CN213693868U - Photosensitive assembly, camera module and electronic equipment - Google Patents
Photosensitive assembly, camera module and electronic equipment Download PDFInfo
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- CN213693868U CN213693868U CN202022698239.4U CN202022698239U CN213693868U CN 213693868 U CN213693868 U CN 213693868U CN 202022698239 U CN202022698239 U CN 202022698239U CN 213693868 U CN213693868 U CN 213693868U
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Abstract
The utility model discloses a photosensitive assembly, module and electronic equipment of making a video recording, include: a circuit board having a hollow region; the reinforcing plate is connected with the circuit board; the photosensitive chip is positioned in the hollow area and is electrically connected with the circuit board, and the photosensitive chip is directly attached to the reinforcing plate; and the bonding layer is arranged between the outer edge of the photosensitive chip and the hollow area between the circuit boards. According to the utility model discloses photosensitive assembly can be so that photosensitive assembly is miniaturized, promotes photosensitive assembly's optical imaging quality.
Description
Technical Field
The utility model belongs to the technical field of the technique and specifically relates to a photosensitive assembly, module and electronic equipment make a video recording are related to.
Background
In general, a photosensitive element is provided with a photosensitive chip. It is common practice to glue the chip directly to the circuit board and then to connect the chip to the circuit board to transmit signals. When the signal is turned on, it is necessary to perform welding, whether the signal is turned on by a wire or by an element such as an electrode. In some schemes, high connection reliability between the chip and the circuit board needs to be ensured, special glue needs to be adopted, and the glue needs to keep high environmental temperature during bonding so as to prevent the glue from being hardened too fast in the bonding process. In short, during the assembly process of the photosensitive assembly, the workpiece is inevitably heated due to certain assembly processes. Because the characteristic difference of the materials of the chip and the circuit board is large when the chip expands with heat and contracts with cold, the deformation stress of the circuit board is easily transmitted to the chip, and the chip is inevitably forced to deform after assembly. In addition, when the chip is attached by using the circuit board as a reference surface, the inclination of the chip after the chip is attached is large and the consistency is poor because the contact surface area is large and the flatness is relatively unstable. For the above reasons, the photosensitive chip is easily deformed during the assembly process of the photosensitive assembly, so that the optical imaging quality of the photosensitive assembly is poor. In addition, the photosensitive member is also difficult to be miniaturized.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a photosensitive assembly to make photosensitive assembly miniaturized, promote photosensitive assembly's optical imaging quality.
The utility model provides a module of making a video recording with above-mentioned photosensitive assembly.
The utility model discloses still provide an electronic equipment who has above-mentioned module of making a video recording.
According to the utility model discloses photosensitive assembly, include: a circuit board having a hollow region; the reinforcing plate is connected with the circuit board; the photosensitive chip is positioned in the hollow area and is electrically connected with the circuit board, and the photosensitive chip is directly attached to the reinforcing plate; and the bonding layer is arranged between the outer edge of the photosensitive chip and the hollow area between the circuit boards.
According to the photosensitive assembly provided by the embodiment of the utility model, the photosensitive chip is arranged in the hollow area of the circuit board and is directly attached to the reinforcing plate, and the photosensitive chip is connected with the circuit board only through the bonding layer at the outer edge, so that the stress transmitted from the circuit board to the photosensitive chip due to expansion caused by heat and contraction caused by cold can be relieved or isolated; the circuit board is directly pasted on the reinforcing plate, and the surface flatness of the photosensitive chip can be improved by utilizing the surface flatness of the reinforcing plate, so that better optical imaging quality can be obtained. In addition, the photosensitive chip is arranged in the hollow area of the circuit board, so that the height of the photosensitive assembly can be effectively reduced, and the miniaturization effect of the photosensitive assembly is improved.
In some embodiments, the side surface of the photosensitive chip is bonded to the bonding layer, and there is no adhesive layer between the back surface of the photosensitive chip and the reinforcing plate.
In some embodiments, the photosensitive assembly further comprises: the optical filter is arranged on one side, far away from the reinforcing plate, of the photosensitive chip.
Optionally, a non-photosensitive area of the photosensitive chip is bonded on the optical filter, a non-hollow area of the circuit board is bonded on the reinforcing plate, and the optical filter is connected with a combination of the photosensitive chip and the reinforcing plate and a combination of the circuit board through the bonding layer.
In some embodiments, the photosensitive chip is electrically connected to the circuit board through an electrode and a conductor, the electrode includes a through electrode penetrating through the filter, one end of the through electrode facing the photosensitive chip is electrically connected to the photosensitive chip, and the other end of the through electrode is connected to the circuit board through the conductor.
In other specific embodiments, the photosensitive chip is electrically connected to the circuit board through an electrode and a conductor, the electrode includes a first electrode connected to the photosensitive chip and a second electrode connected to the circuit board, and the conductor is a conductive layer formed on one side of the optical filter, which is close to the photosensitive chip, and is connected to the first electrode and the second electrode respectively.
Optionally, the photosensitive assembly further comprises: and the protective glue is coated on the electrode and the conductor outside the non-photosensitive area of the photosensitive chip.
In some embodiments, the circuit board has an inner flange connected to an inner side surface of the hollow area, and the inner flange is disposed corresponding to a side surface of the photosensitive chip or the optical filter.
Specifically, when the inner flange is arranged corresponding to the photosensitive chip, the edge of the optical filter is positioned on the inner flange; when the inner flange is arranged corresponding to the optical filter, the bonding layer is bonded with the inner flange.
According to the utility model discloses module of making a video recording, include: the photosensitive assembly and the lens assembly arranged on the circuit board in any one of the above embodiments.
According to the utility model discloses the module of making a video recording, through the sensitization chip setting in the module of making a video recording in the hollow area of circuit board, and directly laminate mutually with the reinforcing plate, can alleviate or completely cut off the circuit board because of expend with heat and contract with cold transmitted stress to sensitization chip for sensitization chip attaches guarantees high roughness behind the reinforcing plate, thereby makes the module of making a video recording have better optical imaging quality. In addition, the photosensitive chip is arranged in the hollow area of the circuit board, so that the height of the photosensitive assembly can be effectively reduced, and the miniaturization effect of the camera module is improved.
According to the utility model discloses electronic equipment, including above-mentioned embodiment the module of making a video recording.
According to the utility model discloses electronic equipment, through the hollow region with the sensitization chip setting in electronic equipment at the circuit board, and directly laminate mutually with the reinforcing plate, can make sensitization chip keep high roughness for electronic equipment has better optical imaging quality. In addition, the photosensitive chip is arranged in the hollow area of the circuit board, so that the height of the photosensitive assembly can be effectively reduced, and the miniaturization effect of the electronic equipment is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a photosensitive assembly according to an embodiment of the present invention (in which an outer edge of a filter is flush with an outer edge of a photosensitive chip);
FIG. 2 is an enlarged view of a portion of the structure of FIG. 1;
fig. 3 is a schematic structural diagram of a photosensitive assembly according to an embodiment of the present invention (in which the optical filter includes a main body portion and an extension portion);
FIG. 4 is an enlarged view of a portion of the structure of FIG. 3;
fig. 5 is a schematic diagram of an assembly process of the camera module according to an embodiment of the present invention (in which an outer edge of the optical filter is flush with an outer edge of the photo sensor chip, and the protective glue is a glue body);
fig. 6 is a schematic diagram of an assembly process of the camera module according to an embodiment of the present invention (in which an outer edge of the optical filter is flush with an outer edge of the photo sensor chip, and the protective glue is an injection molding);
fig. 7 is a schematic diagram of an assembly process of the camera module according to an embodiment of the present invention (in which the optical filter includes a main body portion and an extension portion, and the protective glue is a glue body);
fig. 8 is a schematic view illustrating an assembly process of the camera module according to an embodiment of the present invention (in which the optical filter includes a main body portion and an extension portion, and the protective glue is an injection molding member);
fig. 9 is a schematic side view of an electronic device in an embodiment of the present invention.
Reference numerals:
A circuit board 1, a hollow area 11, an inner flange 12,
A reinforcing plate 2, a photosensitive chip 3,
An electrode 46, a lead 47,
An adhesive layer 5,
A third adhesive layer 7,
Casing 2000, clear aperture 2100, mainboard 3000.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A photosensitive assembly 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 8.
According to the utility model discloses photosensitive assembly 100, as shown in fig. 1 and fig. 2, include: circuit board 1, reinforcing plate 2, sensitization chip 3 and tie coat 5, reinforcing plate 2 links to each other with circuit board 1. As can be seen from a diagram of fig. 5, the circuit board 1 has a hollow area 11, and as can be seen from the overall structure diagram of fig. 1, the photosensitive chip 3 is located in the hollow area 11 and electrically connected to the circuit board 1 for signal transmission. The photosensitive chip 3 is directly attached to the reinforcing plate 2, and the bonding layer 5 is arranged in a hollow area 11 between the outer edge of the photosensitive chip 3 and the circuit board 1.
Specifically, the photosensitive chip 3 has a front surface, a back surface and a side surface connected between the front surface and the back surface, and the front surface of the photosensitive chip 3 has a photosensitive area for receiving light irradiation.
The inventors have found that some stations need to be performed under high temperature condition due to the process requirement during the assembly process of the photosensitive assembly 100. In some schemes, a DA (Die attach) process is required, and before the DA process is performed, ultraviolet irradiation is performed on the cut wafer; some solutions require WB (Wire bonding) processes, which obviously avoid the soldering process, and these processes inevitably raise the temperature of the photosensitive assembly 100. Due to the expansion and contraction characteristics of the material, there is a difference in CTE (coefficient of thermal expansion) between the photosensitive chip 3 and the circuit board 1. When the back of the photosensitive chip 3 is directly adhered to the circuit board 1 through glue, the deformation stress of the circuit board 1 is directly transmitted to the photosensitive chip 3 through the glue when the temperature rises, and the photosensitive chip 3 is forced to deform.
The photosensitive chip 3 in this application is arranged in the hollow area 11 of the circuit board 1, and is directly attached to the reinforcing plate 2. Sensitization chip 3 only the periphery is through the internal perisporium of 5 hollow area 11 of tie coat connection circuit board 1, compare in the scheme of gluing whole back at circuit board 1 with sensitization chip 3, the scheme of this application has reduced the area of contact between sensitization chip 3 and circuit board 1, does not contact completely even between sensitization chip 3 and the circuit board 1, and sensitization chip 3 all supports through reinforcing plate 2 with circuit board 1, and connects through tie coat 5.
The scheme can relieve or isolate the stress transferred to the photosensitive chip 3 by the circuit board 1 due to thermal expansion and cold contraction. Compared with the circuit board 1, the reinforcing plate 2 has smaller internal stress and smaller structural deformation when cooled after being heated, and the reinforcing plate 2 can easily keep smooth finish and flatness. With the attached circuit board 1 that directly pastes on the reinforcing plate 2 rather than the back with sensitization chip 3, guarantee sensitization chip 3's high roughness easily, can highly maintain naked piece form (no deformation or reduce the deformation by a wide margin) in process flow to can obtain better optical imaging quality.
In addition, when a general photosensitive chip is attached with a circuit board as a reference surface, the flatness of the circuit board is relatively large and unstable, so that the inclination of the photosensitive chip after the attachment is large and the consistency is poor.
This application is provided with the reinforcing plate 2 that is used for supporting sensitization chip 3 specially, and the poor influence of roughness that circuit board 1 brought in the conventional setting that can significantly reduce can improve the attached Tilt (slope) effect of sensitization chip 3, promotes sensitization chip 3's laminating roughness.
In addition, the photosensitive chip 3 is disposed in the hollow area 11 of the circuit board 1, so that the height of the photosensitive assembly 100 can be effectively reduced, and the miniaturization effect of the photosensitive assembly 100 can be improved. In some schemes, the photosensitive assembly 100 further comprises an optical filter 4, and the arrangement of the hollow area 11 on the circuit board 1 enables the photosensitive chip 3 to be reversely arranged on the optical filter 4, and the two are both located in the hollow area 11, so that an optical filter support can be omitted, and the miniaturization arrangement of the photosensitive assembly 100 is further facilitated.
According to the utility model discloses photosensitive assembly 100, through the hollow area 11 with photosensitive chip 3 setting at circuit board 1, and directly laminate mutually with reinforcing plate 2, can improve the attached Tilt (slope) effect of photosensitive chip 3, can also alleviate or isolated circuit board 1 to photosensitive chip 1 because of the stress that expend with heat and contract with cold transmitted for photosensitive chip 3 attaches in reinforcing plate 2 back assurance high roughness, thereby can obtain better optical imaging quality. In addition, the photosensitive chip 3 is disposed in the hollow area 11 of the circuit board 1, so that the height of the photosensitive assembly 100 can be effectively reduced, and the miniaturization effect of the photosensitive assembly 100 can be improved.
As mentioned above, the adhesive layer 5 is disposed in the hollow area 11 between the outer edge of the photosensitive chip 3 and the circuit board 1, for example, when the photosensitive chip 3 is a square piece, the adhesive layer 5 is adhered between the four sides of the photosensitive chip 3 and the circuit board 1. When the adhesive layer 5 is adhered to the outer edge of the photosensitive chip 3, the glue is not easily adhered to the photosensitive area of the photosensitive chip 3. In some embodiments, the side surface of the photo chip 3 is bonded to the bonding layer 5, and there is no adhesive layer between the back surface of the photo chip 3 and the reinforcing plate 2. That is, the glue forming the adhesive layer 5 adheres to the side of the photosensitive chip 3, but does not adhere to the back of the photosensitive chip 3, and the back of the photosensitive chip 3 is in direct contact with the reinforcing plate 2 without interposing the glue. Set up like this and can utilize reinforcing plate 3's surface finish to improve sensitization chip 3's roughness, also can reduce the glue influence when expend with heat and contract with cold moreover, reduce the stress of reinforcing plate 2 to sensitization chip 3 transmission.
In some embodiments, as shown in fig. 1 and fig. 2, the photosensitive assembly 100 further includes a filter 4, and the filter 4 is disposed on a side of the photosensitive chip 3 away from the reinforcing plate 2. That is, the front surface of the photosensitive chip 3 is the optical filter 4, and the back surface of the photosensitive chip 3 is the reinforcing plate 2. The arrangement of the optical filter 4 can reduce the unnecessary light of the photosensitive chip 3 and change the imaging effect.
In some embodiments, as shown in fig. 1 and 2, the non-photosensitive area of the photosensitive chip 3 is bonded to the optical filter 4, the non-hollow area of the circuit board 1 is bonded to the reinforcing plate 2, and the combination of the optical filter 4 and the photosensitive chip 3, and the combination of the reinforcing plate 2 and the circuit board 1 are connected by the adhesive layer 5. The assembly is characterized in that the bonded glue or colloid avoids the photosensitive area of the photosensitive chip 3, and the light is prevented from being refracted through the glue or colloid and then thrown into the photosensitive area of the photosensitive chip 3 in use. The optical filter 4 and the photosensitive chip 3 are connected as an assembly, and electrical connection by the optical filter 4 can be conveniently performed, for example, it is mentioned below that the photosensitive chip 3 can perform electrode or wire arrangement by the optical filter 4, and the like. After bonding reinforcing plate 2 and circuit board 1 together earlier, 5 adhesion sensitization chips 3 of rethread tie coat are favorable to controlling 5 quantities of tie coat, avoid excessive back overflow to advance sensitization chip 3's front or back.
Of course, in other embodiments, the photosensitive assembly 100 may be assembled in other manners, such as fixing the filter 4 on the circuit board 1, or the like, or eliminating the filter 4, and sequentially adhering the photosensitive core 3 and the circuit board 1 to the reinforcing plate 4, which is not limited in this respect.
In one embodiment, as shown in fig. 1-2, the light sensing chip 3 is electrically connected to the circuit board 1 through an electrode and a conductor, the electrode includes a through electrode 46 penetrating through the filter 4, one end of the through electrode 46 facing the light sensing chip 3 is electrically connected to the light sensing chip 3, and the other end of the through electrode 46 is connected to the circuit board 1 through the conductor. For ease of distinction, the electrical conductors are referred to herein as wires 47.
In another embodiment, as shown in fig. 3 and 4, the photosensitive chip 3 is electrically connected to the circuit board 1 through electrodes and conductors, the electrodes include a first electrode 44 connected to the photosensitive chip 3 and a second electrode 45 connected to the circuit board 1, and the conductors are conductive layers 43 formed on the side of the filter 4 close to the photosensitive chip 3 and connected to the first electrode 44 and the second electrode 45, respectively.
Specifically, as shown in fig. 2 and 4, the photosensitive assembly 100 further includes a protective paste 6, and the protective paste 6 is coated on the electrode and the conductor outside the non-photosensitive region of the photosensitive chip 3. Thus, the protective adhesive 6 has a protective effect on the electrode and the conductor, and the communication reliability is improved. Here, the protective paste 6 avoids the non-photosensitive region of the photosensitive chip 3, so as to prevent the light from being reflected by the protective paste 6 and then emitted to the photosensitive chip 3.
In some alternative embodiments, as shown in fig. 2 and 4, the circuit board 1 has an inner flange 12, and the inner flange 12 is connected to the inner side surface of the hollow area 11, as shown in fig. 5 and 7, and the inner flange 12 is disposed corresponding to the side surface of the photosensitive chip 3 or the optical filter 4. Therefore, the whole reasonable layout of the photosensitive chip 3, the optical filter 4 and the circuit board 1 is facilitated, and the stable and good matching relation among the photosensitive chip 3, the optical filter 4 and the circuit board 1 is facilitated.
Specifically, as shown in fig. 7, when the inner flange 12 is disposed corresponding to the photosensitive chip 3, the edge of the optical filter 4 is located on the inner flange. This arrangement makes it possible to support the optical filter 4 by the connection surface. As shown in fig. 5, when the inner flange 12 is disposed corresponding to the optical filter 4, the adhesive layer 5 is adhered to the inner flange 12. This increases the contact area between the adhesive layer 5 and the circuit board 1, thereby improving connection reliability and reliability.
In some embodiments, as shown in fig. 3 and 4, the light sensing chip 3 has a light sensing area on a side facing the light filter 4, the circuit board 1 has an inner flange 12, the light filter 4 includes a main body portion 41 on the light sensing area and an extension portion 42 on the inner flange 12, and the protective adhesive 6 is disposed on a side of the light filter 4 and the circuit board 1 away from the reinforcing plate 2. It will be appreciated that the provision of the body portion 41 provides good filtering and transmission to the photosensitive area. The extension 42 is provided to cooperate with the inner flange 12 to provide a good positioning and supporting effect.
Specifically, as shown in fig. 3 and 4, a conductive layer 43 is disposed on one side of the optical filter 4 close to the photosensitive chip 3, and a first electrode 44 and a second electrode 45 are disposed at two ends of the conductive layer 43 respectively, wherein the first electrode 44 is connected between the photosensitive chip 3 and the optical filter 4, and the second electrode 45 is connected between the circuit board 1 and the optical filter 4. Thus, through the communication effect of the first electrode 44, the conductive layer 43 and the second electrode 45, the electrical information between the circuit board 1 and the photosensitive chip 3 can be effectively transmitted, thereby improving the operation reliability of the photosensitive assembly 100.
Optionally, the conductive layer 43 may be an LDS circuit, which not only facilitates processing and molding, but also facilitates improving the performance stability of the conductive layer 43, thereby improving the service life of the layer conductive layer 43.
Of course, in some other embodiments, the lines 34 may be plated, for example, the areas of the filter 4 where no lines need to be formed may be shielded, and a conductive plating layer may be deposited on the areas where lines need to be formed to form plated lines. This also enables stable transfer work, and the specific form of the conductive layer 43 is not limited herein.
In some embodiments, as shown in fig. 1 and 2, the outer edge of the photosensitive chip 3 is flush with the outer edge of the optical filter 4, the protective adhesive 6 is disposed on the side of the optical filter 4 and the circuit board 1 away from the reinforcing plate 2, and a part of the protective adhesive 6 extends into the hollow area 11 between the outer edge of the optical filter 4 and the circuit board 1. This can improve the mounting stability between the optical filter 4 and the circuit board 1, thereby improving the operational reliability of the optical filter 4 and the circuit board 1.
Specifically, as shown in fig. 1 and fig. 2, a through electrode 46 is disposed at a position of the optical filter 4 close to the circuit board 1, a wire 47 is disposed at a side of the through electrode 46 away from the light sensing chip 3, and the wire 47 is connected to the circuit board 1 and is wrapped in the protective adhesive 6. It can be understood that the through electrodes 46 and the conductive wires 47 can effectively transmit electrical information, thereby improving the operation reliability of the photosensitive assembly 100. In addition, wire 47 cladding can provide limiting displacement for wire 47 in protection glue 6 to promote wire 47's operational reliability, can reduce because of the condition such as the fracture that produces of the effect such as rocking in the use.
Optionally, the conductor may be a gold wire, a silver wire, or a copper wire, and the specific form of the conductor is not limited herein.
In some embodiments, as shown in fig. 1 and 3, the reinforcing plate 2 is a steel sheet. It can be understood that the steel sheet has not only good structural strength, but also good supporting effect for the photosensitive chip 3. And also has good roughness to promote sensitization chip 3's level and smooth effect, optimize and improve sensitization chip 3's slope.
Of course, in other embodiments, the reinforcing plate 2 may also be an alloy plate or a composite plate, and a good supporting function can also be achieved, and the specific form of the reinforcing plate 2 is not limited herein.
In some embodiments, as shown in fig. 5-8, the protective adhesive 6 is a common adhesive 61 or an injection molded part 62, and as shown in fig. 6 and 8, when the protective adhesive 6 is the injection molded part 62, the injection molded part 62 can be used to support the lens assembly 200. It can be understood that the common colloid 61 has the advantages of convenient use, flexible arrangement, capability of improving the forming efficiency and the like. The injection molding part 62 has a simple molding process and certain structural strength, and can provide a good supporting function for the lens assembly 200.
In some embodiments, as shown in fig. 2 and 4, the photosensitive assembly 100 further includes a third adhesive layer 7 disposed between the circuit board 1 and the reinforcing plate 2. It can be understood that the third adhesive layer 7 can improve the stability of the fit between the circuit board 1 and the reinforcing plate 2, thereby improving the reliability of the operation of the photosensitive chip 3.
Of course, in other embodiments, the outer edge of the reinforcing plate 2 may also be provided with a detent structure, which also enables a stable fit between the circuit board 1 and the reinforcing plate 2, and the specific form of fit between the circuit board 1 and the reinforcing plate 2 is not limited herein.
The following describes a camera module 1000 according to an embodiment of the present invention.
According to the utility model discloses module 1000 of making a video recording, include: the photosensitive assembly 100 and the lens assembly 200 disposed on the circuit board 1 according to any of the above embodiments.
Specifically, as shown in fig. 5, the lens assembly 200 includes a driving motor 210 and a lens 220, and the lens 220 is connected to the driving motor 210. Alternatively, the drive motor 210 is a voice coil motor, and the drive motor 210 is externally fitted to the lens. The lens assembly 200 is connected to the circuit board 1 of the light sensing assembly 100, and light rays pass through the lens and then irradiate into the light sensing area of the light sensing chip 3.
According to the utility model discloses module 1000 of making a video recording, through the hollow region 11 of the setting at circuit board 1 of sensitization chip 3 in the module 1000 of making a video recording, and directly laminate with reinforcing plate 2 mutually, can improve the attached Tilt (slope) effect of sensitization chip 3, can also alleviate or completely cut off the stress that circuit board 1 transmitted to sensitization chip 3 because of expend with heat and contract with cold for sensitization chip 3 attaches and guarantees high roughness behind reinforcing plate 2, thereby makes module 1000 of making a video recording have better optical imaging quality. In addition, the photosensitive chip 3 is disposed in the hollow area 11 of the circuit board 1, so that the height of the photosensitive assembly 100 can be effectively reduced, and the miniaturization effect of the camera module 1000 can be improved.
In some embodiments, as shown in fig. 6 and 8, when the protective adhesive 3 is the injection molded part 62, the lens assembly 200 is supported on the injection molded part 62, so that the mounting stability of the lens assembly 200 can be improved.
The electronic device 10000 according to an embodiment of the present invention is described below with reference to the drawings.
According to the utility model discloses electronic equipment 10000, including above-mentioned embodiment the module 1000 of making a video recording. The electronic device 10000 can be a terminal product such as a smart phone, a tablet computer, a vehicle-mounted camera, and the like.
Specifically, as shown in fig. 9, the electronic device 10000 includes a housing 2000, a light-passing hole 2100 is formed in the housing 2000, the camera module 1000 is disposed in the housing 2000, and a lens of the camera module 1000 is disposed toward the light-passing hole 2100, so that external light enters the camera module 1000 through the light-passing hole 2100 when in use. The electronic device 10000 is provided with a main board 3000 to control the overall operation of the electronic device, the circuit board 1 in the photosensitive component 100 is electrically connected with the main board 3000 of the electronic device 10000, and the main board 3000 obtains image information through the circuit board 1.
According to the utility model discloses electronic equipment 10000, through the hollow region 11 of setting up sensitization chip 3 in electronic equipment 10000 at circuit board 1, and directly laminate with reinforcing plate 2 mutually, can improve the attached Tilt (slope) of sensitization chip 3, can also alleviate or isolated circuit board 1 is because of the stress that expend with heat and contract with cold transmitted to sensitization chip 3 for sensitization chip 3 is attached in reinforcing plate 2 after guaranteeing high roughness, thereby makes electronic equipment 10000 have better optical imaging quality. In addition, the photosensitive chip 3 is disposed in the hollow area 11 of the circuit board 1, so that the height of the photosensitive assembly 100 can be effectively reduced, and the miniaturization effect of the electronic device 10000 is improved.
The camera module 1000 according to some embodiments of the present invention will be described below with reference to the drawings.
Example 1
According to the utility model discloses module 1000 of making a video recording, as shown in fig. 5, include: a photosensitive assembly 100 and a lens assembly 200 disposed on the circuit board 1. Wherein, photosensitive assembly 100 includes: the device comprises a circuit board 1, a reinforcing plate 2, a photosensitive chip 3, an optical filter 4, an adhesive layer 5, a protective adhesive 6 and a third adhesive layer 7.
The circuit board 1 has a hollow 11 and an inner flange 12, and the inner flange 12 is attached to an inner side surface of the hollow 11.
The reinforcing plate 2 is a steel plate and is connected with the circuit board 1.
The light sensing chip 3 has a light sensing region on a side facing the filter 4. The photosensitive chip 3 is located in the hollow area 11 and electrically connected with the circuit board 1, and the photosensitive chip 3 is directly attached to the reinforcing plate 2.
The filter 4 is located in the hollow area 11 and is disposed on a side of the photosensitive chip 3 away from the reinforcing plate 2. The outer edge of the filter 4 is flush with the outer edge of the light-sensing chip 3.
The filter 4 is provided with a through electrode 46 near the circuit board 1, a wire 47 is provided on one side of the through electrode 46 far away from the photosensitive chip 3, and the wire 47 is connected to the circuit board 1 and is wrapped in the protective adhesive 6.
The adhesive layer 5 is arranged in the hollow area 11 between the outer edge of the photosensitive chip 3 and the circuit board 1, and the adhesive layer 5 is adhered to the inner flange 12.
The protective adhesive 6 is a common adhesive 61, the adhesive 61 is disposed on the side of the optical filter 4 and the circuit board 1 away from the stiffener 2, and a portion of the protective adhesive 6 extends into the hollow area 11 between the outer edge of the optical filter 4 and the circuit board 1.
The third adhesive layer 7 is provided between the circuit board 1 and the reinforcing plate 2.
One assembly process of the lens assembly 1000 of the present embodiment is as follows:
1. forming a penetrating electrode 46 on the filter 4, and implanting gold balls on the photosensitive chip 3;
2. the optical filter 4 is arranged on the photosensitive chip 3;
3. as shown in fig. 5a, the photosensitive chip 3 and the optical filter 4 are disposed in the hollow region 11 of the circuit board 1;
4. as shown in fig. 5b, a wire 47 is provided between the through electrode 46 and the circuit board 1;
5. as shown in fig. 5c, the colloid 61 is drawn to the side of the filter 4 and the circuit board 1 away from the stiffener 2, and a part of the colloid 61 extends into the hollow region 11 between the outer edge of the filter 4 and the circuit board 1, so that the colloid 61 covers the wires 47;
6. as shown in fig. 5d, the adhesive layer 5 is filled into the hollow area 11 between the outer edge of the photo chip 3 and the circuit board 1;
7. as shown in fig. 5e, the steel sheet is attached to the circuit board 1 by a third adhesive layer 7 and supports the photo chip 3.
8. As shown in fig. 5f, the lens assembly 200 (including the lens and VCM motor) is mounted on the circuit board 1;
step 8 may be performed between step 5 and step 6.
Example 2
According to the utility model discloses module 1000 of making a video recording, as shown in fig. 7, include: a photosensitive assembly 100 and a lens assembly 200 disposed on the circuit board 1. Wherein, photosensitive assembly 100 includes: the device comprises a circuit board 1, a reinforcing plate 2, a photosensitive chip 3, an optical filter 4, an adhesive layer 5, a protective adhesive 6 and a third adhesive layer 7.
The circuit board 1 has a hollow 11 and an inner flange 12, and the inner flange 12 is attached to an inner side surface of the hollow 11.
The reinforcing plate 2 is a steel plate and is connected with the circuit board 1.
The light sensing chip 3 has a light sensing region on a side facing the filter 4. The photosensitive chip 3 is located in the hollow area 11, and the photosensitive chip 3 is directly attached to the reinforcing plate 2.
The filter 4 includes a body portion 41 on the photosensitive region and an extension portion 42 on the inner flange 12. The filter 4 is located in the hollow area 11 and is disposed on a side of the photosensitive chip 3 away from the reinforcing plate 2.
The filter 4 is provided with a conductive layer 43 on one side close to the light sensing chip 3, and a first electrode 44 and a second electrode 45 are respectively arranged at two ends of the conductive layer 43, wherein the first electrode 44 is connected between the light sensing chip 3 and the filter 4, and the second electrode 45 is connected between the circuit board 1 and the filter 4.
The adhesive layer 5 is provided in the hollow region 11 between the outer edge of the photosensitive chip 3 and the circuit board 1.
The protective adhesive 6 is an adhesive 61, and the adhesive 61 is disposed on the side of the optical filter 4 and the circuit board 1 away from the stiffener 2.
The third adhesive layer 7 is provided between the circuit board 1 and the reinforcing plate 2.
One assembly process of the lens assembly 1000 of the present embodiment is as follows:
1. a conductive layer 43, a first electrode 44 and a second electrode 45 are arranged on the surface corresponding to the photosensitive area of the photosensitive chip 3;
2. the optical filter 4 is installed on the photosensitive chip 3, as shown in fig. 7a, the photosensitive chip 3 and the optical filter 4 are disposed in the hollow region 11 of the circuit board 1;
3. as shown in fig. 7b, the colloid 61 is drawn to the side of the filter 4 and the circuit board 1 away from the reinforcing plate 2, so that the colloid 61 covers the conductive layer 43 outside the light-sensing area of the light-sensing chip 3, the first electrode 44 and the second electrode 45;
4. as shown in fig. 7c, the adhesive layer 5 is filled between the outer edge of the photo chip 3 and the circuit board 1.
5. As shown in fig. 7d, the steel sheet is attached to the circuit board 1 through the third adhesive layer 7 and supports the photosensitive chip 3.
6. As shown in fig. 7e, the lens assembly 200 (including the lens and the VCM motor) is mounted on the circuit board 1.
Here, step 6 may also be performed between step 4 and step 5.
Example 3
As shown in fig. 6c, the protective adhesive 6 forms an injection molding member 62 to the side of the optical filter 4 and the circuit board 1 away from the stiffener 2 by injection molding, so as to achieve stable installation of the optical filter 4 and the circuit board 1, and the rest of the settings are the same as those in embodiment 1, which is not described herein again.
Example 4
As shown in fig. 8b, the protection adhesive 6 forms an injection molding part 62 by injection molding, so as to achieve stable installation of the optical filter 4 and the circuit board 1, and the rest of the settings are the same as those in embodiment 2, which is not described herein again.
In embodiment 1-embodiment 4, through setting up photosensitive chip 3 in the hollow area 11 of circuit board 1, and directly laminate mutually with reinforcing plate 2, can improve the attached Tilt of photosensitive chip 3, can also alleviate or isolated circuit board 1 and reinforcing plate 2 the stress that expands with heat and contracts with cold and transmit for photosensitive chip 3 guarantees high roughness behind the attached reinforcing plate 2, thereby can obtain better optical imaging quality. In addition, photosensitive chip 3, filter 4 all set up in the hollow area 11 of circuit board 1, can effectively reduce photosensitive assembly 100's height to promote photosensitive assembly 100's miniaturized effect. If the photosensitive chip 3 can be inversely installed on the filter 4 and simultaneously located in the hollow area 11, the support of the filter 4 can be omitted, so that the photosensitive assembly 100 is miniaturized.
In the description herein, references to the description of the terms "embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A photosensitive assembly, comprising:
a circuit board having a hollow region;
the reinforcing plate is connected with the circuit board;
the photosensitive chip is positioned in the hollow area and is electrically connected with the circuit board, and the photosensitive chip is directly attached to the reinforcing plate;
and the bonding layer is arranged between the outer edge of the photosensitive chip and the hollow area between the circuit boards.
2. The photosensitive assembly of claim 1, wherein the side of the photosensitive chip is bonded to the bonding layer, and there is no adhesive layer between the back of the photosensitive chip and the reinforcing plate.
3. A photosensitive assembly according to claim 1, further comprising: the optical filter is arranged on one side, far away from the reinforcing plate, of the photosensitive chip.
4. A photosensitive assembly according to claim 3, wherein the non-photosensitive region of the photosensitive chip is bonded to the optical filter, the circuit board is bonded to the reinforcing plate, and the assembly of the optical filter and the photosensitive chip and the assembly of the reinforcing plate and the circuit board are connected by the adhesive layer.
5. The photosensitive assembly according to claim 3, wherein the photosensitive chip is electrically connected to the circuit board through an electrode and a conductor, the electrode includes a through electrode penetrating through the filter, one end of the through electrode facing the photosensitive chip is electrically connected to the photosensitive chip, and the other end of the through electrode is connected to the circuit board through the conductor.
6. The photosensitive assembly according to claim 3, wherein the photosensitive chip is electrically connected to the circuit board through an electrode and a conductive body, the electrode includes a first electrode connected to the photosensitive chip and a second electrode connected to the circuit board, and the conductive body is a conductive layer formed on a side of the optical filter close to the photosensitive chip and is respectively connected to the first electrode and the second electrode.
7. A photosensitive assembly according to claim 5 or 6, further comprising: and the protective glue is coated on the electrode and the conductor outside the non-photosensitive area of the photosensitive chip.
8. The photosensitive assembly of claim 3, wherein the circuit board has an inner flange connected to an inner side surface of the hollow area, and the inner flange is disposed corresponding to a side surface of the photosensitive chip or the optical filter.
9. The photosensitive assembly of claim 8, wherein when the inner flange is disposed corresponding to the photosensitive chip, the edge of the optical filter is located on the inner flange; when the inner flange is arranged corresponding to the optical filter, the bonding layer is bonded with the inner flange.
10. The utility model provides a module of making a video recording which characterized in that includes: the photosensitive assembly of any one of claims 1-9 and a lens assembly disposed on the circuit board.
11. An electronic apparatus characterized by comprising the camera module according to claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022698239.4U CN213693868U (en) | 2020-11-20 | 2020-11-20 | Photosensitive assembly, camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022698239.4U CN213693868U (en) | 2020-11-20 | 2020-11-20 | Photosensitive assembly, camera module and electronic equipment |
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| CN213693868U true CN213693868U (en) | 2021-07-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115278020A (en) * | 2022-07-27 | 2022-11-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115499570A (en) * | 2022-09-14 | 2022-12-20 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device of camera module |
-
2020
- 2020-11-20 CN CN202022698239.4U patent/CN213693868U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115278020A (en) * | 2022-07-27 | 2022-11-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115499570A (en) * | 2022-09-14 | 2022-12-20 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device of camera module |
| CN115499570B (en) * | 2022-09-14 | 2024-04-16 | 昆山丘钛微电子科技股份有限公司 | Packaging method and device for camera module |
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