KR101099736B1 - Photo senser package - Google Patents

Abstract

The present invention relates to a photo sensor package, comprising: a substrate assembly including a transparent substrate, a photo sensor chip mounted on the substrate assembly, solder balls for electrically connecting the photo sensor chip, the substrate assembly, and the printed circuit board; It includes a passive element mounted in a transparent substrate of the substrate assembly.

Description

Photo sensor package {Photo senser package}

The present invention relates to a photo sensor package, and more particularly to a photo sensor package in which passive elements are mounted on a substrate assembly.

The photo sensor is a semiconductor device having a function of capturing an image of a person or an object. Recently, the photo sensor has been expanded in a mobile phone as well as a digital camera or a camcorder.

The photo sensor is configured in the form of a camera module and mounted on the devices. The camera module is composed of a lens, a holder, an infrared filter, a photo sensor and a printed circuit board (PCB). The lens forms an image, and the image formed by the lens is collected by an IR filter to a photo sensor, and the photo sensor converts an optical signal of the image into an electrical signal to take an image.

The photo sensor generally has a pixel area for sensing an image at the center, and bonding pads for transmitting or receiving an electric signal or other signal of an image captured by the pixel at the periphery are arranged. It is. The photo sensor is a chip on board (COB) method that is directly mounted on a camera module in a bare chip state, or a chip scale package that is mounted on a camera module after packaging a photo sensor chip. ; CSP) mounted on the camera module. In this case, when the chip scale package method is used, it is possible to prevent dust or moisture from penetrating into the image sensing area generated in the chip on board method.

On the other hand, the photo sensor package is sold as one part for manufacturing the camera module or assembled at least in another line into the camera module. That is, the photo sensor package is manufactured as a separate component and transferred to another line or factory, and then mounted on a printed circuit board (PCB), and then attaching a flexible printed circuit (FPC). The holder and lens housing are installed on the printed circuit board to complete the camera module.

However, in the process in which the photo sensor package is mounted on the printed circuit board, passive elements such as resistors, inductors, and capacitors may be mounted in other areas of the printed circuit board to be electrically connected to the photo sensor package. When the passive element is mounted on the printed circuit board separately from the photo sensor package in this way, the size of the printed circuit board is increased. In addition, when the passive element is mounted on the printed circuit board, the distance between the passive element and the photo sensor package is increased, so that the path of the electric signal becomes long, thereby causing a problem of deteriorating electrical characteristics. In addition, since the photo sensor package and the passive element mounting process are separately performed, the process becomes complicated.

The present invention provides a photo sensor package including a passive element.

The present invention provides a photo sensor package that can solve the above problems by mounting a passive element on a transparent substrate on which the photo sensor chip is mounted.

The present invention provides a photo sensor package in which a groove is formed by etching a predetermined region of a transparent substrate on which a photo sensor chip is mounted, and a passive element is mounted in the groove.

A photo sensor package according to an aspect of the present invention includes a substrate assembly including a transparent substrate; A photo sensor chip mounted on the substrate assembly; Solder balls for electrically connecting the photo sensor chip, the substrate assembly, and the printed circuit board; And a passive element mounted in the transparent substrate of the substrate assembly.

The photo sensor chip is mounted in a region where the thickness of one region of the substrate assembly is thinner than another region and the thickness of the substrate assembly is thin.

The passive element is mounted outside the pixel area of the photo sensor chip.

The passive element is mounted in a groove formed by etching the region corresponding to at least one of the solder balls, the region between the solder ball and the photo sensor chip, or the transparent substrate in the solder ball outer region.

The passive element is electrically connected through a metal wire formed on one surface of the transparent substrate.

The passive element penetrates up and down one region of the transparent substrate and is electrically connected to one surface of the transparent substrate through a through hole in which a conductive material is embedded.

The photo sensor package according to the present invention forms a groove by etching a predetermined region of the transparent substrate of the substrate assembly on which the photo sensor chip is mounted, and mounts a passive element in the groove. The passive element may form a groove in the transparent substrate in the region where the solder ball is formed and may be mounted in the groove, or may be formed by embedding in the region between the solder ball and the photo sensor chip. That is, the passive element can be formed near the region where the solder ball is formed.

According to the present invention, the passive element is mounted in the groove formed in the transparent substrate of the substrate assembly, so that the size of the printed circuit board, such as the area and thickness of the printed circuit board can be reduced compared to the conventional passive element is mounted on the printed circuit board. That is, the area of the passive element mounted and the width of the wiring connected to the passive element can be reduced. In addition, it is possible to reduce the distance between the photo sensor chip and the passive element can improve the electrical characteristics than the conventional. In addition, since the mounting process of the customer can be simplified, the number of processes can be reduced as compared with the related art. As a result, the camera module can be reduced in weight.

1 is a plan view of a photosensor package according to an embodiment of the present invention.
2 and 3 are cross-sectional views taken along the line AA ′ and BB ′ of FIG. 1.
4 to 6 are top plan views of photosensor packages according to other embodiments of the present invention.
7 is a cross-sectional view of a photosensor package according to another embodiment of the present invention.
8 to 10 are cross-sectional views illustrating a method of mounting a passive element in a transparent substrate according to an embodiment of the present invention.
11 is a cross-sectional view of a substrate assembly mounted with a passive device according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information. In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity, and like reference numerals designate like elements. In addition, if a part such as a layer, film, area, etc. is expressed as “upper” or “on” another part, each part is different from each part as well as being “right up” or “directly above” another part. This includes the case where there is another part between parts.

1 is a plan view schematically illustrating a photo sensor package according to a first exemplary embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views taken along the lines A-A 'and B-B' of FIG. 1, respectively.

1, 2, and 3, the photo sensor package according to the first embodiment of the present invention is disposed to face the photo sensor chip 10 and the photo sensor chip 10 for sensing an image, and the photo sensor chip. A substrate assembly 20 electrically connected to the 10, a solder portion 30 for electrically connecting the photo sensor chip 10, the substrate assembly 20, and the printed circuit board 50, and the substrate assembly 20. And a passive element 40 embedded in the transparent substrate 21.

The photo sensor chip 10 is disposed at the center to sense an image, and is provided at the periphery of the photo sensor chip 10 to transmit an electrical signal of an image captured by the pixel area 11, to transmit or receive other signals, or to supply power. It includes a terminal portion (not shown) for. The pixel region 11 includes, for example, a plurality of photodiodes for converting light into an electrical signal, three primary color filters of red, green, and blue provided on the photodiode to distinguish colors, and a photo filter provided on the color filter. Microlenses that concentrate on the diode to improve sensitivity may be stacked.

The substrate assembly 20 is formed on the transparent substrate 21, the metal wire 22 selectively formed on one surface of the transparent substrate 21 on which the photo sensor chip 10 is mounted, and the metal wire 22. An insulating film 23 for insulating the metal wiring 22 is included. The transparent substrate 21 may be made of a transparent material such as glass or plastic, and may be manufactured in a plate shape having a predetermined thickness. In addition, one surface of the transparent substrate 21 on which the metal wires 22 are formed or the other surface of the transparent substrate 21 on which the metal wires 22 are not formed is used to improve or filter the sensitivity of light in a wavelength band of a desired light. The material can be coated. For example, an IR cutoff filter (not shown) may be coated or an IR cutoff film (not shown) may be attached on the other surface of the transparent substrate 21 to which light is incident to pass or block light of a specific wavelength band. The metal wire 22 is formed outside the region corresponding to the pixel region 11 on one surface of the transparent substrate 21. The metal lines 22 may be patterned and formed using a printing process, or may be patterned by a photo and etching process after depositing a metal material. In addition, the insulating film 23 is formed on the metal wiring 22 so as to expose a predetermined region of the metal wiring 22. That is, a portion of the metal wiring 22 connected to the photo sensor chip 10 and the printed circuit board is exposed by the insulating film 23. The insulating layer 23 may also be patterned and formed by a printing process, and the photo and etching process may be patterned after depositing an insulating material.

The solder part 30 may include a solder sealing ring 31, a photo sensor chip 10, and a substrate assembly to prevent foreign substances from entering the sealing area including the pixel area 11 of the photo sensor chip 10. A plurality of flip-pump solder joints 32 for electrically connecting the substrate 20, a plurality of solder balls 33 for electrically connecting the substrate assembly 20 and the printed circuit board 50, and the substrate assembly 20. ) And a connection solder 34 for electrically connecting the passive element 40. The solder sealing ring 31 is provided between the photo sensor chip 10 and the substrate assembly 20 so as to surround the sealing region including the pixel region 11 of the photo sensor chip 10, and the substrate assembly 20 and the photo. Foreign matter is prevented from entering the space between the sensors 10. In addition, in order to form the solder sealing ring 31, solder sealing ring pads 31a and 31b are formed in a predetermined region on the photo sensor chip 10 and a predetermined region of the transparent substrate 21. In this case, the insulating film 23 may be formed on the solder sealing ring pad 31b formed on the transparent substrate 21 so that a portion of the solder sealing ring pad 31b is exposed thereon. The solder sealing ring 31 may be any shape capable of packaging the sealing area. For example, the solder sealing ring 31 may be in a closed loop shape, or may have an air passage in a closed loop shape having a predetermined width and length, and a closed loop having a predetermined width. It may be a variety of forms, such as a form having a solder sealing ring of the form and one or two auxiliary solder sealing ring having a width around the unclosed portion. In addition, the plurality of flip chip solder joints 32 are provided between the substrate assembly 20 outside the solder sealing ring 31 and the photo sensor chip 10. In order to form the flip chip solder joint 32, a flip chip solder joint pad 32a is formed in a predetermined area on the photo sensor chip 10, and the flip chip solder joint 32 is formed of metal wires of the substrate assembly 20. 22 and flip chip solder joint pads 32a on the photo sensor chip 10. In addition, the plurality of solder balls 33 may be fused on the metal wire 22 of the substrate assembly 20 outside the photo sensor chip 10 to electrically connect the substrate assembly 20 and the printed circuit board. In addition, the connection solder 34 is formed between the metal wiring 22 of the substrate assembly 20 and the connection pad 41 of the passive element 40. Here, the plurality of solder balls 33 are formed at equal intervals, for example, along the perimeter of the rectangular transparent substrate 21, at least one of the solder balls 33 is removed, at least one passive in place The element 40 is mounted.

The passive element 40 includes at least one of a decoupling capacitor, an inductor, a resistor, a varistor, a filter, and the like, and removes noise of a signal transmitted between the photo sensor chip 10 and the printed circuit board 50. Do it. This passive element 40 is mounted in the transparent substrate 21 of the substrate assembly 20. That is, after the groove having a predetermined shape is formed in a predetermined region of the transparent substrate 21, the passive element 40 is mounted in the groove, and the remaining region of the groove is filled with an insulating material such as a polymer. In addition, the passive element 40 may be provided, for example, on the same axis as the solder ball 33. That is, a groove is formed at a position where at least one of the plurality of solder balls 33 formed on one surface of the transparent substrate 21 is formed to surround the photo sensor chip 10, and the passive element 40 is mounted in the groove. By doing so, the area in which the passive element 40 is mounted can be reduced. For example, as illustrated, the passive element 40 may be mounted in an area corresponding to the two solder balls 40. In this case, a connection pad (not shown) may be formed on the metal wire 22 and the passive element 40 to mount the passive element 40.

On the other hand, the printed circuit board 50 may be connected to the solder ball 33 by the connection pad, the circuit pattern is printed so that the drive voltage and current from the outside through the substrate assembly 20, the photo sensor chip 10 To feed. The printed circuit board 50 may be in various forms capable of supplying a driving voltage and current to the photo sensor chip 10 from the outside, such as a single layer or multilayer printed circuit board, a metal printed circuit board, a flexible printed circuit board, and the like.

Meanwhile, the passive element 40 may be mounted in various regions of the transparent substrate 21. For example, as shown in FIG. 4, it may be mounted in an area corresponding to one solder ball 33, and as shown in FIG. 5, the photo sensor chip 10 may be mounted in an area between two solder balls 33. It may be provided in the area between). Of course, the above embodiments have described a case in which one passive cost 40 is mounted, but as shown in FIG. 6, three passive elements may be mounted in one photo sensor package. That is, in the photo sensor package according to the present invention, at least one passive element 40 may be mounted in the transparent substrate 21.

In addition, as illustrated in FIG. 7, the photo sensor chip 10 may be mounted on a predetermined area of the lower surface of the transparent substrate 21, preferably, a central area is thinner than other areas. The central area of the lower surface of the transparent substrate 21 may be reduced in thickness by dry or wet etching. In addition, a sharp step may be generated between the etching area and the eating area, and a gentle step may be formed to have a predetermined slope. The passive element 40 may be mounted on an upper surface of the transparent substrate 21 outside the pixel area, for example, inside the transparent substrate 21 outside the solder ball 33. Since the photo sensor chip 10 is mounted in the central area that is thinner than the outer portion, the thickness of the photo sensor package can be reduced, thereby reducing the thickness of the camera module. In addition, the size of the solder ball 33 is determined according to the thickness of the photo sensor chip 10. Since the thickness of the transparent substrate 21 is mounted in a thin central region, the size of the solder ball 33 may be reduced. Accordingly, the size of the photo sensor package can be reduced.

As described above, a method of mounting the passive element 40 in the transparent substrate 21 according to an embodiment of the present invention will be described with reference to FIGS. 8 to 11.

Referring to FIG. 8, a predetermined area of the transparent substrate 21 is etched to form the grooves 26. The groove 26 may be formed by performing a dry etching or a wet etching process. In addition, the groove is preferably formed wider than the size of the passive element to be mounted. In addition, the depth of the groove 26 is formed not too deep or too shallow compared to the height of the passive element, it is preferable to form the same depth as the height of the passive element. In addition, the groove 26 may be formed such that the side wall has a gentle inclination. In this case, the bottom surface of the groove 26 is preferably formed wider than the size of the passive element. This means that when the bottom surface of the groove 26 is narrower than the size of the passive element, the passive element does not come into contact with the bottom surface of the groove 26 and spans the sidewall of the groove 26, so that the passive element cannot be stably settled. Because.

Referring to FIG. 9, the passive element 40 is mounted in a groove 26 formed in the transparent substrate 21. The passive element 40 is in contact with the bottom surface of the groove 26 to be stably seated. In addition, an adhesive material may be applied to the other surface of the passive element 40 in contact with the bottom surface of the groove 26 or the bottom surface of the groove 26 so that the passive element 40 may be stably seated. Then, the polymer 27 is formed in the remaining space of the groove 26 on which the passive element 40 is seated so that the groove 26 is buried. At this time, the polymer 27 should not be formed on the exposed surface of the passive element 40 because the metal wires formed thereafter may be insulated from the passive element 40 by the polymer 27. To this end, an etching process for removing the polymer 27 remaining on the transparent substrate 21 or the passive element 40 after the polymer 27 is formed or a printing process is performed so that the polymer 27 is formed only in a limited region. You may.

Referring to FIG. 10, the metal wire 22 is formed on the transparent substrate 21 including at least a portion of the passive element 40. The metal wire 22 may be formed by forming a metal layer on the transparent substrate 21 by a method such as sputtering or plating, and then patterning the metal layer by a photo and etching process. Of course, in the case of using the sputtering, the metal wiring 22 may be formed without performing a photolithography and etching process in the case of depositing using a shadow mask. In addition, although the metal wiring 22 can be formed by a printing process, also in this case, the metal wiring 22 can also be formed, without performing a photography and an etching process.

Thereafter, an insulating film (not shown) that exposes a predetermined region of the metal wire 22 may be formed and then bonded using a photo sensor chip and a connection part.

On the other hand, the metal wire 22 formed on one surface of the transparent substrate 21 is not directly connected to the passive element 40, and as shown in FIG. 11, the second metal wire (2) is formed on the other surface of the transparent substrate 21. 22A may be formed, and the second metal wire 22A may be formed in the transparent substrate 21 to be connected to the passive element 40 and the metal wire 22 through the through holes 28 and 29 in which the conductive material is embedded. have. In this case, it is preferable to form the insulating layer 23A on the second metal wiring 22A to prevent external exposure of the second metal wiring 22A. In this case, the passive element 40 may be embedded in the transparent substrate 21 without one surface thereof being exposed to the transparent substrate 21.

As described above, in the photo sensor package according to the exemplary embodiment of the present invention, the passive element 40 is mounted in the transparent substrate 21 of the substrate assembly 20, and preferably mounted on the same axis as the solder ball 33. Can be. Accordingly, the size of the printed circuit board can be reduced compared to the conventional case in which the photo sensor package and the passive element are mounted on the printed circuit board, thereby reducing the size of the camera module. In addition, in the related art, although the distance between the photo sensor chip 10 and the passive element 40 is far, the signal path is increased, and thus the electrical characteristics are deteriorated, such as noise is introduced into the signal. The 40 is mounted on the substrate assembly 20 and disposed adjacent to the photo sensor chip 10, thereby shortening the signal path and thus improving the electrical characteristics of the camera module.

Although the technical spirit of the present invention has been described in detail according to the above embodiment, it should be noted that the above embodiment is for the purpose of description and not of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

10: photo sensor chip 20: substrate assembly
30 solder part 40 passive element

Claims (9)

A substrate assembly comprising a transparent substrate;
A photo sensor chip mounted on the substrate assembly;
Solder balls for electrically connecting the photo sensor chip, the substrate assembly, and the printed circuit board; And
And a passive element mounted in the transparent substrate of the substrate assembly.
The photo sensor package of claim 1, wherein a thickness of one region of the transparent substrate is thinner than another region.
The photo sensor package of claim 2, wherein the photo sensor chip is mounted in a region where the thickness of the transparent substrate is thin.
The photo sensor package of claim 1, wherein the passive element is mounted outside a pixel area of the photo sensor chip. The photo sensor package of claim 4, wherein the passive element is mounted in a groove formed by etching the transparent substrate in a region corresponding to at least one of the solder balls.
The photo sensor package of claim 4, wherein the passive element is mounted in a groove formed by etching the transparent substrate in an area between the solder ball and the photo sensor chip.
The photo sensor package of claim 4, wherein the passive element is mounted in a groove formed by etching the transparent substrate outside the solder ball.
The photo sensor package according to claim 5, wherein the passive element is electrically connected through a metal wire formed on one surface of the transparent substrate.
The photo sensor of claim 5, wherein the passive element vertically penetrates one region of the transparent substrate and is electrically connected to one surface of the transparent substrate through a through hole in which a conductive material is embedded. package.

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