CN112312674A - Molded circuit board, camera module, manufacturing method of camera module and electronic equipment - Google Patents

Molded circuit board, camera module, manufacturing method of camera module and electronic equipment Download PDF

Info

Publication number
CN112312674A
CN112312674A CN201910698550.8A CN201910698550A CN112312674A CN 112312674 A CN112312674 A CN 112312674A CN 201910698550 A CN201910698550 A CN 201910698550A CN 112312674 A CN112312674 A CN 112312674A
Authority
CN
China
Prior art keywords
layer
molding
circuit board
main body
front surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910698550.8A
Other languages
Chinese (zh)
Inventor
栾仲禹
黄桢
卢彬
刘丽
郑程倡
李婷花
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201910698550.8A priority Critical patent/CN112312674A/en
Priority to US17/631,565 priority patent/US20220279094A1/en
Priority to PCT/CN2020/099767 priority patent/WO2021017743A1/en
Priority to EP20848503.7A priority patent/EP4007460A4/en
Publication of CN112312674A publication Critical patent/CN112312674A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

A molded circuit board, a camera module, a manufacturing method of the camera module and an electronic device are provided. The molded circuit board comprises a circuit board main body and a molded structure. The circuit board main body comprises at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are overlapped at intervals. The molding structure comprises a molding layer, wherein the molding layer is overlapped on at least one surface of the circuit board main body so as to cover at least one part of the substrate layer of the circuit board main body.

Description

Molded circuit board, camera module, manufacturing method of camera module and electronic equipment
Technical Field
The invention relates to the technical field of electronic information, in particular to a molded circuit board, a camera module, a manufacturing method of the camera module and electronic equipment.
Background
The circuit board is one of the core components of various electronic devices, and can provide mechanical support for fixing and assembling various electronic components such as an integrated circuit, so as to realize wiring, electrical connection and electrical insulation among the various electronic components. Generally, a wiring board is a conductive pattern formed by forming a printed wiring, a printed element, or a combination of both on an insulating substrate according to a predetermined design. The types of wiring boards generally include single-sided wiring boards, double-sided wiring boards, and multilayer wiring boards. The single-sided circuit board or the double-sided circuit board is generally formed by etching a circuit on a copper clad laminate having a single-sided copper clad layer or a double-sided copper clad layer (of course, a punching process is also applied to a part of the circuit board), and the copper clad laminate is formed by laminating a copper foil and a substrate (the substrate is made of an insulating material). Multilayer wiring boards are generally manufactured by a lamination method, which is mainly formed by laminating a plurality of wiring layers (currently, the material of the wiring layer is generally copper) and a plurality of substrates, and then drilling via holes (not shown) between the wiring layers on the multilayer wiring board to electrically connect the wiring layers.
At present, whether a single-sided circuit board, a double-sided circuit board or a multilayer circuit board, a circuit board manufactured by a lamination method or a circuit board manufactured by an additive method, the surface of the circuit board is generally provided with exposed circuits, via holes, pads and a substrate, therefore, a layer of ink layer is generally arranged on the surface of the circuit board in a printing, curtain-spraying, spraying or roll-coating mode and is used for solder mask insulation (namely, all circuits and copper surfaces on the circuit board are covered by the ink layer, and through holes to be welded and pads of the circuit board are reserved, short circuit is prevented from being caused when electronic components are welded, and meanwhile, the circuits can be prevented from being conducted) and a protective circuit board (namely, all circuits on the circuit board are covered by the ink layer, and the circuits are prevented from being oxidized to harm the electrical performance due to the invasion of moisture and various dielectrics, and external mechanical injury can be prevented).
However, as the performance of electronic devices is higher, the chips mounted on the circuit board generate more heat, and the heat dissipation performance of the ink is relatively poor, which may seriously affect the heat dissipation of the circuit board and the chips, thereby causing the performance of the electronic devices to be degraded. Especially for the module of making a video recording, the sensitization chip of the module of making a video recording is usually installed on the circuit board by the subsides, because the existence of printing ink layer makes the heat-sinking capability of this circuit board relatively poor, and then influences the heat dissipation of this sensitization chip, can lead to the performance of this module of making a video recording to seriously descend.
In addition, because the laying process (printing, curtain coating, spraying, rolling coating, or the like) of the ink layer has an inherent defect that the surface of the ink layer is not smooth, for an electronic device such as a camera module which needs to directly attach a chip to a circuit board, the ink layer on the circuit board causes the problems of inclination, bending, and the like of the attachment of the chip to the circuit board, and errors are brought to the assembly of the electronic device, so that the performance of the electronic device is reduced.
In addition, because the ink layer lacks plastic deformation capability and toughness, the ink layer on the surface of the circuit board is easy to break, so that stains can be generated to damage the circuit on the circuit board, and the performance of the electronic equipment is further influenced.
Disclosure of Invention
An object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, which can improve the performance of the camera module and the electronic device.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded circuit board has good heat dissipation performance, which is helpful for improving the problem of relatively poor heat dissipation performance of the conventional circuit board.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded circuit board replaces an ink layer on an existing circuit board with a molded structure, which helps to solve the problems caused by the inherent defects of the ink layer.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, a molding layer of the molding structure of the molded circuit board is formed by curing a molding material with good heat dissipation performance on a surface of a circuit board main body through a molding process, so that the heat dissipation performance of the molding structure is better than that of an ink layer, which is beneficial to enhancing the heat dissipation performance of the molded circuit board and is convenient for enhancing the performance of the camera module and the electronic device.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded structure can improve the structural strength of the molded circuit board and reduce the bending degree of the molded circuit board.
Another object of the present invention is to provide a molded circuit board and a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the method for manufacturing the molded circuit board eliminates the arrangement of ink on the circuit board main body, so that the molded structure can be directly combined with the circuit board main body, which helps to increase the bonding strength between the two.
Another object of the present invention is to provide a molded circuit board and a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the process of ink layout is eliminated, so that the method for manufacturing the molded circuit board is simplified, which helps to reduce the manufacturing cost.
Another object of the present invention is to provide a molded circuit board and a camera module, and a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded circuit board can provide a flat mounting surface through the molded structure, which is helpful for improving the performance of the camera module and the electronic device.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded circuit board can avoid the problem of contamination caused by the broken ink layer, which is the case with the conventional circuit board, and is helpful to improve the protection of the circuit board main body.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded structure of the molded circuit board can provide a mounting surface for a lens assembly to replace a lens holder or a base in an existing camera module, which helps to simplify the assembly process of the camera module.
Another object of the present invention is to provide a molded circuit board, a camera module, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the molded structure of the molded circuit board can provide a chip mounting surface and/or a mounting surface with good flatness, so as to avoid the problem of tilting and bending of a chip and an optical lens during mounting, and to help ensure good performance of the camera module and the electronic device.
Another object of the present invention is to provide a molded wiring board and a camera module, a method of manufacturing the same, and an electronic apparatus, in which it is not necessary to use expensive materials or complicated structures in order to achieve the above object. Therefore, the present invention successfully and effectively provides a solution to not only provide a simple molded circuit board and camera module, and methods of manufacturing the same, and an electronic apparatus, but also increase the practicality and reliability of the molded circuit board and camera module, and methods of manufacturing the same, and an electronic apparatus.
To achieve at least one of the above objects or other objects and advantages, the present invention provides a method for manufacturing a molded wiring board, comprising the steps of:
providing a circuit board main body, and forming a molding layer of a molding structure on at least one surface of the circuit board main body through a molding die by curing an insulating molding material.
According to an embodiment of the present invention, the step of providing a circuit board main body, and forming a molding layer of a molding structure on at least one surface of the circuit board main body through a molding die by curing an insulating molding material includes the steps of:
and curing the insulating molding material on the front surface of the circuit board main body to form a front surface molding layer of the molding structure by using an upper mold of the molding mold, wherein the front surface molding layer only covers the front surface conducting circuit of the front surface circuit layer of the circuit board main body, so that the bonding pad of the front surface circuit layer is exposed outside.
According to an embodiment of the present invention, the step of forming a front molding layer of the molding structure on the front surface of the circuit board main body by curing the insulating molding material through an upper mold of the molding mold includes the steps of:
placing the circuit board main body on the upper die of the forming die, so that the inner surface of the upper die is pressed on the bonding pad of the front surface circuit layer of the circuit board main body, and a front surface molding space is formed between the inner surface of the upper die and the front surface of the circuit board main body; and
injecting the insulating molding material into the front molding space to form the front molding layer after curing.
According to an embodiment of the present invention, the method for manufacturing a molded circuit board further includes, before the step of placing the circuit board main body on the upper mold of the molding mold, the steps of:
and etching the front surface conducting circuit of the front surface circuit layer of the circuit board main body to reduce the height of the front surface conducting circuit, so that the surface of the front surface conducting circuit is lower than the surface of the bonding pad.
According to an embodiment of the present invention, before the step of placing the circuit board main body on the upper mold of the molding mold, the method further includes the steps of:
and depositing metal on the bonding pad of the front surface circuit layer of the circuit board main body through a deposition process to increase the height of the bonding pad, so that the surface of the front surface conducting circuit is lower than the surface of the bonding pad.
According to an embodiment of the present invention, the step of providing a circuit board main body, and forming a molding layer of a molding structure on at least one surface of the circuit board main body through a molding die by curing an insulating molding material includes the steps of:
forming a front molding layer of the molding structure on the front surface of the circuit board main body by an upper mold of the molding mold through curing of the insulating molding material, wherein the front molding layer only covers the surface of a substrate layer of the circuit board main body, so that a front conducting circuit and a bonding pad of the front circuit layer are exposed outside; and
correspondingly, an insulating protection layer is arranged on the front surface conducting circuit of the front surface circuit layer to cover the front surface conducting circuit.
According to an embodiment of the present invention, the step of forming the front molding layer of the molding structure on the front surface of the circuit board main body by curing the insulating molding material through an upper mold of a molding mold includes the steps of:
placing the circuit board main body on the upper die of the forming die, so that the inner surface of the upper die is simultaneously pressed on the front surface conducting circuit and the bonding pad of the front surface circuit layer of the circuit board main body, and a front surface molding space is formed between the inner surface of the upper die and the front surface of the circuit board main body; and
injecting the insulating molding material into the front molding space to form the front molding layer after curing.
According to an embodiment of the present invention, the step of providing a circuit board main body, and forming a molding layer of a molding structure on at least one surface of the circuit board main body by curing an insulating molding material through a molding die further includes the steps of:
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body by curing the insulating molding material through a lower mold of the molding mold, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body.
According to an embodiment of the present invention, the method for manufacturing a molded circuit board further comprises the steps of:
and attaching a group of electronic components to the bonding pads of the front circuit layer of the circuit board main body.
According to an embodiment of the present invention, the step of forming a molding layer of a molding structure by providing a circuit board main body and curing an insulating molding material on at least one surface of the circuit board main body through a molding die includes the steps of:
attaching a group of electronic components to a bonding pad of a front circuit layer of the circuit board main body;
forming a front molding layer and a molding packaging body of the molding structure on the front surface of the circuit board main body by an upper mold of the molding mold through curing of the insulating molding material, wherein the front molding layer covers a front conducting circuit of the front circuit layer, and the molding packaging body covers the electronic component; and
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body by curing the insulating molding material through a lower mold of the molding mold, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body to manufacture the molded circuit board.
According to an embodiment of the invention, the front surface molding layer only covers the front surface conductive circuit on the front surface circuit layer at the edge region of the circuit board main body.
According to an embodiment of the present invention, the heat dissipation efficiency of the insulating molding material is greater than that of the ink material.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, including the steps of:
the method of manufacturing a molded wiring board according to any one of the above, manufacturing the molded wiring board;
mounting at least one photosensitive chip on the molding circuit board, and connecting each photosensitive chip with the molding circuit board in a conductive manner; and
and correspondingly arranging a lens assembly on the molding circuit board, so that each optical lens of the lens assembly is positioned on the corresponding photosensitive path of the photosensitive chip.
According to an embodiment of the present invention, the method for manufacturing a camera module further includes:
a light filtering component is correspondingly arranged between the molding circuit board and the lens component, so that light rays entering from each optical lens are received by the photosensitive chip after passing through the light filtering element of the light filtering component.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, including the steps of:
the method comprises the following steps that at least one photosensitive chip is conductively mounted in a chip mounting area of a circuit board main body, and a group of electronic components are conductively mounted in an edge area of the circuit board main body;
forming a front molding layer and a molding packaging body of a molding layer of a molding structure on the front surface of the circuit board main body through a molding die by curing an insulating molding material, wherein the front molding layer only covers front conducting circuits on the front circuit layer of the circuit board main body and positioned at the edge area of the circuit board main body, and the molding packaging body covers the electronic component and the non-photosensitive area of the photosensitive chip;
correspondingly arranging at least one filter element of a filter assembly on the molding packaging body, wherein each filter element is positioned on the corresponding photosensitive path of the photosensitive chip; and
and correspondingly arranging a lens assembly on the molded packaging body of the molding structure, wherein each optical lens of the lens assembly is positioned on the photosensitive path of the corresponding photosensitive chip, so that light rays entering from each optical lens are received by the photosensitive chip after passing through the corresponding filter element.
According to an embodiment of the present invention, the method for manufacturing a camera module further includes:
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body through the molding die by curing the insulating molding material, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body.
According to another aspect of the present invention, there is also provided a molded wiring board comprising:
the circuit board comprises a circuit board main body, a circuit board main body and a circuit board, wherein the circuit board main body comprises at least one circuit layer and at least one substrate layer, and the circuit layer and the substrate layer are overlapped at intervals; and
a molding structure, wherein the molding structure comprises a molding layer, wherein the molding layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body.
According to an embodiment of the present invention, the molding layer of the molding structure includes a front molding layer, wherein the front molding layer is stacked on a front surface of the circuit board main body to cover the substrate layer on the front surface of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer includes a front surface via circuit and a set of pads conductively connected to the front surface via circuit, and wherein the front surface molding layer further covers the front surface via circuit of the front surface circuit layer.
According to an embodiment of the present invention, the front surface molding layer of the molding structure is provided with a groove corresponding to the pad of the front surface circuit layer, so as to ensure that the pad of the front surface circuit layer is exposed while the front surface molding layer covers the front surface conductive circuit of the front surface circuit layer of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer includes a front surface via line and a set of pads conductively connected to the front surface via line, wherein the molding structure further includes an insulating protective layer, wherein the insulating protective layer is stacked on the front surface molding layer and corresponds to the front surface via line of the front surface circuit layer of the circuit board main body to cover the front surface via line.
According to an embodiment of the present invention, a surface of the front surface conductive circuit of the front surface circuit layer of the circuit board main body is flush with a surface of the pad of the front surface circuit layer.
According to an embodiment of the present invention, a surface of the front surface conductive line of the front surface circuit layer of the circuit board main body is lower than a surface of the pad of the front surface circuit layer.
According to an embodiment of the invention, the molding layer of the molding structure comprises a reverse molding layer, wherein the reverse molding layer is stacked on the reverse surface of the circuit board main body to cover the substrate layer on the reverse surface of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a reverse circuit layer stacked on a reverse surface of the substrate layer, wherein the reverse circuit layer includes reverse conductive circuits, and wherein the reverse molding layer covers the reverse conductive circuits of the reverse circuit layer.
According to an embodiment of the present invention, the molded circuit board further includes a set of electronic components, wherein each of the electronic components is attached to the pad of the front surface circuit layer of the circuit board main body, and the molded structure further includes a molded package, wherein the molded package integrally extends from the front surface molded layer to cover the electronic component.
According to an embodiment of the present invention, the front surface molding layer of the molding structure covers the front surface conductive lines and the substrate layer of the front surface circuit layer at the edge region of the circuit board main body, so that the front surface conductive lines and the substrate layer of the front surface circuit layer at the chip mounting region of the circuit board main body are exposed to the outside.
According to an embodiment of the present invention, the molding layer of the molding structure is formed by curing an insulating molding material on at least one surface of the circuit board body through a molding die.
According to an embodiment of the present invention, the heat dissipation efficiency of the insulating molding material is greater than that of the ink material.
According to another aspect of the present invention, the present invention further provides a camera module, including:
a molded wiring board, wherein the molded wiring board comprises:
the circuit board comprises a circuit board main body, a circuit board main body and a circuit board, wherein the circuit board main body comprises at least one circuit layer and at least one substrate layer, and the circuit layer and the substrate layer are overlapped at intervals; and
a molding structure, wherein the molding structure comprises a molding layer, wherein the molding layer is stacked on at least one surface of the circuit board body to cover at least one part of the substrate layer of the circuit board body;
at least one photosensitive chip, wherein each photosensitive chip is attached to the molding circuit board, and each photosensitive chip is electrically connected to the molding circuit board; and
and the lens assembly comprises at least one optical lens, wherein the lens assembly is correspondingly arranged on the molded circuit board, and each optical lens is positioned on the photosensitive path of the corresponding photosensitive chip.
According to an embodiment of the present invention, the molding layer of the molding structure includes a front molding layer, wherein the front molding layer is stacked on a front surface of the circuit board main body to cover the substrate layer on the front surface of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer includes a front surface via circuit and a set of pads conductively connected to the front surface via circuit, wherein the front surface molding layer further covers the front surface via circuit of the front surface circuit layer, and each of the photosensitive chips is attached to the front surface molding layer.
According to an embodiment of the present invention, the front surface molding layer of the molding structure is provided with a groove corresponding to the pad of the front surface circuit layer, so as to ensure that the pad of the front surface circuit layer is exposed while the front surface molding layer covers the front surface conductive circuit of the front surface circuit layer of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer includes a front surface via line and a set of pads conductively connected to the front surface via line, wherein the molding structure further includes an insulating protective layer, wherein the insulating protective layer is stacked on the front surface molding layer and corresponds to the front surface via line of the front surface circuit layer of the circuit board main body to cover the front surface via line, and wherein each of the photosensitive chips is attached to the insulating protective layer.
According to an embodiment of the invention, the molding layer of the molding structure comprises a reverse molding layer, wherein the reverse molding layer is stacked on the reverse surface of the circuit board main body to cover the substrate layer on the reverse surface of the circuit board main body.
According to an embodiment of the present invention, the circuit layer of the circuit board main body includes a reverse circuit layer stacked on a reverse surface of the substrate layer, wherein the reverse circuit layer includes reverse conductive circuits, and wherein the reverse molding layer covers the reverse conductive circuits of the reverse circuit layer.
According to an embodiment of the present invention, the front surface molding layer of the molding structure covers the front surface conductive lines and the substrate layer of the front surface circuit layer at the edge region of the circuit board main body, so that the front surface conductive lines and the substrate layer of the front surface circuit layer at the chip mounting region of the circuit board main body are exposed, wherein each of the photosensitive chips is directly mounted on the chip mounting region of the circuit board main body by an adhesive.
According to an embodiment of the present invention, the camera module further includes a set of electronic components, wherein each of the electronic components is attached to the pad of the front circuit layer of the circuit board main body, wherein the molding structure further includes a molded package, wherein the molded package integrally extends from the front molding layer to cover the electronic component, and wherein the lens assembly is assembled to the molded package.
According to an embodiment of the invention, the molding package of the molding structure further covers a non-photosensitive region of the photosensitive chip.
According to an embodiment of the present invention, the molding layer of the molding structure is formed by curing an insulating molding material on at least one surface of the circuit board body through a molding die.
According to an embodiment of the present invention, the insulating molding material is an epoxy molding compound.
According to an embodiment of the present invention, the lens assembly further includes at least one driver, wherein each of the optical lenses is assembled to the driver, and each of the drivers is mounted to the molded circuit board to drivably maintain each of the optical lenses in the photosensitive path of the corresponding photosensitive chip.
According to an embodiment of the present invention, the lens assembly further includes at least one lens barrel, wherein each optical lens is assembled to the lens barrel, and each lens barrel is mounted to the molded circuit board to maintain each optical lens in the photosensitive path of the corresponding photosensitive chip.
According to an embodiment of the present invention, the lens assembly further includes a light turning mechanism, wherein the light turning mechanism is disposed in the photosensitive path of the photosensitive chip, and is configured to turn the light entering the light turning mechanism, so that the turned light is received by the photosensitive element after passing through the optical lens.
According to an embodiment of the present invention, the image capturing module further includes a filter assembly, wherein the filter assembly is correspondingly disposed between the optical lens and the photosensitive chip, so that the light entering through the optical lens is received by the photosensitive chip after passing through the filter assembly.
According to an embodiment of the present invention, the optical filter assembly includes at least one optical filter element and a base, wherein each of the optical filter elements is assembled to the base, and the base is correspondingly disposed on the molding structure of the molding circuit board at a position corresponding to an edge region of the circuit board main body, so that each of the optical filter elements corresponds to the photosensitive path of the corresponding photosensitive element, and the lens assembly is assembled to the base.
According to an embodiment of the invention, the base is a stand base manufactured separately or a molded base manufactured by a molding process.
According to another aspect of the present invention, the present invention also provides an electronic device, comprising:
an electronic device body; and
at least one above-mentioned arbitrary camera module, wherein every camera module is set up in the electronic equipment body for obtain the image.
According to another aspect of the present invention, there is also provided an electronic device, wherein the electronic device is provided with at least one molded circuit board as described in any one of the above.
Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
Drawings
Fig. 1 is a schematic perspective view of a camera module according to a first embodiment of the invention.
Fig. 2 shows a schematic cross-sectional view of the camera module according to the above-described first embodiment of the present invention.
Fig. 3A is a schematic view showing one of the manufacturing processes of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 3B is a schematic view showing a second process of manufacturing the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 4A shows a first modified embodiment of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 4B shows a second modified embodiment of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 4C shows a third modified embodiment of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 4D shows a fourth modified embodiment of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 4E shows a fifth modified embodiment of the molded wiring board according to the above-described first embodiment of the present invention.
Fig. 5A shows a first variant of the camera module according to the above-described first embodiment of the invention.
Fig. 5B shows a second variant of the camera module according to the above-described first embodiment of the invention.
Fig. 5C shows a first variant of the camera module according to the above-described first embodiment of the invention.
Fig. 5D shows a second variant of the camera module according to the above-described first embodiment of the invention.
Fig. 6 shows a schematic cross-sectional view of a camera module according to a second embodiment of the invention.
Fig. 7 shows a schematic process of manufacturing the molded wiring board of the camera module according to the second embodiment of the present invention.
Fig. 8A shows a first variant of the camera module according to the above-described second embodiment of the invention.
Fig. 8B shows a second variant of the camera module according to the above-described second embodiment of the invention.
Fig. 9 is a flowchart illustrating a method for manufacturing a camera module according to an embodiment of the invention.
Fig. 10A shows a first example of manufacturing a molded wiring board in the method of manufacturing the camera module according to the above-described embodiment of the present invention.
Fig. 10B shows a second example of manufacturing the molded wiring board in the manufacturing method of the image pickup module according to the above-described embodiment of the present invention.
Fig. 10C shows a third example of manufacturing the molded wiring board in the manufacturing method of the image pickup module according to the above-described embodiment of the present invention.
Fig. 11 shows a variant of the method for manufacturing the camera module according to the above-described embodiment of the invention.
Fig. 12 shows a perspective view of an electronic device according to an embodiment of the invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The circuit board is an essential part of electronic equipment and mainly provides mechanical support for fixing and assembling various electronic components such as integrated circuits. Circuit boards generally include single-sided circuit boards, double-sided circuit boards, and multilayer circuit boards, and since the surfaces of various circuit boards generally have exposed lines, vias, pads, and substrates, therefore, in the prior art, an ink layer is usually disposed on the surface of the circuit board by printing, curtain coating, spraying or roller coating, for example, a layer of ink is first disposed by spraying, then the photosensitive reaction of the photosensitive resist is utilized to transfer the conductive pattern on the film to the ink of the circuit board, and then ultraviolet rays are irradiated, because the transparent part outside the conductive pattern on the film is penetrated by ultraviolet rays, the corresponding printing ink on the surface of the circuit board is subjected to photopolymerization and changed into a polymer from a monomer, and finally, the printing ink which is not subjected to photopolymerization on the surface of the circuit board is removed through weak alkaline solution, so that the copper surface is exposed, and the purpose is to insulate and protect the circuit board in a solder-proof manner.
However, as the performance of electronic equipment is higher and higher, the chips or other devices mounted on the circuit board generate more heat, and the heat dissipation performance of the ink is relatively poor, which seriously affects the heat dissipation of the circuit board, thereby causing the performance of the electronic equipment to be reduced. Especially for the module of making a video recording, the sensitization chip of the module of making a video recording is usually directly mounted on the circuit board, because the existence of printing ink layer makes the heat-sinking capability of this circuit board relatively poor, and then influences the heat dissipation of this sensitization chip, can lead to the performance of this module of making a video recording to seriously descend. In addition, because the laying process (printing, curtain coating, spraying, rolling coating, or the like) of the ink layer has an inherent defect that the surface of the ink layer is not smooth, for an electronic device such as a camera module which needs to directly attach a chip to a circuit board, the ink layer on the circuit board causes the problems of inclination, bending, and the like of the attachment of the chip to the circuit board, and errors are brought to the assembly of the electronic device, so that the performance of the electronic device is reduced. Therefore, in order to solve the above problems, the present invention provides a molded circuit board and a method for manufacturing the same, which can improve the heat dissipation performance and/or the flatness of the circuit board, and contribute to the improvement of the performance of various electronic devices equipped with the molded circuit board.
It should be noted that although fig. 1 to fig. 8B and the following description use a circuit board of a camera module as an example to illustrate features and advantages of the molded circuit board of the present invention, it can be understood by those skilled in the art that the molded circuit board disclosed in fig. 1 to fig. 8B and the following description is only an example and does not limit the content and scope of the present invention.
Referring to fig. 1 to 3B of the drawings of the specification, a molded wiring board, a method of manufacturing the same, and a camera module according to an embodiment of the present invention are illustrated. Specifically, as shown in fig. 1 and fig. 2, the camera module 1 includes a lens assembly 10, at least one photosensitive chip 20, and a molded circuit board 30, wherein each photosensitive chip 20 is attached to the molded circuit board 30, and each photosensitive chip 20 is electrically connected to the molded circuit board 30, wherein the lens assembly 10 includes at least one optical lens 11, wherein the lens assembly 10 is correspondingly disposed on the molded circuit board 30, and each optical lens 11 is located in a photosensitive path of the corresponding photosensitive chip 20, so as to assemble the camera module 1.
Specifically, as shown in fig. 2 and fig. 3A, the molded circuit board 30 includes a circuit board main body 31 and a molded structure 32, wherein the circuit board main body 31 includes at least one circuit layer 310 and at least one substrate layer 314, wherein the circuit layer 310 and the substrate layer 314 are stacked at intervals, wherein the molded structure 32 includes a molded layer 321, wherein the molded layer 321 is stacked on at least one surface of the circuit board main body 31 to cover at least a portion of the substrate layer 314 of the circuit board main body 31. It is understood that the substrate layer 314 of the circuit board main body 31 may be, but not limited to, made of Polyimide Film (PI Film) or Polypropylene (PP).
Specifically, the molding layer 321 of the molding structure 32 is formed by curing an insulating molding material 320 on at least one surface of the circuit board main body 31 through a molding die. It can be understood that, because the molding structure 32 is directly and integrally formed on the surface of the circuit board main body 31 by a molding process, the molding structure 32 not only can improve the flatness of the circuit board main body 31 to provide a chip mounting surface with higher flatness, but also can be directly combined with the circuit board main body 31, so as to increase the bonding strength between the two, prevent the molding structure 32 from loosening or falling off, and contribute to prolonging the service life of the molding structure 32.
Notably, in the invention, the thickness of the molding layer 321 of the molding structure 32 is between 10 micrometers and 100 micrometers. Preferably, the thickness of the molding layer 321 of the molding structure 32 is between 10 and 50 micrometers. It is understood that the thickness of the circuit layer 310 of the circuit board main body 31 is generally between 10 microns and 50 microns (generally about 25 microns), while the thickness of the ink layer in the conventional circuit board is also about 25 microns.
Preferably, the heat dissipation efficiency of the insulating molding material 320 is greater than that of the ink material, so that the heat dissipation performance of the molded circuit board 30 is superior to that of the circuit board on which the ink layer is disposed, and the overall heat dissipation performance of the camera module 1 is improved.
More preferably, the insulating Molding material 320 is implemented as an Epoxy Molding Compound (EMC material), which enables the molded circuit board 30 to avoid the problem of contamination caused by the broken ink layer, which is the case with the existing circuit board, and helps to improve the protection of the circuit board main body. It can be understood that, since the heat dissipation efficiency of the EMC material is usually 1W to 3W, and the heat dissipation efficiency of the ink material is usually only 0.2W, the heat dissipation performance of the molded circuit board 30 of the present invention is better than that of the conventional ink circuit board, which is beneficial to meet the development requirement of high performance of the current electronic device. Of course, in other examples of the present invention, the insulating molding material 320 may also be implemented as other insulating molding materials with good heat dissipation performance, as long as the heat dissipation efficiency is better than that of the ink material, and the present invention is not described herein again.
It should be noted that although the features and advantages of the camera module 1 of the present invention are described in the accompanying fig. 1 to 5D and the following description by taking the camera module 1 as an example including only one optical lens 11 and one photo sensor chip 20, it can be understood by those skilled in the art that the camera module 1 disclosed in the accompanying fig. 1 to 5D and the following description is only an example and does not limit the content and scope of the present invention, for example, in other examples of the camera module, the number of the optical lens 11 and the photo sensor chip 20 may be more than one to form an array camera module. In addition, the type of the optical lens 10 can be adjusted according to the requirements of the camera module, for example, the optical lens 10 can be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, and the like, which is not limited in the present invention. The type of the circuit board main body 31 of the molded circuit board 30 can be adjusted accordingly according to the requirements of the camera module, for example, in this embodiment of the present invention, the circuit board main body 31 can be implemented as a multilayer circuit board. In other examples of the present invention, the wiring board main body 31 may be implemented as other types of wiring boards such as a single-sided wiring board or a double-sided wiring board.
Illustratively, as shown in fig. 2 and fig. 3A, in this embodiment of the present invention, the circuit layers 310 of the circuit board main body 31 of the molded circuit board 30 include a front circuit layer 311, at least one intermediate circuit layer 312, and a back circuit layer 313, wherein all of the substrate layers 314 are arranged in a stacked manner, wherein the front circuit layer 311 and the back circuit layer 312 are stacked on outermost sides of the substrate layers 314, respectively, and each of the intermediate circuit layers 312 is stacked between adjacent substrate layers 314, respectively, to form the circuit board main body 31 by press-fitting. It is understood that the front circuit layer 311, the middle circuit layer 312 and the back circuit layer 313 may be electrically connected, but not limited to, through via holes (not shown) formed in the circuit board main body 31. Of course, the circuit board main body 31 may also be formed by stacking one front circuit layer 311 and one substrate layer 314 on each other to form a single-sided circuit board; alternatively, the circuit board main body 31 may be formed by stacking one front surface circuit layer 311, one substrate layer 314, and one rear surface circuit layer 313 on top of one another to form a double-sided circuit board.
It is noted that the front surface circuit layer 311, the middle circuit layer 312 and the back surface circuit layer 313 are respectively defined according to the position of the circuit layer 310 in the circuit board main body 31, for example, the circuit layer 310 on the front surface of the circuit board main body 31 is defined as the front surface circuit layer 311, the circuit layer 310 in the middle of the circuit board main body 31 is defined as the middle circuit layer 312, and the circuit layer 310 on the back surface of the circuit board main body 31 is defined as the back surface circuit layer 313. It is understood that, in the present invention, the surface of the circuit board main body 31 for attaching the photosensitive chip 20 is defined as the front surface of the circuit board main body 31 (e.g., the upper surface of the circuit board main body 31 in fig. 2); the surface of the wiring board main body 31 opposite to the surface to which the photosensitive chip 20 is attached is defined as the reverse surface of the wiring board main body 31 (the lower surface of the wiring board main body 31 in fig. 2).
Further, in this embodiment of the present invention, as shown in fig. 2 and fig. 3A, the front surface circuit layer 311 of the circuit board main body 31 of the molded circuit board 30 includes a front surface conductive circuit 3111 and a set of pads 3112, wherein each of the pads 3112 is conductively connected to the front surface conductive circuit 3111; the back side wiring layer 313 includes only a back side conductive wiring 3131, and does not include any pad. In other words, in this embodiment of the present invention, all the pads are concentrated on the front surface of the circuit board main body 31, so that various electronic components and the photosensitive chip 20 can only be disposed on the front surface of the circuit board main body 31, which is beneficial to reducing the height of the molded circuit board 30, and thus the overall height of the camera module 1. Of course, in other examples of the present invention, the reverse side circuit layer 313 may also include a pad for soldering various electronic components, which is not described in detail herein.
It is noted that, as shown in fig. 2, the main board body 31 has a chip mounting region 3101 and an edge region 3102, wherein the edge region 3102 is located around the chip mounting region 3101, and the pad 3112 is located at the edge region 3102 of the main board body 31. Thus, when the photosensitive chip 20 is mounted on the chip mounting region 3101 of the board main body 31 of the molded board 30, the photosensitive chip 20 can be electrically connected to the pad 3112 through a wire to conduct the photosensitive chip 20 and the molded board 30. Of course, in other examples of the present invention, when the pad of the photosensitive chip 20 is located on a non-photosensitive surface of the photosensitive chip 20 (e.g., a back surface of the photosensitive chip 20), the pad 3112 of the front circuit layer 311 may also be located in the chip mounting region 3101 of the circuit board main body 31, which is not described in detail herein.
Preferably, the surface of the front side conductive line 3111 of the front side circuit layer 311 is flush with the surface of the pad 3112 of the front side circuit layer 311. For example, the front surface conductive traces 3111 and the pads 3112 of the front surface trace layer 311 of the circuit board main body 31 are etched through a whole piece of copper foil to ensure that the surface of the front surface conductive traces 3111 is flush with the surface of the pads 3112. Of course, in other examples of the present invention, the front side conductive line 3111 and the pad 3112 may also be manufactured by other processes, and the present invention is not described in detail herein.
According to the above embodiment of the present invention, as shown in fig. 3A, the molding layer 321 of the molding structure 32 of the molded circuit board 30 includes a front molding layer 3211, wherein the front molding layer 3211 is stacked on the front surface of the circuit board main body 31 to cover the substrate layer 314 on the front surface of the circuit board main body 31. Specifically, the front surface molding layer 3211 may cover the surfaces of the front surface conductive traces 3111 of the front surface circuit layer 311 (i.e., the front surface molding layer 3211 covers the conductive traces 3111 located in the chip mounting region 3101 and the edge region 3102 of the circuit board main body 31 and the surfaces of the substrate layers 314 located in the front surface of the circuit board main body 31, and the front surface molding layer 3211 does not cover the surfaces of the pads 3112 of the front surface circuit layer 311.
In other words, the molding layer 321 of the molding structure 32 of the molded circuit board 30 includes a front molding layer 3211 formed by curing the insulating molding material 320 on the front surface of the circuit board main body 31 through a molding process, wherein the surface of the pad 3112 of the front circuit layer 311 is exposed because the front molding layer 3211 is not coated, and the surface of the front conductive circuit 3111 of the front circuit layer 311 and the surface of the substrate layer 314 on the front surface of the circuit board main body 31 are protected because the front molding layer 3211 is coated. It can be understood that, just because the bonding pad 3112 is exposed, and the front surface conductive trace 3111 is covered by the front surface molding layer 3211, the front surface molding layer 3211 of the molding structure 32 can perfectly replace the ink layer to function as a solder-proof insulation and a protection circuit board. Meanwhile, the heat dissipation efficiency of the insulating molding material 320 used for molding the front molding layer 3211 is greater than that of an ink material, so the front molding layer 3211 can also improve the heat dissipation performance of the molded circuit board 30.
When the molded circuit board 30 is manufactured, one of the circuit board main bodies 31 may be placed in a molding mold 50 to perform a molding process, so as to form the front molding layer 3211 of the molding structure 32 by curing the insulating molding material 320 on the front surface of the circuit board main body 31, wherein the front molding layer 3211 covers the front surface conductive circuit 3111 of the front surface circuit layer 311 and the surface of the substrate layer 314 on the front surface of the circuit board main body 31, and exposes the bonding pad 3112 to the outside for power connection to various electronic components and chips.
Specifically, as shown in fig. 3A, the molding die 50 includes an upper die 51, wherein the upper die 51 can be moved to perform a clamping and pulling operation, and when the molding die 50 is in a clamped state, a front molding space 510 is formed between the upper die 51 and the front surface of the circuit board main body 31, wherein the front molding layer 3211 of the die set structure 32 is formed by the insulating molding material being added to the front molding space 510 and being cured. It is understood that the height of the front molding space 510 of the forming mold 50 is between 10 micrometers and 100 micrometers. Preferably, the height of the front molding space 510 of the forming mold 50 is between 10 micrometers and 50 micrometers to mold the front molding layer 321 satisfying the thickness requirement.
More specifically, as shown in fig. 3A, the upper mold 51 of the molding mold 50 has a pressing surface 511 and an upper molding surface 512, wherein the pressing surfaces 511 of the upper mold 51 correspond to the pads 3112 of the front circuit layer 311 of the circuit board main body 31, respectively, and the pressing surface 511 of the upper mold 51 is lower than the upper molding surface 512 of the upper mold 51 (i.e., the upper mold 51 has a step-shaped inner surface), so that when the pressing surface 511 of the upper mold 51 presses the corresponding pad 3112, a gap is still left between the upper molding surface 512 of the upper mold 51 and the front conductive circuit 3111, so as to ensure that the insulating molding material 320 can enter the gap between the upper molding surface 512 of the upper mold 51 and the front conductive circuit 3111, so that the cured front molding layer 3211 can cover the front conductive circuit 3111, to protect the front side conductive line 3111.
For example, as shown in fig. 3A, after the circuit board main body 31 is placed in the upper mold 51, the upper mold 51 is operated to clamp the upper mold 51, so that the pressing surface 511 of the upper mold 51 is pressed on the surface of the pad 3112, and the front molding space 510 is formed between the upper molding surface 512 of the upper mold 51 and the front surface conductive line 3111 of the front surface circuit layer 311 and the surface of the substrate layer 314; then, the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 that covers the front conductive trace 3111 and the substrate layer 314 at the same time after curing, so as to manufacture the molded circuit board 30 (or a molded circuit board semi-finished product); finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to perform drawing, and the molded wiring board 30 (or a molded wiring board semi-finished product) is taken out from the molding mold 50.
It should be noted that, as shown in fig. 3A, since the pressing surface 511 of the upper mold 51 presses the surface of the pad 3112 during the molding process, so that the insulating molding material 320 cannot cover the surface of the pad 3112, a groove 3210 is formed on the front molding layer 3211 formed by curing the insulating molding material 320 at a position corresponding to the pad 3112, so that the surface of the pad 3112 is exposed, so as to electrically connect various electronic components with the molding circuit board 30. In particular, when an electronic component is soldered to the pad 3112 for electrical connection to the mold wiring board 30, since the groove 3210 is formed at a position on the front molding layer 3211 corresponding to the pad 3112, outflow of molten solder can be effectively prevented, and thus the mold structure 32 can improve structural strength and heat dissipation performance of the mold wiring board 30, and simultaneously avoid waste of resources due to outflow of molten solder, which also contributes to improvement of soldering performance at the pad 3112.
In addition, since the front molding layer 3211 is integrally formed by a molding process, the front molding layer 3211 can provide a flat chip mounting surface for mounting the photosensitive chip 20, so as to reduce the possibility of inclination or bending of the mounting of the photosensitive chip 20, which is helpful for reducing mounting errors and improving the performance of the camera module 1. Even for a photosensitive chip with a larger size, the front molding layer 3211 can control the mounting error of the chip within a controllable range, so as to ensure that the image pickup mold 1 has higher performance.
Fig. 4A shows a first variant embodiment of the molded wiring board 30 of the camera module 1 according to the above-described embodiment of the invention. The molded wiring board 30 according to the first modified embodiment of the present invention is different from the above-described example according to the present invention in that: the front surface molding layer 3211 of the molding structure 32 covers only the surface of the substrate layer 314 of the circuit board main body 31, but does not cover the front surface conductive line 3111 and the bonding pad 3112 of the front surface circuit layer 311, that is, the front surface conductive line 3111 and the bonding pad 3112 of the front surface circuit layer 311 are both exposed.
Specifically, as shown in fig. 4A, the upper mold 51 of the forming mold 50 only has a pressing surface 511 (that is, the upper mold 51 has a flat inner surface), so that when the pressing surface 511 of the upper mold 51 is pressed on the pad 3112, there is no gap between the pressing surface 511 of the upper mold 51 and the front conductive line 3111, so that the front molding layer 3211 formed by curing only covers the surface of the substrate layer 314 of the circuit board main body 31, and the front conductive line 3111 and the pad 3112 of the front circuit layer 311 are both exposed.
For example, as shown in fig. 4A, after the circuit board main body 31 is placed in the upper mold 51, the upper mold 51 is operated to clamp the upper mold 51, so that the press-fit surface 511 of the upper mold 51 is simultaneously pressed against the surface of the pad 3112 and the surface of the front surface conductive line 3111, and the front surface molding space 510 is formed between the press-fit surface 511 of the upper mold 51 and the surface of the substrate layer 314 of the circuit board main body 31; then, injecting the insulating molding material 320 into the front molding space 510 to form the front molding layer 3211 only covering the surface of the substrate layer 314 after curing, thereby manufacturing the molded circuit board 30; finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to perform drawing, and the molded wiring board 30 is taken out from the molding mold 50.
It is to be noted that, in this first modified embodiment of the present invention, since the front conductive trace 3111 of the front circuit layer 311 of the circuit board main body 31 is still exposed outside the front molding layer 3211, so that the front conductive trace 3111 still has the risk of mechanical damage and short circuit, in order to solve this problem, the present invention further provides a second modified embodiment of the molded circuit board 30 on the basis of the first modified embodiment. Specifically, as shown in fig. 4B, the molding structure 32 further includes an insulating protective layer 322, wherein the insulating protective layer 322 is correspondingly disposed on the surface of the front conductive trace 3111 of the front trace layer 311 to cover the front conductive trace 3111, so as to prevent the front conductive trace 3111 from being mechanically damaged or short-circuited.
Preferably, the insulating protection layer 322 of the molding structure 32 is formed by curing an insulating molding material on the exposed surface of the front conductive line 311 through a molding process after the front molding layer 3211 is formed, so as to further cover the exposed surface of the front conductive line 311 through the insulating protection layer 322. Of course, in other examples of the present invention, the insulating protection layer 322 may also be disposed on the exposed surface of the front conductive line 311 by means of, for example, pasting, gluing, applying, and the like.
Fig. 4C shows a third modified embodiment of the molded wiring board 30 of the camera module 1 according to the above-described embodiment of the present invention. The molded wiring board 30 according to the third modified embodiment of the present invention is different from the above-described example according to the present invention in that: when the molded circuit board 30 is manufactured, the upper mold 51 of the molding mold 50 only has an upper molding surface 512 (that is, the upper mold 51 has a flat inner surface), and when the molding mold 50 is in a mold clamping state, the upper molding surface 512 of the upper mold 51 does not contact the front conductive line 311 and the bonding pad 3112 of the front circuit layer 311, so that the front molding layer 3211 formed by curing covers the surface of the substrate layer 314 of the circuit board main body 31 and the front conductive line 311 and the bonding pad 3112 of the front circuit layer 311 at the same time. Thereafter, thinning molding is performed by grinding or the like, so that the front surface molding layer 3211 forms the groove 3210 at a position corresponding to the pad 3112, so that the pad 3112 of the front surface wiring layer 311 is exposed.
For example, as shown in fig. 4C, first, after the circuit board main body 31 is placed in the upper mold 51, the upper mold 51 is operated to close the mold, so that none of the upper molding surfaces 512 of the upper mold 51 abuts on the front surface conductive traces 311 of the front surface trace layer 311 and the pads 3112, so as to form the front surface molding space 510 between the inner surface of the upper mold 51 and the front surface of the circuit board main body 31; then, injecting the insulating molding material 320 into the front molding space 510 to form the front conductive traces 311 covering the front trace layer 311 of the circuit board main body 31 and the front molding layer 3211 of the pads 3112 after curing, so as to form the molded circuit board semi-finished product; then, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to perform drawing, and the molded circuit board semi-finished product is taken out from the molding mold 50; finally, the groove 3210 is formed on the front molding layer 3211 at a position corresponding to the pad 3112 by grinding, thereby manufacturing the molded wiring board 30. Of course, in other examples of the present invention, the front surface molding layer 3211 may also be thinned by grinding, so that the front surface conductive traces 311 and the pads 3112 of the front surface trace layer 311 are exposed.
It should be noted that, since the inner surface of the upper mold 51 does not abut against the front surface conductive traces 311 and the pads 3112 of the front surface trace layer 311, the distance between the inner surface of the upper mold 51 and the front surface of the circuit board main body 31 is increased, and therefore the front surface molding space 510 is enlarged, so that the insulating molding material 320 flows more easily to fill the front surface molding space 510, which helps to complete the molding process.
Fig. 4D shows a fourth modified embodiment of the molded wiring board 30 of the camera module 1 according to the above-described embodiment of the present invention. The molded wiring board 30 according to the fourth modified embodiment of the present invention is different from the above-described example according to the present invention in that: the surface of the front conductive trace 3111 of the front circuit layer 311 of the circuit board main body 31 is lower than the surface of the pad 3112 of the front circuit layer 311, that is, the height of the front conductive trace 3111 is smaller than the height of the pad 3112, so that when the front conductive trace 3111 of the front circuit layer 311 is covered by the front molding layer 3211, the pad 3112 of the front circuit layer 311 can still be exposed.
Specifically, as shown in fig. 4D, when the molded circuit board 30 is manufactured, the front conductive traces 3111 of the front circuit layer 311 are etched by an etching process to reduce the height of the front conductive traces 3111 of the front circuit layer 311, so that the height of the front conductive traces 3111 is smaller than the height of the pads 3112; then, the front surface molding layer 3211 is formed on the front surface of the circuit board main body 31 by the molding process through the molding die 50, so that the front surface conductive trace 3111 of the front surface circuit layer 311 is covered by the front surface molding layer 3211, and the pad 3112 of the front surface circuit layer 311 can still be exposed. Of course, in other examples of the present invention, when manufacturing the molded circuit board 30, a metal may be deposited on the pads 3112 of the front circuit layer 311 by a deposition process to increase the height of the pads 3112 of the front circuit layer 311, so that the height of the pads 3112 is greater than the height of the front conductive circuit 3111; then, the front surface molding layer 3211 is formed on the front surface of the circuit board main body 31 by a molding process through a molding die, so that the front surface conductive trace 3111 of the front surface circuit layer 311 is covered by the front surface molding layer 3211, and the pad 3112 of the front surface circuit layer 311 can still be exposed.
For example, as shown in fig. 4D, first, the front surface conductive trace 3111 of the front surface circuit layer 311 of the circuit board main body 31 is etched to reduce the height of the front surface conductive trace 3111, so that the surface of the front surface conductive trace 3111 is lower than the surface of the pad 3112; next, after the etched circuit board main body 31 is placed in the upper mold 51, the upper mold 51 is operated to close the mold, so that the pressing surface 511 of the upper mold 51 is pressed on the surface of the pad 3112, and a gap is still left between the pressing surface 511 of the upper mold 51 and the surface of the front surface conductive line 3111, so as to form the front surface molding space 510 between the pressing surface 511 of the upper mold 51 and the surfaces of the substrate layer 314 and the front surface conductive line 3111 of the circuit board main body 31; then, the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 that only covers the surface of the substrate layer 314 and the surface of the front conductive line 3111 after curing, thereby manufacturing the molded wiring board 30; finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to perform drawing, and the molded wiring board 30 is taken out from the molding mold 50.
Fig. 4E shows a fifth modified embodiment of the molded wiring board 30 of the camera module 1 according to the above-described embodiment of the present invention. The molded wiring board 30 according to the fifth modified embodiment of the present invention is different from the above-described example according to the present invention in that: by adopting the process of plate splicing, a plurality of circuit board main bodies 31 are simultaneously placed into a forming mold to mold the plurality of circuit board main bodies 31, so that a plurality of molding structures 32 are formed at one time. It should be noted that, since a plurality of the circuit board main bodies 31 are molded simultaneously to form the corresponding molded structures 32 on the plurality of the circuit board main bodies 31, this also helps to ensure that the molded circuit board 30 can provide a flat chip mounting surface while improving the manufacturing efficiency of the molded circuit board 30.
Exemplarily, as shown in fig. 4E, after two circuit board main bodies 31 combined together are placed on the corresponding upper mold 51, the upper mold 51 is operated to close the mold so that the pressing surface 511 of the upper mold 51 is pressed on the surface of the pad 3112, and the pressing head 513 of the upper mold 51 is pressed on the combined position of the circuit board main bodies 31, wherein one front molding space 510 is respectively formed between the upper molding surface 512 of the upper mold 51 and the front surface conductive trace 3111 of the front surface circuit layer 311 of each circuit board main body 31 and the surface of the substrate layer 314; then, the insulating molding material 320 is injected into each front molding space 510 to form the front molding layer 3211 that covers the front conductive line 3111 and the substrate layer 314 after curing, so as to form a molded circuit board semi-finished product; finally, after the upper mold 51 is operated to perform the drawing to take out the molded wiring board semi-finished product, the molded wiring board semi-finished product is cut along the joint of the two wiring board main bodies 31 to obtain two molded wiring boards 30. It is understood that, in this example of the present invention, since the ram 513 of the upper die 51 is directly pressed against the circuit board main body 31, at least a portion of the circuit board main body 31 of the molded circuit board 30 (e.g., at least a side portion of the circuit board main body 31) is exposed by being not covered by the front molding layer 3211, that is, at least a portion of the circuit board main body 31 of the molded circuit board 30 is exposed. Of course, in other examples of the present invention, the exposed portion of the circuit board main body 31 of the molded circuit board 30 may be covered with other insulating materials later, or the exposed portion of the circuit board main body 31 of the molded circuit board 30 may be cut directly.
It should be noted that, in the above embodiment of the present invention, as shown in fig. 2 and fig. 3B, the molding layer 321 of the molding structure 32 of the molded circuit board 30 may further include a reverse molding layer 3212 formed by curing the insulating molding material 320 on the reverse surface of the circuit board main body 31 through a molding process, wherein the reverse molding layer 3212 covers the surface of the reverse conductive line 3131 of the reverse circuit layer 313 and the surface of the substrate layer 314 located on the reverse surface of the circuit board main body 31 to protect the reverse conductive line 3131. It is understood that, in this embodiment of the invention, since the reverse side circuit layer 313 of the circuit board main body 31 only includes the reverse side conductive circuit 3131 and does not include the bonding pad, it is not necessary to consider whether the bonding pad is exposed or not in the process of forming the reverse side molding layer 3212 by molding, and the molding is directly performed by the molding die 50. Of course, in other examples of the present invention, the molding structure 32 of the molded circuit board 30 may only include the reverse molding layer 3212 or the front molding layer 3211, and an ink layer may be disposed on the surface of the circuit board main body 31 without a molding layer.
Specifically, as shown in fig. 3B, the molding die 50 further includes a lower die 52, wherein the lower die 52 can be moved to perform a clamping and pulling operation, and when the molding die 50 is in a clamped state, a reverse molding space 520 is formed between the lower die 52 and the reverse surface of the circuit board main body 31, wherein the reverse molding layer 3212 of the die set structure 32 is formed by the insulating molding material being added to the reverse molding space 520 and being cured.
More specifically, as shown in fig. 3B, the lower mold 52 of the forming mold 50 has a flat lower molding surface 521, so that when the circuit board main body 31 is placed in the lower mold 52, the lower molding surface 521 of the lower mold 52 forms the reverse molding space 520 with the reverse surface of the circuit board main body 31, so that the insulating molding material 320 forms the reverse conductive traces 3131 covering the reverse trace layer 313 and the reverse molding layer 3212 of the substrate layer 314 after being cured in the reverse molding space 520. Of course, in other examples of the invention, the reverse side molding layer 3212 may only cover the substrate layer 314 on the reverse side of the circuit board main body 31, and the reverse side conductive traces 3131 not covered by the reverse side trace layer 313, so that the reverse side conductive traces 3131 are exposed.
Illustratively, as shown in fig. 3B, after the circuit board main body 31 is placed in the lower mold 52, the lower mold 52 is operated to close the mold, so as to form the reverse molding space 520 between the lower molding surface 521 of the lower mold 52 and the reverse surface of the circuit board main body 31; then, the insulating molding material 320 is injected into the reverse molding space 520 to form the reverse molding layer 3212 which covers the reverse conductive line 3131 and the substrate layer 314 at the same time after curing; finally, after the insulating molding material 320 is cured to form the reverse molding layer 3212, the lower mold 52 is operated to perform drawing, and the molded wiring board 30 is taken out from the molding mold 50.
It is to be noted that the molding layer 321, the reverse molding layer 3212 and the obverse molding layer 3211 of the molding structure 32 may be molded together by the molding die 50 through a molding process. Alternatively, the back molding layer 3212 and the front molding layer 3211 of the molding structure 32 may be separately molded by a molding process. Of course, the reverse molding layer 3212 may be molded by the lower mold 52 of the molding mold 50 after the front molding layer 3211 is molded; the front molding layer 3211 may be molded by the lower mold 52 of the forming mold 50 before being molded, which is not further limited in the present invention.
In addition, in order to further enhance the heat dissipation capability of the molded circuit board 30, the circuit board main body 31 of the molded circuit board 30 may further include a copper-clad layer (not shown in the figure), wherein the copper-clad layer and the reverse side wiring layer 313 are arranged at intervals on the reverse side of the circuit board main body 31, so that the copper-clad layer is not in contact with the reverse side conductive wiring 3131 of the reverse side wiring layer 313, which is beneficial for enhancing the heat dissipation capability of the molded circuit board 30 through the copper-clad layer.
Further, the back molding layer 3212 may refer to a molding manner of the front molding layer 3211, such that the back molding layer 3212 only covers the back conductive traces 3131 of the back circuit layer 313, but does not cover the copper-clad layer, and the copper-clad layer is exposed to the outside, so as to improve the heat dissipation performance of the molded circuit board 30 to the maximum extent. In other words, in the process of molding the back molding layer 3212, the copper-clad layer may be exposed outside the back molding layer 3212 in the same manner as the pad 3112 is exposed outside the front molding layer 3211 in the above embodiment, and the description of the present invention is omitted here.
According to the above embodiment of the present invention, as shown in fig. 2, the molded circuit board 30 further includes a set of electronic components 33, and each of the electronic components 33 may be attached to the pad 3112 of the front circuit layer 311 of the circuit board main body 31 by a process such as smt (surface Mount technology). It should be noted that, in this embodiment of the present invention, the photosensitive chip 20 and each of the electronic components 33 may be mounted after the front molding layer 3211 of the molded circuit board 30 is formed, and the photosensitive chip 20 is mounted on the chip mounting surface of the front molding layer 3211 to correspond to the chip mounting region 3101 of the circuit board main body 31, and each of the electronic components 33 is mounted on the pad 3112 to correspond to the edge region 3102 of the circuit board main body 31. It should be understood that in the camera module of the present invention, the type of the electronic component 33 may not be limited, for example, the electronic component 33 can be implemented as a resistor, a capacitor, a driving device, or the like.
In addition, after the photosensitive chip 20 is attached to the front molding layer 3211 of the molding structure 32 of the molding board 30, the photosensitive chip 20 and the pad 3112 of the front circuit layer 311 may be electrically connected by a gold wire process to conduct the photosensitive chip 20 and the molding board 30.
It should be noted that, as shown in fig. 2, in the first embodiment of the present invention, the camera module 1 further includes a filter assembly 40, wherein the filter assembly 30 is correspondingly disposed between the optical lens 11 of the lens assembly 10 and the photosensitive chip 20, so that the light entering through the optical lens 11 is received by the photosensitive chip 20 after passing through the filter assembly 40, thereby improving the imaging quality of the camera module 1.
Specifically, the filter assembly 40 includes a filter element 41 and a base 42, wherein the filter element 41 is assembled on the base 42, and the base 42 is correspondingly disposed on the front molding layer 3211 of the molding structure 32 of the molded circuit board 30 at a position corresponding to the edge region 3102 of the circuit board main body 31, so that the filter element 41 is located between the photosensitive chip 20 and the optical lens 11, and the filter element 41 also corresponds to the photosensitive path of the photosensitive chip 20, wherein the size of the filter element 31 is larger than that of the photosensitive area of the photosensitive chip 20, so as to ensure that light entering the inside of the image pickup module 1 from the optical lens 11 is filtered by the filter element 41 and then received by the photosensitive chip 20 for photoelectric conversion, thereby improving the imaging quality of the image pickup module 1, for example, the filter element 41 may filter an infrared portion of the light entering the camera module 1 from the optical lens 11.
Preferably, the base 42 is implemented as a separately fabricated holder base 421, wherein the holder base 421 is adhered to the front molding layer 3211, so that the holder base 421 can also serve as a mirror seat for mounting the lens assembly 10 while the filter element 41 assembled to the holder base 421 is maintained in the photosensitive path of the photosensitive chip 20.
Further, as shown in fig. 2, the lens assembly 10 of the camera module 1 may further include a driver 12, wherein the optical lens 11 is drivably assembled to the driver 12, and the driver 12 is assembled to the top surface of the support base 421, so that the optical lens 11 is maintained in the photosensitive path of the photosensitive chip 20. In addition, when the camera module 1 is used, the driver 12 can drive the optical lens 11 to move back and forth along the photosensitive path of the photosensitive chip 20, so as to adjust the focal length of the camera module 1 by adjusting the distance between the optical lens 11 and the photosensitive chip 20, so that the camera module 1 is implemented as a zoom camera module. The type of the driver 12 of the camera module 1 of the present invention is not limited, and the driver 2 may be implemented as a voice coil motor, which can be electrically connected to the molded circuit board 30 to be in an operating state after receiving power and control signals to drive the optical lens 11 to move back and forth along the photosensitive path of the photosensitive chip 20. However, it will be understood by those skilled in the art that the type of the driver 12 is not limited as long as it can drive the optical lens 11 to move back and forth along the photosensitive path of the photosensitive chip 20.
It should be noted that fig. 5A shows a first variant of the camera module 1 according to the first embodiment of the invention. In particular, in contrast to the first embodiment according to the invention described above, the camera module 1 according to the first variant of the invention is implemented as a fixed-focus camera module, that is to say the lens arrangement 10 of the camera module 1 may also be free of the driver 12 in this variant of the invention. Specifically, the lens assembly 10 includes a lens barrel 12 ', wherein the lens barrel 12' is assembled to the top surface of the holder base 421, and the optical lens 11 is fixedly assembled to the lens barrel 12 ', so that the optical lens 11 is held in the photosensitive path of the photosensitive chip 20 by the lens barrel 12'. In addition, in the process of assembling the lens barrel 12 'on the top surface of the holder base 421, the angle at which the lens barrel 12' is assembled on the top surface of the holder base 421 can be adjusted by a calibration device, so that the optical axis of the optical lens 11 can be perpendicular to the light-sensing surface of the light-sensing chip 20, thereby ensuring the imaging quality of the image pickup module 1. It is understood that the barrel 12 'may be fabricated separately, such that the barrel 12' may or may not be threaded, as the present invention is not limited in this respect.
Fig. 5B shows a second variant of the camera module 1 according to the above-described first embodiment of the invention. Specifically, in contrast to the first modified embodiment of the present invention, the base 42 of the filter assembly 40 of the camera module 1 according to the second modified embodiment of the present invention is implemented as a mold base 422, wherein the mold base 422 is formed by molding material on the front molding layer 3211 of the molded circuit board 30 at a position corresponding to the edge region 3102 of the circuit board main body 31 by a molding process, and the lens barrel 12 'is assembled on the top surface of the mold base 422 to hold the optical lens 11 on the photosensitive path of the photosensitive chip 20 by the lens barrel 12'. That is, in this modified embodiment of the present invention, the molding base 422 is first fabricated by a molding process, and then the lens barrel 12 'fabricated separately is assembled on the top surface of the molding base 422, so that the angle at which the lens barrel 12' is assembled on the top surface of the molding base 422 can be adjusted by a calibration device, so that the optical axis of the optical lens 11 can be perpendicular to the photosensitive surface of the photosensitive chip 20, thereby ensuring the imaging quality of the camera module 1. Of course, in other examples of the present invention, the lens barrel 12 'may also integrally extend on the top surface of the mold base 422, that is, the lens barrel 12' and the mold base 422 may be integrally cured and formed by the molding material through a molding process, so as to enhance the stability and reliability of the camera module 1.
Preferably, in this modified embodiment of the present invention, as shown in fig. 5B, the molding base 422 covers the electronic component 33 on the molding circuit board 30 after molding, and is located around the photosensitive chip 20 attached to the molding circuit board 30, so as to isolate the adjacent electronic component 33 and isolate the electronic component 33 and the photosensitive chip 20 by the molding base 422.
Fig. 5C shows a third variant of the camera module 1 according to the above-described first embodiment of the invention. Specifically, the camera module 1 according to the third modified embodiment of the present invention is different from the above-described second modified embodiment of the present invention in that: the molding base 422 covers the non-photosensitive area of the electronic component 33 and the photosensitive chip 20 on the molding circuit board 30 after molding, so as to firmly attach the photosensitive chip 20 to the molding circuit board 30, thereby achieving compact structure and reducing the influence of dirt on the electronic component and the circuit board main body on the photosensitive chip 20.
Preferably, as shown in fig. 5C, the module base 422 has a stepped structure to provide a lower mounting surface for the filter element 41 and a higher mounting surface for the lens barrel 12', so as to reduce the distance between the filter element 41 and the photosensitive chip 20, which helps to reduce the overall height of the camera module 1. It can be understood that, since the molding base 422 is integrally formed on the molding circuit board 30 by a mold, the molding base 422 can provide a relatively flat mounting surface, so that the filter element 41 can be substantially parallel to the photosensitive chip 20 with a small inclination.
Fig. 5D shows a fourth variant of the camera module 1 according to the above-described first embodiment of the invention. Specifically, compared to the first embodiment of the present invention, the camera module 1 according to the fourth modified embodiment of the present invention is implemented as a periscopic camera module, that is, the camera module 1 further includes a light steering mechanism 13, wherein the light steering mechanism 13 is disposed in the photosensitive path of the photosensitive chip 20, and is used for steering the light entering the light steering mechanism 13, so that the light steered by the light steering mechanism 13 is received by the photosensitive chip 20 after passing through the optical lens 11. It can be understood that, since the periscopic camera module can be mounted to various electronic device bodies in a "lying" mounting manner, the height of the periscopic array module can be reduced, and therefore, after the periscopic array module is mounted to the electronic device body, the thickness of the electronic device body is not increased, and the trend of light and thin development of the electronic device is met.
Referring to fig. 6 and 7 of the drawings, a camera module 1A according to a second embodiment of the present invention is illustrated. The second embodiment according to the present invention differs from the above-described first embodiment according to the present invention in that: the mold structure 32A of the mold substrate 30A of the camera module 1A further includes a mold package 323A, wherein the mold package 323A integrally extends from the front mold layer 3211 to replace the base of the optical filter assembly 40, so that the optical filter 41 and the lens assembly 10 can be directly assembled to the mold package 323A of the mold substrate 30A, so as to maintain the optical filter 41 and the optical lens 11 of the lens assembly 10 in the photosensitive path of the photosensitive chip 20. Preferably, the molded package 323A covers the electronic component 33 of the molded circuit board 30A, so that the molded package 323A isolates the adjacent electronic component 33 and isolates the electronic component 33 from the photosensitive chip 20, thereby reducing contamination of the photosensitive chip 20 caused by contamination carried on the electronic component 33.
Further, as shown in fig. 7, the molded package 323A of the molded structure 32A and the front molding layer 3211 are formed by curing the insulating molding material 320 on the front surface of the circuit board main body 31 through a molding process, so that the electronic component 33 of the molded circuit board 30A is covered by the molded package 323A, and the front molding layer 3211 covers the surface of the front conductive trace 3111 of the front circuit layer 311 and the surface of the substrate layer 314 on the front surface of the circuit board main body 31, so that the surface of the pad 3112 of the front circuit layer 311 is exposed.
In other words, when manufacturing the molded circuit board 30A, the electronic component 33 may be first attached to the pad 3112 of the front surface circuit layer 311 of the circuit board main body 31 by soldering; then, the circuit board main body 31 is placed into a molding mold 50A for molding, so that the insulating molding material 320 is cured on the front surface of the circuit board main body 31 to form the front surface molding layer 3211 of the molding structure 32A and the molding package 323A, wherein the front surface molding layer 3211 covers the surface of the front surface conductive circuit 3111 of the front surface circuit layer 311 and the surface of the substrate layer 314 located on the front surface of the circuit board main body 31, and exposes a portion of the pad 3112 to the outside for power connection to the photosensitive chip 20. It should be noted that, since the molded package 323A and the front molding layer 3211 are integrally formed by the forming mold 50A, the mounting surface provided by the molded package 323A can maintain a good parallelism with the chip mounting surface provided by the front molding layer 3211, which not only helps to ensure that the photosensitive chip 20 and the filter element 41 are parallel to each other, but also helps to ensure that the optical axis of the optical lens 11 is perpendicular to the photosensitive surface of the photosensitive chip 20.
Specifically, as shown in fig. 7, the molding die 50A includes an upper die 51A, wherein the upper die 51A can be moved to perform a clamping and pulling operation, and when the molding die 50A is in a clamped state, a front molding space 510A is formed between the upper die 51A and the front surface of the circuit board main body 31, wherein the front molding layer 3211 and the molded package 323A of the module structure 32A are added to the front molding space 510A by the insulating molding material 320 and formed after curing.
More specifically, as shown in fig. 7, the upper mold 51A of the molding mold 50A has a press-fit surface 511A, a first upper molding surface 512A, and a second upper molding surface 513A, wherein the press-fit surface 511A of the upper mold 51A corresponds to the pads 3112 of the front surface wiring layer 311 of the wiring board main body 31, the second upper molding surface 513A of the upper mold 51A is located around the first upper molding surface 512A of the upper mold 51A, and the second upper molding surface 513A of the upper mold 51A corresponds to the electronic component 33. The press-fitting surface 511A of the upper mold 51A is lower than the first upper molding surface 512A of the upper mold 51A, and the first upper molding surface 512A of the upper mold 51A is lower than the second upper molding surface 513A of the upper mold 51A (i.e., the upper mold 51A has a stepped inner surface), so that when the press-fitting surface 511A of the upper mold 51A is press-fitted to the corresponding pad 3112, a gap is still left between the first upper molding surface 512A of the upper mold 51A and the front surface conduction line 3111, and a gap is left between the second upper molding surface 513A of the upper mold 51A and the top surface 3113113113112 of the electronic component 33, to ensure that the insulating molding material 320 can enter the gap between the first upper molding surface 512A and the front surface conduction line 1 and the gap between the second upper molding surface 513A and the electronic component 33, the front surface molding layer 3211 formed by curing can cover the front surface conductive line 3111, and the molded package 323A formed by curing can cover the electronic component 33 to protect the front surface conductive line 3111 and the electronic component 33.
For example, as shown in fig. 7, the electronic component 33 is first attached to the pad 3112 on the front circuit layer 311 of the circuit board main body 31; after the circuit board main body 31 is placed in the upper mold 51A, the upper mold 51A is operated to close the mold, so that the pressing surface 511A of the upper mold 51A is pressed on the surface of the pad 3112 remaining on the front surface circuit layer 311, and the front surface molding space 510A is formed between the first and second upper molding surfaces 512A, 513A of the upper mold 51A and the front surface conductive circuit 3111 of the front surface circuit layer 311, the substrate layer 314, and the surface of the electronic component 33; then, the insulating molding material 320 is injected into the front molding space 510A to form the front molding layer 3211 that covers the front conductive line 3111A and the substrate layer 314A at the same time and the molding package 323A that covers the electronic component 33 after curing, thereby manufacturing the molding wiring board 30A; finally, after the insulating molding material 320 is cured to form the front molding layer 3211 and the molded package 323A, the upper mold 51A is operated to perform a drawing, and the molded wiring board 30A is taken out from the molding mold 50A. Of course, in this example of the present invention, the image pickup module 1A can also be assembled by molding the reverse molding layer 3212 on the reverse surface of the circuit board main body 31, and then sequentially mounting the photosensitive chip 20, the filter element 41, and the lens assembly 10 on the molded circuit board 30A.
It is to be noted that, in the above embodiment of the present invention, the front molding layer 3211 of the molding structure 32A covers the chip mounting region 3101 and the edge region 3102 of the circuit board main body 31, so that the photosensitive chip 20 is mounted on the front molding layer 3211 of the molding structure 32A of the molded circuit board 30A, so as to reduce the adverse effect of the circuit board main body 31 on the mounting accuracy of the photosensitive chip 20 by the front molding layer 3211. Of course, in other examples of the present invention, the photosensitive chip 20 may be directly attached to the chip attaching region 3101 of the circuit board main body 31 by an adhesive.
Fig. 8A shows, by way of example, a first variant of the camera module 1A according to the above-described second embodiment of the invention, in particular the camera module 1A according to the first variant of the invention differs from the above-described second embodiment of the invention in that: the photosensitive chip 20 is directly attached to the chip attaching region 3101 of the wiring board main body 31 of the molded wiring board 30A by an adhesive 60; the front molding layer 3211A of the molding layer 321A of the molding structure 32A covers only the front conductive traces 3111 of the front circuit layer 311 and the substrate layer 314 at the edge region 3102 of the circuit board main body 31, so that the front conductive traces 3111 of the front circuit layer 311 at the chip mounting region 3101 of the circuit board main body 31 are exposed due to being uncovered. Thus, when the photosensitive chip 20 is mounted by the adhesive 60, the adhesive 60 can enter the notch of the front circuit layer 311, which is beneficial to increasing the contact area between the adhesive 60 and the molding circuit board 30A, and further enhancing the mounting strength of the photosensitive chip 20. In addition, in this modified embodiment of the present invention, the molded package 323A of the molded structure 32A covers only the electronic component 33, so as to prevent interference between adjacent electronic components 33.
It should be noted that, as shown in fig. 8A, since the photosensitive chip 20 is directly mounted on the chip mounting region 3101 of the circuit board main body 31, and the front molding layer 3211A of the molding structure 32A only covers the edge region 3102 of the circuit board main body 31, the invention can mold the molding structure 32A on the circuit board main body 31 by a molding process, and then mount the photosensitive chip 20 on the chip mounting region 3101 of the circuit board main body 31; alternatively, the photosensitive chip 20 may be attached to the chip attaching region 3101 of the circuit board main body 31, and the molding structure 32A may be molded on the circuit board main body 31 by a molding process, which is not limited in the present invention.
Fig. 8B shows a second variant of the camera module 1A according to the above-mentioned second embodiment of the invention, in particular the camera module 1A according to the second variant of the invention differs from the first variant of the above-mentioned second embodiment of the invention in that: the molding package 323A of the molding structure 32A simultaneously covers the electronic component 33 and the non-photosensitive region of the photosensitive chip 20, so as to further enhance the bonding strength between the photosensitive chip 20 and the molding circuit board 32A, and also help to prevent the photosensitive chip 20 from being contaminated by dirt existing on the circuit board main body 31. It should be noted that, since the molding package 323A of the molding structure 32A covers the non-photosensitive region of the photosensitive chip 20, before the molding structure 32A is molded on the circuit board main body 31 by a molding process, the photosensitive chip 20 needs to be attached to the chip mounting region 3101 of the circuit board main body 31 by the adhesive 60, and the photosensitive chip 20 needs to be electrically connected to the circuit board main body 31.
It should be noted that, in the second embodiment and its modified embodiments of the present invention, except for the above-mentioned structure, other structures of the camera module 1A are the same as those of the camera module 1 according to the first embodiment of the present invention, and the camera module 1A also has modified embodiments similar to or the same as those of the camera module 1 according to the first embodiment, and will not be described again here.
According to another aspect of the present invention, an embodiment of the present invention further provides a method for manufacturing a camera module. Specifically, referring to fig. 9, the method for manufacturing the camera module includes the steps of:
s100: providing a circuit board main body 31, and forming a molding layer 321(321A) of a molding structure 32(32A) on at least one surface of the circuit board main body 31 through a molding die 50(50A) by curing an insulating molding material 320;
s200: mounting at least one photosensitive chip 20 on the molded circuit board 30(30A), and connecting each photosensitive chip 20 with the molded circuit board 30(30A) in a conductive manner;
s300: a lens assembly 10 is correspondingly disposed on the molded circuit board 30(30A), such that each optical lens 11 of the lens assembly 10 is located on the photosensitive path of the corresponding photosensitive chip 20.
Further, as shown in fig. 9, the method for manufacturing the camera module further includes the steps of:
s400: a filter assembly 40 is correspondingly disposed between the mold circuit board 30(30A) and the lens assembly 10, so that the light entering from each optical lens 11 is received by the photosensitive chip 20 after passing through the filter element 41 of the filter assembly 40.
It should be noted that, in the first example of the present invention, as shown in fig. 10A, the step S100 in the method for manufacturing the camera module, that is, the method for manufacturing the molded wiring board 30(30A), may include the steps of:
s110: by an upper mold 51 of the forming mold 50, a front molding layer 3211 of the molding layer 321 of the molding structure 32 is formed on the front surface of the circuit board main body 31 by curing the insulating molding material 320, wherein the front molding layer 3211 only covers the front conductive traces 3111 of the front circuit layer 311 of the circuit board main body 31, so that the pads 3112 of the front circuit layer 311 are exposed.
Further, as shown in fig. 10A, the method for manufacturing the molded wiring board 30(30A) may include the steps of:
s120: by means of a lower mold 52 of the molding mold 50, a reverse molding layer 3212 of the molding structure 32 is formed on the reverse side of the circuit board main body 31 by curing the insulating molding material 320, wherein the reverse molding layer 3212 covers the reverse side conductive traces 3131 of the reverse side trace layer 313 of the circuit board main body 31.
Further, as shown in fig. 10A, the method for manufacturing the molded wiring board 30(30A) may further include the steps of:
s130: a set of electronic components 33 is attached to the pads 3112 of the front surface circuit layer 311 of the circuit board main body 31.
It is worth mentioning that, according to the above first example of the present invention, as shown in fig. 10A, the step S110 may include the steps of:
s112: placing the circuit board main body 31 on the upper mold 51 of the molding mold 50 such that an inner surface of the upper mold 51 is pressed against the pads 3112 of the front surface circuit layer 311 of the circuit board main body 31 and a front surface molding space 510 is formed between the inner surface of the upper mold 51 and the front surface of the circuit board main body 31; and
s113: the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 after curing.
It is to be noted that the inner surface of the upper mold 51 of the forming mold 50 can be designed as required to mold the front molding layer 3211 as required. For example, the surface of the front conductive trace 3111 of the front trace layer 311 is generally flush with the surface of the pad 3112 of the front trace layer 311, and it is possible to design the inner surface of the upper mold 51 to form a pressing surface 511 and a molding surface 512, wherein the pressing surface 511 is lower than the molding surface 512, so that the upper mold 51 has a stepped inner surface. Of course, the upper mold 51 may also have a flat inner surface, and at this time, the front surface conductive trace 3111 covering the front surface trace layer 311 and the front surface molding layer 3211 of the pad 3112 may be molded first, and then the pad 3112 is exposed by grinding; alternatively, the front circuit layer 311 of the circuit board main body 31 may be pretreated so that the surface of the front conductive circuit 3111 of the front circuit layer 311 is lower than the surface of the pad 3112.
Illustratively, as shown in fig. 10A, in the above first example of the present invention, before the step S112, the step S110 may further include the steps of:
s111: the front surface conductive traces 3111 of the front surface trace layer 311 of the circuit board main body 31 are etched to reduce the height of the front surface conductive traces 3111, so that the surface of the front surface conductive traces 3111 is lower than the surface of the pads 3112.
Of course, in other examples of the present invention, before the step S112, the step S110 may further include the steps of: metal is deposited on the pad 3112 of the front surface circuit layer 311 of the circuit board main body 31 by a deposition process to increase the height of the pad 3112 so that the surface of the front surface conductive circuit 3111 is lower than the surface of the pad 3112.
In a second example of the present invention, as shown in fig. 10B, the step S100, i.e., the method for manufacturing the molded circuit board 30(30A), may further include the steps of:
s110': forming a front molding layer 3211 of the molding structure 32 on the front surface of the circuit board main body 31 by an upper mold 51 of the molding mold 50 through curing the insulating molding material 320, wherein the front molding layer 3211 only covers the surface of the substrate layer 314 of the circuit board main body 31, so that the front conductive traces 3111 and the pads 3112 of the front circuit layer 311 are exposed;
s120': correspondingly, an insulating protection layer 322 is disposed on the front conductive line 3111 of the front circuit layer 311 to cover the front conductive line 3111;
s130': forming a reverse molding layer 3212 of the molding structure 32 on the reverse side of the circuit board main body 31 by curing the insulating molding material 320 through a lower mold 52 of the molding mold 50, wherein the reverse molding layer 3212 covers the reverse side conductive traces 3131 of the reverse side trace layer 313 of the circuit board main body 31; and
s140': a set of electronic components 33 is attached to the pads 3112 of the front surface wiring layer 311 of the wiring board main body 31 to produce the molded wiring board 30.
It is noted that in this second example of the present invention, the insulating protective layer 322 may be disposed to cover the front surface via wires 3111 of the front surface wire layer 311 by, for example, molding, bonding, or the like.
According to the above second example of the present invention, as shown in fig. 10B, the step S110' further includes the steps of:
s111': placing the circuit board main body 31 on the upper mold 51 of the forming mold 50, so that the inner surface of the upper mold 51 is simultaneously pressed on the front surface conductive traces 3111 and the pads 3112 of the front surface trace layer 311 of the circuit board main body 31, so as to form a front surface molding space 510 between the inner surface of the upper mold 51 and the front surface of the circuit board main body 31; and
s112': the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 after curing.
In a third example of the present invention, as shown in fig. 10C, the step S100, i.e., the method for manufacturing the molded wiring board 30(30A), may include the steps of:
s110': attaching a set of electronic components 33 to the pads 3112 of the front surface circuit layer 311 of the circuit board main body 31;
s120': forming a front molding layer 3211A of the molding structure 32A and a molding package 323A on the front surface of the circuit board main body 31 by curing the insulating molding material 320 through an upper mold 51A of the molding mold 50A, wherein the front molding layer 3211A covers the front surface conductive traces 3111 of the front surface trace layer 311, and the molding package 323A covers the electronic component 33; and
s130': by a lower mold 52 of the molding mold 50, a reverse molding layer 3212 of the molding structure 32A is formed on the reverse side of the circuit board main body 31 by curing the insulating molding material 320, wherein the reverse molding layer 3212 covers the reverse conductive traces 3131 of the reverse circuit layer 313 of the circuit board main body 31 to form the molded circuit board 30A.
It is noted that in some examples of the present invention, the front molding layer 3211A only covers the front conductive traces 3111 of the front trace layer 311 at the edge region 3101 of the circuit board main body 31.
It should be noted that the present invention further provides a variant implementation of the method for manufacturing the image capture module according to the above embodiment of the present invention, and the step S100 may further include the steps of: firstly, the electronic component 33 and the photosensitive chip 20 are attached to the front surface of the circuit board main body 31, and the photosensitive chip 20 is electrically connected with the circuit board main body 31; and then, the molding die 50A is used to form a front molding layer 3211A of the molding structure 32A and a molding package 323A on the front surface of the circuit board main body 31 by curing the insulating molding material 320, wherein the molding package 323A covers the electronic component 33 and the non-photosensitive region of the photosensitive chip 20.
Illustratively, as shown in fig. 11, in this modified embodiment of the present invention, the method for manufacturing the camera module includes the steps of:
s100': the method includes the steps of (1) conductively mounting at least one photosensitive chip 20 on a chip mounting region 3101 of a circuit board main body 31, and conductively mounting a group of electronic components 33 on an edge region 3102 of the circuit board main body 31;
s200': a front molding layer 3211A of a molding layer 321A of a molding structure 32A and a molding package 323A are formed on the front surface of the circuit board main body 31 by curing the insulating molding material 320 through a molding die 50(50A), wherein the front molding layer 3211A covers only the front conductive traces 3111 on the front circuit layer 311 of the circuit board main body 31 at the edge region 3101 of the circuit board main body 31, and the molding package 323A covers the non-photosensitive region of the electronic component 33 and the photosensitive chip 20;
s300': correspondingly, at least one filter element 41 of a filter assembly 40 is disposed on the molded package 323A, wherein each filter element 41 is located on the photosensitive path of the corresponding photosensitive chip 20; and
s400': a lens assembly 10 is correspondingly disposed on the molded package 323A of the molding structure 32A, wherein each optical lens 11 of the lens assembly 10 is located in the photosensitive path of the corresponding photosensitive chip 20, so that light entering from each optical lens 11 is received by the photosensitive chip 20 after passing through the corresponding filter element 41.
Further, as shown in fig. 11, the method for manufacturing the camera module further includes the steps of:
s500': a reverse molding layer 3212 of the molding layer 321A of the molding structure 32A is formed by the molding die 50(50A) on the reverse side of the circuit board main body 31 through curing by the insulating molding material 320, wherein the reverse molding layer 3212 covers the reverse conducting wires 3131 of the reverse circuit layer 313 of the circuit board main body 31.
It is worth mentioning that according to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device is configured with at least one of the molded circuit boards 30(30A) for providing mechanical support for fixing and assembling various electronic components such as an integrated circuit. For example, in the above-described embodiment of the present invention, the electronic apparatus may be implemented, but not limited to, as the camera module 1(1A) configured with the molded wiring board 30 (30A). In other examples of the present invention, the electronic device may also be implemented as various electronic devices such as a computer, a robot, AR glasses, and the like, which are provided with the molded wiring board 30 (30A).
In addition, referring to fig. 12, according to another aspect of the present invention, the present invention further provides an electronic apparatus, wherein the electronic apparatus includes an electronic apparatus body 70 and at least one camera module 1(1A), wherein each camera module 1(1A) is respectively disposed on the electronic apparatus body 70 for obtaining an image. It should be noted that the type of the electronic device body 70 is not limited, for example, the electronic device body 70 may be any electronic device capable of being configured with the camera module 1, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and the like. It will be understood by those skilled in the art that although fig. 12 illustrates the electronic device body 70 implemented as a smart phone, it does not limit the content and scope of the present invention.
It is noted that references to "upper", "lower", "inner", "outer", etc., in this disclosure are made based on the orientation or positional relationship shown in the drawings, which are for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (49)

1. A method of manufacturing a molded wiring board, comprising the steps of:
providing a circuit board main body, and forming a molding layer of a molding structure on at least one surface of the circuit board main body through a molding die by curing an insulating molding material.
2. The method of manufacturing a molded circuit board according to claim 1, wherein the step of providing a circuit board main body, and forming a molding layer of a molded structure on at least one surface of the circuit board main body by curing an insulating molding material through a molding die comprises the steps of:
and curing the insulating molding material on the front surface of the circuit board main body to form a front surface molding layer of the molding structure by using an upper mold of the molding mold, wherein the front surface molding layer only covers the front surface conducting circuit of the front surface circuit layer of the circuit board main body, so that the bonding pad of the front surface circuit layer is exposed outside.
3. The method for manufacturing a molded wiring board according to claim 2, wherein the step of forming a front surface molding layer of the molded structure on the front surface of the wiring board main body by an upper mold of the molding mold being cured by the insulating molding material comprises the steps of:
placing the circuit board main body on the upper die of the forming die, so that the inner surface of the upper die is pressed on the bonding pad of the front surface circuit layer of the circuit board main body, and a front surface molding space is formed between the inner surface of the upper die and the front surface of the circuit board main body; and
injecting the insulating molding material into the front molding space to form the front molding layer after curing.
4. The method of manufacturing a molded wiring board according to claim 3, further comprising, before the step of placing the wiring board main body on the upper mold of the molding die, the step of:
and etching the front surface conducting circuit of the front surface circuit layer of the circuit board main body to reduce the height of the front surface conducting circuit, so that the surface of the front surface conducting circuit is lower than the surface of the bonding pad.
5. The method of manufacturing a molded wiring board according to claim 3, further comprising, before the step of placing the wiring board main body on the upper mold of the molding die, the step of:
and depositing metal on the bonding pad of the front surface circuit layer of the circuit board main body through a deposition process to increase the height of the bonding pad, so that the surface of the front surface conducting circuit is lower than the surface of the bonding pad.
6. The method of manufacturing a molded circuit board according to claim 1, wherein the step of providing a circuit board main body, and forming a molding layer of a molded structure on at least one surface of the circuit board main body by curing an insulating molding material through a molding die comprises the steps of:
forming a front molding layer of the molding structure on the front surface of the circuit board main body by an upper mold of the molding mold through curing of the insulating molding material, wherein the front molding layer only covers the surface of a substrate layer of the circuit board main body, so that a front conducting circuit and a bonding pad of the front circuit layer are exposed outside; and
correspondingly, an insulating protection layer is arranged on the front surface conducting circuit of the front surface circuit layer to cover the front surface conducting circuit.
7. The method of manufacturing a molded wiring board according to claim 6, wherein the step of forming a front surface molding layer of the molded structure on the front surface of the wiring board main body by an upper mold of a molding mold through curing of the insulating molding material comprises the steps of:
placing the circuit board main body on the upper die of the forming die, so that the inner surface of the upper die is simultaneously pressed on the front surface conducting circuit and the bonding pad of the front surface circuit layer of the circuit board main body, and a front surface molding space is formed between the inner surface of the upper die and the front surface of the circuit board main body; and
injecting the insulating molding material into the front molding space to form the front molding layer after curing.
8. The method for manufacturing a molded circuit board according to any one of claims 1 to 7, wherein the step of providing a circuit board main body, and forming a molding layer of a molded structure by curing an insulating molding material on at least one surface of the circuit board main body by a molding die further comprises the steps of:
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body by curing the insulating molding material through a lower mold of the molding mold, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body.
9. The method of manufacturing a molded wiring board according to claim 8, further comprising the steps of:
and attaching a group of electronic components to the bonding pads of the front circuit layer of the circuit board main body.
10. The method of manufacturing a molded circuit board according to claim 1, wherein the step of forming a molding layer of a molded structure by providing a circuit board main body and curing a molding material on at least one surface of the circuit board main body by a molding die comprises the steps of:
attaching a group of electronic components to a bonding pad of a front circuit layer of the circuit board main body;
forming a front molding layer and a molding packaging body of the molding structure on the front surface of the circuit board main body by an upper mold of the molding mold through curing of the insulating molding material, wherein the front molding layer covers a front conducting circuit of the front circuit layer, and the molding packaging body covers the electronic component; and
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body by curing the insulating molding material through a lower mold of the molding mold, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body to manufacture the molded circuit board.
11. The method of manufacturing a molded wiring board according to claim 10, wherein the front surface molding layer covers only the front surface conductive wiring on the front surface wiring layer at the edge region of the wiring board main body.
12. A method of manufacturing a molded wiring board as claimed in any one of claims 1 to 7, 10 and 11, wherein the heat dissipation efficiency of the insulating molding material is larger than that of the ink material.
13. A method for manufacturing a camera module is characterized by comprising the following steps:
a method of manufacturing a molded wiring board according to any one of claims 1 to 12, the molded wiring board being manufactured;
mounting at least one photosensitive chip on the molding circuit board, and connecting each photosensitive chip with the molding circuit board in a conductive manner; and
and correspondingly arranging a lens assembly on the molding circuit board, so that each optical lens of the lens assembly is positioned on the corresponding photosensitive path of the photosensitive chip.
14. The method for manufacturing a camera module according to claim 13, further comprising the steps of:
a light filtering component is correspondingly arranged between the molding circuit board and the lens component, so that light rays entering from each optical lens are received by the photosensitive chip after passing through the light filtering element of the light filtering component.
15. A method for manufacturing a camera module is characterized by comprising the following steps:
the method comprises the following steps that at least one photosensitive chip is conductively mounted in a chip mounting area of a circuit board main body, and a group of electronic components are conductively mounted in an edge area of the circuit board main body;
forming a front molding layer and a molding packaging body of a molding layer of a molding structure on the front surface of the circuit board main body through a molding die by curing an insulating molding material, wherein the front molding layer only covers front conducting circuits on the front circuit layer of the circuit board main body and positioned at the edge area of the circuit board main body, and the molding packaging body covers the electronic component and the non-photosensitive area of the photosensitive chip;
correspondingly arranging at least one filter element of a filter assembly on the molding packaging body, wherein each filter element is positioned on the corresponding photosensitive path of the photosensitive chip; and
and correspondingly arranging a lens assembly on the molded packaging body of the molding structure, wherein each optical lens of the lens assembly is positioned on the photosensitive path of the corresponding photosensitive chip, so that light rays entering from each optical lens are received by the photosensitive chip after passing through the corresponding filter element.
16. The method for manufacturing a camera module according to claim 15, further comprising the steps of:
and forming a reverse molding layer of the molding structure on the reverse side of the circuit board main body through the molding die by curing the insulating molding material, wherein the reverse molding layer coats a reverse conducting circuit of the reverse circuit layer of the circuit board main body.
17. A molded wiring board, comprising:
the circuit board comprises a circuit board main body, a circuit board main body and a circuit board, wherein the circuit board main body comprises at least one circuit layer and at least one substrate layer, and the circuit layer and the substrate layer are overlapped at intervals; and
a molding structure, wherein the molding structure comprises a molding layer, wherein the molding layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body.
18. The molded wiring board of claim 17, wherein the molding layer of the molded structure comprises a front molding layer, wherein the front molding layer is stacked on a front side of the wiring board body to encapsulate the substrate layer on the front side of the wiring board body.
19. The molded wiring board of claim 18, wherein the wiring layer of the wiring board body comprises a front side wiring layer stacked on a front side of the substrate layer, wherein the front side wiring layer comprises front side conductive wirings and a set of pads conductively connected to the front side conductive wirings, and wherein the front side molding layer further covers the front side conductive wirings of the front side wiring layer.
20. The molded wiring board of claim 19, wherein the front molding layer of the molding structure is provided with a recess corresponding to the pad of the front wiring layer to ensure that the pad of the front wiring layer is exposed while the front molding layer covers the front conductive wiring of the front wiring layer of the wiring board main body.
21. The molded wiring board of claim 18, wherein the wiring layer of the wiring board body comprises a front surface wiring layer stacked on a front surface of the substrate layer, wherein the front surface wiring layer comprises front surface via wirings and a set of pads conductively connected to the front surface via wirings, wherein the molding structure further comprises an insulating protective layer, wherein the insulating protective layer is stacked on the front surface molding layer and corresponds to the front surface via wirings of the front surface wiring layer of the wiring board body to cover the front surface via wirings.
22. The molded wiring board of claim 19, wherein a surface of the front side conductive traces of the front side trace layer of the wiring board body is flush with a surface of the pads of the front side trace layer.
23. The molded wiring board of claim 19, wherein a surface of the front-side conductive wiring of the front-side wiring layer of the wiring board main body is lower than a surface of the pad of the front-side wiring layer.
24. The molded wiring board of claim 17, wherein the molding layer of the molded structure comprises a back side molding layer, wherein the back side molding layer is laminated to a back side of the wiring board body to encapsulate the substrate layer on the back side of the wiring board body.
25. The molded wiring board of claim 24, wherein the wiring layer of the wiring board body comprises a reverse wiring layer laminated on a reverse side of the substrate layer, wherein the reverse wiring layer comprises reverse conductive wiring, and wherein the reverse molding layer covers the reverse conductive wiring of the reverse wiring layer.
26. A molded wiring board as claimed in any one of claims 19 to 23, further comprising a plurality of electronic components, wherein each of said electronic components is mounted to said pads of said front side wiring layer of said wiring board body, wherein said molded structure further comprises a molded package, wherein said molded package integrally extends from said front side molding layer to encase said electronic components.
27. The molded wiring board of claim 26, wherein the front molding layer of the molding structure covers the front conductive traces and the substrate layer of the front wiring layer at an edge region of the wiring board body such that the front conductive traces and the substrate layer of the front wiring layer at a chip mounting region of the wiring board body are exposed.
28. A molded wiring board as in any of claims 17 to 25, wherein said molding layer of said molded structure is formed by curing an insulating molding material on at least one surface of said wiring board body by a molding die.
29. The molded wiring board of claim 18, wherein the insulating molding material has a heat dissipation efficiency greater than that of the ink material.
30. A camera module, comprising:
a molded wiring board, wherein the molded wiring board comprises:
the circuit board comprises a circuit board main body, a circuit board main body and a circuit board, wherein the circuit board main body comprises at least one circuit layer and at least one substrate layer, and the circuit layer and the substrate layer are overlapped at intervals; and
a molding structure, wherein the molding structure comprises a molding layer, wherein the molding layer is stacked on at least one surface of the circuit board body to cover at least one part of the substrate layer of the circuit board body;
at least one photosensitive chip, wherein each photosensitive chip is attached to the molding circuit board, and each photosensitive chip is electrically connected to the molding circuit board; and
and the lens assembly comprises at least one optical lens, wherein the lens assembly is correspondingly arranged on the molded circuit board, and each optical lens is positioned on the photosensitive path of the corresponding photosensitive chip.
31. The camera module of claim 30, wherein the molding layer of the molding structure comprises a front molding layer, wherein the front molding layer is stacked on a front surface of the circuit board body to encapsulate the substrate layer on the front surface of the circuit board body.
32. The camera module of claim 31, wherein the circuit layer of the circuit board main body comprises a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer comprises front surface conductive traces and a set of pads conductively connected to the front surface conductive traces, wherein the front surface molding layer further covers the front surface conductive traces of the front surface circuit layer, and wherein each of the photo-sensing chips is attached to the front surface molding layer.
33. The camera module of claim 32, wherein the front surface molding layer of the molding structure is provided with a groove corresponding to the pad of the front surface circuit layer to ensure that the pad of the front surface circuit layer is exposed while the front surface molding layer covers the front surface conductive circuit of the front surface circuit layer of the circuit board main body.
34. The camera module of claim 31, wherein the circuit layer of the circuit board main body comprises a front surface circuit layer stacked on a front surface of the substrate layer, wherein the front surface circuit layer comprises front surface conductive lines and a set of pads conductively connected with the front surface conductive lines, wherein the mold structure further comprises an insulating protective layer, wherein the insulating protective layer is stacked on the front surface mold layer and corresponds to the front surface conductive lines of the front surface circuit layer of the circuit board main body to cover the front surface conductive lines, and wherein each of the photosensitive chips is attached to the insulating protective layer.
35. The camera module of claim 30, wherein the molding layer of the molding structure comprises a back molding layer, wherein the back molding layer is stacked on a back surface of the circuit board body to encapsulate the substrate layer on the back surface of the circuit board body.
36. The camera module of claim 35, wherein the circuit layer of the circuit board body comprises a back side circuit layer stacked on a back side of the substrate layer, wherein the back side circuit layer comprises back side conductive circuits, and wherein the back side molding layer covers the back side conductive circuits of the back side circuit layer.
37. The camera module of claim 31, wherein the front molding layer of the molding structure covers the front conductive traces and the substrate layer of the front circuit layer at an edge region of the circuit board body, such that the front conductive traces and the substrate layer of the front circuit layer at a die attach region of the circuit board body are exposed, wherein each of the photosensitive dies is directly attached to the die attach region of the circuit board body by an adhesive.
38. The camera module of claim 31, further comprising a plurality of electronic components, wherein each of the electronic components is attached to the pads of the front side circuitry layer of the circuitry body, wherein the molded structure further comprises a molded package, wherein the molded package integrally extends from the front side circuitry layer to encase the electronic components, and wherein the lens assembly is assembled to the molded package.
39. The camera module of claim 38, wherein the molded package of the molded structure further encapsulates a non-photosensitive region of the photosensitive die.
40. The camera module of any of claims 30-39, wherein the molding layer of the molding structure is formed by curing an insulating molding material on at least one surface of the circuit board body through a molding die.
41. The camera module of claim 40, wherein the insulating molding material is an epoxy molding compound.
42. The camera module of any of claims 30-39, wherein the lens assembly further comprises at least one driver, wherein each of the optical lenses is assembled to the driver, and each of the drivers is mounted to the molded circuit board to drivably maintain each of the optical lenses in the photosensitive path of the corresponding photosensitive chip.
43. The camera module of any of claims 30-39, wherein the lens assembly further comprises at least one lens barrel, wherein each optical lens is assembled to the lens barrel, and each lens barrel is mounted to the molded circuit board to maintain each optical lens in the photosensitive path of the corresponding photosensitive chip.
44. The camera module of any of claims 30-39, wherein the lens assembly further comprises a light redirecting mechanism, wherein the light redirecting mechanism is disposed in the photosensitive path of the photosensitive chip and is configured to redirect light entering the light redirecting mechanism such that the redirected light is received by the photosensitive element after passing through the optical lens.
45. The camera module according to any one of claims 30-37, further comprising a filter, wherein the filter is correspondingly disposed between the optical lens and the photo sensor chip, such that the light entering through the optical lens is received by the photo sensor chip after passing through the filter.
46. The camera module of claim 45, wherein the filter assembly includes at least one filter element and a base, wherein each filter element is assembled to the base and the base is correspondingly disposed on the molded structure of the molded circuit board at a position corresponding to an edge region of the circuit board body such that each filter element corresponds to the photosensitive path of the corresponding photosensitive element, and wherein the lens assembly is assembled to the base.
47. The camera module of claim 46, wherein the base is a stand base manufactured separately or a molded base manufactured by a molding process.
48. An electronic device, comprising:
an electronic device body; and
the camera module of any of claims 30-47, wherein each camera module is disposed on the electronic device body for capturing images.
49. An electronic device, wherein the electronic device is provided with at least one molded wiring board according to any one of claims 17 to 29.
CN201910698550.8A 2019-07-31 2019-07-31 Molded circuit board, camera module, manufacturing method of camera module and electronic equipment Pending CN112312674A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201910698550.8A CN112312674A (en) 2019-07-31 2019-07-31 Molded circuit board, camera module, manufacturing method of camera module and electronic equipment
US17/631,565 US20220279094A1 (en) 2019-07-31 2020-07-01 Molded circuit board and camera module, and manufacturing method thereof and electronic device
PCT/CN2020/099767 WO2021017743A1 (en) 2019-07-31 2020-07-01 Molded circuit board and camera module, and manufacturing method therefor and electronic device comprising same
EP20848503.7A EP4007460A4 (en) 2019-07-31 2020-07-01 Molded circuit board and camera module, and manufacturing method therefor and electronic device comprising same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910698550.8A CN112312674A (en) 2019-07-31 2019-07-31 Molded circuit board, camera module, manufacturing method of camera module and electronic equipment

Publications (1)

Publication Number Publication Date
CN112312674A true CN112312674A (en) 2021-02-02

Family

ID=74485788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910698550.8A Pending CN112312674A (en) 2019-07-31 2019-07-31 Molded circuit board, camera module, manufacturing method of camera module and electronic equipment

Country Status (1)

Country Link
CN (1) CN112312674A (en)

Similar Documents

Publication Publication Date Title
CN112217969B (en) Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof
CA2571345C (en) System and method for mounting an image capture device on a flexible substrate
US7665915B2 (en) Camera module, method of manufacturing the same, and printed circuit board for the camera module
JP4395859B2 (en) Camera module for portable terminals
US7515817B2 (en) Camera module
JP4584214B2 (en) Image sensor module, camera module using the same, and camera module manufacturing method
US10477084B2 (en) Manufacturing method for camera module
CN204669479U (en) Camera module
CN109427731B (en) Circuit board
KR20040002752A (en) Camera module and method of manufacturing the same
CN113488493B (en) Chip packaging structure, manufacturing method thereof and module
JP4197228B2 (en) Solid-state imaging device and manufacturing method thereof
CN211090187U (en) Molded circuit board, camera module and electronic equipment
CN213693868U (en) Photosensitive assembly, camera module and electronic equipment
KR20200063107A (en) Filming assembly and its packaging method, lens module, electronic device
CN112312674A (en) Molded circuit board, camera module, manufacturing method of camera module and electronic equipment
JP2005051535A (en) Imaging apparatus and manufacturing method therefor
KR100613419B1 (en) Image Sensor Module and the product method thereof
US20220279094A1 (en) Molded circuit board and camera module, and manufacturing method thereof and electronic device
CN112714239B (en) Photosensitive assembly, camera module, method thereof and electronic equipment
US8049809B2 (en) Solid-state image pickup device and electronic instruments
JP2008166521A (en) Solid-state imaging device
JP2006019837A (en) Circuit module
CN111050057B (en) Camera module and electronic product
WO2024116976A1 (en) Connector device, semiconductor device, inter-substrate connection structure, and electronic apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination