CN112291449B

CN112291449B - Camera module, photosensitive assembly and manufacturing method thereof

Info

Publication number: CN112291449B
Application number: CN201910677226.8A
Authority: CN
Inventors: 栾仲禹; 黄桢; 陈凯; 许晨祥; 陈佳炜; 刘丽
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2022-07-26
Anticipated expiration: 2039-07-25
Also published as: CN112291449A

Abstract

The application relates to a photosensitive assembly, which comprises a circuit board and a photosensitive chip, wherein the photosensitive chip is provided with a first surface for attaching the photosensitive chip and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, and the chip attaching area comprises a depressed area and a flat area; the photosensitive chip is attached to the first surface through an adhesive arranged in the chip attaching area, the adhesive at least comprises a first adhesive material, the first adhesive material is arranged in the leveling area, and the first adhesive material is prevented from contacting the depressed area. The application also provides a corresponding camera module, a photosensitive assembly and a camera module manufacturing method. The problem of the glue shrink volume is uneven because of circuit board surface unevenness causes can be improved to this application.

Description

Camera module, photosensitive assembly and manufacturing method thereof

Technical Field

The invention relates to the technical field of camera modules, in particular to a camera module, a photosensitive assembly for the camera module and a manufacturing method of the photosensitive assembly.

Background

In order to meet the increasingly wide market demands, high pixels, large chips, small sizes and large apertures are the irreversible development trend of the existing camera modules. However, the requirements for high pixel, large chip, small size, and large aperture are difficult to realize in the same image pickup mold. For example, firstly, the market puts forward higher and higher demands on the imaging quality of a camera module, and how to obtain higher imaging quality with a smaller camera module volume has become a big problem in the field of compact camera modules (for example, camera modules for mobile phones), especially on the premise of establishing the technical development trends of high pixels, large apertures, large chips and the like in the mobile phone industry; secondly, the compact development of the mobile phone and the increase of the screen occupation ratio of the mobile phone enable the space in the mobile phone, which can be used for a front camera module, to be smaller and smaller; the quantity of the rear camera module is more and more, and the area that occupies is also bigger and more, leads to other configurations of cell-phone such as battery size, the corresponding shrink of mainboard size, in order to avoid the sacrifice of other configurations, the market hopes that the rear camera module volume can reduce, realizes the small-size encapsulation promptly.

The market demand is a development bottleneck of the camera module packaging industry, and causes the problem that the demand is not solved in time and delay, the reason analysis is mainly as follows:

(1) high pixel, large chip size: because the chip size is gradually increased, for example, the size of a common chip with more than 4800 ten thousand pixels at the present stage is 1/2 inches, and a 1/1.7 inch chip or even a larger chip is popularized in the future, so that the chip size is rapidly increased, but because the photosensitive chip is thinner than a common chip and has a thickness of about 0.15mm, the problem of inclination and field curvature of a large chip is more easily caused, and the influence on the imaging quality of a camera module is increasingly large.

(2) A large aperture: due to the popularization of large pixel chips, the corresponding improvement of optical performance is also an inevitable trend, for example, the optical parameters of lenses such as a large aperture, a large wide angle and the like are gradually improved, so that the resolution performance of the photosensitive chip is realized to the greatest extent. But large aperture, large wide angle modules put higher demands on the flatness of the module. The flatness of the photosensitive chip has great influence on the imaging of the camera module. The photosensitive assembly, on the other hand, typically includes a photosensitive chip and a wiring board. The photosensitive chip is generally fixed on the circuit board by gluing, and then electrically connected to the circuit board by a conductive wire (e.g., gold wire). In other words, the fixing of the photosensitive chip and the circuit board is mainly realized by glue. The circuit board that adopts in the module of making a video recording at present is mostly multilayer circuit board, and multilayer circuit board is made through the lamination method, makes through the conducting layer and the insulating layer that the lamination multilayer was set up alternately promptly. Wherein the conductive layer is typically a copper material layer. Due to the circuit trace design of the circuit board, when the designed circuit is fabricated, it is usually necessary to etch the copper layer (conductive layer) except the conductive circuit. Furthermore, due to the requirement on the size of the camera module, the area of the circuit board is usually small, the wiring design of the conducting circuits in the circuit board is limited, the distribution of the conducting circuits is often uneven, the conducting circuits are particularly dense in some areas, and the amount of copper layer corrosion is relatively large in places where the conducting circuits are dense, so that the surface of the circuit board may be uneven.

The inventor of the present invention found that, in the prior art, the photosensitive chip is adhered to the circuit board through the glue, and the uneven surface of the circuit board causes uneven thickness distribution of the glue disposed between the circuit board and the photosensitive chip, so that different shrinkage amounts are generated during curing of the glue at various positions, and the photosensitive chip is inclined or bent relative to the circuit board, and such inclination or bending is one of the important reasons that prevent the assembly of the camera module and the improvement of the imaging quality.

Therefore, there is a need for a solution that can overcome the inclination or bending of the photosensitive chip caused by the unevenness of the surface of the circuit board.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide a solution for a photosensitive assembly and a camera module.

In order to solve the above technical problem, the present invention provides a photosensitive assembly, which includes: the circuit board is provided with a first surface for attaching the photosensitive chip and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, and the chip attaching area comprises a depressed area and a flat area; the photosensitive chip is attached to the first surface through adhesive arranged in the chip attaching area, the adhesive at least comprises a first adhesive material, the first adhesive material is arranged in the leveling area, and the first adhesive material is prevented from contacting the depressed area. The photosensitive assembly may further include electronic components and the like, which are not described in detail herein.

The adhesive glue further comprises a second glue material, the second glue material is arranged in the recessed area, and the shrinkage rate of the second glue material is smaller than that of the first glue material.

Wherein the shrinkage rate of the second rubber material is 25% -75% of the shrinkage rate of the first rubber material.

The circuit board is a printed circuit board, and the circuit board is a multilayer board formed by arranging and laminating a plurality of conducting layers and insulating layers at intervals.

Wherein the multilayer board has a first area and a second area, wherein the first area has a lower wiring density than the second area, the surface of the first area is set as the flat area, and the surface of the second area is set as the recessed area.

The circuit board comprises a hard board, a flexible connecting belt and a connector, wherein two ends of the flexible connecting belt are connected with the hard board and the connector; the chip attaching area is located on the hard board, the depressed area is located close to one end of the connecting band, and the leveling area is located far away from one end of the connecting band.

Wherein the recessed areas correspond to dense areas of wiring in the multi-layer board that are more densely populated with MIPI wiring than other areas of the multi-layer board.

The adhesive glue also comprises a second glue material, the shrinkage rate of the first glue material is larger than that of the second glue material, the first glue material is arranged in the flat area, the second glue material is arranged in the recessed area, and the first glue material is covered above the second glue material.

Wherein the total shrinkage of the glue material arranged in the flat area is equal to the total shrinkage of the glue material arranged in the recessed area by adjusting the respective thicknesses of the glue materials arranged in the flat area and the recessed area.

The depressed area is not provided with the adhesive glue, so that an air gap is reserved between the photosensitive chip and the circuit board in the depressed area.

The photosensitive assembly further comprises a metal wire and an electronic element, the metal wire electrically connects the photosensitive chip and the circuit board based on a wire bonding process, the electronic element is mounted on the first surface of the circuit board, and the electronic element is located on the outer side of the metal wire.

Wherein, there is air gap between first gluey material and the second gluey material.

Wherein the air gap is communicated with the region outside the chip attaching region.

According to another aspect of the present application, there is also provided a camera module, which includes: any one of the photosensitive assemblies described above, and a lens assembly, wherein the bottom surface of the lens assembly is bonded to the top surface of the photosensitive assembly by an adhesive.

The top surface of the photosensitive assembly and the photosensitive surface of the photosensitive chip form an included angle which is not zero; the adhesive glue has different thicknesses at different positions to compensate the included angle, so that the optical axis of the lens assembly is perpendicular to the photosensitive surface.

The bonding glue comprises a third glue material with a third shrinkage rate and a fourth glue material with a fourth shrinkage rate, the third shrinkage rate is smaller than the fourth shrinkage rate, and the thickness of the third glue material is larger than that of the fourth glue material.

The photosensitive assembly further comprises a molding part formed on the surface of the circuit board, the molding part surrounds the photosensitive chip, and the top surface of the molding part is the top surface of the photosensitive assembly.

According to another aspect of the present application, there is provided a method for manufacturing a photosensitive assembly, including: 1) preparing a circuit board, wherein the circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, and the chip attaching area comprises a concave area and a flat area; 2) arranging an adhesive glue on the first surface, wherein the adhesive glue comprises a first glue material, the first glue material is arranged on the flat area, and the first glue material is prevented from contacting the depressed area; 3) moving the photosensitive chip to the position above the chip attaching area, and then moving the photosensitive chip downwards to enable the bottom surface of the photosensitive chip to be in contact with and extrude the adhesive; and 4) curing the adhesive glue so as to attach the photosensitive chip to the circuit board.

The first glue material has a first shrinkage rate, the adhesive glue further comprises a second glue material having a second shrinkage rate, and the first shrinkage rate is larger than the second shrinkage rate; the step 2) comprises the following substeps: 2a) arranging the second rubber material in the recessed area; and 2b) arranging the first rubber material in the leveling area.

Wherein the step 2b) further comprises: the first glue material is spaced apart from the first glue material.

The first glue material has a first shrinkage rate, the adhesive glue further comprises a second glue material having a second shrinkage rate, and the first shrinkage rate is larger than the second shrinkage rate; the step 2) comprises the following substeps: 2a) arranging the second rubber material in the recessed area; and 2b) arranging the first rubber material in the flattening area, and covering the first rubber material above the second rubber material.

Wherein the step 2) further comprises: avoiding the depressed area when arranging the first glue material, and not arranging other glue materials in the depressed area.

According to still another aspect of the present application, there is provided a method for manufacturing a camera module, including: a) manufacturing a photosensitive assembly according to any one of the photosensitive assembly manufacturing methods described above; b) detecting the inclination angle of the top surface of the photosensitive component or the lens component relative to the photosensitive surface of the photosensitive chip; and c) arranging adhesive glue on the top surface of the photosensitive assembly according to the detected inclination angle so as to compensate the inclination angle, and then adhering the bottom surface of the lens assembly to the top surface of the photosensitive assembly.

Wherein the step c) further comprises: and arranging rubber materials with different thicknesses at different positions of the top surface of the photosensitive assembly to compensate the inclination angle.

Wherein the step c) further comprises: different rubber materials with different shrinkage rates are arranged at different positions of the top surface of the photosensitive assembly to compensate the inclination angle.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can avoid the depressed area through setting up the different multiple gluey materials of shrinkage factor on the circuit board surface or when the rubber coating, improves the uneven problem of glue shrinkage that causes by circuit board surface unevenness.

2. According to the circuit board, the first glue and the second glue with different shrinkage rates are arranged on the surface of the circuit board, so that the problem that the photosensitive chip inclines or bends relative to the circuit board due to the fact that the surface of the circuit board is uneven is solved.

3. The present application may form a molded package (i.e., a molding portion) on the circuit board by molding to provide a flat mounting surface for the filter assembly or the lens assembly.

4. The optical axis of the lens component can be ensured to be vertical or nearly vertical to the photosensitive surface of the photosensitive chip;

5. this application can help improving the formation of image quality of the module of making a video recording.

Drawings

FIG. 1 illustrates a schematic cross-sectional view of a photosensitive assembly 1000 in one embodiment of the present application;

FIG. 2 illustrates a cross-sectional view of a photosensitive assembly 1000 according to another embodiment of the present application;

fig. 3 is a schematic cross-sectional view of a camera module according to an embodiment of the present application;

fig. 4 is a schematic cross-sectional view of a camera module according to another embodiment of the present application;

fig. 5 is a schematic cross-sectional view of a camera module according to yet another embodiment of the present application;

fig. 6 is a schematic cross-sectional view of a camera module according to yet another embodiment of the present application;

fig. 7 is a schematic cross-sectional view of a camera module according to yet another embodiment of the present application;

FIG. 8 is a schematic top view illustrating a glue dispensing manner of a photosensitive assembly according to an embodiment of the present application;

FIG. 9 is a schematic top view illustrating a glue dispensing manner of a photosensitive assembly according to another embodiment of the present disclosure;

FIG. 10 is a schematic top view illustrating a glue dispensing method of a photosensitive assembly according to another embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in the present specification, expressions such as first, second, etc. are used only for distinguishing one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including" and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after the list of listed features, that the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, the use of "may" mean "one or more embodiments of the application" when describing embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as words of table approximation, not as words of table degree, and are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

FIG. 1 illustrates a cross-sectional view of a photosensitive assembly 1000 in one embodiment of the present application. Referring to fig. 1, in the present embodiment, a photosensitive assembly 1000 includes a circuit board 10, a photosensitive chip 20, and a metal wire 30. The circuit board 10 has a first surface 12 for attaching the photosensitive chip and a second surface 13 opposite to the first surface 12, and the first surface 12 has a chip attaching region 11. The chip attach area 11 includes a recess area 11a and a flat area 11 b. Generally, the recessed area 11a is a corner or a side of the upper surface of the circuit board (or the chip attachment area) that is relatively lower with respect to other areas. The photosensitive chip 20 is attached to the first surface 12 by an adhesive disposed in the chip attaching region 11, wherein the adhesive includes at least two adhesive materials with different shrinkage rates. The two kinds of glue may be a first glue 21 and a second glue 22. The second rubber material 22 is disposed in the recessed area 11a, and the shrinkage rate thereof is smaller than that of the first rubber material 21 disposed in the flat area 11 b. Since the thickness of the glue material disposed in the recessed area 11a is larger and the thickness of the glue material disposed in the flat area 11b is smaller, if the same glue material is used, a portion (e.g., the recessed area) with the larger thickness of the glue material will generate a larger shrinkage amount during the curing process of the glue material, resulting in the inclination or bending of the photo sensor chip, and further resulting in the reduction of the imaging quality. In the embodiment, since the second rubber material 22 in the recessed area 11a has a smaller shrinkage rate, the above-mentioned phenomenon of inconsistent shrinkage can be compensated, so that the shrinkage rate of the rubber material in the recessed area 11a is substantially equal to the shrinkage rate of the rubber material in the flat area 11b, thereby suppressing or preventing the inclination or bending of the photo sensor chip. In actual production, the cross section of the recessed area may be irregular, so that the shrinkage of the glue material in the recessed area may be difficult to be completely equal to that of the glue material in the flat area, but by adopting the scheme of the embodiment, the shrinkage of the glue material in the recessed area and the shrinkage of the glue material in the flat area can be close to each other, thereby alleviating the problem that the photosensitive chip is inclined or bent due to the unevenness of the surface of the circuit board. Further, in this embodiment, the shrinkage rate of the second rubber material may be 25% to 75% of the shrinkage rate of the first rubber material. The thickness of the glue material arranged on the flat area is about 10-30 microns. The recessed regions may have a depth of about 10-30 microns.

Further, still referring to fig. 1, in an embodiment of the present application, a product of the thickness of the first glue material and the shrinkage rate of the first glue material is equal to or approximately equal to a product of the thickness of the second glue material and the shrinkage rate of the second glue material, so that the glue material shrinkage of the recessed area is consistent or nearly consistent with the glue material shrinkage of the flat area.

Further, in one embodiment of the present application, the wiring board 10 may be a printed wiring board. The printed circuit board is a multilayer board formed by arranging and laminating a plurality of conducting layers and insulating layers at intervals. Wherein the conductive layer may be made of a metal layer, such as a copper material layer. The copper material layer may be etched (or otherwise removed) to form the desired wiring, resulting in a conductive layer. In the present embodiment, the multilayer board has a first area and a second area, wherein the second area has a higher wiring density than the first area. In other words, in the present embodiment, the second region of the wiring board is more densely wired, and therefore the copper material layer therein may be more etched, resulting in a state where the surface of the second region is recessed after the multi-layer lamination, and therefore, the surface of the second region where the wiring is denser may be set as the recessed region 11a according to the degree of wiring density at the time of wiring design. Accordingly, the first region of the circuit board is sparsely wired, so that the copper material layer therein may be less etched, and the surface of the first region after multi-layer lamination still assumes a relatively flat state (because the copper material layer therein is relatively intact), so that the surface of the sparsely wired first region may be set as the flat region 11b according to the wiring density at the time of wiring design. In this way, the manufacturer of the photosensitive assembly can divide the recessed area 11a and the flat area 11b in advance according to the wiring design of the circuit board, thereby efficiently applying the respective first and second glue materials to the corresponding positions.

Further, in an embodiment of the present application, in the photosensitive assembly, the circuit board may include a hard board, a flexible connection band, and a connector, and both ends of the flexible connection band are connected to the hard board and the connector. The chip attaching area is located on the hard board, the depressed area is located close to one end of the connecting band, and the leveling area is located far away from one end of the connecting band. In some cases, the circuit design at the connection between the hard board and the flexible connection band is relatively dense (generally, MIPI wire routing is close to one side of the flexible connection band and is dense), so the amount of corrosion of the copper layer (or other metal layers) at that position is relatively large, the thickness of the circuit board is relatively thin, and a depression is likely to occur on the surface of the circuit board at that position, and therefore, it is preferable to provide the second adhesive material with a smaller shrinkage rate at that position. In other words, the second glue material with the smaller shrinkage rate can be disposed on the side of the chip attaching region close to the flexible connection band, and the first glue material with the larger shrinkage rate can be disposed on the side of the chip attaching region far from the flexible connection band.

FIG. 2 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to another embodiment of the present application. Referring to fig. 2, in the present embodiment, the photosensitive assembly 1000 includes a circuit board 10, a photosensitive chip 20, and a metal wire 30. The circuit board 10 has a first surface 12 for attaching the photosensitive chip and a second surface 13 opposite to the first surface 12, and the first surface 12 has a chip attaching region 11. The chip attach region 11 includes a recess region 11a and a flat region 11 b. The photosensitive chip 20 is attached to the first surface 12 through an adhesive disposed in the chip attachment region 11, where the adhesive includes at least two adhesive materials with different shrinkage rates. The two kinds of glue materials can be a first glue material 21 and a second glue material 22. Wherein the shrinkage rate of the second rubber material 22 is smaller than that of the first rubber material 21. In this embodiment, the first plastic material and the second plastic material are disposed in the recessed area, and the first plastic material is disposed in the leveling area. Wherein in the recessed area, the first rubber material covers the second rubber material. Since the thickness of the adhesive material disposed in the recessed area 11a is larger and the thickness of the adhesive material disposed in the flat area 11b is smaller, if the same adhesive material is used, a portion (e.g., the recessed area) with a larger thickness of the adhesive material will shrink a larger amount during the curing process of the adhesive material, so that the photosensitive chip is tilted or bent, thereby reducing the imaging quality. In the embodiment, since the second rubber material 22 in the recessed area 11a has a smaller shrinkage rate, the above-mentioned phenomenon of inconsistent shrinkage can be compensated, so that the shrinkage rate of the rubber material in the recessed area 11a is substantially equal to the shrinkage rate of the rubber material in the flat area 11b, thereby suppressing or preventing the inclination or bending of the photo sensor chip. In actual production, the cross section of the recessed area may be irregular, so that the shrinkage of the plastic material in the recessed area may be difficult to be completely equal to that of the flat area, but by adopting the scheme of the embodiment, the shrinkage of the plastic material in the recessed area and that of the flat area can be close to each other, thereby alleviating the problem of inclination or bending of the photosensitive chip caused by the unevenness of the surface of the circuit board.

Further, in other embodiments of the present application, the photosensitive assembly may further include an electronic component. The metal Wire electrically connects the photosensitive chip with the circuit board based on a Wire bonding (Wire bonding) process, the electronic component is mounted on the first surface of the circuit board, and the electronic component is located outside the metal Wire. The wire bonding is a process method for realizing electrical interconnection between chips and a substrate and information intercommunication between the chips by using a thin metal wire and utilizing heat, pressure and ultrasonic energy to tightly weld the metal wire and a substrate bonding pad. Under ideal control conditions, electron sharing or atomic interdiffusion can occur between the lead and the substrate, so that atomic-scale bonding between the two metals is realized.

Further, in other embodiments of the present application, the thickness of each of the glue materials disposed in the flat area and the recessed area may be adjusted such that the total shrinkage of the glue material disposed in the flat area is equal to or substantially equal to the total shrinkage of the glue material disposed in the recessed area. The types of the adhesive materials are not limited to two, and the division of the chip attaching area is not limited to two areas. For example, the chip attaching area may be divided into a plurality of partitions according to the degree of the recess, and each partition is coated with a corresponding adhesive material, which may have a corresponding shrinkage rate. The deeper the depression, the lower the shrinkage of the glue material can be applied.

Further, fig. 3 shows a schematic cross-sectional view of a camera module according to an embodiment of the present application. Referring to fig. 3, the camera module includes a photosensitive assembly 1000 and a lens assembly 2000. In this embodiment, the photosensitive assembly 1000 is added with the electronic component 40, the lens holder 50 and the color filter 60 (the color filter may also be referred to as a filter element) on the basis of fig. 1. The electronic component 40 can be mounted on the first Surface (i.e. the upper Surface) of the circuit board by an SMT process (SMT is an abbreviation of Surface Mounting Technology, which can be interpreted as Surface mount Technology), and the electronic component 40 is located outside the metal wires. In particular, the electronic component 40 may be a capacitive component or an inductive component or a resistive component. The lens mount 50 may also be referred to as a lens holder. In this embodiment, the mirror base 50 can be adhered to the first surface of the circuit board, and the mirror base 50 is located outside the electronic component 40. The color filter 60 is mounted to the mirror base 50. In this embodiment, the top surface of the lens holder 50 is used for bonding the lens assembly 2000. In this embodiment, other portions of the photosensitive assembly are completely the same as those of the embodiment of fig. 1, and are not repeated. Further, in the present embodiment, the lens assembly 2000 may include a motor 2100, a lens barrel 2300, and a lens group 2200 mounted within the lens barrel 2300. The motor 2100 may also be eliminated or replaced with an outer barrel that has no moving parts and may be screwed to the barrel 2300. The camera module can be an FF module (fixed focus module), an AF module (focusing module), an optical zoom module or a periscopic module and the like.

Further, fig. 4 shows a schematic cross-sectional view of a camera module according to another embodiment of the present application. Referring to fig. 4, in the present embodiment, the photosensitive assembly 1000 includes a molding portion 70, and the molding portion 70 may be directly formed on the first surface (i.e., the upper surface) of the circuit board through a molding process. The molding part 70 may cover and wrap the electronic component 40, the molding part 70 surrounds the photosensitive chip 20, and there is a space between the molding part 70 and the photosensitive chip 20. I.e. the photosensitive assembly employs a so-called MOB process scheme. In this embodiment, the color filter 60 is mounted on a separate filter base 50, and the filter base 50 is mounted on top of the molding part 70. The top of the color filter lens mount 50 is used to mount the lens assembly 2000.

Further, fig. 5 shows a schematic cross-sectional view of a camera module according to still another embodiment of the present application. Referring to fig. 5, in the present embodiment, the photosensitive assembly 1000 includes a molding portion 70, and the molding portion 70 is directly formed on the first surface (i.e., the upper surface) of the circuit board through a molding process. Unlike the embodiment of fig. 4, the molding part 70 may cover and wrap the electronic component 40 and the metal wires, and the molding part 70 extends around the photosensitive chip 20 and toward the photosensitive chip 20, contacts and covers a non-photosensitive area of the photosensitive chip 20 (i.e., an edge area of the photosensitive chip 20). In this embodiment, the color filter mount 50 is eliminated, the color filter is mounted to the stepped structure of the mold part 70, and the top surface of the mold part 70 is a flat surface for mounting the lens assembly. In other words, in this embodiment, the photosensitive assembly 1000 adopts a so-called MOC process scheme.

Further, fig. 6 shows a schematic cross-sectional view of a camera module according to still another embodiment of the present application. In this embodiment, the photosensitive assembly 1000 employs a so-called MOC process scheme. The bottom surface of the lens assembly 2000 is adhered to the top surface of the photosensitive assembly 1000 by an adhesive. The molding portion 70 provides a flat surface and thus may serve as a mounting surface for mounting (bonding) the lens assembly 2000, i.e., a top surface of the molding portion 70 may serve as a top surface of the photosensitive assembly 1000. On the other hand, as described earlier, the wiring board 10 may be a printed wiring board that is a multilayer board in which a plurality of conductive layers and insulating layers are disposed at intervals and laminated. Wherein the conductive layer may be made of a metal layer, such as a copper material layer. The copper material layer may be etched (or other process for removing the copper material) to form the desired wiring, thereby obtaining a conductive layer. Due to process reasons, the surface of the PCB may be uneven, and although two kinds of glue materials with different shrinkage rates may be respectively disposed in the recessed area 11a and the flat area 11b, the compensation effect of this measure may be limited, at this time, an included angle between the top surface of the photosensitive assembly 1000 and the photosensitive surface of the photosensitive chip 20 may still be different from zero, that is, the top surface of the photosensitive assembly 1000 and the photosensitive surface of the photosensitive chip 20 may still be not parallel. If the lens assembly and the photosensitive assembly are assembled according to the conventional process, a glue material with uniform thickness is arranged between the lens assembly and the photosensitive assembly, which may cause tilt problem, so that an inclined angle exists between the lens assembly and the photosensitive surface of the photosensitive chip. However, if the AA process (active alignment process) is used for assembly, the production cost is high, and the production efficiency is low. Therefore, in this embodiment, another scheme is proposed, namely, for the adhesive used for bonding the bottom surface of the lens assembly and the top surface of the photosensitive assembly, different amounts of adhesive are arranged at different positions, so that the adhesive has different thicknesses at different positions, and further, an included angle between the top surface of the photosensitive assembly 1000 and the photosensitive surface of the photosensitive chip 20 is compensated, so that the optical axis ax of the lens assembly is perpendicular to the photosensitive surface (i.e., the inclination of the lens assembly relative to the photosensitive surface is compensated). Specifically, the adhesive glue may include a third glue material 81 having a third shrinkage rate and a fourth glue material 82 having a fourth shrinkage rate, the third shrinkage rate is smaller than the fourth shrinkage rate, and a thickness of the third glue material 81 is greater than a thickness of the fourth glue material 82. The proposal of the embodiment can improve the problem of the inclination of the light sensing surface (namely tilt problem) caused by the unevenness of the surface of the circuit board. Specifically, in this embodiment, a glue material with non-uniform thickness is disposed between the lens assembly and the molding portion (which may also be referred to as a mold package), so that the inclination of the lens assembly can be consistent or nearly consistent with the inclination of the imaging surface of the photosensitive chip, and the optical axis of the photosensitive chip (i.e., the normal of the photosensitive surface) can be consistent or nearly consistent with the optical axis of the lens assembly. Further, in this embodiment, a third rubber material and a fourth rubber material with different shrinkage rates are disposed between the lens assembly and the molding portion, so that the thicker portion and the thinner portion of the adhesive glue have approximately the same shrinkage amount after curing, and thus after curing of the adhesive glue, the inclination of the lens assembly can still be consistent or nearly consistent with the inclination of the imaging surface (i.e. the light-sensing surface) of the light-sensing chip. Further, in this embodiment, the tilt of the photosensitive chip may be determined according to a recess (generally, MIPI wire routing location) caused by etching a copper layer on the circuit board or measured by an apparatus (for example, measured by a laser multipoint ranging method) on the surface of the chip. The circuit board is manufactured to have higher consistency, the tilt of the photosensitive chip caused by the circuit board is generally higher in consistency, and compared with an AA mode, the method for improving the tilt of the camera module is low in cost and high in efficiency.

Further, in another embodiment of the present application, a third glue material and a fourth glue material with different shrinkage rates may be disposed between the lens assembly and the molding portion. And comprehensively calculating the shrinkage rates and the thicknesses of the third rubber material and the fourth rubber material, so that after solidification shrinkage, the inclination of the lens component can be consistent with or close to the inclination of an imaging surface (namely a photosensitive surface) of the photosensitive chip. Note that in this embodiment, the thickness of the third plastic material may not be greater than that of the fourth plastic material, and the specific thicknesses of the third plastic material and the fourth plastic material may be obtained through calculation.

Further, in yet another embodiment of the present application, the same rubber material with the same shrinkage rate may be disposed between the lens assembly and the molding portion, but the rubber material has different thicknesses at different positions, so that the tilt of the lens assembly can be consistent or nearly consistent with the tilt of the imaging surface (i.e., the light sensing surface) of the light sensing chip.

Further, in still another embodiment of the present application, a third rubber and a fourth rubber having different shrinkage rates may be disposed between the lens assembly and the molding part. The third glue material and the fourth glue material can be arranged in the same thickness, but in the curing process, the shrinkage of the third glue material and the shrinkage of the fourth glue material are different, so that the lens assembly can be inclined to a certain degree after curing, and the inclination of the lens assembly can be consistent with or close to the inclination of an imaging surface (namely a light sensing surface) of the light sensing chip.

Further, fig. 7 shows a schematic cross-sectional view of a camera module according to still another embodiment of the present application. In this embodiment, the photosensitive assembly 1000 adopts a so-called MOB process scheme. The present embodiment is different from the embodiment of fig. 6 in that there is a space between the molding part 70 and the photosensitive chip 20. The rest is the same as the embodiment of fig. 6 and will not be described again.

Further, fig. 8 is a schematic top view illustrating a glue dispensing manner of the photosensitive assembly according to an embodiment of the present application. In the present embodiment, the wiring board 10 includes a wiring board main body 10a, a connection tape 10b, and a connector 10 c. The first rubber material 21 and the second rubber material 22 with different shrinkage rates are respectively arranged in the flattening area and the depression area, wherein the shrinkage rate of the first rubber material 21 is larger than that of the second rubber material 22. The present embodiment is different from the embodiment of fig. 1 in that the first rubber material 21 and the second rubber material 22 are not in contact with each other, and a space 29 is provided between the two. The spacing may be an air gap. In this embodiment, the second rubber material 22 is located at a side close to the connecting band 10b, and the air gap is in a "C" shape. In the solution of this embodiment, the boundary areas of the first rubber material 21 and the second rubber material 22 can be prevented from being mixed with each other, and such mixing may cause variation in the properties of the rubber materials due to changes in environmental conditions (e.g., temperature rise during baking) during the manufacturing process (or during long-term use), thereby affecting the bonding effect of the rubber materials. In other words, the scheme of this embodiment can avoid the glue material to take place the variation because of mixing to ensure the bonding effect.

Further, fig. 9 is a schematic top view illustrating a glue dispensing manner of a photosensitive assembly according to another embodiment of the present application. Referring to fig. 9, in the present embodiment, there is also a gap between the first rubber material 21 and the second rubber material 22. The difference between this embodiment and the embodiment of fig. 8 is that, in this embodiment, the recess region is located at a corner of the chip attaching region on the first surface of the circuit board. Accordingly, the second glue material 22 is applied in a substantially fan-like shape.

Further, fig. 10 is a schematic top view illustrating a glue dispensing manner of a photosensitive assembly according to still another embodiment of the present application. Referring to fig. 10, in the present embodiment, the first and

second rubber materials

21 and 22 are coated in a shape of a "m". The first rubber material 21 and the second rubber material 22 have a space therebetween. In this embodiment, the recessed area is located at one corner of the chip attaching area on the first surface of the circuit board. The second glue material 22 is coated to form one corner of the shape of the Chinese character 'mi'.

It should be noted that in the embodiments of fig. 8-10, after the photosensitive chip is pressed down and bonded, the adhesive material is pressed by the bottom surface of the photosensitive chip, and may be deformed to some extent. There is a possibility that air bubbles may occur in the glue. The bubbles in the adhesive material expand in the subsequent baking process, so that the photosensitive assembly generates variation, and the photosensitive chip is bent or inclined relative to the circuit board. Therefore, in a preferred embodiment, when the first adhesive material and the second adhesive material are coated, the air gap between the first adhesive material and the second adhesive material is communicated with the region outside the chip attaching region, so that the probability of bubbles caused by pressing and bonding the photosensitive chip down can be remarkably reduced, the photosensitive chip is prevented or inhibited from bending or inclining relative to the circuit board, and the product yield is improved.

It should be noted that if the first adhesive material and the second adhesive material are directly contacted to fill the chip attachment region with the adhesive material (for example, refer to the embodiment of fig. 1), bubbles in the adhesive material can also be avoided.

Further, in the above embodiments, two or more kinds of glue materials are used for the glue used for attaching the chip (which may be a Die glue, and the Die glue is understood to be a DA glue, and the DA is called Die Attach overall), but the application is not limited to the above embodiments. For example, in one embodiment of the present application, only one type of die attach adhesive may be used. The die attach adhesive may be disposed only in the planarized region, avoiding the recessed region. An air gap may be formed between the recessed region of the first surface (i.e., the upper surface) of the circuit board and the bottom surface of the photosensitive chip.

It should be noted that, in the present application, no matter whether one or two or more types of die attach adhesives are used, the adhesive material disposed in the flat area does not directly contact the recessed area of the first surface (i.e., the upper surface) of the circuit board. In the solution shown in fig. 2, although the first adhesive material is located above the recessed area, the first adhesive material is separated by the second adhesive material, so that the first adhesive material is considered not to be in contact with the recessed area.

According to another embodiment of the present application, there is also provided a method of manufacturing a photosensitive assembly, including steps S10-S50. The specific description is as follows.

In step S10, a wiring board is prepared. The circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, the chip attaching area comprises a depressed area and a flat area, and the first surface is placed upwards. Further, in this step, the resistance accommodating device may be electrically connected to the circuit board based on an SMT process, that is, the electronic component is mounted on the circuit board and then the photosensitive chip is attached.

And step S20, arranging a second rubber material with a second shrinkage rate in the concave area.

Step S30, a first rubber material with a first shrinkage rate is disposed in the leveling area, where the first shrinkage rate is greater than the second shrinkage rate.

And step S40, moving the photosensitive chip to the position above the chip attaching area, and then moving the photosensitive chip downwards to enable the bottom surface of the photosensitive chip to contact and extrude the first rubber material and the second rubber material.

Step S50, curing the first adhesive material and the second adhesive material, so as to attach the photosensitive chip to the circuit board.

According to still another embodiment of the present application, there is also provided a photosensitive assembly manufacturing method, which includes steps S10-S50. The specific description is as follows.

In step S10, a wiring board is prepared. The circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, the chip attaching area comprises a concave area and a flat area, and the first surface is placed upwards. Furthermore, in this step, the resistance accommodating device may be electrically connected to the circuit board based on an SMT process, that is, the electronic component is mounted on the circuit board and then the photosensitive chip is attached.

Step S30, arranging a first glue material with a first shrinkage rate in the leveling area, and covering the first glue material above the second glue material, where the first shrinkage rate is greater than the second shrinkage rate.

And step S40, moving the photosensitive chip to the position above the chip attaching area, and then moving the photosensitive chip downwards to enable the bottom surface of the photosensitive chip to contact and extrude the first rubber material.

Step S50, curing the first and second glue materials, thereby attaching the photosensitive chip to the circuit board.

According to still another embodiment of the present application, there is also provided a method for manufacturing a photosensitive assembly, which includes steps S100-S400. The specific description is as follows.

Step S100, a wiring board is prepared. The circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, the chip attaching area comprises a concave area and a flat area, and the first surface is placed upwards. Further, in this step, the resistance accommodating device may be electrically connected to the circuit board based on an SMT process, that is, the electronic component is mounted on the circuit board and then the photosensitive chip is attached.

Step S200, arranging a first rubber material with a first shrinkage rate in the recessed area, and avoiding the recessed area when arranging the first rubber material.

And step S300, moving the photosensitive chip to the position above the chip attaching area, and then moving the photosensitive chip downwards to enable the bottom surface of the photosensitive chip to contact and extrude the first rubber material. An air gap is reserved between the concave area and the bottom surface of the photosensitive chip.

Step S400, curing the first adhesive material, so as to attach the photosensitive chip to the circuit board.

Further, according to an embodiment of the present application, a method for manufacturing a camera module is also provided, which includes steps a-c.

Step a, manufacturing the photosensitive assembly according to the manufacturing method of the photosensitive assembly.

And b, detecting the inclination angle of the top surface of the photosensitive component or the lens component relative to the photosensitive surface of the photosensitive chip.

And c, arranging adhesive glue on the top surface of the photosensitive assembly according to the detected inclination angle to compensate the detected inclination angle, and then adhering the bottom surface of the lens assembly to the top surface of the photosensitive assembly.

In one embodiment, in the step c, different thicknesses of glue may be disposed at different positions of the top surface of the photosensitive assembly to compensate for the tilt angle. Compensating for this tilt angle allows the tilt of the lens assembly to be in or near alignment with the tilt of the imaging surface (i.e., the photosensitive surface) of the photosensitive chip.

In another embodiment, in the step c, different rubber materials with different shrinkage rates may be arranged at different positions of the top surface of the photosensitive assembly to compensate for the inclination angle. Compensating for this tilt angle allows the tilt of the lens assembly to be in or near agreement with the tilt of the imaging surface (i.e., the photosensitive surface) of the photosensitive chip.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A photosensitive assembly, comprising:

the circuit board is provided with a first surface for attaching the photosensitive chip and a second surface opposite to the first surface, the first surface of the circuit board is provided with a chip attaching area, and the chip attaching area comprises a depressed area and a flat area; and

the photosensitive chip is attached to the first surface through adhesive glue arranged in the chip attaching area, the adhesive glue comprises a first glue material and a second glue material, the first glue material is arranged in the flat area, and the first glue material is prevented from contacting the recessed area; the second rubber material is arranged in the recessed area, and the shrinkage rate of the second rubber material is smaller than that of the first rubber material; the product of the thickness of the first rubber material and the shrinkage rate of the first rubber material is matched with the product of the thickness of the second rubber material and the shrinkage rate of the second rubber material, so that the rubber material shrinkage of the depressed area is consistent with the rubber material shrinkage of the flat area.

2. A photosensitive assembly according to claim 1, wherein the shrinkage rate of the second adhesive material is 25% -75% of the shrinkage rate of the first adhesive material.

3. A photosensitive assembly according to claim 1, wherein said wiring board is a printed wiring board, and said wiring board is a multilayer board having a plurality of conductive layers and insulating layers arranged at intervals and laminated.

4. A photosensitive assembly according to claim 3, wherein said multilayer board has a first area and a second area, wherein said first area is less dense in wiring than said second area, a surface of said first area is set as said flat area, and a surface of said second area is set as said recessed area.

5. A photosensitive assembly according to claim 3, wherein the circuit board includes a hard board, a flexible connection band and a connector, and both ends of the flexible connection band connect the hard board and the connector; the chip attaching area is located on the hard board, the depressed area is located close to one end of the connecting band, and the leveling area is located far away from one end of the connecting band.

6. A photosensitive assembly according to claim 3, wherein the recessed areas correspond to dense areas of wiring in the multilayer board that are more dense in MIPI wiring than other areas of the multilayer board.

7. A photosensitive assembly according to claim 1, wherein the flat area is disposed with the first glue, the recessed area is disposed with the second glue, and the first glue is covered above the second glue.

8. The photosensitive assembly according to claim 1 or 7, wherein a total shrinkage amount of the paste material disposed in the flat area is equal to a total shrinkage amount of the paste material disposed in the recessed area by adjusting respective thicknesses of the paste materials disposed in the flat area and the recessed area.

9. A photosensitive assembly according to claim 1, wherein said recessed area is not provided with said adhesive so that an air gap is left between said photosensitive chip and said circuit board in said recessed area.

10. A photosensitive assembly according to claim 1, further comprising a metal wire electrically connecting the photosensitive chip and the wiring board based on a wire bonding process, and an electronic component mounted on the first surface of the wiring board and located outside the metal wire.

11. A photosensitive assembly according to claim 1, wherein an air gap is provided between the first adhesive material and the second adhesive material.

12. The photosensitive assembly of claim 11, wherein the air gap communicates with an area outside the die attach region.

13. The utility model provides a module of making a video recording which characterized in that, it includes:

the photosensitive assembly of any one of claims 1-12, and

the bottom surface of the lens component is bonded to the top surface of the photosensitive component through bonding glue.

14. The camera module of claim 13, wherein an angle between a top surface of the photosensitive element and a photosensitive surface of the photosensitive chip is not zero; the adhesive glue has different thicknesses at different positions to compensate the included angle, so that the optical axis of the lens component is perpendicular to the photosensitive surface.

15. The camera module of claim 14, wherein the adhesive glue comprises a third glue material having a third shrinkage rate and a fourth glue material having a fourth shrinkage rate, the third shrinkage rate is less than the fourth shrinkage rate, and a thickness of the third glue material is greater than a thickness of the fourth glue material.

16. The camera module of claim 13, wherein the photosensitive assembly further comprises a molding portion formed on the surface of the circuit board, the molding portion surrounds the photosensitive chip, and a top surface of the molding portion is a top surface of the photosensitive assembly.

17. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps:

1) preparing a circuit board, wherein the circuit board has a first surface and a second surface opposite to the first surface, the first surface of the circuit board has a chip attaching area, and the chip attaching area comprises a concave area and a flat area;

2) arranging an adhesive glue on the first surface, wherein the adhesive glue comprises a first glue material and a second glue material; the first rubber material has a first shrinkage rate, the second rubber material has a second shrinkage rate, and the first shrinkage rate is greater than the second shrinkage rate; the step 2) comprises the following substeps: 2a) arranging the second rubber material in the recessed area; and 2b) arranging the first rubber material in the flat area, wherein the first rubber material avoids contacting the depressed area; the product of the thickness of the first rubber material and the shrinkage rate of the first rubber material is matched with the product of the thickness of the second rubber material and the shrinkage rate of the second rubber material, so that the rubber material shrinkage of the depressed area is consistent with the rubber material shrinkage of the flat area;

3) moving a photosensitive chip to the position above the chip attaching area, and then moving the photosensitive chip downwards to enable the bottom surface of the photosensitive chip to be in contact with and extrude the adhesive; and

4) and curing the adhesive glue so as to attach the photosensitive chip to the circuit board.

18. A method for fabricating a photosensitive assembly according to claim 17, wherein said step 2b) further comprises: the first glue material is spaced apart from the first glue material.

19. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps:

2) arranging an adhesive glue on the first surface, wherein the adhesive glue comprises a first glue material and a second glue material; the first rubber material has a first shrinkage rate, the second rubber material has a second shrinkage rate, and the first shrinkage rate is greater than the second shrinkage rate; the step 2) comprises the following substeps:

2a) arranging the second rubber material in the recessed area; and 2b) arranging the first rubber material on the leveling area, and covering the first rubber material above the second rubber material; the product of the thickness of the first rubber material and the shrinkage rate of the first rubber material is matched with the product of the thickness of the second rubber material and the shrinkage rate of the second rubber material, so that the rubber material shrinkage of the depressed area is consistent with the rubber material shrinkage of the flat area;

20. A method for manufacturing a camera module is characterized by comprising the following steps:

a) the method of manufacturing a photosensitive assembly according to claim 17;

b) detecting the inclination angle of the top surface of the photosensitive component or the lens component relative to the photosensitive surface of the photosensitive chip; and

c) arranging adhesive glue on the top surface of the photosensitive assembly according to the detected inclination angle to compensate the inclination angle, and then adhering the bottom surface of the lens assembly to the top surface of the photosensitive assembly.

21. The method for manufacturing a camera module according to claim 20, wherein the step c) further comprises: and arranging rubber materials with different thicknesses at different positions of the top surface of the photosensitive assembly to compensate the inclination angle.

22. The method for manufacturing a camera module according to claim 20, wherein the step c) further comprises: different rubber materials with different shrinkage rates are arranged at different positions of the top surface of the photosensitive assembly to compensate the inclination angle.