JP2000049319A - Solid-state image-pickup device - Google Patents
Solid-state image-pickup deviceInfo
- Publication number
- JP2000049319A JP2000049319A JP10211037A JP21103798A JP2000049319A JP 2000049319 A JP2000049319 A JP 2000049319A JP 10211037 A JP10211037 A JP 10211037A JP 21103798 A JP21103798 A JP 21103798A JP 2000049319 A JP2000049319 A JP 2000049319A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- optical member
- state image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000003384 imaging method Methods 0.000 claims description 71
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、固体撮像素子と
光学部材とを一体に実装した固体撮像装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device in which a solid-state imaging device and an optical member are integrally mounted.
【0002】[0002]
【従来の技術】この種の固体撮像装置として、例えば、
図3に示すように、固体撮像素子1を基板2に実装し、
固体撮像素子1の外部電極パッドをボンディングワイヤ
3を介して基板2に形成した配線パターン4の電極パッ
ドに接続すると共に、固体撮像素子1およびボンディン
グワイヤ3を覆うように、枠状の脚部を一体に形成した
レンズ5を封止樹脂6により基板2に取り付けて、固体
撮像素子1全体を基板2とレンズ5とにより封止するよ
うにしたものがある。2. Description of the Related Art As this type of solid-state imaging device, for example,
As shown in FIG. 3, the solid-state imaging device 1 is mounted on the substrate 2,
The external electrode pads of the solid-state imaging device 1 are connected to the electrode pads of the wiring pattern 4 formed on the substrate 2 via the bonding wires 3, and the frame-shaped legs are formed so as to cover the solid-state imaging device 1 and the bonding wires 3. In some cases, the integrally formed lens 5 is attached to the substrate 2 with a sealing resin 6 so that the entire solid-state imaging device 1 is sealed with the substrate 2 and the lens 5.
【0003】また、特開平7−202152号公報に
は、図4に示すように、固体撮像素子11を基板12に
実装し、固体撮像素子11の外部電極パッドをボンディ
ングワイヤ13を介して基板12に形成した配線パター
ン14の電極パッドに接続すると共に、固体撮像素子1
1上にその受光部を覆うように、枠状の脚部を一体に形
成したプリズム15を載置し、このプリズム15の脚
部、ボンディングワイヤ13、および固体撮像素子11
の露出部分を覆うように封止樹脂16を設けて、固体撮
像素子11の受光部をプリズム15で直接封止するよう
にしたものが開示されている。Japanese Patent Application Laid-Open No. 7-202152 discloses that a solid-state imaging device 11 is mounted on a substrate 12 and external electrode pads of the solid-state imaging device 11 are connected to the substrate 12 via bonding wires 13 as shown in FIG. Connected to the electrode pads of the wiring pattern 14 formed in the
A prism 15 integrally formed with a frame-shaped leg is mounted on the prism 1 so as to cover the light-receiving portion, and the leg of the prism 15, the bonding wire 13 and the solid-state image sensor 11
Is disclosed in which a sealing resin 16 is provided so as to cover an exposed portion of the solid-state imaging device 11, and the light-receiving portion of the solid-state imaging device 11 is directly sealed by the prism 15.
【0004】さらに、特開平9−121040号公報に
は、基板に取り付けた固体撮像素子を覆うように、枠状
の脚部を一体に形成したレンズを基板に取り付けて固体
撮像素子全体を封止するようにした固体撮像装置におい
て、レンズの脚部に傾斜面を形成し、この傾斜面を固体
撮像素子の上面エッジに当接させることにより、固体撮
像素子に対するレンズの位置決めを行うようにしたもの
が開示されている。Further, Japanese Patent Application Laid-Open No. Hei 9-121040 discloses that a lens having frame-shaped legs integrally formed is attached to a substrate so as to cover the solid-state imaging device attached to the substrate, and the entire solid-state imaging device is sealed. In the solid-state imaging device, the lens is positioned with respect to the solid-state imaging device by forming an inclined surface on a leg portion of the lens and bringing the inclined surface into contact with an upper surface edge of the solid-state imaging device. Is disclosed.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た従来の固体撮像装置にあっては、固体撮像素子の外部
電極パッドをボンディングワイヤを介して基板に形成し
た配線パターンの電極パッドに接続するようにしている
ため、固体撮像素子の取り付け部分にボンディングワイ
ヤのスペースをも確保しなければならず、小型化が困難
になるという問題がある。また、図3および図4に示す
構成にあっては、レンズやプリズムよりなる光学部材を
固体撮像素子の受光部に対して位置決めして、基板や固
体撮像素子に接着固定するのが困難になるという問題が
ある。However, in the above-mentioned conventional solid-state imaging device, the external electrode pads of the solid-state imaging device are connected to the electrode pads of the wiring pattern formed on the substrate via bonding wires. Therefore, it is necessary to secure a space for the bonding wire in a portion where the solid-state imaging device is attached, and there is a problem that downsizing is difficult. In addition, in the configuration shown in FIGS. 3 and 4, it is difficult to position the optical member including the lens and the prism with respect to the light receiving portion of the solid-state imaging device and to fix the optical member to the substrate or the solid-state imaging device. There is a problem.
【0006】この発明は、このような従来の問題点に着
目してなされたもので、全体を小型化でき、しかも固体
撮像素子と光学部材との位置決めを簡単かつ高精度にで
きるよう適切に構成した固体撮像装置を提供することを
目的とするものである。SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and has an appropriate structure so that the whole can be reduced in size and the positioning between the solid-state imaging device and the optical member can be performed easily and with high accuracy. It is an object of the present invention to provide a solid-state imaging device according to the present invention.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するた
め、この発明は、固体撮像素子と光学部材とを一体に実
装した固体撮像装置において、前記固体撮像素子の外部
電極パッド上に形成した突起電極と、前記光学部材に形
成した電極パッドを有する配線パターンと、この配線パ
ターンの電極パッドと前記突起電極とを直接接続した状
態で、その接続部を含む前記固体撮像素子の外周全域に
設けた封止樹脂とを有することを特徴とするものであ
る。In order to achieve the above object, the present invention relates to a solid-state image pickup device in which a solid-state image pickup device and an optical member are integrally mounted, and a projection formed on an external electrode pad of the solid-state image pickup device. An electrode, a wiring pattern having an electrode pad formed on the optical member, and a state in which the electrode pad of the wiring pattern and the protruding electrode are directly connected, and are provided on the entire outer periphery of the solid-state imaging device including the connection portion. And a sealing resin.
【0008】このように、固体撮像素子の外部電極パッ
ド上に形成した突起電極と、光学部材に形成した配線パ
ターンの電極パッドとを直接接続するようにすれば、ボ
ンディングワイヤを用いる場合のようなボンディングス
ペースが不要となるので、装置の小型化を図ることが可
能となる。また、光学部材に固体撮像素子の突起電極が
接続される電極パッドを有する配線パターンを形成する
にあたっては、その配線パターンを光学部材の光軸に対
して高精度で位置決めして形成することができるので、
その配線パターンの電極パッドに固体撮像素子の突起電
極を位置決めして接続することにより、光学部材の光軸
と固体撮像素子の受光部とを同時に高精度で位置決めす
ることが可能となる。As described above, if the protruding electrodes formed on the external electrode pads of the solid-state imaging device are directly connected to the electrode pads of the wiring pattern formed on the optical member, it is possible to achieve the same effect as when a bonding wire is used. Since a bonding space is not required, the size of the device can be reduced. Further, in forming a wiring pattern having an electrode pad to which a projection electrode of a solid-state imaging device is connected to an optical member, the wiring pattern can be formed with high precision positioning with respect to the optical axis of the optical member. So
By positioning and connecting the protruding electrodes of the solid-state imaging device to the electrode pads of the wiring pattern, the optical axis of the optical member and the light-receiving portion of the solid-state imaging device can be simultaneously positioned with high accuracy.
【0009】[0009]
【発明の実施の形態】図1は、この発明に係る固体撮像
装置の第1実施形態を一部分解して示す断面図である。
この固体撮像装置では、CCD,CMOS,CMD等の
固体撮像素子21の受光部側表面縁部に外部電極パッド
を形成し、その外部電極パッドの表面に、ワイヤボンデ
ィング法やメッキ法等により、Au,Cu,In, ハンダ等の金
属の突起電極22を形成する。また、レンズ、プリズ
ム、各種フィルタ等の光学部材23(図1ではレンズ)
は、アクリル、ポリカーボネート、ポリオレフィン等の
透明樹脂またはガラス等を用いてモールド成形法等によ
り形成すると共に、その周縁部には枠状の脚部23aを
一体に形成する。なお、枠状の脚部23aは、その内側
の寸法を固体撮像素子21の外形寸法よりも小さく、か
つ受光部の寸法よりも大きくし、外側の寸法を固体撮像
素子21の外形寸法よりも大きくする。FIG. 1 is a partially exploded sectional view of a solid-state imaging device according to a first embodiment of the present invention.
In this solid-state imaging device, an external electrode pad is formed on a light-receiving-side surface edge of a solid-state imaging device 21 such as a CCD, a CMOS, or a CMD, and Au is formed on the surface of the external electrode pad by a wire bonding method, a plating method, or the like. , Cu, In, solder, and other metal protruding electrodes 22 are formed. Optical members 23 such as lenses, prisms, and various filters (lenses in FIG. 1)
Is formed by a molding method or the like using a transparent resin such as acrylic, polycarbonate, polyolefin or the like, glass, or the like, and a frame-shaped leg 23a is integrally formed on a peripheral portion thereof. Note that the frame-shaped leg 23a has an inner dimension smaller than the outer dimension of the solid-state imaging device 21 and larger than the dimension of the light receiving section, and an outer dimension larger than the outer dimension of the solid-state imaging device 21. I do.
【0010】脚部23aの下面には、印刷法、フォトリ
ソグラフィ法やMID(モールデッドインターコネクト
デバイス)法等により配線パターン24を形成すると共
に、この配線パターン24には、固体撮像素子21の外
部電極パッド上の突起電極22の位置と対応する位置に
電極パッドを形成し、この脚部23a上の電極パッド
と、固体撮像素子21の対応する突起電極22とを位置
決めして、フリップチップボンダ等により電気的に接続
する。また、脚部23a上の電極パッドと固体撮像素子
21上の突起電極22との接続部を含む固体撮像素子2
1の外周全域には、エポキシ、フェノール、シリコン、
アクリル等の封止樹脂25を設けて、固体撮像素子21
の受光部を光学部材23で直接封止する。On the lower surface of the leg 23a, a wiring pattern 24 is formed by a printing method, a photolithography method, a MID (molded interconnect device) method, or the like. An electrode pad is formed at a position corresponding to the position of the protruding electrode 22 on the pad, and the electrode pad on the leg portion 23a and the corresponding protruding electrode 22 of the solid-state imaging device 21 are positioned, and the flip-chip bonder or the like is used. Make an electrical connection. Further, the solid-state imaging device 2 including a connection portion between the electrode pad on the leg 23 a and the protruding electrode 22 on the solid-state imaging device 21.
Epoxy, phenol, silicone,
By providing a sealing resin 25 such as acrylic, the solid-state imaging device 21 is provided.
Is directly sealed with the optical member 23.
【0011】光学部材23は、上記のように、その脚部
23aの下面に固体撮像素子21を実装した状態で、脚
部23aの下面の露出する配線パターン24を、基板2
6に形成した対応する配線パターン27にハンダや導電
樹脂等により電気的に接続して、基板26に搭載する。
なお、基板26には、固体撮像素子21が侵入する開口
部26aを形成しておく。As described above, the optical member 23 is connected to the wiring pattern 24 on the lower surface of the leg 23a while the solid-state imaging device 21 is mounted on the lower surface of the leg 23a.
6 is electrically connected to the corresponding wiring pattern 27 formed by using solder, conductive resin, or the like, and mounted on the substrate 26.
Note that the substrate 26 has an opening 26a through which the solid-state imaging device 21 enters.
【0012】この実施形態によれば、固体撮像素子21
の外部電極パッド上の突起電極22を、光学部材23の
脚部下面の配線パターン24の電極パッドに、ボンディ
ングワイヤを用いることなく直接接続するようにしたの
で、ボンディングスペースが不要となり、装置を小型化
できる。また、光学部材23の脚部下面に電極パッドを
設ける配線パターン24を形成するにあたっては、その
配線パターン24を光学部材23の光軸に対して高精度
で位置決めして形成することができるので、固体撮像素
子21の突起電極22を光学部材23の電極パッドに位
置決めして接続することで、光学部材23の光軸と固体
撮像素子21の受光部とを同時に高精度で位置決めする
ことができる。According to this embodiment, the solid-state imaging device 21
The projection electrode 22 on the external electrode pad is directly connected to the electrode pad of the wiring pattern 24 on the lower surface of the leg of the optical member 23 without using a bonding wire. Can be In forming the wiring pattern 24 for providing the electrode pads on the lower surface of the leg of the optical member 23, the wiring pattern 24 can be formed with high precision positioning with respect to the optical axis of the optical member 23. By positioning and connecting the protruding electrode 22 of the solid-state imaging device 21 to the electrode pad of the optical member 23, the optical axis of the optical member 23 and the light receiving section of the solid-state imaging device 21 can be simultaneously positioned with high accuracy.
【0013】図2は、この発明に係る固体撮像装置の第
2実施形態を一部分解して示す断面図である。この固体
撮像装置では、第1実施形態と同様に、固体撮像素子3
1の受光部側表面縁部に外部電極パッドを形成し、その
外部電極パッドの表面に、金属の突起電極32を形成す
る。また、光学部材33(図2ではレンズ)には、その
周縁部に枠状の脚部33aを一体に形成すると共に、こ
の脚部33aに固体撮像素子31を挿入して装填するた
めの段差部33bを形成する。FIG. 2 is a partially exploded sectional view of a second embodiment of the solid-state imaging device according to the present invention. In the solid-state imaging device, as in the first embodiment, the solid-state imaging device 3
An external electrode pad is formed on the edge of the light-receiving unit side surface, and a metal bump electrode 32 is formed on the surface of the external electrode pad. The optical member 33 (the lens in FIG. 2) is formed integrally with a frame-shaped leg 33a at a peripheral portion thereof, and a step portion for inserting and loading the solid-state imaging device 31 into the leg 33a. 33b is formed.
【0014】脚部33aの下面および段差部33bに
は、配線パターン34を延在して形成すると共に、固体
撮像素子31の突起電極32の位置と対応する段差部3
3bの配線パターン34には電極パッドを形成し、この
段差部33b上の電極パッドと固体撮像素子31の対応
する突起電極32とを位置決めして電気的に接続する。
また、段差部33b上の電極パッドと固体撮像素子31
上の突起電極32との接続部を含む固体撮像素子31の
外周全域には、封止樹脂35を設けて、固体撮像素子3
1の受光部を光学部材33で直接封止する。On the lower surface of the leg portion 33a and the step portion 33b, a wiring pattern 34 is formed so as to extend, and the step portion 3 corresponding to the position of the projecting electrode 32 of the solid-state image sensor 31 is formed.
An electrode pad is formed on the wiring pattern 34b, and the electrode pad on the step portion 33b and the corresponding protruding electrode 32 of the solid-state imaging device 31 are positioned and electrically connected.
Further, the electrode pad on the step portion 33b and the solid-state imaging device 31
A sealing resin 35 is provided on the entire outer periphery of the solid-state imaging device 31 including the connection portion with the protruding electrode 32 so that the solid-state imaging device 3
One light receiving unit is directly sealed with the optical member 33.
【0015】光学部材33は、上記のように、その脚部
33aの段差部33bに固体撮像素子31を実装した状
態で、脚部33aの下面の配線パターン34を、基板3
6に形成した対応する配線パターン37に電気的に接続
して、基板36に搭載する。なお、この実施形態の場合
には、固体撮像素子31が光学部材33の段差部33b
に挿入されて実装されるので、基板36には第1実施形
態におけるような開口を形成する必要はない。The optical member 33 is connected to the wiring pattern 34 on the lower surface of the leg 33a while the solid-state imaging device 31 is mounted on the step 33b of the leg 33a.
6 is electrically connected to the corresponding wiring pattern 37 formed on the substrate 6 and mounted on the substrate 36. In the case of this embodiment, the solid-state imaging device 31 is connected to the step portion 33 b of the optical member 33.
Therefore, there is no need to form an opening in the substrate 36 as in the first embodiment.
【0016】この実施形態においても、第1実施形態と
同様に、固体撮像素子31の外部電極パッド上の突起電
極32を、ボンディングワイヤを用いることなく、光学
部材33に形成した配線パターン34の電極パッドに直
接接続するようにしたので、装置を小型化できる。ま
た、光学部材33の配線パターン34は、光学部材33
の光軸に対して高精度で位置決めして形成することがで
きるので、固体撮像素子31の突起電極32を光学部材
33の電極パッドに位置決めして接続することで、光学
部材33の光軸と固体撮像素子31の受光部とを同時に
高精度で位置決めすることができる。In this embodiment, similarly to the first embodiment, the protruding electrodes 32 on the external electrode pads of the solid-state imaging device 31 are formed by using the electrodes of the wiring pattern 34 formed on the optical member 33 without using a bonding wire. Since the connection is made directly to the pad, the size of the device can be reduced. The wiring pattern 34 of the optical member 33 is
Can be positioned and formed with high precision with respect to the optical axis of the optical member 33. By positioning and connecting the protruding electrode 32 of the solid-state imaging device 31 to the electrode pad of the optical member 33, The light-receiving section of the solid-state imaging device 31 can be simultaneously positioned with high accuracy.
【0017】なお、この発明は、上述した実施形態にの
み限定されるものではなく、幾多の変形または変更が可
能である。例えば、固体撮像素子の外部電極パッド上に
形成した突起電極と、光学部材に形成した配線パターン
の電極パッドとの電気的接続は、異方導電樹脂を用いて
行うこともできる。このようにすれば、電極どうしの電
気的接続と、固体撮像素子の受光部の封止とを同時に行
うことができるので、生産性を向上でき、コストを低減
することが可能となる。Note that the present invention is not limited to the above-described embodiment, and various modifications or changes can be made. For example, the electrical connection between the protruding electrode formed on the external electrode pad of the solid-state imaging device and the electrode pad of the wiring pattern formed on the optical member can be performed using an anisotropic conductive resin. With this configuration, the electrical connection between the electrodes and the sealing of the light receiving portion of the solid-state imaging device can be performed simultaneously, so that the productivity can be improved and the cost can be reduced.
【0018】[0018]
【発明の効果】以上のように、この発明によれば、固体
撮像素子の外部電極パッド上に突起電極を形成し、この
突起電極を光学部材に形成した配線パターンの電極パッ
ドに直接接続すると共に、固体撮像素子の外周全域を封
止樹脂で封止して、固体撮像素子と光学部材とを一体に
実装するようにしたので、ボンディングスペースが不要
となり、装置を小型化できる。したがって、小型な電子
カメラ等の実現が可能となる。また、光学部材上の配線
パターンは、光学部材の光軸に対して高精度に位置決め
して形成できるので、その配線パターンの電極パッド
と、固体撮像素子に形成した突起電極とを直接接続すれ
ば、同時に、光学部材と固体撮像素子の受光部との位置
決めを高精度にできる。したがって、画質の良好な画像
が得られる固体撮像装置を低コストで実現することがで
きる。As described above, according to the present invention, a projecting electrode is formed on an external electrode pad of a solid-state imaging device, and the projecting electrode is directly connected to an electrode pad of a wiring pattern formed on an optical member. Since the entire outer periphery of the solid-state imaging device is sealed with a sealing resin and the solid-state imaging device and the optical member are integrally mounted, a bonding space is not required and the device can be downsized. Therefore, a small electronic camera or the like can be realized. Further, since the wiring pattern on the optical member can be formed with high precision positioning with respect to the optical axis of the optical member, if the electrode pad of the wiring pattern is directly connected to the protruding electrode formed on the solid-state imaging device. At the same time, the positioning between the optical member and the light receiving section of the solid-state imaging device can be performed with high accuracy. Therefore, a solid-state imaging device capable of obtaining an image with good image quality can be realized at low cost.
【図1】この発明の第1実施形態を一部分解して示す断
面図である。FIG. 1 is a partially exploded sectional view of a first embodiment of the present invention.
【図2】同じく、第2実施形態を一部分解して示す断面
図である。FIG. 2 is a sectional view showing the second embodiment in a partially disassembled manner.
【図3】従来の固体撮像装置の構成を示す断面図であ
る。FIG. 3 is a cross-sectional view illustrating a configuration of a conventional solid-state imaging device.
【図4】同じく、従来の固体撮像装置の他の構成を示す
断面図である。FIG. 4 is a cross-sectional view showing another configuration of the conventional solid-state imaging device.
21,31 固体撮像素子 22,32 突起電極 23,33 光学部材 23a,33a 脚部 24,27,34,37 配線パターン 25,35 封止樹脂 26,36 基板 33b 段差部 21, 31 Solid-state imaging device 22, 32 Protruding electrode 23, 33 Optical member 23a, 33a Leg 24, 27, 34, 37 Wiring pattern 25, 35 Sealing resin 26, 36 Substrate 33b Step
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4M118 AA10 AB01 HA03 HA11 HA14 HA23 HA24 HA31 5C024 AA00 AA01 AA18 AA20 CA31 CA32 CA33 EA04 EA06 EA08 FA01 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M118 AA10 AB01 HA03 HA11 HA14 HA23 HA24 HA31 5C024 AA00 AA01 AA18 AA20 CA31 CA32 CA33 EA04 EA06 EA08 FA01
Claims (1)
した固体撮像装置において、 前記固体撮像素子の外部電極パッド上に形成した突起電
極と、 前記光学部材に形成した電極パッドを有する配線パター
ンと、 この配線パターンの電極パッドと前記突起電極とを直接
接続した状態で、その接続部を含む前記固体撮像素子の
外周全域に設けた封止樹脂とを有することを特徴とする
固体撮像装置。1. A solid-state imaging device in which a solid-state imaging device and an optical member are integrally mounted, a wiring pattern having a protruding electrode formed on an external electrode pad of the solid-state imaging device and an electrode pad formed on the optical member. A solid-state imaging device, comprising: an electrode pad of the wiring pattern; and a sealing resin provided over the entire outer periphery of the solid-state imaging element including the connection portion in a state of being directly connected to the projection electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP10211037A JP2000049319A (en) | 1998-07-27 | 1998-07-27 | Solid-state image-pickup device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10211037A JP2000049319A (en) | 1998-07-27 | 1998-07-27 | Solid-state image-pickup device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000049319A true JP2000049319A (en) | 2000-02-18 |
Family
ID=16599331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10211037A Pending JP2000049319A (en) | 1998-07-27 | 1998-07-27 | Solid-state image-pickup device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000049319A (en) |
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