KR100613419B1 - Image Sensor Module and the product method thereof - Google Patents

Abstract

The present invention relates to an image sensor module and a method of manufacturing the same, the image sensor module has a plurality of pads for wire bonding the image sensor, the upper surface and the printed circuit board is a flexible printed circuit board (FPCB) soldered coupled A circuit board (PCB), the image sensor is wrapped on an upper surface thereof, and an upper portion thereof includes a housing in which a lens-coupled barrel is screwed together, and a filter installed inside the housing, wherein the housing is formed of a wire bonding pad of the PCB. Bonded to the PCB so as to press a predetermined portion, and a method of manufacturing the adhesive comprises: bonding an image sensor to an upper surface of a central portion of the PCB with an adhesive, wire bonding each pad of the image sensor with a pad of the PCB, and housing the housing. Adhesive bonding to the PCB to press and press about 2/3 of the PCB's wirebonding pad length The step of assembling the lens A'ssy in the housing, connecting the circuit elements on the bottom of the PCB to each pad in the SMT process and the pads of the FPCB to the plurality of pads on the bottom of the PCB hot bar (Hot Bar) is made through the step of bonding through work.

Therefore, according to the present invention, the elements located on the upper surface of the PCB can be mounted on the bottom of the PCB, thereby minimizing the size of the image sensor module, making the housing easy, and at the same time, eliminating the flux contamination generated during the soldering operation of the SMT process. By reducing process defects, it is possible to improve reliability and yield.

Image sensor, module, camera, FPCB, short circuit

Description

Image sensor module and its manufacturing method

1A is a cross-sectional view of a conventional general image sensor module mounted on a PCB;

Figure 1b is a top view of the PCB of the prior art,

Figure 1c is a bottom view of the PCB of the prior art,

Figure 1d is a prior art FPCB,

2A is a cross-sectional view of the image sensor module of the present invention mounted on a PCB;

Figure 2b is a top view of the PCB of the present invention,

Figure 2c is a bottom view of the PCB of the present invention,

And,

2D is an FPCB diagram of the present invention.

* Description of symbols on the main parts of the drawings *

110: image sensor module 112: image sensor

114: filter 116: housing outline

117: housing inner line 132: capacitor

141: PCB 142: PCB outline line

150 housing 170 lens

180: barrel

The present invention relates to a method for manufacturing an image sensor module, and more particularly to a method for manufacturing a miniaturized image sensor module.

Nowadays, digital cameras are increasing in frequency with Internet video communication, and with the recent increase of the next generation mobile communication terminals such as PDAs and IMT-2000 terminals, small cameras for using these small information communication terminals for video communication, etc. The need for modules is increasing. In other words, the demand for ultra-slim camera modules, which are directly and indirectly connected to high functional and multifunctional digital camera products, is increasing. In particular, in the future, PDAs will be diverted from simple schedule management and transformed into multimedia devices utilizing various peripheral devices such as camera modules and mobile communication modules. Of course, it is not only considered a multimedia service that can store, transmit, and provide still images and videos, but also it is expected that there is an increasing need for a camera module that is further miniaturized and thinned.

In accordance with the miniaturization and light weight of the electronic products, flexible printed circuit boards (hereinafter referred to as "FPCBs") have been developed and used. FPCB has excellent workability, heat resistance, bending resistance, chemical resistance, and heat resistance, so it is the core parts of all electronic products such as cameras, computer and peripherals, mobile phones, VIDEO & AUIDIO devices, CAMCORDER, PRINTER, DVD, TFT LCD, It is widely used in satellite equipment, military equipment, medical equipment, etc. Among mobile phones, it is widely used to connect LCD module and main board or especially to PCB equipped with image sensor and main board. . An image sensor is a semiconductor module that converts an optical image into an electrical signal. It is a component used to store, transmit, and display the image signal as a display device. When connecting a PCB equipped with an image sensor and the main board, Due to the compact PCB size, connecting the FPCB is not easy. In addition, in order to mount the image sensor on the PCB, since it is usually mounted using a module, the connection becomes more difficult due to the space constraint of the module.

Hereinafter, a method of installing the conventional module on a PCB will be described with reference to FIGS. 1A to 1D. 1A is a cross-sectional view of a conventional general image sensor module mounted on a PCB, FIG. 1B is a top view of the PCB of the prior art, FIG. 1C is a bottom view of the PCB of the prior art, and FIG. 1D is an FPCB diagram of the prior art. As shown in FIG. 1, the image sensor module 10 includes a lens A'ssy having an image sensor 12 installed on a central upper surface of a PCB 41 used as a substrate, and including a barrel 18 and a lens 17. It further includes a housing 15, a filter 14, and an FPCB 70 for supporting the same. In addition, a plurality of circuit elements for signal processing are mounted on the PCB 41 so that the image sensor 12 can operate. In particular, as a bypass element, a capacitor 32 is an upper surface of the PCB 41 and the image sensor. It is surface-mounted by the SMT process at the adjacent distance of (12). In this description, four capacitors 32 are described. SMT is Surface Mount Technology (Surface Mount Technology), which is a technology that prints lead on PCB, mounts chip components on it, and bonds (solders) between PCB and lead components using reflow. A barrel 18 coupled with a screw is installed inside the housing 15 surrounding the image sensor module 10 on an upper surface thereof, and a lens 17 is mounted in the barrel 18 (hereinafter, referred to as a barrel 18). Attached to the lens 17 is referred to as lens A 'ssy). In addition, the FPCB 70 is connected to the filter 14 installed in the housing 15 and the rear surface of the PCB 41. The image sensor module 10 first SMT components such as the capacitor 32 on the upper surface of the PCB 41, and attaches the image sensor 12 to the upper surface of the central portion of the PCB 41, and then wire bonding upwards. By performing the steps of connecting the terminals, sealing the housing (Housing sealing), mounting the lens A'ssy and bonding the FPCB 70 to manufacture the image sensor module. In the above process, a conventional FPCB bonding process will be described. First, referring to the bottom view of the PCB 41 of FIG. 1C, a plurality of pads 51 and 61 to be plated with SnPb to be combined with the FPCB 70 and plating lines 52 and 62 are formed on each pad are provided with the FPCB 70. A certain length is derived from the outside of the flexible cable. In the plating method, an electrode is connected to each of the plating lines 52 and 62, and SnPb may be electroplated. However, the plating is completed in a thickness of 20 ± 5 μm, and the plating is completed. It is preferable to cut by.

In addition, FIG. 1D is a FPCB 70 having a plurality of layers to be combined with the bottom view of the PCB 41, and the pad 71 to be soldered to the pad of the PCB 41 and the plating line 72 to plate each pad are uniform. The length is derived and some pads are connected to the lower layers of the plurality of layers through via holes (73).

Accordingly, the bottom surface of the PCB 41 and the FPCB 70 are bonded by hot bar work and bonded.

In this case, as shown in FIG. 1B, a plurality of wire bonding pads 33 for wire bonding the image sensor 12 to the PCB 41 and mounting the capacitor 32 are provided at an adjacent distance of the image sensor 12 and the housing ( The inner line 17 of 15 may be formed at the closest distance between the wire bonding pad 33 and the capacitor 32 to reduce the overall size of the image sensor module 10. That is, the outer line 16 and the PCB outer line 42 of the housing 15 may also be reduced in size when the size of the inner line 17 of the housing 15 is reduced. However, since the capacitor 32 is located on the upper surface of the PCB 41, the housing 15, which is adhesively fixed to the upper surface of the PCB 41, should not be pressed against the capacitor 32. Since 17) is to be enlarged around the capacitor 32, the size of the PCB 41 and the housing 15 is inevitably increased by the size of the capacitor 32. In addition, in order to minimize the size of the module, the inner line 17 of the housing 15 also has a complicated structure such as precisely shaving the boundary portion near the capacitor 32, making the housing mold difficult and inferior in case of injection. It has an element of.

In addition, the wire bonding operation as described above is easily opened due to vibration or shock, and often causes malfunctions, and the flux component used in the SMT process of the capacitor 32 flows into the peripheral wire bonding pad portion. In this case, wire bonding is not performed, which causes a defect.

The present invention is to solve the above problems, to minimize the size of the image sensor module, to facilitate the housing manufacturing and soldering operation of the SMT process by allowing the devices located on the upper surface of the PCB to be mounted on the bottom of the PCB The aim is to provide an image sensor module device that can reduce flux contamination and reduce process defects to improve reliability and yield.

The image sensor module according to an embodiment of the present invention for solving the above object is provided with a plurality of pads for wire bonding the image sensor, the upper surface and the flexible printed circuit board (FPCB) is soldered coupled to the bottom A printed circuit board (PCB), the image sensor is wrapped on the upper surface and the upper portion comprises a housing in which the lens-coupled barrel is screwed and a filter installed inside the housing and the housing wire bonding pad of the PCB It is coupled to the PCB to support a predetermined portion of the.

The circuit elements for performing the function of the image sensor are formed on the bottom surface of the PCB, and two SMT pads are configured to SMT the circuit elements, but not to be shorted between the pad soldered to the FPCB and the SMT pad. It is preferable that the plating lines of the pads installed at intervals (about 300 μm or more) and soldered to the FPCB are connected to specific SMT pads to form the plating lines.

In addition, the pad of the FPCB to be soldered to the PCB is more preferably formed in the connector portion of the FPCB without forming a plating line directly to the outside.

Method of manufacturing an image sensor module according to an embodiment of the present invention for achieving the above object is the step of bonding the image sensor to the upper surface of the central portion of the PCB with an adhesive, each pad of the image sensor and the pad of the PCB wire Bonding the housing, adhesively mounting the housing to the PCB so as to press and press about two-thirds the length of the wire bonding pad of the PCB, assembling the lens A'ssy to the housing, the bottom of the PCB Connecting the circuit elements to the respective pads in an SMT process, and bonding the pads of the FPCB to a plurality of pads on the bottom of the PCB through a hot bar operation.

On the bottom of the PCB, two SMT pads are configured to SMT the circuit elements, but are provided at a predetermined interval (300 μm or more) so as not to be shorted between the pads soldered to the FPCB and the SMT pads, and the pads soldered to the FPCB. The plating line of is preferably connected to a specific SMT pad to form a plating line.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2A is a cross-sectional view of the image sensor module of the present invention mounted on a PCB, FIG. 2B is a top view of the PCB of the present invention, FIG. 2C is a bottom view of the PCB of the present invention, and FIG. 2D is an FPCB diagram of the present invention. As shown, since the general configuration of the image sensor module is the same as the prior art, the description thereof will be omitted and only the configuration of the housing, the PCB, and the FPCB, which are the features of the present invention, will be described. As shown in the cross-sectional view of FIG. 2A, the entire length B of the housing 150 is smaller than the previous length A by placing the capacitor 132 located on the top surface of the PCB 141 on the bottom surface of the PCB 141. By reducing the size of the module can be minimized. The inner line 117 of the housing 150 is also produced monotonously to facilitate mold making and reduce defects in injection (see FIG. 2B). In addition, as the capacitor 132 is moved to the bottom surface of the PCB 141, the inner line 117 of the housing 150 also moves near the terminal of the image sensor 112, and also the terminal 113 of the image sensor 112. Wire bonding pad (133) and the wire bonding pad (133) to the inner line 117 of the housing 150 to crimp a portion of the wire bonding pad 133 so as to prevent defects and increase the bonding force after wire bonding. 133) to overlap. Preferably, about 2/3 of the length of the soldering pad 133 may be pressed and pressed.

Reference numeral 142 shows the outer line 142 of the PCB 141, 116 shows the outer line of the housing 150. In addition, the filter 114 refers to a conventional IR cut-off filter used in the image sensor module, the role is configured to block the light of the wavelength of 650nm or more to perform the function of filtering the light entering the camera sensor.

On the other hand, the structural difference as the capacitor 132 is moved to the bottom of the PCB 141 will be described with reference to Figure 2c. Two SMT pads are configured to SMT the capacitor 132, and are installed at predetermined intervals so as not to short between the FPCB 190, the pad 150 to be soldered, and the SMT pads 151 and 152, and the FPCB 190 The plating line of the pad 150 to be soldered with is connected to a specific SMT pad 151 to form a plating line 152. That is, although the conventional plating lines 162 are directly connected to the pad 161, the plating line of the pad 150 is the plating line 153 connected to any one pad 151 of the SMT pads so as to prevent a short. ) To form separately. The pad 150 and the SMT pads 151 and 152 may be spaced about 300 μm apart. In addition, it is more preferable that the SMT pads 151 and 152 are positioned at four corners, as shown in the figure, to be symmetrical with each other to maintain flatness of the module. As described above, by placing the capacitor 132 on the bottom surface of the PCB 141, the problem of poor wire bonding caused by contamination of the pad around the capacitor 132 by the flux component generated during the soldering operation. You can also solve.

Hereinafter, the FPCB 190 coupled to the PCB 141 will be described with reference to FIG. 2D. Conventional FPCB 70 has a fine spacing between the PCB outer line 42 and the FPCB outer line 74, but the FPCB 141 of the present invention has a spacing C between the PCB outer line 142 and the FPCB outer line 194. ) Is formed to be wide. This is because the capacitor 132 is located on the bottom of the PCB 141, the width of the FPCB 190 is reduced by the size of the capacitor. Therefore, in the past, when the FPCB 70 is aligned with the PCB 41 and bonded, defects in which the FPCB 70 protrudes out of the PCB outer line 42 due to a small process margin have occurred. Since the distance C between the outer line 142 and the FPCB outer line 194 is secured, it is effective for managing module size tolerances. In addition, the plating line 192 of the edge pad 191 is formed in the connector 195 through the via hole (Via Hole: 193) so as not to be short with the SMT pad 152.

Hereinafter, a process of manufacturing the image sensor module according to the above configuration will be described.

First, the image sensor 112 is adhered to the upper surface of the central portion of the PCB 141 by an adhesive (die attach process), and then each pad 113 of the image sensor 112 and the pad 133 of the PCB 141 are upwardly disposed. Bond with Au wire to connect. Afterwards, the housing 115 for protecting the image sensor 122 from foreign matter and fixing the lens 117 is adhered with an adhesive so as to match the housing lines 116 and 117 of the PCB 141. At this time, the housing 115 is pressed by about two-thirds of the length of the wire bonding pad 113, and serves to strengthen the bonding. Subsequently, the lenses A'ssy 117 and 118 having the lens 117 mounted on the barrel 118 are assembled to the housing 115, and the pads 151 and 152 on the bottom surface of the PCB 141 by the SMT process. Connect to Lastly, the pads of the FPCB 170 are adhered to the plurality of pads on the bottom surface of the PCB 141 assembled as described above through a hot bar operation, and an insulating tape or an insulating material is added to protect the capacitor 132. To complete the process.

While the invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

According to the method of manufacturing an image sensor module according to the present invention as described above, it is possible to attach the elements located on the upper surface of the PCB to the bottom of the PCB to minimize the size of the image sensor module, and at the same time easy to manufacture the housing SMT By reducing the flux contamination during soldering of the process, process defects can be reduced to improve reliability and yield.

Claims (8)

Image sensor; A printed circuit board (PCB) having a plurality of pads for wire-bonding the image sensor on an upper surface thereof and a flexible printed circuit board (FPCB) soldered to the bottom surface thereof; A housing in which the image sensor is wrapped on an upper surface thereof, and a barrel in which a lens is coupled is screwed on an upper portion thereof; And And a filter installed inside the housing, wherein the image sensor module is adhesively bonded to the PCB so that the housing can be pressed by pressing about 2/3 of the wire bonding pad of the PCB. . The method of claim 1, Image sensor module, characterized in that the circuit elements for performing the function of the image sensor is formed on the bottom surface of the PCB. The method of claim 2, In order to SMT the circuit element, two SMT pads are configured, and the pads to be soldered to the FPCB and the SMT pads are installed at predetermined intervals so as not to be short-circuited. Image sensor module, characterized in that to form a plating line. The method of claim 3, wherein The predetermined interval is an image sensor module, characterized in that installed spaced apart more than 300㎛. The method of claim 3, wherein The pad of the FPCB soldered to the PCB is The image sensor module, characterized in that formed on the connector portion of the FPCB without forming a plating line directly to the outside. In the method for manufacturing an image sensor module composed of a housing, a filter and an FPCB for supporting the lens A'ssy composed of a PCB, an image sensor and a barrel and a lens, Bonding an image sensor to an upper surface of a central portion of the PCB with an adhesive; Wire bonding each pad of the image sensor with a pad of the PCB; Adhesively mounting the housing to the PCB so as to press and compress about 2/3 of the wirebonding pad length of the PCB; Assembling the lens A'ssy into a housing; Connecting circuit elements on the bottom surface of the PCB to respective pads through an SMT process; And And bonding a pad of the FPCB to a plurality of pads on a bottom surface of the PCB through a hot bar operation. The method of claim 6, On the bottom of the PCB, two SMT pads are configured to SMT the circuit element, but are provided at predetermined intervals so as not to be shorted between the pad to be soldered to the FPCB and the SMT pad, and the plating line of the pad to be soldered to the FPCB is specified. Method of manufacturing an image sensor module characterized in that it is connected to the SMT pad to form a plating line. The method of claim 6, The predetermined interval is an image sensor module manufacturing method characterized in that the spaced apart more than 300㎛ installed.

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