JP2000049319A - Solid-state image-pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize an entire part and to easily and accurately position a solid-state image-pickup element and an optical member by providing a sealing resin at the entire outer-periphery region of the solid-state image-pickup element, including a connection part while an electrode pad and a bump electrode a wiring pattern is connected directly. SOLUTION: An external electrode pad is formed at a solid-state image- pickup element 21 and a bump electrode 22 is formed at the external electrode pad. An optical member 23 is formed, and a leg part 23a is formed at a circumferential part. A wiring pattern 24 is formed at the leg part 23a, an electrode pad is formed at a position corresponding to the position of the bump electrode 22 of the solid-state image-pickup element 21 in the wiring pattern 24, and the electrode pad and the bump electrode 22 where the solid-state image-pickup element 21 which corresponds are positioned and are connected electrically. A sealing resin 25 is provided at the entire outer peripheral region of the solid- state image-pickup element 21, and the light reception part of the solid-state image-pickup element 21 is directly sealed by the optical member 23, thus miniaturizing the optical member and accurately positioning the light reception part of optical member and the solid-state image-pickup element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device in which a solid-state imaging device and an optical member are integrally mounted.

[0002]

2. Description of the Related Art As this type of solid-state imaging device, for example,
As shown in FIG. 3, the solid-state imaging device 1 is mounted on the substrate 2,
The external electrode pads of the solid-state imaging device 1 are connected to the electrode pads of the wiring pattern 4 formed on the substrate 2 via the bonding wires 3, and the frame-shaped legs are formed so as to cover the solid-state imaging device 1 and the bonding wires 3. In some cases, the integrally formed lens 5 is attached to the substrate 2 with a sealing resin 6 so that the entire solid-state imaging device 1 is sealed with the substrate 2 and the lens 5.

Japanese Patent Application Laid-Open No. 7-202152 discloses that a solid-state imaging device 11 is mounted on a substrate 12 and external electrode pads of the solid-state imaging device 11 are connected to the substrate 12 via bonding wires 13 as shown in FIG. Connected to the electrode pads of the wiring pattern 14 formed in the
A prism 15 integrally formed with a frame-shaped leg is mounted on the prism 1 so as to cover the light-receiving portion, and the leg of the prism 15, the bonding wire 13 and the solid-state image sensor 11
Is disclosed in which a sealing resin 16 is provided so as to cover an exposed portion of the solid-state imaging device 11, and the light-receiving portion of the solid-state imaging device 11 is directly sealed by the prism 15.

Further, Japanese Patent Application Laid-Open No. Hei 9-121040 discloses that a lens having frame-shaped legs integrally formed is attached to a substrate so as to cover the solid-state imaging device attached to the substrate, and the entire solid-state imaging device is sealed. In the solid-state imaging device, the lens is positioned with respect to the solid-state imaging device by forming an inclined surface on a leg portion of the lens and bringing the inclined surface into contact with an upper surface edge of the solid-state imaging device. Is disclosed.

[0005]

However, in the above-mentioned conventional solid-state imaging device, the external electrode pads of the solid-state imaging device are connected to the electrode pads of the wiring pattern formed on the substrate via bonding wires. Therefore, it is necessary to secure a space for the bonding wire in a portion where the solid-state imaging device is attached, and there is a problem that downsizing is difficult. In addition, in the configuration shown in FIGS. 3 and 4, it is difficult to position the optical member including the lens and the prism with respect to the light receiving portion of the solid-state imaging device and to fix the optical member to the substrate or the solid-state imaging device. There is a problem.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and has an appropriate structure so that the whole can be reduced in size and the positioning between the solid-state imaging device and the optical member can be performed easily and with high accuracy. It is an object of the present invention to provide a solid-state imaging device according to the present invention.

[0007]

In order to achieve the above object, the present invention relates to a solid-state image pickup device in which a solid-state image pickup device and an optical member are integrally mounted, and a projection formed on an external electrode pad of the solid-state image pickup device. An electrode, a wiring pattern having an electrode pad formed on the optical member, and a state in which the electrode pad of the wiring pattern and the protruding electrode are directly connected, and are provided on the entire outer periphery of the solid-state imaging device including the connection portion. And a sealing resin.

As described above, if the protruding electrodes formed on the external electrode pads of the solid-state imaging device are directly connected to the electrode pads of the wiring pattern formed on the optical member, it is possible to achieve the same effect as when a bonding wire is used. Since a bonding space is not required, the size of the device can be reduced. Further, in forming a wiring pattern having an electrode pad to which a projection electrode of a solid-state imaging device is connected to an optical member, the wiring pattern can be formed with high precision positioning with respect to the optical axis of the optical member. So
By positioning and connecting the protruding electrodes of the solid-state imaging device to the electrode pads of the wiring pattern, the optical axis of the optical member and the light-receiving portion of the solid-state imaging device can be simultaneously positioned with high accuracy.

[0009]

FIG. 1 is a partially exploded sectional view of a solid-state imaging device according to a first embodiment of the present invention.
In this solid-state imaging device, an external electrode pad is formed on a light-receiving-side surface edge of a solid-state imaging device 21 such as a CCD, a CMOS, or a CMD, and Au is formed on the surface of the external electrode pad by a wire bonding method, a plating method, or the like. , Cu, In, solder, and other metal protruding electrodes 22 are formed. Optical members 23 such as lenses, prisms, and various filters (lenses in FIG. 1)
Is formed by a molding method or the like using a transparent resin such as acrylic, polycarbonate, polyolefin or the like, glass, or the like, and a frame-shaped leg 23a is integrally formed on a peripheral portion thereof. Note that the frame-shaped leg 23a has an inner dimension smaller than the outer dimension of the solid-state imaging device 21 and larger than the dimension of the light receiving section, and an outer dimension larger than the outer dimension of the solid-state imaging device 21. I do.

On the lower surface of the leg 23a, a wiring pattern 24 is formed by a printing method, a photolithography method, a MID (molded interconnect device) method, or the like. An electrode pad is formed at a position corresponding to the position of the protruding electrode 22 on the pad, and the electrode pad on the leg portion 23a and the corresponding protruding electrode 22 of the solid-state imaging device 21 are positioned, and the flip-chip bonder or the like is used. Make an electrical connection. Further, the solid-state imaging device 2 including a connection portion between the electrode pad on the leg 23 a and the protruding electrode 22 on the solid-state imaging device 21.
Epoxy, phenol, silicone,
By providing a sealing resin 25 such as acrylic, the solid-state imaging device 21 is provided.
Is directly sealed with the optical member 23.

As described above, the optical member 23 is connected to the wiring pattern 24 on the lower surface of the leg 23a while the solid-state imaging device 21 is mounted on the lower surface of the leg 23a.
6 is electrically connected to the corresponding wiring pattern 27 formed by using solder, conductive resin, or the like, and mounted on the substrate 26.
Note that the substrate 26 has an opening 26a through which the solid-state imaging device 21 enters.

According to this embodiment, the solid-state imaging device 21
The projection electrode 22 on the external electrode pad is directly connected to the electrode pad of the wiring pattern 24 on the lower surface of the leg of the optical member 23 without using a bonding wire. Can be In forming the wiring pattern 24 for providing the electrode pads on the lower surface of the leg of the optical member 23, the wiring pattern 24 can be formed with high precision positioning with respect to the optical axis of the optical member 23. By positioning and connecting the protruding electrode 22 of the solid-state imaging device 21 to the electrode pad of the optical member 23, the optical axis of the optical member 23 and the light receiving section of the solid-state imaging device 21 can be simultaneously positioned with high accuracy.

FIG. 2 is a partially exploded sectional view of a second embodiment of the solid-state imaging device according to the present invention. In the solid-state imaging device, as in the first embodiment, the solid-state imaging device 3
An external electrode pad is formed on the edge of the light-receiving unit side surface, and a metal bump electrode 32 is formed on the surface of the external electrode pad. The optical member 33 (the lens in FIG. 2) is formed integrally with a frame-shaped leg 33a at a peripheral portion thereof, and a step portion for inserting and loading the solid-state imaging device 31 into the leg 33a. 33b is formed.

On the lower surface of the leg portion 33a and the step portion 33b, a wiring pattern 34 is formed so as to extend, and the step portion 3 corresponding to the position of the projecting electrode 32 of the solid-state image sensor 31 is formed.
An electrode pad is formed on the wiring pattern 34b, and the electrode pad on the step portion 33b and the corresponding protruding electrode 32 of the solid-state imaging device 31 are positioned and electrically connected.
Further, the electrode pad on the step portion 33b and the solid-state imaging device 31
A sealing resin 35 is provided on the entire outer periphery of the solid-state imaging device 31 including the connection portion with the protruding electrode 32 so that the solid-state imaging device 3
One light receiving unit is directly sealed with the optical member 33.

The optical member 33 is connected to the wiring pattern 34 on the lower surface of the leg 33a while the solid-state imaging device 31 is mounted on the step 33b of the leg 33a.
6 is electrically connected to the corresponding wiring pattern 37 formed on the substrate 6 and mounted on the substrate 36. In the case of this embodiment, the solid-state imaging device 31 is connected to the step portion 33 b of the optical member 33.
Therefore, there is no need to form an opening in the substrate 36 as in the first embodiment.

In this embodiment, similarly to the first embodiment, the protruding electrodes 32 on the external electrode pads of the solid-state imaging device 31 are formed by using the electrodes of the wiring pattern 34 formed on the optical member 33 without using a bonding wire. Since the connection is made directly to the pad, the size of the device can be reduced. The wiring pattern 34 of the optical member 33 is
Can be positioned and formed with high precision with respect to the optical axis of the optical member 33. By positioning and connecting the protruding electrode 32 of the solid-state imaging device 31 to the electrode pad of the optical member 33, The light-receiving section of the solid-state imaging device 31 can be simultaneously positioned with high accuracy.

Note that the present invention is not limited to the above-described embodiment, and various modifications or changes can be made. For example, the electrical connection between the protruding electrode formed on the external electrode pad of the solid-state imaging device and the electrode pad of the wiring pattern formed on the optical member can be performed using an anisotropic conductive resin. With this configuration, the electrical connection between the electrodes and the sealing of the light receiving portion of the solid-state imaging device can be performed simultaneously, so that the productivity can be improved and the cost can be reduced.

[0018]

As described above, according to the present invention, a projecting electrode is formed on an external electrode pad of a solid-state imaging device, and the projecting electrode is directly connected to an electrode pad of a wiring pattern formed on an optical member. Since the entire outer periphery of the solid-state imaging device is sealed with a sealing resin and the solid-state imaging device and the optical member are integrally mounted, a bonding space is not required and the device can be downsized. Therefore, a small electronic camera or the like can be realized. Further, since the wiring pattern on the optical member can be formed with high precision positioning with respect to the optical axis of the optical member, if the electrode pad of the wiring pattern is directly connected to the protruding electrode formed on the solid-state imaging device. At the same time, the positioning between the optical member and the light receiving section of the solid-state imaging device can be performed with high accuracy. Therefore, a solid-state imaging device capable of obtaining an image with good image quality can be realized at low cost.

[Brief description of the drawings]

FIG. 1 is a partially exploded sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view showing the second embodiment in a partially disassembled manner.

FIG. 3 is a cross-sectional view illustrating a configuration of a conventional solid-state imaging device.

FIG. 4 is a cross-sectional view showing another configuration of the conventional solid-state imaging device.

[Explanation of symbols]

 21, 31 Solid-state imaging device 22, 32 Protruding electrode 23, 33 Optical member 23a, 33a Leg 24, 27, 34, 37 Wiring pattern 25, 35 Sealing resin 26, 36 Substrate 33b Step

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M118 AA10 AB01 HA03 HA11 HA14 HA23 HA24 HA31 5C024 AA00 AA01 AA18 AA20 CA31 CA32 CA33 EA04 EA06 EA08 FA01

Claims (1)

[Claims] 1. A solid-state imaging device in which a solid-state imaging device and an optical member are integrally mounted, a wiring pattern having a protruding electrode formed on an external electrode pad of the solid-state imaging device and an electrode pad formed on the optical member. A solid-state imaging device, comprising: an electrode pad of the wiring pattern; and a sealing resin provided over the entire outer periphery of the solid-state imaging element including the connection portion in a state of being directly connected to the projection electrode.