 3E), the passive component is mounted. In addition, the CCD solid-state imaging device (package) can be obtained by closing the opening of the hollow package with the flexible substrate on which the sealing glass is mounted so as to close the opening (see h in FIG. 2 and FIG. 3). (See (f).) After the package is obtained, the package is inspected (see symbol i in FIG. 2).

  Here, since the bonding wire is covered with the first resin before injecting the second resin, the bonding wire covered with the first resin serves as a dam at the time of injecting the second resin. The second resin can be prevented from flowing into the imaging surface of the CCD solid-state imaging device during the injection of the second resin.

  Thereafter, the lens barrel is mounted to form a camera module (see symbol j in FIG. 2), and the image quality inspection is performed before shipment.

In the solid-state imaging camera module to which the present invention is applied, the sealing glass is mounted so as to close the opening of the flexible substrate provided in the region corresponding to the imaging unit of the solid-state imaging device, and the sealing glass size can be reduced. Can be achieved, and the manufacturing cost can be reduced.
That is, an opening is formed in an area corresponding to the imaging area of the solid-state imaging device of the flexible substrate, and the sealing glass is mounted so as to close the opening, and the opening of the hollow package is formed by the flexible substrate on which the sealing glass is mounted. The size of the seal glass required for the camera module configured to close the package (the size indicated by reference numeral L1 in FIG. 1) is the same as that of the camera module configured to close the entire opening of the hollow package with the seal glass. The manufacturing cost can be reduced because it is smaller than the required seal glass size (the size indicated by reference numeral L2 in FIG. 4).

  In addition, by arranging the elements necessary for circuit formation around the seal glass, it is possible to effectively utilize the area that has not been used as a dead space in the past, and the degree of freedom of the layout of passive elements is improved. At the same time, the camera module can be downsized.

  Furthermore, in the conventional method for manufacturing a solid-state imaging camera module, since package mounting processing (solder mounting) is performed after the package is inspected, there is a concern about a decrease in yield, but solid-state imaging to which the present invention is applied. In the manufacturing method of the camera module, a high yield can be expected because the package is inspected after performing the mounting process (ACF mounting or ACP mounting).

  In addition, the conventional manufacturing method of the solid-state imaging camera module has (1) closed the opening of the hollow package with the seal glass and (2) mounted the package on the flexible substrate in the same line. In the manufacturing method of the solid-state imaging camera module to which the invention is applied, the sealing glass is mounted on the flexible substrate in a separate line, and the opening of the hollow package is closed with the flexible substrate on which the sealing glass is mounted. Therefore, it is possible to shorten the time until shipment.

It is typical sectional drawing for demonstrating an example of the camera module to which this invention is applied. It is a process flow for demonstrating the manufacturing method of the camera module to which this invention is applied. It is typical sectional drawing for demonstrating the manufacturing method of the camera module to which this invention is applied. It is typical sectional drawing for demonstrating the conventional camera module. It is a process flow for demonstrating the manufacturing method of the conventional camera module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solid-state imaging camera module 2 CCD solid-state imaging device 3 Lens barrel 4 Hollow package 5 Die paste 6 CCD solid-state imaging device 7 Bonding wire 8 1st resin material 9 Support member 10 Opening part of flexible substrate 11 Seal glass 12 Passive component 13 ACF resin or ACP resin 14 Lens 15 Lens fixing resin 16 Hollow package opening 17 Flexible substrate

Claims (5)

A semiconductor package base in which a solid-state image sensor is incorporated;
A light transmissive member made of a light transmissive material disposed above the solid-state imaging device;
In a solid-state imaging device comprising a flexible substrate for connecting the solid-state imaging element and other circuits,
The opening of the semiconductor package base has a hole formed at least in a region corresponding to the imaging unit of the solid-state imaging device, and the hole is blocked by the flexible substrate covered with the light transmissive member. A solid-state imaging device characterized by that. The solid-state imaging device is electrically connected by a bonding layer and a wiring layer connected to the flexible substrate provided on the semiconductor package base,
The solid-state imaging device according to claim 1, wherein the bonding wire is covered with an insulating material. The solid-state imaging device according to claim 2, wherein a support member that supports the flexible substrate is injected and formed in a gap between the bonding wire and the semiconductor package base. A semiconductor package base in which a solid-state image sensor is housed; a light-transmitting member made of a light-transmitting material disposed above the solid-state image sensor; and a flexible substrate for connecting the solid-state image sensor and another circuit; A method of manufacturing a solid-state imaging device comprising:
The solid-state image sensor is mounted on the semiconductor package base, and the solid-state image sensor and a wiring layer connected to the flexible substrate provided on the semiconductor package base are electrically connected by a bonding wire;
Coating the bonding wire with an insulating material;
Injecting a resin material into a gap between the bonding wire covered with the insulating material and the semiconductor package base;
A hole is formed in the opening of the semiconductor package base at least in a region corresponding to the imaging unit of the solid-state imaging device, and the hole is blocked by the flexible substrate covered with the light transmissive material. A method for manufacturing a solid-state imaging device. A semiconductor package base in which a solid-state image sensor is housed; a light-transmitting member made of a light-transmitting material disposed above the solid-state image sensor; and a flexible substrate for connecting the solid-state image sensor and another circuit; A solid-state imaging device having
A lens disposed above the solid-state imaging device;
In a camera module including a lens barrel portion that supports the lens,
The opening of the semiconductor package base has a hole formed at least in a region corresponding to the imaging unit of the solid-state imaging device, and the hole is blocked by the flexible substrate covered with the light transmissive member. A camera module characterized by that.

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