CN110636186A - Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment - Google Patents

Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment Download PDF

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Publication number
CN110636186A
CN110636186A CN201810651876.0A CN201810651876A CN110636186A CN 110636186 A CN110636186 A CN 110636186A CN 201810651876 A CN201810651876 A CN 201810651876A CN 110636186 A CN110636186 A CN 110636186A
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CN
China
Prior art keywords
molding
lens
chip
chip mounting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810651876.0A
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Chinese (zh)
Inventor
邹新苗
黄桢
方银丽
姜俊彬
陈佳炜
许晨祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
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Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201810651876.0A priority Critical patent/CN110636186A/en
Priority to PCT/CN2019/092439 priority patent/WO2019242771A1/en
Priority to CN201980037485.2A priority patent/CN112272943B/en
Publication of CN110636186A publication Critical patent/CN110636186A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A molding photosensitive assembly and a camera module, a manufacturing method thereof and electronic equipment, wherein the molding photosensitive assembly is used for assembling the camera module with an optical lens, and comprises a circuit board, a photosensitive element and a molding base. The photosensitive element is conductively connected to the circuit board. The molding base is formed on the circuit board in a molding mode and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive element is correspondingly mounted on the chip mounting surface of the molding base, and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is positioned on a photosensitive path of the photosensitive element.

Description

Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment
Technical Field
The present invention relates to the field of optical imaging, and more particularly to a molded photosensitive device, a camera module, a method for manufacturing the same, and an electronic apparatus.
Background
In recent years, electronic products, smart devices, and the like are increasingly developed toward being light, thin and high-performance, and the development trend of the electronic products and the smart devices puts more stringent requirements on the size and imaging capability of a camera module, which is one of standard configurations of the electronic products and the smart devices.
In the assembly process related to the current camera module, the most troublesome and difficult problem is how to find a feasible and effective solution on the basis of controlling the assembly cost of the camera module so as to solve the problems of fuzzy pixels, poor quality and the like of the camera module caused by the deformation of the circuit board.
Specifically, in the conventional assembly process of the camera module, the photosensitive chip and the lens holder are usually directly attached to the circuit board, and then the lens is mounted on the lens holder, and the relative position between the photosensitive chip and the lens needs to be adjusted to ensure that the photosensitive surface of the photosensitive chip is perpendicular to the optical axis of the lens, thereby ensuring that the camera module has good imaging quality.
However, in the assembly process of the camera module, the steps of baking and heating are performed for multiple times, and since the deformation of the circuit board after being heated is large, that is, the circuit board is easily warped after being heated, so that the photosensitive surface of the photosensitive chip on the circuit board is not parallel to the mounting surface of the lens holder, and therefore, the photosensitive surface of the photosensitive chip is difficult to keep perpendicular to the optical axis of the lens, and the imaging quality of the camera module is directly affected.
In addition, along with the imaging function of the camera module is stronger and stronger, namely the performance of the lens and the performance of the photosensitive chip are upgraded continuously, the vertical precision requirement between the optical axis of the lens and the photosensitive surface of the photosensitive chip is higher and higher, so that once the photosensitive chip or the lens is inclined, the imaging quality of the camera module is seriously influenced, and even the whole camera module is scrapped.
Disclosure of Invention
An object of the present invention is to provide a molded photosensitive device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein a mold base of the molded photosensitive device can stably maintain a photosensitive surface of a photosensitive element mounted on a chip mounting surface of the mold base to be perpendicular to an optical axis of an optical lens mounted on a lens mounting surface of the mold base, thereby ensuring good imaging quality of the camera module.
Another object of the present invention is to provide a molded photosensitive device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein the molded base can prevent the photosensitive element mounted on the chip mounting surface of the molded base from tilting or warping, so as to ensure good imaging quality of the camera module.
Another object of the present invention is to provide a molded photosensitive element and a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base is integrally formed on a circuit board of the molded photosensitive element by a molding process to provide a more flat and stable chip mounting surface and lens mounting surface through the molded base.
Another object of the present invention is to provide a molded light sensing device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base can keep the chip mounting surface parallel to the lens mounting surface to ensure that the camera module has good image quality.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base can enhance the deformation resistance of the circuit board to prevent the circuit board from being deformed by heat.
Another object of the present invention is to provide a molded light sensing device and a camera module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the molded base has an integrated structure, which is beneficial to keep the chip mounting surface and the lens mounting surface of the molded base parallel to each other, so as to ensure that the light sensing surface of the light sensing element mounted on the chip mounting surface and the optical axis of the optical lens mounted on the lens mounting surface are perpendicular to each other.
Another object of the present invention is to provide a molded light sensing module, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the molded base has an integrated structure, which is beneficial to keep the chip mounting surface and the lens mounting surface of the molded base parallel to each other, so as to adjust the relative position between the optical lens and the light sensing element during the assembly process, so that the optical axis of the optical lens is perpendicular to the light sensing surface of the light sensing element.
Another object of the present invention is to provide a molded photosensitive device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, a thickness of a chip mounting portion of the molded base is smaller than a thickness of a lens mounting portion of the molded base, so as to reduce a distance between the photosensitive element and the circuit board, and further reduce a height of the camera module.
Another object of the present invention is to provide a molded light sensing device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, a connection portion of the molded base can increase the connection strength between the chip mounting portion and the lens mounting portion, thereby enhancing the overall strength and deformation resistance of the molded base.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion and the lens mounting portion are disposed on the circuit board at an interval to form a reserved space of the molded base between the chip mounting portion and the lens mounting portion, and a set of circuit board connectors of the circuit board correspond to the reserved space to prevent the molded base from covering the circuit board connectors, so as to facilitate electrical communication between the photosensitive element and the circuit board.
Another object of the present invention is to provide a molded photosensitive element, a camera module, a method of manufacturing the same, and an electronic apparatus, in which in some embodiments of the present invention, the chip mounting portion, the lens mounting portion, and the connecting portion of the mold base are simultaneously formed in one molding, that is, the mold base is integrally molded in the same mold, so as to ensure that the upper surfaces of the chip mounting portion and the lens mounting portion maintain good uniformity and parallelism.
Another object of the present invention is to provide a molded light sensing device, a camera module, a method for manufacturing the same, and an electronic apparatus, wherein in some embodiments of the present invention, the die mounting portion of the mold base is provided with at least one separation gap to relieve stress applied to the die mounting portion of the mold base, so as to prevent the die mounting portion from deforming due to thermal deformation of the circuit board.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the separation gap separates the chip mounting portion into at least two sub-chip mounting portions, so as to distribute stress applied to the chip mounting portion and prevent the chip mounting portion from being deformed due to concentrated stress.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the die mounting portion of the mold base is provided with at least one receiving groove for receiving a fluid adhesive material, so that the die mounting surface of the module base can directly support the photosensitive element, thereby ensuring that the photosensitive surface of the photosensitive element has a high flatness.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the receiving groove is located at the center of the chip mounting portion to optimize the fixing effect of the adhesive material received in the receiving groove on the photosensitive element, so as to prevent the photosensitive element from tilting due to uneven stress.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, each receiving groove is disposed in a shape of a Chinese character 'hui', and the center of the chip mounting portion is still the receiving groove, so as to reduce the amount of the adhesive material used and maintain a good fixing effect.
Another object of the present invention is to provide a molded photosensitive assembly, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, each of the receiving grooves is circumferentially disposed on the chip mounting portion, so that the photosensitive element is subjected to a uniform adhesive force, thereby preventing the photosensitive element from being tilted due to uneven stress.
Another object of the present invention is to provide a molded photosensitive element, a camera module, a method for manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the receiving groove is penetratingly disposed on the chip mounting portion to form a through-hole type groove in the chip mounting portion, so that during a molding process, the receiving groove corresponds to a pressing head of a molding die, so that the pressing head of the molding die can press the circuit board during the molding process to prevent the circuit board from being deformed, thereby improving flatness of the circuit board and the chip mounting portion.
To achieve at least one of the above objects and other objects and advantages, the present invention provides a molded photosensitive assembly for assembling an optical lens into a camera module, comprising:
a circuit board;
the photosensitive element is connected to the circuit board in a conducting manner; and
and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is positioned in a photosensitive path of the photosensitive element.
In some embodiments of the present invention, the chip mounting surface and the lens mounting surface provided by the mold base are parallel to each other.
In some embodiments of the present invention, the mold base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and a reserved space is provided, wherein the lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.
In some embodiments of the present invention, the circuit board is provided with a chip molding region, a lens molding region, a non-molding region and at least one set of circuit board connectors, wherein the lens molding region is located around the chip molding region, the non-molding region is located between the chip molding region and the lens molding region, each set of circuit board connectors is disposed in the non-molding region of the circuit board, after molding on the circuit board, the chip mounting portion of the molding base covers the chip molding region of the circuit board, the lens mounting portion of the molding base covers the lens molding region of the circuit board, and the reserved space of the molding base corresponds to the non-molding region of the circuit board.
In some embodiments of the present invention, the mold base further comprises at least one connection portion, wherein each connection portion integrally extends from the lens mount portion to the chip mount portion to form the mold base having an integral structure.
In some embodiments of the present invention, the circuit board is further provided with a connection molding region, wherein the connection molding region is located between the lens molding region and the chip molding region and communicates the lens molding region and the chip molding region, and after the circuit board is molded, the connection portion of the molding base covers the connection molding region of the circuit board so as to integrate the lens mounting portion and the chip mounting portion through the connection portion.
In some embodiments of the present invention, the connecting portion has a lens connecting end and a chip connecting end, wherein the lens connecting end of the connecting portion is integrally connected with the lens mounting portion, and the chip connecting end of the connecting portion is integrally connected with the chip mounting portion, wherein the connecting portion extends from the lens connecting end to the chip connecting end in a tapered manner.
In some embodiments of the present invention, a thickness of the chip mounting part is smaller than a thickness of the lens mounting part.
In some embodiments of the present invention, the chip mounting portion of the mold base includes at least two sub-chip mounting portions spaced apart from each other and forming a separation gap between adjacent sub-chip mounting portions, wherein each of the sub-chip mounting portions is integrally connected to the lens mounting portion by the corresponding connection portion.
In some embodiments of the present invention, the separation gap is disposed in a line shape to separate the chip mounting portion into two sub-chip mounting portions.
In some embodiments of the present invention, the separation gap is disposed in a cross shape to separate the chip mounting portion into four sub-chip mounting portions.
In some embodiments of the present invention, the four sub-chip mounting portions are grouped two by two, and each group of the sub-chip mounting portions is integrally connected to the lens mounting portion through the same connecting portion.
In some embodiments of the present invention, the molded photosensitive element further includes an adhesive layer, wherein the chip mounting portion of the mold base includes at least one receiving groove, and each of the receiving grooves is recessed downward from the chip mounting surface to form a groove for receiving the adhesive layer, so that the photosensitive element is fixedly mounted to the chip mounting surface of the chip mounting portion through the adhesive layer.
In some embodiments of the present invention, each of the receiving grooves is disposed in the chip mounting portion in an array arrangement.
In some embodiments of the present invention, each of the receiving grooves is disposed on the chip mounting portion in a surrounding manner. .
In some embodiments of the present invention, each of the receiving grooves extends downward from the chip mounting surface to the wiring board to form the through-hole type groove to bond the photosensitive element, the chip mounting portion, and the wiring board together through the adhesive layer.
In some embodiments of the present invention, each of the receiving grooves is disposed in a shape of a Chinese character 'hui', so that the chip mounting portion is divided into two sub-chip mounting portions by the receiving groove, wherein the two sub-chip mounting portions are integrally connected to form the chip mounting portion having an integrated structure.
In some embodiments of the present invention, the molded photosensitive assembly further includes a set of electronic components, wherein the electronic components are attached to the lens molding region of the circuit board at intervals so as to be covered by the lens mounting portion of the molding base.
In some embodiments of the present invention, the molded photosensitive assembly further includes at least one set of leads, wherein the photosensitive element includes a photosensitive region, a non-photosensitive region and at least one set of chip connectors, wherein the non-photosensitive region is located around the photosensitive region, and each set of the chip connectors is respectively disposed in the non-photosensitive region of the photosensitive element, so as to conductively connect the chip connectors with the corresponding circuit board connectors through the leads.
According to another aspect of the present invention, the present invention further provides a camera module, including:
an optical lens; and
the optical lens is correspondingly mounted on the lens mounting surface of the molded photosensitive assembly, and the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.
According to another aspect of the present invention, the present invention further provides an electronic device comprising:
an electronic device body; and
at least one camera module, wherein the camera module is disposed on the electronic device body for obtaining an image, and the camera module is according to claim 20.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive member, comprising the steps of:
forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the mold base; and
and conductively connecting the photosensitive element and the circuit board to manufacture a molded photosensitive assembly.
In some embodiments of the present invention, the step of forming a mold base on a circuit board by a molding process, wherein the mold base provides a flat chip mounting surface and a flat lens mounting surface, comprises the steps of:
placing the circuit board on a second die of a forming die;
closing a first mold and a second mold of the forming mold to form a forming space of the forming mold between the first mold and the second mold; and
adding a molding material to the molding space of the molding die to integrally form the molding base on the circuit board after the molding material is cured.
In some embodiments of the present invention, the step of clamping a first mold and a second mold of the forming mold to form a forming space of the forming mold between the first mold and the second mold includes the steps of:
pressing the circuit board in a non-molding area of the circuit board by using a pressing surface of the first mold;
correspondingly forming a chip mounting part forming space in a chip molding area of the circuit board;
correspondingly forming a lens mounting part forming space in a lens molding area of the circuit board, wherein the non-molding area is positioned between the chip molding area and the lens molding area; and
correspondingly forming a connecting part forming space in a connecting molding area of the circuit board, wherein the connecting part forming space is communicated with the chip installation part forming space and the lens installation part forming space to form the forming space with an integrated structure.
In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to integrally form the molding base on the circuit board after the molding material is cured includes the steps of:
forming a lens mounting part which is wrapped on the lens molding area of the circuit board in the lens mounting part forming space, so that the top surface of the lens mounting part forms the lens mounting surface;
forming a chip mounting part which covers the chip molding area of the circuit board in the chip mounting part forming space, so that the top surface of the chip mounting part forms the chip mounting surface; and
and forming a connecting part which covers the connecting molding area of the circuit board in the connecting part forming space, wherein the connecting part is integrally connected with the chip mounting part and the lens mounting part so as to form the molding base with an integrated structure.
In some embodiments of the present invention, the method for manufacturing a molded photosensitive assembly further comprises:
and pressing the central part of the chip molding area of the circuit board by a pressing head of the first mold.
In some embodiments of the present invention, the method for manufacturing a molded photosensitive assembly further comprises:
and after the molding material is solidified, forming a containing groove positioned in the chip mounting part.
In some embodiments of the present invention, the method for manufacturing a molded photosensitive assembly further comprises:
and after the molding material is solidified, forming a separation gap positioned in the chip mounting part, wherein the separation gap separates the chip mounting part into at least two mutually-spaced sub-chip mounting parts.
In some embodiments of the present invention, the step of adding a molding material to the molding space of the molding die to integrally form the molding base on the circuit board after the molding material is cured includes the steps of:
pouring the molding material into the molding space of the lens mounting part of the molding space; and
and guiding the molding material to flow into the chip mounting part molding space from the lens mounting part molding space through the connecting part molding space so that the molding space is filled with the molding material.
In some embodiments of the present invention, the chip mounting surface and the lens mounting surface are parallel to each other.
In some embodiments of the present invention, the method of manufacturing a molded photosensitive assembly, wherein the chip mounting surface is lower than the lens mounting surface.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:
forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the mold base;
conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly; and
and mounting an optical lens to the lens mounting surface of the molding base, and enabling an optical axis of the optical lens to be perpendicular to the photosensitive surface of the photosensitive element to manufacture a camera module.
Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
Drawings
Fig. 1 is a perspective view of a camera module according to a first preferred embodiment of the invention.
Fig. 2 is a schematic perspective cross-sectional view of the camera module according to the first preferred embodiment of the invention.
Fig. 3 is a perspective view of a molded photosensitive element of the camera module according to the first preferred embodiment of the invention.
FIGS. 4A to 4C are schematic views illustrating the manufacturing steps of the molded photosensitive assembly according to the first preferred embodiment of the present invention.
FIG. 5 is a first variant of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.
FIGS. 6A and 6B are a second variant of the molded photosensitive assembly according to the above first preferred embodiment of the present invention.
Fig. 7 is a flowchart illustrating a method for manufacturing the camera module according to the first preferred embodiment of the invention.
FIG. 8 is a perspective view of a molded photosensitive element according to a second preferred embodiment of the present invention.
FIG. 9 is a first variant of the molded photosensitive assembly according to the second preferred embodiment of the present invention.
FIG. 10 is a second variant of the molded photosensitive element according to the second preferred embodiment of the present invention.
FIG. 11A is a perspective view of a molded photosensitive assembly according to a third preferred embodiment of the present invention.
FIG. 11B is a schematic cross-sectional view of the molded photosensitive assembly according to the third preferred embodiment of the present invention.
FIGS. 12A and 12B are views showing a first modified embodiment of the molded photosensitive member according to the above-described third preferred embodiment of the present invention.
Fig. 13A to 13C are a second variant of the molded photosensitive element according to the third preferred embodiment of the present invention.
FIGS. 14A and 14B are views showing a third modified embodiment of the molded photosensitive assembly according to the third preferred embodiment of the present invention.
Fig. 15A and 15B are perspective views of an electronic apparatus with the above-described camera module according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Referring to fig. 1 to 7 of the drawings accompanying the present specification, a camera module 1 according to a first preferred embodiment of the present invention is illustrated, wherein the camera module 1 comprises at least one optical lens 10 and a molded photosensitive element 20. As shown in fig. 1 to 4C, the molded photosensitive assembly 20 includes a circuit board 21, at least one photosensitive element 22, and a molded base 23, wherein each photosensitive element 22 is electrically connected to the circuit board 21, the molded base 23 is integrally formed on the circuit board 21 in a molded manner, and provides at least one chip mounting surface 2301 and at least one lens mounting surface 2302 with high flatness, each photosensitive element 22 is mounted on the corresponding chip mounting surface 2301, each optical lens 10 is mounted on the corresponding lens mounting surface 2302, and each optical lens 10 is located in a photosensitive path of the corresponding photosensitive element 22.
It should be understood that the mold base 23 is manufactured and formed by a molding process by injecting a molding material melted into a liquid state by heating into a mold, and is formed into a fixed shape corresponding to the mold after cooling. As shown in fig. 4A to 4C, since the mold used in the molding process has a high flatness, the surface of the mold base 23 formed in the mold also has a high flatness, and therefore, the mold base 23 can provide the chip mounting surface 2301 with more flatness so as to mount the photosensitive element 22 on the chip mounting surface 2301 flatly. Meanwhile, since the mold base 23 has higher structural strength and higher heat resistance with respect to a circuit board, the mold base 23 formed by a molding process and bonded to the circuit board 21 improves the structural strength of the molded photosensitive member 20 and can be prevented from being deformed by heat, so that the photosensitive member 23 mounted on the chip mounting surface 2301 can be effectively prevented from being inclined or warped.
Preferably, as shown in fig. 2 and 4C, each of the chip mounting surfaces 2301 and the corresponding lens mounting surface 2302 are parallel to each other, so that when the photosensitive element 22 and the optical lens 10 are mounted on the mold base 23, it is further helpful to adjust the photosensitive element 22 and the optical lens 10, so as to align the photosensitive surface 220 of each photosensitive element 22 and the optical axis 100 of the corresponding optical lens 10, so that the photosensitive surface 220 of each photosensitive element 22 is perpendicular to the optical axis 100 of the corresponding optical lens 10, and further ensure that the image capturing module 1 has good imaging quality. It should be understood that the shape and size of each of the chip mounting surfaces 2301 can be designed and planned according to the shape and size of the light sensing element 22, and correspondingly, the shape and size of each of the lens mounting surfaces 2302 can be designed and planned according to the lateral shape and size of the lens barrel of the optical lens 10, and the shapes and sizes of the chip mounting surfaces 2301 and the lens mounting surfaces 2302 are different for different light sensing elements 22 and optical lenses 10, and are not described in detail herein.
It should be noted that although the features and advantages of the camera module 1 of the present invention are described in the following description and the camera module 1 includes only one optical lens 10 and one photosensitive element 22 in fig. 1 to 7, it can be understood by those skilled in the art that the camera module 1 disclosed in fig. 1 to 7 and the following description is only an example and does not limit the content and scope of the present invention, for example, in other examples of the camera module, the number of the optical lens 10 may be more than one, and correspondingly, the number of the photosensitive element 22 may be more than one, so as to form an array camera module. In addition, the type of the optical lens 10 may be adjusted according to the requirements of the camera module, for example, the optical lens 10 may be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, and the like, which is not limited in the present invention.
Specifically, as shown in fig. 2 and 4A, the mold base 23 includes a chip mounting portion 231 having the chip mounting surface 2301 and a lens mounting portion 232 having the lens mounting surface 2302, and the lens mounting portion 232 is located around the chip mounting portion 231, so that the lens mounting surface 2302 is located around the chip mounting surface 2301, so that when the photosensitive element 22 is mounted on the lens mounting surface 2302 and the optical lens 10 is mounted on the lens mounting surface 2302, the optical lens 10 corresponds to a photosensitive path of the photosensitive element 22, that is, the optical axis 100 of the optical lens 10 and the photosensitive surface 220 of the photosensitive element 22 are perpendicular to each other, and the optical axis 100 of the optical lens 10 corresponds to the center of the photosensitive surface 220 of the photosensitive element 22.
More specifically, as shown in fig. 3, the mold base 23 is further provided with a reserved space 233, wherein the reserved space 233 is disposed between the chip mounting part 231 and the lens mounting part 232. In other words, the chip mounting part 231 and the lens mounting part 232 of the mold base 23 are arranged at intervals to form the reserved space 233 of the mold base 23 between the chip mounting part 231 and the lens mounting part 232.
It should be noted that, as shown in fig. 4A, the circuit board 21 includes a chip molding region 211, a lens molding region 212 and a non-molding region 213, wherein the non-molding region 213 is located between the chip molding region 211 and the lens molding region 212, and the lens molding region 212 is located around the chip molding region 211, so that when the circuit board 21 is molded by a molding process, the chip mounting portion 231 of the molding base 23 is formed in the chip molding region 211 of the circuit board 21, such that the chip mounting portion 231 of the molding base 23 covers the chip molding region 211 of the circuit board 21, and the lens mounting portion 232 of the molding base 23 is formed in the lens molding region 212 of the circuit board 21, such that the lens mounting portion 232 of the molding base 23 covers the lens molding region 212 of the circuit board 21, to form the empty space 233 of the mold base 23 in the non-mold region 213 of the wiring board 21 so that the mold base 23 does not cover the non-mold region 213 of the wiring board 231. In other words, the chip mold region 211 of the wiring board 21 corresponds to the chip mounting portion 231 of the mold base 23, the lens mold region 211 of the wiring board 21 corresponds to the lens mounting portion 232 of the mold base 23, and the non-mold region 213 of the wiring board 21 corresponds to the reserved space 233 of the mold base 23.
Further, as shown in fig. 2 and fig. 3, the circuit board 21 further includes at least one set of circuit board connectors 214, wherein each set of circuit board connectors 214 is disposed in the non-molding region 213 of the circuit board 211, so as to prevent the molding base 23 from obstructing the electrical connection between the photosensitive element 22 and the circuit board connectors 214 due to the circuit board connectors 214 covering the circuit board 21, and facilitate the conductive connection between the photosensitive element 22 and the circuit board 21.
Accordingly, as shown in fig. 3, the photosensitive element 22 includes a photosensitive region 221, a non-photosensitive region 222, and at least one set of chip connectors 223, wherein the non-photosensitive region 222 is located around the photosensitive region 221, and each set of the chip connectors 223 is respectively disposed in the non-photosensitive region 222 of the photosensitive element 22. In other words, the photosensitive area 221 is located in the middle of the photosensitive element 22, the non-photosensitive area 222 is located at the outer periphery of the photosensitive element 22, and the non-photosensitive area 222 is arranged around the photosensitive area 221 such that each set of the chip connectors 223 is located at the outer periphery of the photosensitive element 22.
It should be noted that, as shown in fig. 2, the molded photosensitive element 20 further includes an adhesive layer 26, wherein the adhesive layer 26 is located between the photosensitive element 22 and the chip mounting surface 2301 of the molded base 23, so that the photosensitive element 22 is fixedly mounted on the chip mounting surface 2301 of the molded base 23 through the adhesive layer 26. It should be understood that in the process of mounting the photosensitive element 22 to the die mounting surface 2301, an adhesive material such as glue, solid glue, or the like is first applied to the die mounting surface 2301 of the mold base 23, and then the photosensitive element 22 is stacked on the die mounting surface 2301 to form the adhesive layer 26 between the photosensitive element 22 and the die mounting surface 2301 after the adhesive material is cured.
As shown in fig. 3, the molded photosensitive assembly 20 further includes at least one set of leads 24, wherein each lead of each set of leads 24 has a circuit board connection terminal 241 and a chip connection terminal 242, respectively, wherein each lead of each set of leads 24 extends curvedly between the circuit board connection terminal 241 and the chip connection terminal 242, respectively, wherein the circuit board connection terminal 241 of each set of leads 24 is connected to each set of the circuit board connectors 214 of the circuit board 21, respectively, and the chip connection terminal 242 of each set of leads 24 is connected to each set of the chip connectors 223 of the photosensitive element 22, respectively, to conductively connect the photosensitive element 22 and the circuit board 21.
It is to be noted that the type of the lead 24 may not be limited, and for example, the lead 24 may be a gold wire, that is, after the photosensitive element 22 is attached to the chip mounting surface 2301 of the mold base 23, the lead 24 can be made to conduct the photosensitive element 22 and the circuit board 21 by a gold wire process. However, in other examples, the lead 24 may be other types of leads, such as silver wire, copper wire, etc., where the lead 24 can conduct the photosensitive element 22 and the circuit board 21.
In one example of the camera module 1 of the present invention, each of the board connectors 214 of the board 21 and each of the chip connectors 223 of the photosensitive element 22 may be a land, respectively, i.e., each of the board connectors 214 of the board 21 and each of the chip connectors 223 of the photosensitive element 22 may be disc-shaped, respectively, for allowing the board connection terminals 241 and the chip connection terminals 242 of the leads 24 to be connected to the board connectors 214 of the board 21 and the chip connectors 223 of the photosensitive element 22, respectively. In another example of the camera module of the present invention, the circuit board connectors 214 of the circuit board 21 and the chip connectors 223 of the photosensitive element 22 may be respectively spherical, for example, solder paste or other soldering material is dotted on the non-molding region 213 of the circuit board 21 and the non-photosensitive region 222 of the photosensitive element 22 to form the circuit board connectors 214 of the circuit board 21 and the chip connectors 223 of the photosensitive element 22, respectively. However, it will be understood by those skilled in the art that the types of the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 do not limit the type and scope of the camera module of the present invention, i.e., in other examples of the camera module, the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 may have other shapes not illustrated above.
It should be noted that, as shown in fig. 2, the molded photosensitive assembly 20 further includes a set of electronic components 25, wherein each of the electronic components 25 can be mounted on the lens molding region 212 of the circuit board 21 by a process such as smt (surface Mount technology) at intervals, so that after the molding base 23 is molded, the lens mounting portion 232 of the molding base 23 covers each of the electronic components 25 to isolate the adjacent electronic components 25 by the lens mounting portion 232. It should be understood that, because the lens mounting portion 232 of the mold base 23 covers each of the electronic components 25, the adjacent electronic components 25 will not interfere with each other, and even if the distance between the adjacent electronic components 25 is short, the imaging quality of the camera module can be ensured, so that a small area of the circuit board 21 can be mounted with a larger number of the electronic components 25, and the structure of the mold photosensitive assembly 20 is more compact, which is beneficial to improving the imaging quality of the camera module 1 on the basis of controlling the size of the camera module 1.
It should be noted that, in some other embodiments of the present invention, each of the electronic components 25 may also be attached to the non-molding region 213 of the circuit board 21 at intervals, so that after the molding base 23 is molded, each of the electronic components 25 is located in the reserved space 233 of the molding base 23, so that the electronic component 25 is exposed outside the molding base 23 for subsequent repair and maintenance of the electronic component 25.
Preferably, as shown in fig. 2, the chip mounting surface 2301 of the mold base 23 is lower than the lens mounting surface 2302, that is, the thickness of the chip mounting portion 231 of the mold base 23 is smaller than the thickness of the lens mounting portion 232 of the mold base 23, so that the lens mounting portion 232 can completely cover the electronic component 25 to avoid the height of the electronic component 25, and at the same time, the flat lens mounting surface 2302 can be provided for mounting the optical lens 10. Meanwhile, since the chip mounting portion 231 has a small thickness and the distance between the chip mounting surface 2301 and the circuit board 21 is small, the distance between the photosensitive element 22 mounted on the chip mounting surface 2301 and the circuit board 21 can be shortened, which is not only advantageous in shortening the length of the lead 24 required to conductively connect the photosensitive element 22 and the circuit board 21, but also in reducing the overall height of the image pickup module 1.
Further, in the first preferred embodiment of the present invention, as shown in fig. 3 and 4A, the mold base 23 further includes at least one connecting portion 234, wherein each connecting portion 234 extends integrally from the lens mounting portion 232 to the chip mounting portion 231, so as to combine the chip mounting portion 231 and the lens mounting portion 232 into a whole through the connecting portion 234, thereby forming the mold base 23 with an integrated structure, so as to enhance the overall strength and deformation resistance of the mold base 23, and facilitate preventing the mold base 23 from being deformed due to heat or external force, thereby providing a more flat and stable mounting surface. In other words, the wiring board 21 is further provided with a connection molding region 215, and the connection molding region 215 communicates with the chip molding region 211 and the lens molding region 212, respectively, so that when the mold base 23 is formed by a molding process, the chip mounting portion 231, the lens mounting portion 232, and the connecting portion 234 of the mold base 23 are integrally formed on the wiring board 21, wherein the connecting portion 234 corresponds to the connection molding region 215 of the wiring board 21, and the connecting portion 234 integrates the chip mounting portion 231 and the lens mounting portion 232, so that the chip mounting surface 2301 of the chip mounting portion 231 and the lens mounting surface 2302 of the lens mounting portion 232 can be stably kept parallel to prevent lowering of the chip mounting surface 2301 and the lens mounting surface 2302 due to inclination or slight deformation of the chip mounting portion 231 or the lens mounting portion 232 The parallelism further affects the imaging quality of the camera module 1.
It should be noted that although the connecting portions 234 are located between the chip mounting portion 231 and the lens mounting portion 232, that is, the connecting portions 234 correspond to the reserved spaces 233 of the mold base 23, each connecting portion 234 avoids the circuit board connectors 214 located in the non-mold region 213 of the circuit board 21, so as to prevent the connecting portions 234 from covering or shielding the circuit board connectors 214 to prevent the circuit board connectors 214 from being conductively connected with the chip connectors 223 of the photosensitive element 22.
Illustratively, as shown in fig. 2 and 3, the circuit board connectors 214 of the circuit board 21 are disposed on both sides of the chip molding region 211, that is, the non-molding regions 213 are distributed on both sides of the chip molding region 211, and at this time, the number of the connecting portions 234 of the mold base 23 is two, and the two connecting portions are symmetrically disposed on the front and rear sides of the chip mounting portion 231, respectively, to divide the reserved space 233 of the mold base 23 into left and right portions, so that the left and right portions of the reserved space 233 correspond to the corresponding two portions of the non-molding region 213 of the circuit board 21, respectively, so that the circuit board connectors 214 disposed on the left and right portions of the non-molding region 213 are exposed on the left and right sides of the chip mounting portion 231, respectively, so as to be electrically connected to the chip connectors 223 of the photosensitive element 22 correspondingly, so as to conduct the photosensitive element 22 and the wiring board 21.
Preferably, as shown in fig. 3, the width of each connecting portion 234 is smaller than the width of the chip mounting portion 231, so that the occupied space of the connecting portion 234 (i.e. the area of the connection molding region 215 of the circuit board 21) is reduced, and the area of the non-molding region 213 of the circuit board 21 can be correspondingly increased, so as to provide sufficient space for arranging the circuit board connectors 214, and prevent the circuit board connectors 214 from being too crowded to contact with each other to cause short circuit accidents. More preferably, the width of the connecting portion 234 is not less than 1/10 of the width of the chip mounting portion 231, so as to prevent the connecting strength of the connecting portion 234 from being too weak due to too small width of the connecting portion 234, thereby reducing the overall strength of the mold base 23.
It should be understood that in some other examples of the present invention, the width of each of the connecting portions 234 may be equal to or greater than the width of the chip mounting portion 231, so as to increase the connection strength between the connecting portion 234 and the chip mounting portion 231 and the lens mounting portion 232, respectively, and also increase the deformation resistance of the connecting portion 234 itself, so as to ensure good parallelism between the chip mounting surface 2301 and the lens mounting surface 2302.
More preferably, in the first preferred embodiment of the present invention, as shown in fig. 3 and 4A, the thickness of the connection portion 234 is equal to the thickness of the chip mounting portion 231. Of course, in some other embodiments of the present invention, the thickness of the connecting portion 234 may be greater than the thickness of the chip mounting portion 231, or may be smaller than the thickness of the chip mounting portion 231.
In the first preferred embodiment of the present invention, as shown in fig. 4A to 4C, the chip mounting portion 231 and the lens mounting portion 232 of the mold base 23 are simultaneously molded in one molding, that is, the circuit board 21 is correspondingly placed in a molding die 400 to perform a molding process by the molding die 400, thereby forming the mold base 23 for covering the chip mold region 211 and the lens mold region 213 of the wiring board 21, so that the upper surfaces of the chip mounting portion 231 and the lens mounting portion 232 of the mold base 23 have good conformity, to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 have high parallelism, which helps to make the photosensitive surface 220 of the photosensitive element 22 mounted on the chip mounting surface 2301 perpendicular to the optical axis 100 of the optical lens 10 mounted on the lens mounting surface 2302.
Specifically, as shown in fig. 4B and 4C, the molding die 400 includes a first die 401 and a second die 402, wherein at least one of the first die 401 and the second die 402 can be moved to allow the first die 401 and the second die 402 to be clamped and pulled, and a molding space 403 is formed between the first die 401 and the second die 402, wherein the molding base 23 is formed by the molding material added to the molding space 403 and cured.
For example, in one embodiment, the second mold 402 may be fixed, the first mold 401 may be movable relative to the second mold 402 along guide posts to clamp when the first mold 401 is moved toward the second mold 402 and to draw when the first mold 401 is moved away from the second mold 402, and the molding space 403 is formed between the first mold 401 and the second mold 402 when the first mold 401 and the second mold 402 are clamped. In another embodiment, the first mold 401 may be fixed and the second mold 402 may be movable relative to the first mold 401 along guide posts to clamp the mold when the second mold 402 is moved toward the first mold 401 and to draw the mold when the second mold 402 is moved away from the first mold 401.
Further, as shown in fig. 4C, the forming mold 400 further includes a cover film 404, wherein the cover film 404 is overlappingly disposed on a press-fit surface 4011 of the first mold 401 of the forming mold 400, and the cover film 404 corresponds to the non-molding region 213 of the circuit board 21, wherein after the circuit board 21 is placed on the first mold 401 and/or the second mold 402, the first mold 401 and the second mold 402 of the forming mold 400 are operated to perform a mold-closing operation so that the circuit board 21 is located in the forming space 403 of the forming mold 400, wherein the press-fit surface 4011 of the first mold 401 presses the non-molding region 213 of the circuit board 21, and the cover film 404 is located between the press-fit surface 4011 of the first mold 401 and the non-molding region 213 of the circuit board 21, so as to prevent the press-fit surface 4011 of the first mold 401 from scratching the circuit board connectors 214 located in the non-molding region 213. It should be understood that in some other embodiments of the present invention, the forming mold 400 may not include the cover film 404, so that the pressing surface 4011 of the first mold 401 directly presses the non-molding region 213 of the circuit board 21 when the molds are closed.
Further, as shown in fig. 4C, the cover film 404 is preferably made of a material having a certain elasticity, such as plastic, rubber, a polymer material, or the like, so that the cover film 404 can also absorb an impact force generated at an instant when the press-fit surface 4011 of the first mold 401 contacts the circuit board 21 when the first mold 401 and the second mold 402 are subjected to a mold clamping operation, thereby preventing damage to the circuit board 21 caused by the mold clamping of the first mold 401 and the second mold 402.
It should be understood that, since the circuit board connectors 214 located in the non-molding region 213 usually protrude from the upper surface of the circuit board 21, the pressing surface 4011 of the first mold 401 cannot be tightly pressed against the non-molding region 213 of the circuit board 21, and the cover film 404 can be deformed to prevent a gap from being generated between the pressing surface 4011 of the first mold 401 and the non-molding region 213 of the circuit board 21, so as to prevent the molding material from entering between the pressing surface 4011 of the first mold 401 and the non-molding region 213 of the circuit board 21 to cover the non-molding region 213 of the circuit board 21 during the molding process.
It should be noted that in some other embodiments of the present invention, the forming mold 400 further has a receiving groove disposed on the pressing surface 4011 of the first mold 401, wherein the receiving groove corresponds to the circuit board connector 214 located in the non-molding region 213, so that when the forming mold 400 is closed, the circuit board connector 214 is received in the receiving groove, so that the pressing surface 4011 of the first mold 401 can be tightly pressed against the non-molding region 213 of the circuit board 21, so as to prevent molding material from entering between the pressing surface 4011 and the non-molding region 213 to cover the non-molding region 213 of the circuit board 21.
It is worth mentioning that the fluid-like molding material according to the present invention may be a liquid material or a solid particle material or a mixture of liquid and solid particles, and it is understood that the molding material, whether implemented as a liquid material or as a solid particle material or as a mixture of liquid and solid particles, is capable of solidifying to form the molding base 23 after being introduced into the molding space 403 of the molding die 400. For example, in this specific example of the present invention, the molding material in a fluid state is implemented as a thermosetting material such as a liquid state, wherein the molding material is cured to form the molding base 23 after being introduced into the molding space 403 of the molding die 400. It should be noted that, after the fluid molding material is added into the molding space 403 of the molding die 400, the manner of solidifying the fluid molding material does not limit the content and scope of the present invention.
Further, the molding space 403 of the molding die 400 corresponds to the chip molding region 211, the lens molding region 212, and the connection molding region 215 of the wiring board 21 to form the chip mounting part 231 covering the chip molding region 211 of the wiring board 21, the lens mounting part 232 covering the lens molding region 212 of the wiring board 21, and the connecting part 234 covering the connection molding region 215 of the wiring board 21 after the molding material added into the molding space 403 is cured, so that the connecting part 234 integrally connects the chip mounting part 231 and the lens mounting part 232, and the top surface of the chip mounting part 231 is defined as the chip mounting surface 2301, and the top surface of the lens mounting part 232 is defined as the lens 2302.
More specifically, as shown in fig. 4B and 4C, during the molding process, the pressing surface 4011 of the first mold 401 of the forming mold 400 is pressed on the non-molding region 213 of the circuit board 21, and the non-molding region 213 is located between the lens molding region 212 and the chip molding region 211 of the circuit board 21, so as to flatten the circuit board 21, thereby ensuring the flatness of the circuit board 21, i.e., ensuring the flatness of the entire molding base surface during the molding process. It should be understood that, in order to further flatten the circuit board 21, in the embodiment described later, the first mold 401 further has a pressing head (not shown in the figure), wherein the pressing head of the first mold 401 corresponds to the central position of the circuit board 21 (i.e., corresponds to the central portion of the chip molding region 211 of the circuit board 21), so that in the mold closing state, the pressing head of the first mold 401 is pressed against the central position of the circuit board 21 to ensure the overall flatness of the circuit board 21, and thus the flatness of the molding base surface is ensured.
In addition, as shown in fig. 4A and 4B, the molding space 403 of the molding die 400 includes a chip mount molding space 4031, a lens mount molding space 4032 and a connecting portion molding space 4033, wherein in a clamped state, the chip mounting portion forming space 4031 corresponds to the chip molding region 211 of the wiring board 21, the lens mount forming space 4032 corresponds to the lens molding region 212 of the wiring board 21, each of the connection portion forming spaces 4033 corresponds to the connection molding region 215 of the wiring board 21, and each of the connection portion molding spaces 4033 communicates with the chip mount molding space 4031 and the lens mount molding space 4032, such that the connecting portion forming space 4033 forms a communicating channel between the chip mount forming space 4031 and the lens mount forming space 4032. Therefore, when the molding material is injected into the molding space 403, the molding material can flow from the lens mount molding space 4032 into the chip mount molding space 4031 through the connection portion molding space 4033 to fill the molding space 403, and the mold base 23 having an integral structure is formed after the molding material is cured, that is, the chip mount portion 231 and the lens mount portion 232 of the mold base 23 can be formed by only one molding so as to ensure that the chip mount surface 2301 and the lens mount surface 2302 of the mold base 23 are parallel to each other. It should be understood that if the chip mounting portion 231 and the lens mounting portion 232 of the mold base 23 are respectively formed by two molding processes, the chip mounting surface 2301 and the lens mounting surface 2302 of the mold base 23 cannot be kept parallel to each other due to inevitable differences in the degree of pressing of the circuit board, the pressing position, and the material of the molding material, etc., which causes great troubles and inconveniences in the subsequent assembly process.
Further, the first mold 401 of the forming mold 400 is further provided with at least one vent (not shown) to exhaust the gas in the forming space 403 of the forming mold 400, so as to prevent the forming space 403 from being filled with the forming material due to the gas in the forming space 403 being unable to exhaust. Specifically, the escape holes are provided outside the chip mounting portion 231 of the first mold 401 to exhaust the gas inside the chip mounting portion molding space 4031 and the connection portion molding space 4033, thereby ensuring that the molding material fills the chip mounting portion molding space 4031 and the connection portion molding space 4033. Preferably, the air vent is located at a position away from the circuit board connector 214 of the circuit board 21 to prevent the molding material from rushing out of the air vent to cover the circuit board connector 214.
It is noted that since the top surface of the chip mounting portion 231 and the top surface of the lens mounting portion 232 of the mold base 23 each correspond to the inner surface of the first mold 401, that is, the chip mounting surface 2301 and the lens mounting surface 2302 of the mold base 23 each correspond to the inner surface of the first mold 401, it is possible to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 of the mold base 23 have high flatness and parallelism by the flatness and parallelism of the inner surface of the first mold 401 for subsequent assembly and calibration.
FIG. 5 shows a first variant embodiment of the molding photosensitive assembly 20 according to the first preferred embodiment of the present invention, in which the molding base 23 of the molding photosensitive assembly 20 includes only one of the connecting portions 234. Illustratively, as shown in fig. 5, the connecting portion 234 integrally connects the chip mounting portion 231 and the lens mounting portion 232, and the connecting portion 234 is located at one side (e.g., a front side) of the chip mounting portion 231 such that the empty space 233 of the mold base 23 is located at the remaining three sides (e.g., a left side, a right side, and a rear side) of the chip mounting portion 232. In other words, the non-molding regions 213 of the wiring board 21 are located on the left, right, and rear sides of the chip mounting portion 232.
Fig. 6A and 6B show a second variant embodiment of the molded photosensitive element 20 according to the first preferred embodiment of the present invention, in which the connecting portion 234 of the molded base 23 of the molded photosensitive element 20 has a chip connecting end 2341 and a lens connecting end 2342, wherein the chip connecting end 2341 of the connecting portion 234 is integrally connected to the chip mounting portion 231, the lens connecting end 2342 of the connecting portion 234 is integrally connected to the lens mounting portion 232, and the connecting portion 234 extends from the lens connecting end 2342 to the chip connecting end 2341 in a tapered manner such that the thickness at the lens connecting end 2342 of the connecting portion 234 is greater than the thickness of the chip connecting end 2341 of the connecting portion 234 to enhance the connecting strength and the deformation resistance of the connecting portion 234 while preventing the connecting portion 234 from protruding from the chip 230mounting surface 1, so as to stably maintain good parallelism between the chip mount face 2301 and the lens mount face 2302.
Further, since the connecting portion 234 extends from the lens connecting end 2342 to the chip connecting end 2341 in a tapered manner, that is, the thickness of the connecting portion 234 at the lens connecting end 2342 is greater than the thickness of the connecting portion 234 at the chip connecting end 2341, the portion of the molding space 403 of the molding die 400 corresponding to the connecting portion 234 is also tapered, so that the molding material injected into the molding space 403 flows from the portion corresponding to the lens mounting portion 232 into the portion corresponding to the chip mounting portion 231, so that the molding material easily fills the entire molding space 403 and is cured on the wiring board 21 to form the molding base 23.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module. Specifically, as shown in fig. 7, the method for manufacturing the camera module 1 includes the steps of:
s1: forming a mold base 23 on a circuit board 21 by a molding process, wherein the mold base 23 provides a flat chip mounting surface 2301 and a lens mounting surface 2302;
s2: mounting a photosensitive element 22 on the chip mounting surface 2301 of the molding base 23, and keeping the photosensitive surface 220 of the photosensitive element 22 parallel to the lens mounting surface 2302; and
s3: the photosensitive element 22 and the wiring board 21 are conductively connected to make the molded photosensitive assembly 20.
Preferably, in step S1, the chip mounting surface 2301 and the lens mounting surface 2302 of the mold base 23 are parallel to each other.
More specifically, the step S1 includes the steps of:
a second mold 402 for placing the circuit board 21 on a forming mold 400;
clamping a first mold 401 and a second mold 402 of the forming mold 400 to form a forming space 403 of the forming mold 400 between the first mold 401 and the second mold 402; and
a molding material is added to the molding space 403 of the molding die 400 to form the molding base 23 on the circuit board 21 after the molding material is cured.
Note that, in step S1, the method further includes the steps of:
pressing the first mold 401 on a non-molding region 213 of the circuit board 21 by a pressing surface 4011;
correspondingly forming a chip mounting part forming space 4031 in a chip molding region 211 of the circuit board 21;
correspondingly forming a lens mounting part forming space 4032 in a lens molding region 212 of the circuit board 21, wherein the non-molding region 213 is located between the chip molding region 211 and the lens molding region 212; and
a connection portion forming space 4033 is correspondingly formed in a connection molding region 215 of the wiring board 21, wherein the connection portion forming space 4033 connects the chip mount forming space 4031 and the lens mount forming space 4032 to form the forming space 403 having an integral structure.
Preferably, in the step S1, the method further includes the steps of:
forming a lens mount 232 covering the lens molding region 212 of the circuit board 21 in the lens mount forming space 4032, so that the lens mount 2302 is formed on the top surface of the lens mount 232;
forming a chip mounting portion 231 covering the chip molding region 211 of the wiring board 21 in the chip mounting portion forming space 4031 such that a top surface of the chip mounting portion 231 forms the chip mounting surface 2301; and
in the connecting portion forming space 4033, a connecting portion 234 is formed to cover the connecting mold region 215 of the wiring board 21, wherein the connecting portion 234 is integrally connected to the chip mounting portion 231 and the lens mounting portion 232 to form the mold base 23 having an integral structure.
More preferably, in the step S1, the method further includes the steps of:
pouring the molding material into the lens mounting portion molding space 4032 of the molding space 403; and
the molding material is guided to flow from the lens mount molding space 4032 into the chip mount molding space 4031 through the connection portion molding space 4033 so that the molding material fills the molding space 403. Further, as shown in fig. 7, the method for manufacturing the camera module 1 further includes the steps of:
s4: an optical lens 10 is mounted on the lens mounting surface 2302 of the mold base 23, and an optical axis of the optical lens 10 is perpendicular to the light sensing surface 220 of the light sensing element 22, so as to form the image pickup module 1.
Specifically, referring to FIG. 8 of the drawings, there is shown a molded photosensitive element 20A in accordance with a second preferred embodiment of the present invention. The molded photosensitive member 20A according to the second preferred embodiment of the present invention is different from the first preferred embodiment of the present invention in that: the chip mounting portion 231A of the mold base 23A of the mold photosensitive assembly 20A includes at least two sub-chip mounting portions 2311A spaced from each other, and a separation gap 2312A is formed between the adjacent sub-chip mounting portions 2311A, so as to relieve stress applied to the chip mounting portion 231A by the circuit board 21 through the separation gap 2312A, and disperse stress applied to the chip mounting portion 231A to the at least two sub-chip mounting portions 2311A, so as to reduce stress applied to each sub-chip mounting portion 2311A, thereby avoiding deformation of each sub-chip mounting portion 2311A, so that the chip mounting portion 231A of the mold base 23A is not deformed along with deformation of the circuit board 21, and ensuring that the chip mounting surface 2301 and the lens mounting surface are kept parallel 2302. In addition, each of the sub-chip mounting portions 2311A is integrally connected to the lens mounting portion 232 through the corresponding connecting portion 234, so that the mold base 23A has an integral structure, which facilitates the formation of the mold base 23A through one-time molding.
Illustratively, as shown in fig. 8, the separation gap 2312A of the chip mounting portion 231A is disposed in a line shape to separate the chip mounting portion 231A into two front and rear sub-chip mounting portions 2311A, wherein the circuit board 21 can be deformed in a concentrated manner at the separation gap 2312A to reduce concentrated stress applied to the sub-chip mounting portion 2311A by the circuit board 21, so that the sub-chip mounting portion 2311A is not deformed due to less concentrated stress, thereby effectively preventing the chip mounting portion 231A from being deformed due to greater stress.
Further, FIG. 9 shows a first variant of the molded photosensitive assembly 20A according to the second preferred embodiment of the present invention, wherein the separation gaps 2312A of the chip mounting portion 231A of the mold base 23A of the molded photosensitive assembly 20A are disposed in a cross shape to separate the chip mounting portion 232A into four sub-chip mounting portions 2311A, wherein the molded base 23A has two of the connecting portions 234, wherein the four sub-chip mounting portions 2311A are grouped in pairs, and each group of the sub-chip mounting portions 231A is integrally connected to the lens mounting portion 232 through one of the connecting portions 234, so that while the volume of the separation gaps 2312A of the module base 231A is increased to further relieve the stress applied to the chip mounting portion 231A by the circuit board 21, it is also possible to ensure that the mold base 23A still has an integral structure so that the chip mount face 2301 and the lens mount face 2302 remain parallel.
Further, fig. 10 shows a second variant of the molded photosensitive assembly 20A according to the second preferred embodiment of the present invention, wherein the molded base 23A of the molded photosensitive assembly 20A has four connecting portions 234, wherein each of the connecting portions 234 integrally connects the corresponding sub-chip mounting portion 2311A and the lens mounting portion 232, respectively, to ensure that the module base 23A has an integral structure.
It is noted that, since the separation gap 2312A of the chip mounting portion 231A of the mold base 23A is a gap or a blank space, that is, the separation gap 2312A is not filled with the molding material during the molding process, and the separation gap 2312A corresponds to the chip molding region 211 of the circuit board 21, the first mold 401 of the molding mold 400 is directly pressed against the chip molding region 211 of the circuit board 21 through the separation gap 2312A during the molding process, so as to stably and flatly hold the circuit board 21 in the molding mold 400, thereby effectively preventing the circuit board 21 from being tilted or deformed due to uneven force, so as to obtain the mold base 23A with higher quality.
Of course, in some other embodiments of the present invention, the separation gap 2312A may be disposed in an "X" shape or a "m" shape to separate the chip mounting portion 231A into a plurality of sub-chip mounting portions 2311A, and reduce the stress applied to the chip mounting portion 231A by the circuit board 21 in other directions through the separation gap 2312A. It should be understood that the shape of the first mold 401 is designed and manufactured according to the shape of the mold base 23A, and the corresponding first mold 401 is manufactured and used for what kind of mold base 23A is desired, and in the present invention, the shape of the first mold 401 is not limited.
It should be noted that, in the second preferred embodiment of the present invention, except for the above-mentioned structure, other structures of the molding photosensitive element 20A are the same as the structure of the molding photosensitive element 20 according to the first preferred embodiment of the present invention, and the molding photosensitive element 20A also has a modified embodiment similar or identical to the modified embodiments of the molding photosensitive element 20 according to the first preferred embodiment, and are not repeated herein.
Since the adhesive material has a certain fluidity before the adhesive layer 26 is cured and formed, and the adhesive material causes uneven thickness of the adhesive layer 26 due to the flow, the photosensitive surface 220 of the photosensitive element 22 is likely to be inclined, and the parallelism between the photosensitive surface 220 of the photosensitive element 22 and the chip mounting surface 2301 is reduced, so that the inclination of the photosensitive surface 220 of the photosensitive element 22 is prevented by providing an accommodating groove for accommodating the adhesive material to suppress the flow of the adhesive material in order to ensure that the photosensitive surface 220 of the photosensitive element 22 and the chip mounting surface 2301 maintain a good parallel relationship.
Specifically, FIGS. 11A and 11B illustrate a molded photosensitive assembly 20B in accordance with a third preferred embodiment of the present invention. The molded photosensitive member 20B according to the second preferred embodiment of the present invention is different from the first preferred embodiment of the present invention in that: the chip mounting portion 231B of the molding base 23B of the molding photosensitive element 20B has at least one receiving groove 2313B, wherein each receiving groove 2313B is recessed downward from the chip mounting surface 2301 to form a groove for receiving the adhesive layer 26, so that the photosensitive element 22 is fixedly mounted on the chip mounting portion 231B through the adhesive layer 26, so that the photosensitive element 22 is tightly attached to the chip mounting surface 2301 of the chip mounting portion 231B, and the photosensitive surface 220 of the photosensitive element 22 is stably kept parallel to the chip mounting surface 2301, so as to prevent the photosensitive surface 220 of the photosensitive element 22 mounted on the chip mounting surface 2301 from being inclined due to flowing of an adhesive material forming the adhesive layer 26. In other words, when the photosensitive element 22 is mounted on the chip mounting portion 231B, the adhesive layer 26 adheres the photosensitive element 22 and the chip mounting portion 231B together, and the chip mounting surface 2301 of the chip mounting portion 231B supports the photosensitive element 22, since the chip mounting portion 231B has high rigidity and flatness, it is possible to ensure that the photosensitive surface 220 of the photosensitive element 22 is kept parallel to the chip mounting surface 2301.
It is to be noted that, although the features and advantages of the receiving groove 2313B of the present invention are illustrated in fig. 11A and 11B and the following description by taking the cross-sectional shape of the receiving groove 2313B as a circular shape as an example, it will be understood by those skilled in the art that the shape of the receiving groove 2313B disclosed in fig. 11A and 11B and the following description is only an example and does not limit the content and scope of the present invention, for example, in other examples of the molded photosensitive assembly 20B of the third preferred embodiment of the present invention, the cross-sectional shape of each receiving groove 2313B may be implemented in various shapes such as a square, a rectangle, a trapezoid, a triangle, an ellipse, a ring, or a polygon.
Illustratively, as shown in fig. 11A and 11B, the chip mounting portion 231B is provided with one receiving groove 2313B, the adhesive layer 26 is received in the receiving groove 2313B of the chip mounting portion 231B when the photosensitive element 22 is mounted on the chip mounting surface 2301, and the photosensitive element 22 is supported on the chip mounting portion 231B with high rigidity, so that the adhesive layer 26 does not affect the flatness of the photosensitive surface 220 of the photosensitive element 22, and the photosensitive surface 220 of the photosensitive element 22 is ensured to be parallel to the chip mounting surface 2301.
Preferably, as shown in fig. 11B, the accommodating groove 2313B is located at the center of the chip mounting portion 231B, so that the adhesive layer 26 accommodated in the accommodating groove 2313B applies uniform adhesive force to the photosensitive element 22 to prevent the photosensitive element 22 from warping due to uneven stress.
It is noted that, since the receiving groove 2313B of the chip mounting portion 231A of the mold base 23A is a through-hole type groove and the receiving groove 2313B corresponds to the central position of the chip molding region 211 of the circuit board 21, that is, the receiving groove 2313B is not filled with the molding material during the molding process, the first mold 401 of the molding mold 400 is directly pressed against the central position of the chip molding region 211 of the circuit board 21 through the receiving groove 2313B during the molding process so as to stably and flatly hold the circuit board 21 in the molding mold 400, thereby effectively preventing the circuit board 21 from being inclined or deformed due to uneven force, so as to obtain the mold base 23A with high quality.
It should be understood that in some other embodiments of the present invention, the chip mounting portion 231B is provided with two or more of the receiving grooves 2313B, and all of the receiving grooves 2313B are uniformly arrayed to ensure that the adhesive layer 26 received in the receiving grooves 2313B applies a uniform adhesive force to the photosensitive elements 22.
FIGS. 12A and 12B show a first variant embodiment of the molded photosensitive element 20B according to the third preferred embodiment of the present invention, in which the chip mounting portion 231B of the mold base 23B of the molded photosensitive element 20B includes two receiving grooves 2313B, and each of the receiving grooves 2313B is concentrically arranged, that is, the two receiving grooves 2313B are arranged in a surrounding manner (one of the receiving grooves 2313B surrounds the other of the receiving grooves 2313B, i.e., forming a ring-surrounding structure) in the chip mounting portion 231B, so that the chip mounting surface 2301 of the chip mounting portion 231B applies a uniform supporting force to the photosensitive element 22 while the adhesive layer 26 received in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22, so as to prevent the light-sensing element 22 from warping due to uneven stress.
It should be understood that although the description of FIGS. 12A and 12B and the modified embodiment illustrate the features and advantages of the chip mounting portion 231B of the present invention by taking the chip mounting portion 231B including two receiving grooves 2313B as an example, those skilled in the art will appreciate that the chip mounting portion 231B disclosed in the description of FIGS. 12A and 12B and the modified embodiment is merely an example and does not limit the scope and content of the present invention, for example, in other examples of the molded photosensitive assembly 20B of the first modified embodiment of the third preferred embodiment of the present invention, the number of the receiving grooves 2313B may be more than two to form grooves for annular nesting.
Fig. 13A to 13C show a second modified embodiment of the molded photosensitive element 20B according to the third preferred embodiment of the present invention, in which the receiving groove 2313B is recessed downward from the chip mounting surface 2301 to the circuit board 21 to form a through-hole type recess for receiving the adhesive layer 26, wherein when the photosensitive element 22 is mounted to the chip mounting portion 231B, the adhesive layer 26 adheres the photosensitive element 22, the chip mounting portion 231B and the circuit board 21 together to fixedly mount the photosensitive element 22 to the chip mounting surface 2301. In other words, as shown in fig. 13B, the receiving groove 2313B is penetratingly provided at the chip mounting portion 231B, and an upper opening of the receiving groove 2313B is located at the chip mounting surface 2301, and a lower opening of the receiving groove 2313B corresponds to the wiring board 21, so that the adhesive layer 26 received in the receiving groove 2313B can simultaneously contact the photosensitive element 22, the chip mounting portion 231B and the wiring board 21 to adhere the photosensitive element 22, the chip mounting portion 231B and the wiring board 21 together.
It is noted that, since the receiving groove 2313B is implemented as a through-hole type groove, as shown in fig. 13C, during the molding process, a pressing head 4012 of the first mold 401 of the forming mold 400 will press a portion of the chip molding region 211 of the circuit board 21, so that the pressing head 4012 and the pressing surface 4011 of the first mold 401 cooperate with each other to ensure the overall flatness of the circuit board 21, so as to provide a flat molding base surface for the molding process of the mold base 23, and ensure that the chip mounting surface 2301 of the mold base 23 has better flatness.
Preferably, the receiving groove 2313B is located in a central region of the chip mounting portion 231B, that is, the receiving groove 2313B corresponds to a central portion of the chip molding region 211 of the circuit board 21, so that during the molding process, the pressing head 4012 of the first mold 401 is pressed on the central portion of the chip molding region 211 of the circuit board 21 and is pressed on the outer side of the chip molding region 211 of the circuit board 21 through the pressing surface 4011 of the first mold 401, so as to further ensure the flatness of the circuit board 21. It should be understood that since the indenter 4012 of the first mold 401 is pressed against the central portion of the chip molding region 211 during molding, and the indenter 4012 is in the chip mounting portion forming space 4031, a space in the chip mounting portion forming space 4031 corresponding to the indenter 4012 forms the receiving groove 2313B of the chip mounting portion 231B without molding material, that is, a chip unmolded region is formed in the central portion of the chip molding region 211 of the wiring board 21 without being molded, while the molding material is cured to form the chip mounting portion 231B.
It should be noted that, compared to the first preferred embodiment according to the present invention, in this embodiment of the present invention, the method for manufacturing the molded photosensitive member 20B further includes the steps of:
a pressing head 4012 of the first mold 401 is pressed on a central portion of the chip molding region 211 of the circuit board 21, so as to form an accommodating groove 2313B located in the chip mounting portion 231B after the molding material is cured. First mold FIGS. 14A and 14B show a third variant embodiment of the molded photosensitive assembly 20B according to the third preferred embodiment of the present invention, wherein the chip mounting portion 231B includes two through-hole type receiving grooves 2313B, and each of the receiving grooves 2313B is disposed in a zigzag shape to divide the chip mounting portion 231B into two sub-chip mounting portions 2311B annularly nested with each other via the receiving grooves 2313B, wherein the two sub-chip mounting portions 2311B are integrally connected to form the chip mounting portion 231B with an integral structure. In other words, one of the two receiving grooves 2313B is located at the center of the chip mounting portion 231B, the other of the two receiving grooves 2313B is located around one of the two receiving grooves 2313B, one of the sub-chip mounting portions 2311B is formed between the two receiving grooves 2313B, and the other of the sub-chip mounting portions 2311B is formed at the periphery of the other receiving groove 2313B, wherein the other of the two receiving grooves 2313B has a "C" -shaped structure, so that the sub-chip mounting portion 2311B located between the two receiving grooves 2313B is integrally connected with the other sub-chip mounting portion 2311B, and the chip mounting portion 231B is ensured to have an integral structure, so that the chip mounting portion 231B is manufactured by one-time molding, thereby ensuring that the chip mounting portion 230b provides the flat chip mounting surface 1.
It should be noted that, in the third preferred embodiment of the present invention, except for the above-mentioned structure, other structures of the molding photosensitive element 20B are the same as the structure of the molding photosensitive element 20 according to the first preferred embodiment of the present invention, and the molding photosensitive element 20B also has a modified embodiment similar or identical to the modified embodiments of the molding photosensitive element 20 according to the first preferred embodiment, and are not repeated herein.
Referring to fig. 15A and 15B, according to another aspect of the present invention, the present invention further provides an electronic apparatus, wherein the electronic apparatus includes an electronic apparatus body 500 and at least one camera module 1, wherein each camera module is respectively disposed on the electronic apparatus body 500 for capturing an image. It should be noted that the type of the electronic device body 500 is not limited, for example, the electronic device body 500 may be any electronic device capable of being configured with the camera module 1, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and the like. It will be understood by those skilled in the art that although fig. 15A and 15B illustrate the electronic device body 500 as a smart phone, the content and scope of the invention are not limited thereto.
Illustratively, as shown in fig. 15A, the camera module 1 is disposed on the electronic device body 500 and faces the front side of the electronic device body 500, so that the camera module 1 serves as a front camera of the electronic device for shooting a spatial object on the front side of the electronic device body 500.
In addition, as shown in fig. 15B, the camera module 1 is disposed on the electronic device body 500 and faces the rear side of the electronic device body 500, so that the camera module 1 serves as a rear camera of the electronic device for shooting a spatial object behind the electronic device body 500.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (33)

1. A molded photosensitive assembly for assembling an optical lens into a camera module, comprising:
a circuit board;
the photosensitive element is connected to the circuit board in a conducting manner; and
and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is positioned in a photosensitive path of the photosensitive element.
2. The molded photosensitive assembly of claim 1, wherein said chip mounting surface and said lens mounting surface provided by said mold base are parallel to each other.
3. The molded photosensitive assembly of claim 2 wherein said mold base includes a chip mount having said chip mount surface and a lens mount having said lens mount surface and is provided with a clearance, wherein said lens mount is located around said chip mount and said clearance is located between said chip mount and said lens mount.
4. The molded photosensitive assembly of claim 3, wherein the circuit board has a chip molding area, a lens molding area, a non-molding area and at least one set of circuit board connectors, wherein the lens molding area is located around the chip molding area, the non-molding area is located between the chip molding area and the lens molding area, each set of circuit board connectors is disposed in the non-molding area of the circuit board, after molding on the circuit board, the chip mounting portion of the mold base covers the chip molding area of the circuit board, the lens mounting portion of the mold base covers the lens molding area of the circuit board, and the reserved space of the mold base corresponds to the non-molding area of the circuit board.
5. The molded photosensitive assembly of claim 4, wherein the mold base further comprises at least one connection portion, wherein each connection portion integrally extends from the lens mount to the chip mount to form the mold base having a unitary structure.
6. The molded photosensitive assembly of claim 5, wherein said circuit board further has a connection molding region, wherein said connection molding region is located between said lens molding region and said chip molding region and connects said lens molding region and said chip molding region, and after molding on said circuit board, said connecting portion of said molding base covers said connection molding region of said circuit board to integrate said lens mounting portion and said chip mounting portion through said connecting portion.
7. The molded photosensitive assembly of claim 6, wherein said connecting portion has a lens connecting end and a chip connecting end, wherein said lens connecting end of said connecting portion is integrally connected with said lens mounting portion, and said chip connecting end of said connecting portion is integrally connected with said chip mounting portion, wherein said connecting portion extends from said lens connecting end to said chip connecting end with a taper.
8. The molded photosensitive assembly of any of claims 3 to 7, wherein the thickness of the chip mounting portion is less than the thickness of the lens mounting portion.
9. The molded photosensitive assembly of any one of claims 5 to 7, wherein said chip mounting portion of said mold base includes at least two sub-chip mounting portions spaced apart from each other and forming a separation gap between adjacent ones of said sub-chip mounting portions, wherein each of said sub-chip mounting portions is integrally connected to said lens mounting portion through a corresponding one of said connecting portions.
10. The molded photosensitive assembly of claim 9, wherein said separation gap is disposed in a line to separate said chip mounting portion into two said sub-chip mounting portions.
11. The molded photosensitive assembly of claim 9, wherein said separation gap is disposed in a cross shape to separate said chip mounting portion into four said sub-chip mounting portions.
12. The molded photosensitive assembly of claim 11, wherein said four sub-chip mounting portions are grouped two by two, and each of said sub-chip mounting portions is integrally connected to said lens mounting portion through the same connecting portion.
13. The molded photosensitive assembly of any one of claims 3 to 7, further comprising an adhesive layer, wherein said chip mounting portion of said mold base includes at least one receiving groove, and each of said receiving grooves is recessed downward from said chip mounting surface to form a groove for receiving said adhesive layer, so that said photosensitive element is fixedly mounted to said chip mounting surface of said chip mounting portion by said adhesive layer.
14. The molded photosensitive assembly of claim 13, wherein each of said receiving grooves is disposed in an array arrangement in said chip mounting portion.
15. The molded photosensitive assembly of claim 13, wherein each of said receiving grooves is disposed in a surrounding arrangement to said chip mounting portion.
16. The molded photosensitive assembly of claim 13 wherein each of said receiving grooves extends downwardly from said chip mounting surface to said wiring board to form through-hole recesses for bonding said photosensitive element, said chip mounting portion and said wiring board together by said adhesive layer.
17. The molding photosensitive assembly of claim 16, wherein each of the receiving grooves is arranged in a shape of a Chinese character 'hui' to divide the chip mounting portion into two sub-chip mounting portions by the receiving groove, wherein the two sub-chip mounting portions are integrally connected to form the chip mounting portion having an integral structure.
18. The molded photosensitive assembly of any of claims 4 to 7, further comprising a set of electronic components, wherein the electronic components are attached to the lens molding region of the circuit board at intervals so as to be wrapped by the lens mounting portion of the molding base.
19. A molded photosensitive assembly according to any one of claims 4 to 7, further comprising at least one set of leads, wherein the photosensitive element comprises a photosensitive region, a non-photosensitive region and at least one set of chip connectors, wherein the non-photosensitive region is located around the photosensitive region, and each set of chip connectors is respectively disposed in the non-photosensitive region of the photosensitive element, so as to conductively connect the chip connectors with the corresponding circuit board connectors through the leads.
20. The molded photosensitive component of any one of claims 1 to 7, wherein said chip mounting surface of said molded base is lower than said lens mounting surface.
21. A camera module, comprising:
an optical lens; and
the molding photosensitive assembly according to any one of claims 1 to 20, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molding photosensitive assembly, and an optical axis of the optical lens is perpendicular to a photosensitive surface of the photosensitive element.
22. An electronic device, comprising:
an electronic device body; and
at least one camera module, wherein the camera module is disposed on the electronic device body for obtaining an image, and the camera module is the camera module according to claim 21.
23. A method of manufacturing a molded photosensitive assembly, comprising the steps of:
forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the mold base; and
and conductively connecting the photosensitive element and the circuit board to manufacture a molded photosensitive assembly.
24. The method of manufacturing a molded photosensitive element of claim 23, wherein said step of forming a mold base on a circuit board by a molding process, wherein said mold base provides a flat chip mounting surface and a flat lens mounting surface, comprises the steps of:
placing the circuit board on a second die of a forming die;
closing a first mold and a second mold of the forming mold to form a forming space of the forming mold between the first mold and the second mold; and
adding a molding material to the molding space of the molding die to integrally form the molding base on the circuit board after the molding material is cured.
25. The method of manufacturing a molded photosensitive member according to claim 24, wherein said step of clamping a first mold and a second mold of said forming mold to form a molding space of said forming mold between said first mold and said second mold comprises the steps of:
pressing the circuit board in a non-molding area of the circuit board by using a pressing surface of the first mold;
correspondingly forming a chip mounting part forming space in a chip molding area of the circuit board;
correspondingly forming a lens mounting part forming space in a lens molding area of the circuit board, wherein the non-molding area is positioned between the chip molding area and the lens molding area; and
correspondingly forming a connecting part forming space in a connecting molding area of the circuit board, wherein the connecting part forming space is communicated with the chip installation part forming space and the lens installation part forming space to form the forming space with an integrated structure.
26. The method of manufacturing a molded photosensitive assembly of claim 25, wherein said step of adding a molding material to said molding space of said molding die to integrally form said molding base on said wiring board after said molding material is cured, comprises the steps of:
forming a lens mounting part which is wrapped on the lens molding area of the circuit board in the lens mounting part forming space, so that the top surface of the lens mounting part forms the lens mounting surface;
forming a chip mounting part which covers the chip molding area of the circuit board in the chip mounting part forming space, so that the top surface of the chip mounting part forms the chip mounting surface; and
and forming a connecting part which covers the connecting molding area of the circuit board in the connecting part forming space, wherein the connecting part is integrally connected with the chip mounting part and the lens mounting part so as to form the molding base with an integrated structure.
27. The method of manufacturing a molded photosensitive assembly of claim 25 or 26, further comprising the steps of:
and pressing the central part of the chip molding area of the circuit board by a pressing head of the first mold.
28. The method of manufacturing a molded photosensitive assembly of claim 27 further comprising the steps of:
and after the molding material is solidified, forming a containing groove positioned in the chip mounting part.
29. The method of manufacturing a molded photosensitive assembly of claim 27 further comprising the steps of:
and after the molding material is solidified, forming a separation gap positioned in the chip mounting part, wherein the separation gap separates the chip mounting part into at least two mutually-spaced sub-chip mounting parts.
30. The method of manufacturing a molded photosensitive member according to claim 25 or 26, wherein said step of adding a molding material to said molding space of said molding die to integrally form said molding base on said wiring board after said molding material is cured, comprises the steps of:
pouring the molding material into the molding space of the lens mounting part of the molding space; and
and guiding the molding material to flow into the chip mounting part molding space from the lens mounting part molding space through the connecting part molding space so that the molding space is filled with the molding material.
31. A method of manufacturing a molded photosensitive component according to any of claims 23 to 26, wherein said chip mounting surface and said lens mounting surface are parallel to each other.
32. A method of manufacturing a molded photosensitive component according to any of claims 23 to 26, wherein said chip mounting surface is lower than said lens mounting surface.
33. A method for manufacturing a camera module is characterized by comprising the following steps:
forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;
mounting a photosensitive element to the chip mounting surface of the mold base;
conductively connecting the photosensitive element and the circuit board to form a molded photosensitive assembly; and
and mounting an optical lens to the lens mounting surface of the molding base, and enabling an optical axis of the optical lens to be perpendicular to the photosensitive surface of the photosensitive element to manufacture a camera module.
CN201810651876.0A 2018-06-22 2018-06-22 Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment Pending CN110636186A (en)

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