JP4375939B2 - Method for manufacturing solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a solid-state imaging device including a solid-state imaging device and an optical lens held in a casing on a flexible wiring board. More specifically, the present invention enables high-precision assembly and realizes downsizing. The present invention relates to a method for manufacturing a solid-state imaging device.
[0002]
[Prior art]
As an example of the prior art, an external view of a solid-state imaging device that includes a solid-state imaging device and an optical lens and is configured by flip-chip connecting the solid-state imaging device and an IC component to a flexible wiring board (hereinafter abbreviated as FPC). As shown in FIG. In FIG. 18, 101 is a flexible printed circuit board (FPC), 101a is an FPC lead part, 103 is an external connection terminal of the FPC, 104 is a fixed base, 104a is a fixed base alignment part, 5 is a fixed cap, 8 is an aperture part, Reference numeral 13 denotes a housing. Here, the fixed pedestal positioning unit 104a is for fixing the FPC 101 and the fixed pedestal 104 with high accuracy.
[0003]
FIG. 17 shows a cross-sectional view of the solid-state imaging device of FIG. In FIG. 17, reference numeral 104 denotes a fixed base, which is bonded and fixed to the FPC 101 while holding the optical filter 7. A fixed cap 5 holds the optical lens 6 and is installed in a movable state for adjusting the focus with the fixed base 104. Here, the fixed base 104 and the fixed cap 5 constitute a housing 13 that holds the optical lens 6 and the optical filter 7. Further, 9 is a solid-state imaging device connected to the wiring of the FPC 101 through 11 flip chip electrode connection portions, and 10 is an IC component connected to the wiring of the FPC 101 through 11 flip chip electrode connection portions. Further, 12 is a chip component connected to the wiring of the FPC 101. Reference numeral 114 denotes an opening of the FPC 101. Here, reference numeral 15 denotes an adhesive that bonds the solid-state imaging device 9 and the IC component 10 and fixes the folded state of the FPC 101.
[0004]
Further, an example of the conventional technique will be described in detail with reference to FIGS. 11, 12, 13, 14, 15, and 16.
FIG. 11 is a development view of the FPC 101 constituting the conventional solid-state imaging device. Here, 101a denotes an FPC lead portion, 101b denotes an FPC bending position, 114 denotes an FPC opening, and 121 denotes an FPC alignment hole. Here, the FPC alignment hole 121 is provided adjacent to the opening 114 of the FPC.
[0005]
FIG. 12 is a development view in which the solid-state imaging device 9, the IC component 10, and the chip component 12 are mounted on the FPC 101 constituting the conventional solid-state imaging device. Here, the FPC alignment hole 121 is provided adjacent to the solid-state imaging device 9 and the chip component 12.
[0006]
FIG. 13 is a developed rear view in which the front and back of the mounted FPC 101 shown in FIG. 12 are turned over. The fixed base 104 which is the optical system unit shown in FIG. 14 is placed on this and is installed using the 121 FPC alignment holes. FIG. 14 is a diagram showing the shape of the fixed base 104. Here, 104a is a fixed pedestal alignment unit, 104b is a fixed pedestal alignment projection, 5 is a fixed cap, and 8 is a throttle unit. Here, the protrusion 104b of FIG. 14 is dropped into the hole 121 of FIG. 13, and the fixed pedestal 104 is placed and installed.
[0007]
FIG. 15 is a view in which the fixed base 104 is mounted on the mounted FPC 101, and although not shown in the drawing, the contact portion is fixed using an adhesive.
FIG. 16 is a drawing of a conventional solid-state imaging device showing a state in which the FPC is bent at the bending position 101b of FIG. 15 and fixed with an adhesive.
[0008]
Next, as an example of the conventional technique, a conventional operation will be described with reference to FIGS. 17 and 18. The light passing through the diaphragm 8 passes through the optical lens 6, then passes through the optical filter 7 and is irradiated onto the imaging area of the solid-state imaging device 9 to form an image. The imaged imaging information is converted into an electrical signal, and is electrically connected to the FPC 101 via the flip chip electrode connecting portion 11 of the solid-state imaging device 9. The flip chip electrode connecting portion of the IC component 10 is connected via the wiring of the FPC 101. An imaging signal is sent to the IC component 10 through the signal 11, and the processed electric signal is again electrically connected to the FPC 101 through the flip chip electrode connection unit 11, and the FPC external connection terminal 103 through the FPC lead unit 101a. The imaging electric signal is extracted from the camera.
[0009]
[Problems to be solved by the invention]
The conventional solid-state imaging device is configured as described above. Since the alignment hole 121 is adjacent to the solid-state imaging device 9 as shown in FIGS. 12 and 17, the flip chip connecting portion 11 of the solid-state imaging device 9. When routing the wiring connected to the external connection terminal 103 on the FPC 101, it is necessary to pass the wiring while avoiding the alignment hole 121, and it is necessary to make a wiring space on the FPC 101 wide. Therefore, the FPC 101 needs a large area, and there is a problem in miniaturizing the solid-state imaging device.
[0010]
Similarly, it is necessary to place the chip component 12 near the flip chip connecting portion 11 of the solid-state image pickup device 9 and connect the wiring. The mounting position of the chip component 12 is close to the alignment hole 121. When the chip component 12 is arranged, it must be arranged and wired while avoiding the alignment hole 121. Therefore, it is necessary to take a wide space for arranging the chip component 12 and the wiring space of the chip component 12 on the FPC 101. It was.
Here, the reason why it is necessary to arrange the chip component 12 near the solid-state image pickup device 9 and connect the wiring is to provide the chip component 12 with a function of a bypass capacitor. This is because as the wiring is connected to 11 as short as possible, the bypass characteristic is improved, and as a result, a more beautiful captured image is obtained.
[0011]
Furthermore, when the solid-state imaging device is further miniaturized, there is a problem that the distance between the two holes of the alignment hole 121 is shortened and the installation accuracy of the optical system unit 104 is lowered. Therefore, in order to increase the installation accuracy of the fixed seat 104, it is better to set the distance between the two holes of the alignment hole 121 larger, but the FPC 101 has a large area, which is a problem against downsizing of the solid-state imaging device. Met.
[0012]
The present invention has been made to solve the above problems, and while maintaining a high-performance imaging function, the area of the FPC 101 can be kept small to reduce the size (volume reduction) of the solid-state imaging device. The purpose is to plan.
[0013]
[Means for Solving the Problems]
The manufacturing method of the solid-state imaging device according to the present invention includes the following steps.
A wiring board on which a solid-state image sensor is mounted is prepared. A housing capable of accommodating an optical lens is prepared. The housing is fixed to the wiring board so that the optical lens and the solid-state imaging element face each other. The housing is provided with a first alignment portion for alignment with the wiring board, and a first alignment portion for fixing to the wiring board, which is provided closer to the position where the optical lens is accommodated than the first alignment portion. 1 fixed part. The wiring board has a second alignment portion and a second fixing portion that are overlapped with each of the first alignment portion and the first fixing portion when the housing is fixed to the wiring board. After the housing is fixed to the wiring board, the first alignment portion of the housing and the second alignment portion of the wiring board are separated from the housing and the wiring board, respectively.
[0014]
Preferably, the wiring board is a flexible wiring board using polyimide.
[0015]
Further, the housing and the flexible wiring board are fixed with an adhesive.
[0016]
The first alignment portion of the housing has an alignment protrusion. The second alignment portion of the wiring board has an alignment hole. The process of fixing the housing to the wiring board is performed in a state where the alignment protrusion is inserted into the alignment hole .
[0017]
In addition, the alignment unit is configured by an alignment hole and an alignment projection.
[0018]
The method for manufacturing a solid-state imaging device according to the present invention includes a step of preparing a wiring board having an alignment hole, a step of preparing a solid-state imaging element having an imaging pixel area, and the solid-state imaging element on the wiring board. The optical lens is positioned on the imaging pixel area of the solid-state imaging device connected to the wiring substrate, the step of preparing a housing having an alignment projection, and holding the optical lens. After the step of inserting the alignment protrusion of the casing into the alignment hole of the wiring board and fixing the casing on the wiring board with an adhesive, and the step of fixing the casing The portion where the alignment protrusion is formed is cut off from the portion of the housing that holds the optical lens, and the alignment hole is formed from the portion of the wiring board to which the solid-state image sensor is connected. Part And a step of dropping Ri.
[0019]
The wiring board is a wiring board using polyimide.
[0020]
Further, the housing has a pedestal and an alignment portion protruding from the pedestal, and the alignment protrusion protrudes below the alignment portion.
[0021]
The wiring board is a flexible wiring board and includes a step of bending the flexible wiring board.
[0022]
In the cutting process, the cut surface of the housing and the cut surface of the wiring board are flush with each other.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a development view of a flexible wiring board (FPC) of a solid-state imaging device according to the present invention. Here, reference numeral 1 denotes an FPC using a film material such as polyimide. Here, the FPC 1 is shown in a flat state, and this FPC 1 is provided with a printed wiring (not shown). Further, 1a is an FPC lead portion provided in a part of the FPC 1, 1b is an FPC bending position provided in a part of the FPC 1, 3 is an external connection terminal provided at one end of the FPC 1, and 14 is the part provided in a part of the FPC 1. An opening in which a rectangular hole is formed in the FPC 1 so that imaging light of the solid-state imaging device passes, and 21 is a position when the casing (optical system unit) of the solid-state imaging device provided in a part of the FPC 1 is installed. This is an alignment hole in which a hole is formed in the FPC 1 used in the above.
[0024]
Next, FIG. 2 shows a view in which electronic components are mounted on the FPC 1 of FIG. 1 and developed in a plane, and the electronic components are electrically connected by printed wiring (not shown) applied to the FPC 1. Is shown. Here, the FPC 1 in FIG. 2 shows a state in which the solid-state imaging device 9 for imaging a subject is flip-chip mounted with the imaging pixel area facing down so as to cover the opening 14 in FIG. Furthermore, the IC component (semiconductor chip) 10 is flip-chip mounted on the FPC 1 and three chip components (chip capacitors and the like) 12 are mounted.
[0025]
Next, FIG. 3 shows a state where the mounted FPC 1 of FIG. 2 is viewed from the back side. Here, since it is a case of single-sided printed wiring, there is no printed wiring on the surface side shown in FIG.
FIG. 4 is an external view of a housing (optical system unit) 13 according to the present invention. Here, 4 is a fixed base, and an optical filter (infrared cut filter) is built in, 4a is a fixed base alignment portion, 4b is a fixed base alignment protrusion, and 4a is long. It has become. In this long 4a portion, a portion close to 4b becomes a “positioning portion”, and a portion close to 4 in 4a becomes a “fixing portion”.
[0026]
Next, FIG. 5 places the housing (optical system unit) 13 of FIG. 4 on the back surface of the mounted FPC 1 of FIG. 3, and drops the fixed base alignment protrusion 4b into the alignment hole 21 of the FPC 1, FIG. 2 is a development view in a state where the casing (optical system unit) 13 is fixed to the FPC 1 with an adhesive.
[0027]
Next, FIG. 6 shows a state in which the housing (optical system unit) 13 is installed on the mounted FPC 1 in FIG. 5, and the FPC 1 and the fixed base alignment portion 4 a are cut along the outline line of the FPC 1 and fixed. The development view of the state which cut off the part of the base alignment protrusion part 4b and the alignment hole 21 is shown. Here, the bold line portion 22 shows the FPC 1 and the fixed base 4 in a highlighted manner, and is the FPC / fixed base cutting portion 22.
[0028]
Next, FIG. 7 shows a state in which the FPC 1 shown in FIG. 6 is bent at the FPC bending position 1b. FIG. 8 shows a cross-sectional view before bending at this time, and FIG. 9 shows a cross-sectional view after bending. 6, 7, 8, and 9, 8 is an aperture portion, 6 is an optical lens, and 5 is a fixed cap. These are mounted on a fixed base 4, and this fixed base 4 is made of FPC 1 with an adhesive. Fixed to. Note that the solid-state imaging device 9 is electrically connected to the FPC 1 via the flip chip connection portion 11, and similarly, the IC component 10 is also electrically connected to the FPC 1 via the flip chip connection portion 11. Underfill is poured into the periphery of the connecting portion 11, and the underfill is poured into the gap between the FPC 1 and the solid-state imaging device 9, the gap between the FPC 1 and the IC component 10, and these gaps, and is cured and fixed by heat treatment. Here, the chip component 12 is electrically connected to the FPC 1 by soldering, the back surface of the solid-state imaging device 9 and the back surface of the IC component 10 are bonded and fixed with an adhesive 15, and the FPC 1 is fixed in a bent state. The figure is shown in FIG.
[0029]
FIG. 10 is an external view according to the present invention, and it is necessary to pay attention to the place where the side surface portion 4a and the cross-sectional portion 1 coincide and are flush with each other. Here, 4a is a fixed pedestal aligning portion, and 1 is an FPC, which is manufactured by cutting along the thick line 22 in FIG.
[0030]
FIG. 9 is a cross-sectional view of the solid-state imaging device according to the first embodiment. Reference numeral 5 denotes a fixed base 4 which is placed in a movable state for focus adjustment while holding the optical lens 6 with a fixed cap. Here, the fixed base 4 and the fixed cap 5 constitute a housing 13 that holds the optical lens 6 and the optical filter 7. The fixed base 4 and the fixed cap 5 are in a movable state in order to adjust the light entering from the diaphragm unit 8 to be focused on the solid-state image pickup device 9 through the optical filter 7. This is not necessary in some cases. Further, the movable method may be a sliding mechanism simply by fitting, or may be a screw type. In general, after focus adjustment is performed, the movable part of the focus adjustment is fixed with a semi-fixed adhesive, and the focus adjustment fixed solid-state imaging device is often obtained.
[0031]
【The invention's effect】
As described above, according to the present invention, in the step of fixing the housing to the flexible wiring board, the alignment portion and the fixing portion of the housing and the flexible wiring board are provided separately, and the alignment portion is provided after the housing is fixed. By separating from the solid-state imaging device, the wiring area of the FPC 1 can be used effectively, and the solid-state imaging device can be miniaturized (small volume) while maintaining a high-performance imaging function.
[0032]
Further, in the step of fixing the housing to the flexible wiring board, the reinforcing plate is further fixed to the back surface of the flexible wiring board with respect to the surface on which the housing is fixed, so that good mechanical strength can be obtained.
[0033]
In addition, in the process of providing a reinforcing plate between the housing and the flexible wiring board and fixing the housing to the reinforcing plate, the surface on which the housing is fixed becomes the reinforcing plate, and it is fixed to it. Strength is obtained.
[0034]
In addition, the reinforcing plate is provided by separating the alignment portion with the flexible wiring board and the fixing portion, and after fixing, the alignment portion is separated from the solid-state imaging device, thereby reducing the size (smaller volume) of the solid-state imaging device. In addition, the solid-state imaging device can be flip-chip mounted easily and accurately.
[0035]
Moreover, since the alignment part is comprised by the hole part for alignment, and the protrusion part for alignment, it can align easily.
[0036]
Preparing a wiring board having an alignment hole; preparing a solid-state imaging device having an imaging pixel area; connecting the solid-state imaging device on the wiring board; holding an optical lens; A step of preparing a housing having a protrusion, and the alignment protrusion of the housing so that the optical lens is positioned on an imaging pixel area of a solid-state imaging device connected on the wiring board. After inserting into the alignment hole of the wiring board and fixing the casing on the wiring board with an adhesive, and after fixing the casing, from the portion holding the optical lens of the casing, And a step of cutting off the portion where the alignment protrusion is formed and cutting off the portion where the alignment hole is formed from the portion where the solid-state imaging device of the wiring board is connected. Can be effectively used wiring area, while maintaining a high-performance imaging function, it is possible to achieve miniaturization of the solid-state imaging device (small volume of).
[0037]
Moreover, since the wiring board is a wiring board using polyimide, good mechanical strength can be obtained.
[0038]
In addition, since the housing has a pedestal and an alignment portion that protrudes from the pedestal, and the alignment protrusion protrudes below the alignment portion, the alignment can be easily performed. Can do.
[0039]
In addition, the wiring board is a flexible wiring board and has a step of bending the flexible wiring board, so that the solid-state imaging device can be miniaturized.
[0040]
Further, since the cut surface of the housing and the cut surface of the wiring board are flush with each other in the cutting process, the solid-state imaging device can be miniaturized.
[Brief description of the drawings]
FIG. 1 is a development view of an FPC according to a first embodiment of the present invention.
FIG. 2 is a development view of a mounted FPC according to the first embodiment of the present invention.
FIG. 3 is a developed rear view of a mounted FPC according to Embodiment 1 of the present invention;
FIG. 4 is an external view of a casing (optical system unit) according to Embodiment 1 of the present invention.
FIG. 5 is a development view in which a housing (optical system unit) is attached to the FPC according to Embodiment 1 of the present invention;
FIG. 6 is a development view of the FPC showing a cut portion according to the first embodiment of the present invention.
FIG. 7 is an external view of a solid-state imaging device according to Embodiment 1 of the present invention.
FIG. 8 is a developed cross-sectional view of the solid-state imaging device according to Embodiment 1 of the present invention.
FIG. 9 is a cross-sectional view of the solid-state imaging device according to Embodiment 1 of the present invention.
FIG. 10 is an external view of a solid-state imaging device according to Embodiment 1 of the present invention.
FIG. 11 is a development view of a conventional FPC.
FIG. 12 is a development view of a conventional mounted FPC.
FIG. 13 is a developed rear view of a conventional mounted FPC.
FIG. 14 is an external view of a conventional casing (optical system unit).
FIG. 15 is a development view in which a conventional casing (optical system unit) is installed on a conventional FPC.
FIG. 16 is a diagram of a conventional solid-state imaging device.
FIG. 17 is a cross-sectional view of a conventional solid-state imaging device.
FIG. 18 is an external view of a conventional solid-state imaging device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flexible wiring board (FPC), 1a FPC lead part, 1b FPC bending position, 3 External connection terminal, 4 Fixed base, 4a Fixed base alignment part, 4b Fixed base alignment protrusion part, 5 Fixed cap, 6 Optical lens, 7 optical filter, 8 aperture, 9 solid-state imaging device, 10 IC component, 11 flip chip connection, 12 chip component, 13 housing (optical system unit), 14 opening, 15 adhesive, 21 alignment hole, 22 FPC / fixed base cutting part, 101 conventional FPC, 101a conventional FPC lead part, 101b conventional FPC bending position, 103 conventional FPC external connection terminal, 104 conventional fixed base, 104a conventional fixed base alignment part, 104b Conventional fixed base alignment protrusion, 114 Conventional FPC opening, 121 Conventional FPC position Align hole.

Claims (4)

(A) preparing a wiring board on which a solid-state imaging device is mounted;
(B) preparing a housing capable of accommodating an optical lens;
(C) fixing the casing to the wiring board so that the optical lens and the solid-state imaging element face each other;
The housing includes a first alignment portion for alignment with the wiring board, and the wiring board provided near a position where the optical lens is accommodated as compared to the first alignment portion. A first fixing portion for fixing,
The wiring board has a second alignment portion and a second fixing portion that are overlapped with each of the first alignment portion and the first fixing portion in the step (c),
(D) After the step (c), the method further includes a step of separating the first alignment portion of the casing and the second alignment portion of the wiring board from the casing and the wiring board, respectively. A method for manufacturing a solid-state imaging device. The method for manufacturing a solid-state imaging device according to claim 1, wherein the wiring board is a flexible wiring board using polyimide. The method of manufacturing a solid-state imaging device according to claim 2, wherein the casing and the flexible wiring board are fixed by an adhesive. The first alignment portion of the housing has an alignment protrusion, and the second alignment portion of the wiring board has an alignment hole;
The method of manufacturing a solid-state imaging device according to claim 1, wherein the step (c) is performed in a state where the alignment protrusion is inserted into the alignment hole.

Images