CN112333350A - Camera module, composite substrate, photosensitive assembly and manufacturing method thereof - Google Patents
Camera module, composite substrate, photosensitive assembly and manufacturing method thereof Download PDFInfo
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- CN112333350A CN112333350A CN201910695388.4A CN201910695388A CN112333350A CN 112333350 A CN112333350 A CN 112333350A CN 201910695388 A CN201910695388 A CN 201910695388A CN 112333350 A CN112333350 A CN 112333350A
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The invention relates to a composite substrate circuit board, which is provided with a first surface and an opposite second surface for attaching a photosensitive chip, and a first side surface and an opposite second side surface; the heat dissipation rib is arranged on the second surface of the circuit board, at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area, the heat dissipation rib is a strip-shaped heat dissipation rib, and at least one end face of the strip-shaped heat dissipation rib extends to the first side face or the second side face; and a back molding part which is manufactured on the second surface through a molding process and is integrated with the heat dissipation rib. The invention also provides a corresponding photosensitive assembly, a corresponding camera module and a corresponding manufacturing method. The invention can prevent the circuit board from warping in the process of molding the jointed board of the circuit board; the whole warping of the circuit board makeup can be prevented in the manufacturing process of the circuit board makeup; the production yield of the composite substrate and the photosensitive assembly can be improved.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a camera module, a photosensitive assembly for the camera module, a composite substrate and a manufacturing method of the composite substrate.
Background
With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like.
In order to meet the increasingly wide market demands, a high-pixel, large-chip, small-size and large-aperture camera module is an irreversible development trend of the existing camera module. However, the requirements for high pixel, large chip, small size, and large aperture are difficult to realize in the same image pickup mold. For example, firstly, the market puts forward higher and higher demands on the imaging quality of a camera module, and how to obtain higher imaging quality with a smaller camera module volume has become a big problem in the field of compact camera modules (for example, camera modules for mobile phones), especially on the premise of establishing the technical development trends of high pixels, large apertures, large chips and the like in the mobile phone industry; secondly, the compact development of the mobile phone and the increase of the occupation ratio of the mobile phone screen enable the space in the mobile phone, which can be used for the front camera module, to be smaller and smaller; the number of the rear camera modules is more and more, the occupied area is larger and larger, other configurations of the mobile phone such as the size of a battery and the size of a mainboard are correspondingly reduced, in order to avoid sacrifice of other configurations, the market hopes that the volume of the rear camera modules can be reduced, namely small-size packaging is realized; thirdly, with the increasing popularity of high pixel chips and the increasing functionality of video capture, chip energy consumption and heat dissipation become important issues that need to be addressed during the module design and manufacturing process.
The market demand is a development bottleneck of the camera module packaging industry, and causes the problem that the demand is not solved in time and delay, the reason analysis is mainly as follows:
(1) high pixel, large chip size: because the chip size is gradually increased, for example, the size of a current common chip with more than 4800 ten thousand pixels is 1/2 inches, and a chip with the size of 1/1.7 inch or even larger is popularized in the future, so that the chip size is rapidly increased, but because the photosensitive chip is thinner than a common chip and has the thickness of about 0.15mm, the field curvature problem is more easily generated by a large chip. Meanwhile, since the chip and the circuit board are generally connected by glue, the glue coating generally presents a shape with low periphery and high middle part, such as a Chinese character mi-shaped drawing glue, so that the middle part of the chip slightly bulges. Moreover, when the chip is attached, the chip is also in a bent shape with the periphery lower than the center due to the suction nozzle sucking the chip from the upper part. In addition, the Coefficient of Thermal Expansion (CTE) indexes of products among the chip, the glue and the circuit board are different, for example, the CTE of the chip is 6ppm/C, the CTE of the PCB is 14ppm/C, a baking process is generally adopted in a module assembly process, the chip bending problem is caused based on the difference of the CTE coefficients of various materials, and the chip bending problem is also aggravated due to the fact that the soft and hard combination board which is conventionally adopted in the industry at present adopts a laminating process and is seriously warped. The chip curvature problem can cause a chip field curvature problem in the final module imaging, and finally affect the imaging quality.
Further, under the current trend of miniaturization of devices, in the current mainstream compact camera module (for example, the camera module for a mobile phone), a heat dissipation member is not added on a circuit board, so as to avoid increasing the size of the camera module, but the heat dissipation performance of the circuit board is not sufficient to match the heat dissipation performance requirement of the module. On the other hand, the current high-end camera module has developed 4800 ten thousand pixels and more, and the video shooting demand is gradually highlighted, for example, 4K high definition video shooting, slow motion capture and the like, and then a camera module with higher pixels and higher frame rate is generated, and the power of the corresponding photosensitive chip is greatly increased. The inventor of the present application has found that, as the heat generated by the photosensitive chip during operation is larger and larger, the deformation of the photosensitive chip caused by the heat accumulation is one of the important factors causing the degradation of the imaging quality. Particularly, under the operating condition, along with the rising of the internal temperature of the camera module, the circuit board and the photosensitive chip can be bent, thereby reducing the imaging quality. In other words, even if the high-pixel high-frame-rate photosensitive chip is packaged without molding, the chip is subject to bending due to the influence of temperature. I.e., neither molded nor unmolded packaging, the problem of warpage of high pixel, large chips cannot be solved.
(2) Miniaturization/small size: in the field of compact camera modules, in order to reduce the size of the camera module and improve the manufacturing efficiency, a molding process is adopted to directly form a bracket (such as a MOB or MOC process scheme) of a lens assembly or other components on a circuit board. Specifically, the camera module may include a photosensitive component and a lens component, and the lens group and other optical elements of the lens component are disposed on a photosensitive path of a photosensitive element (typically, a photosensitive chip) of the photosensitive component. It should be noted that in some embodiments, the color filter may be mounted directly to the photosensitive member as part of the photosensitive member, but in other embodiments, the photosensitive member may not include the color filter, and the color filter may be formed as a separate color filter assembly or mounted in other ways on the light transmission path. Therefore, the lens assembly may be a combination of a lens set, a light-transmitting element such as a color filter and a supporting structural member thereof, and the combination may be referred to as a light-transmitting assembly, so that the position of the color filter can be eliminated or reduced, and the height dimension of the module can be further reduced.
Further, the photosensitive assembly can comprise a circuit board and a molding body integrally molded on the circuit board, and the molding body can further realize the advantages of the module in the dimensions such as length, width, height and the like because the molding body eliminates the advantage of an avoiding space of the traditional lens seat attached module. In addition, the molding body can reinforce the strength of the circuit board, and can ensure the flatness of the module on the basis of reducing the thickness requirement of the circuit board, so that the circuit board can be thinned. For example, in the MOC packaging process, the photosensitive element is attached to the circuit board in advance, and then a molded body is formed on the circuit board through a molding process, and the molded body can wrap the non-photosensitive region of a part of the photosensitive element. In the camera module, the combination of the circuit board and the molded body and the combination of the molded body and the photosensitive chip are rigid combination, and the combination is very firm and can be detached through a destructive method. But meanwhile, the circuit board and the photosensitive chip are combined through glue, and the combination belongs to relatively flexible combination. In addition, the thermal expansion Coefficients (CTE) of the circuit board, the molded body, and the photosensitive chip are different, and when the ambient temperature changes greatly in the manufacturing process (for example, the molding material in the molding process needs to be heated to a temperature of more than 150 degrees celsius, the temperature needs to be heated to a temperature of more than 80 degrees celsius in the module baking stage, and the ambient temperature may change many times in the subsequent manufacturing process of producing the camera module), the expansion degrees of the circuit board, the chip, and the molded body are different, and the expansion speeds are also different. The shrinkage degree of the photosensitive chip is usually the minimum, however, because the combination of the circuit board and the molded body belongs to rigid combination, the circuit board and the molded body generate stress, so that the circuit board and the molded body are bent, the bending drives the photosensitive chip to deform, and especially the upward bending deformation of the photosensitive chip can cause the great reduction of the imaging quality of the module. Fig. 24 is a schematic diagram showing the principle that the wiring board and the molded body are bent to deform the photosensitive chip. Note that fig. 24 is exaggerated for ease of understanding, and in practice the amount of curvature may be only a dozen to twenty microns, but this degree of curvature is sufficient to adversely affect imaging quality. For example, such curvature may cause the curvature of the field of the camera module to be excessive, where the image imaged by the camera module appears to be normal in center effect but poor in periphery effect.
(3) Large aperture
Due to the popularization of large pixel chips, the corresponding improvement of optical performance is also an inevitable trend, for example, the optical parameters of lenses such as a large aperture, a large wide angle and the like are gradually improved, so that the resolution performance of the photosensitive chip is realized to the greatest extent. However, the large aperture and large wide angle module set have higher requirements for the flatness of the module set.
Therefore, there is an urgent need for a solution that can avoid or suppress deformation of the photosensitive chip with a small space size cost, and a solution that can ensure the imaging quality of the camera module (especially the imaging quality in a long-time working state) with a small space size cost.
Further, in the field of consumer electronics, there is also a very high demand on the production efficiency of camera modules in the market. For example, the demand for a camera module for a smart phone may reach the order of tens of millions or even billions. In order to improve the production efficiency and the actual mass production, the photosensitive assembly is usually produced in a makeup mode. In the manufacturing process of the circuit board makeup, the circuit board makeup is generally changed from room temperature to 180 degrees (in the baking and molding process) along with the change of the environmental temperature, and because the circuit board makeup has large area and weak structural strength, the circuit board makeup is more easily bent under the influence of the temperature, the flatness is influenced, the difficulty is brought to chip attachment, and the flatness of the attached chip cannot be ensured. Therefore, how to avoid or suppress the deformation of the photosensitive chip in the imposition production manner and avoid other problems caused by new product design is a big problem at present.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a solution for a photosensitive assembly and a camera module.
In order to solve the above technical problem, the present invention provides a composite substrate for a camera module, including: the circuit board is provided with a first surface, a second surface opposite to the first surface, a first side surface and a second side surface opposite to the first side surface, wherein the first surface is provided with a chip attaching area for attaching a photosensitive chip; the heat dissipation rib is arranged on the second surface of the circuit board, at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area, the heat dissipation rib is a strip-shaped heat dissipation rib, and at least one end face of the strip-shaped heat dissipation rib extends to the first side face or the second side face; and a back molding part which is manufactured on the second surface through a molding process and is integrated with the heat dissipation rib.
At least one end face of the strip-shaped heat dissipation rib is a cutting face.
The strip-shaped heat dissipation rib is provided with two end faces, and the two end faces respectively extend to the first side face and the second side face.
Wherein, the two end faces are both cutting faces.
The radiating ribs comprise a plurality of strip radiating ribs, and the trends of the strip radiating ribs are suitable for forming runners of molding flows among the strip radiating ribs and between the strip radiating ribs and a mold used for the molding process.
The strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs.
Wherein, a plurality of linear type strip heat dissipation muscle sets up parallelly.
Wherein a molding flow injection direction in the molding process is a first direction from the first side surface to the second side surface or a second direction opposite to the first direction.
Wherein the linear strip-shaped heat dissipation rib is parallel to the injection direction of the molding flow.
The circuit board is also provided with a third side surface perpendicular to the first side surface and a fourth side surface opposite to the third side surface; the axis of the linear strip-shaped heat dissipation rib is parallel to the third side face or the fourth side face, or the angle between the axis of the linear strip-shaped heat dissipation rib and the third side face or the fourth side face is less than 45 degrees; and an edge region of the second surface along the third side and the fourth side has a press edge for a molding process.
The heat dissipation rib is made of metal, metal alloy or heat conduction silicone grease, and the heat conduction coefficient of the material for making the heat dissipation rib is 10-1000W/(meter degree).
The thickness of the back molding part is not more than 0.2mm, and the thickness of the heat dissipation rib is not more than 0.1 mm.
According to another aspect of the present invention, there is also provided a photosensitive assembly, including: any of the foregoing composite substrates; the bottom surface of the photosensitive chip is attached to the chip attaching area; and the metal wire is used for electrically connecting the photosensitive chip with the circuit board through a wire bonding process.
The photosensitive assembly further comprises a lens base, and the lens base is attached to the first surface and surrounds the photosensitive chip to form an optical window.
The photosensitive assembly further comprises an electronic element, the electronic element is mounted on the first surface, and the front molding part wraps the electronic element.
The photosensitive assembly further comprises a front molding part, the front molding part is manufactured on the first surface and surrounds the periphery of the photosensitive chip to form a light window, and the front molding part is in contact with the photosensitive chip and covers the edge area of the photosensitive chip.
The photosensitive assembly further comprises a front molding part, the front molding part is manufactured on the first surface and surrounds the photosensitive chip to form a light window, and a gap is formed between the front molding part and the photosensitive chip.
According to another aspect of the present invention, there is also provided a camera module, including: any one of the above photosensitive elements; and the lens assembly is arranged at the top of the photosensitive assembly.
According to another aspect of the present invention, there is also provided a method for manufacturing a composite substrate, including: 1) preparing a circuit board jointed board, wherein the circuit board jointed board comprises a plurality of circuit board units which are connected into a whole, the circuit board jointed board is provided with a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of chip attaching areas for attaching photosensitive chips, each circuit board unit is provided with one chip attaching area, and the circuit board units are distributed in an array; 2) arranging at least one strip-shaped heat dissipation rib on the second surface, wherein each strip-shaped heat dissipation rib extends to each circuit board unit in the same row, and at least one part of the strip-shaped heat dissipation ribs pass through an overlapping area of the back surface of the chip attaching area; 3) forming a back molding part on the second surface by a molding process, wherein the bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation rib and forms a flat surface together; and 4) cutting along the boundary of the circuit board unit to obtain the single composite substrate.
In the step 2), the direction of the strip-shaped heat dissipation ribs is suitable for forming runners of molding flows among the plurality of strip-shaped heat dissipation ribs and/or between the strip-shaped heat dissipation ribs and a mold used for the molding process.
In the step 1), a seed layer is arranged in the jointed board of the circuit board; in the step 2), the strip-shaped heat dissipation ribs are arranged in a manner that a metal layer grows on the basis of the seed layer.
In the step 2), the strip-shaped heat dissipation ribs are arranged in a manner that the preformed heat dissipation ribs are attached to the second surface.
In the step 2), the strip-shaped heat dissipation ribs are arranged in a manner that the second surface is coated with heat-conducting silicone grease and cured.
Wherein the step 3) comprises the following substeps: 31) closing an upper die and a lower die, wherein the upper die is pressed on the second surface, the lower die is pressed on the first surface, and the inner surface of the upper die presses the strip-shaped heat dissipation rib, so that a molding cavity is formed among the second surface, the strip-shaped heat dissipation rib and the upper die; 32) injecting a liquid molding flow into the molding cavity, wherein the injection direction of the molding flow is consistent with the arrangement direction of the row of circuit board units; and 33) solidifying the injected liquid molding material to obtain the back molding part.
In the step 31), the upper mold is pressed on the edge area of the second surface of the circuit board jointed board.
In the step 1), the circuit board units and the frames of the circuit board splicing plates are separated by insulating regions; and in the step 4), cutting the circuit board jointed board, the back molding part and the strip-shaped heat dissipation ribs together to separate the single composite substrate.
According to another aspect of the present invention, there is also provided a method for manufacturing a photosensitive assembly, including: manufacturing a composite substrate by any one of the above composite substrate manufacturing methods; the manufacturing method of the photosensitive assembly further comprises the following steps: 5) and attaching the photosensitive chip to the chip attaching area corresponding to the photosensitive chip, and electrically connecting the photosensitive chip and the circuit board unit corresponding to the photosensitive chip through a lead bonding process.
The manufacturing method of the photosensitive assembly further comprises the following steps: 6) and mounting a molded lens base on the first surface of the circuit board unit, wherein the lens base surrounds the photosensitive chip.
The manufacturing method of the photosensitive assembly further comprises the following steps: 6) a front molding part is formed on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip.
The step 4) is executed after the step 6), and in the step 4), the circuit board jointed board, the back surface molding part, the strip-shaped heat dissipation ribs and the front surface molding part are cut together to separate the single photosensitive assembly.
Compared with the prior art, the application has at least one of the following technical effects:
1. the utility model provides a sensitization subassembly and module of making a video recording can avoid or restrain sensitization chip deformation with a less space size cost.
2. The back of the photosensitive assembly can be a flat surface, so that the subsequent manufacturing process is convenient to realize, the photosensitive assembly is convenient to adapt to other components of terminal equipment (such as a mobile phone), and the photosensitive assembly is more suitable for large-scale mass production.
3. The application of the composite substrate, the photosensitive assembly and the camera module has high production efficiency.
4. In the photosensitive assembly of this application, the back heat dissipation muscle combines together with encapsulation portion, and on the other hand has improved the structural strength of circuit board, and on the other hand has improved photosensitive chip's radiating efficiency, avoids heat accumulation too fast, has reduced because of the different crooked stress of circuit board that leads to that causes of thermal expansion coefficient, consequently the photosensitive assembly of this application can follow two aspects and restrain photosensitive chip crooked.
5. The photosensitive assembly of this application can restrain the sensitization chip crooked through avoiding the too fast effect with increasing two aspects of structural strength of heat accumulation, therefore the encapsulation portion at the circuit board back and the thickness of heat dissipation muscle can reduce relatively, in other words, this application can realize restraining the crooked effect of sensitization chip with littleer thickness cost.
6. The circuit board can be prevented from warping in the process of molding the circuit board spliced plate.
7. The method and the device can prevent the whole board makeup from warping in the manufacturing process of the board makeup.
8. The heat dissipation rib can form a flow channel of a molding flow in the molding process of the circuit board jointed board, so that the phenomenon of 'insufficient injection' in a molding cavity is prevented, the problems of unevenness and the like of a back molding part are avoided, and the production yield of a composite substrate and a photosensitive assembly is improved.
Drawings
Fig. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application;
FIG. 2 illustrates a perspective view of the composite substrate 1000 shown in FIG. 1;
FIG. 3 illustrates a schematic front view of a composite substrate 1000 on which the photosensitive chip 50 is mounted in one embodiment of the present application;
FIG. 4 illustrates a schematic cross-sectional view of a photosensitive assembly 2000 including a composite substrate 1000 in one embodiment of the present application;
FIG. 5 shows a schematic backside view of a composite substrate in a variant embodiment of the present application;
FIG. 6 shows a schematic backside view of a composite substrate in another variant embodiment of the present application;
FIG. 7 illustrates a composite substrate based photosensitive assembly 2000 according to another embodiment of the present application;
FIG. 8 illustrates a composite substrate based photosensitive assembly 2000 according to yet another embodiment of the present application;
FIG. 9 shows a schematic cross-sectional view of a photosensitive assembly of yet another alternative embodiment of the present application;
FIG. 10 shows a schematic cross-sectional view of a photosensitive assembly of one variant embodiment of the present application;
fig. 11 shows the wiring board 10 in step S10;
fig. 12 is a schematic diagram illustrating the step S20 of manufacturing the heat dissipation ribs 20 on the second surface 15 of the circuit board 10;
fig. 13 is a schematic view illustrating the circuit board 10 placed in the mold to form the molding cavity in step S30 in an embodiment of the present application;
FIG. 14 shows a schematic view of an embodiment of the present application in which a liquid molding material is injected into a mold cavity and molded into an encapsulant 30;
fig. 15 shows the composite substrate obtained after the mold opening, which includes the wiring board 10, the heat dissipation ribs 20, and the encapsulation portion 30;
FIG. 16A shows a circuit board panel having connector portions;
FIG. 16B shows a circuit board panel without a connector portion;
FIG. 17 is a schematic view of the mold cavity formed after clamping in step S30 of an embodiment of the present application;
FIG. 18 illustrates a schematic view of the mold after step S30 of one embodiment of the present application;
FIG. 19 is a schematic diagram illustrating the method after the mold opening in step S30 according to an embodiment of the present application;
FIG. 20 is a schematic view of the mold cavity formed after clamping in step S31 of an embodiment of the present application;
FIG. 21 illustrates a schematic view of the mold after step S31 of one embodiment of the present application;
FIG. 22 is a schematic diagram illustrating the method after opening the mold in step S31 according to an embodiment of the present application;
FIG. 23 illustrates a composite substrate with heat dissipating extensions in one embodiment of the present application;
FIG. 24 is a schematic view showing the principle of deformation of the photosensitive chip caused by bending of the wiring board and the molded body;
FIG. 25 is a schematic cross-sectional view of a camera module in an embodiment of the present application;
fig. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;
fig. 27 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application;
FIG. 28 is a schematic cross-sectional view of a camera module according to yet another embodiment of the present application;
fig. 29 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
fig. 30 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
fig. 31 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
FIG. 32A shows a circuit board panel according to an embodiment of the present application;
FIG. 32B shows a circuit board panel according to another embodiment of the present application;
FIG. 32C shows a circuit board panel according to yet another embodiment of the present application;
FIG. 32D shows a circuit board panel according to yet another embodiment of the present application;
FIG. 33 is a schematic bottom view of a circuit board panel and a plurality of heat dissipating ribs according to an embodiment of the present disclosure;
FIG. 34A shows a schematic cross-sectional view of a circuit board panel after clamping in one embodiment of the present application;
FIG. 34B is a schematic cross-sectional view of a closed circuit board panel of another embodiment of the present application;
FIG. 35 illustrates a molding material flow direction in one embodiment of the present application;
FIG. 36 is a schematic bottom view of a composite substrate panel formed after back molding in accordance with an embodiment of the present application;
FIG. 37 is a schematic view of a cut composite substrate panel in one embodiment of the present application;
FIG. 38A is a perspective view of a monolithic composite substrate made from panels as described above according to one embodiment of the present application;
FIG. 38B shows an exploded view of FIG. 38A;
FIG. 39 is a schematic front view of a panel of photosensitive assemblies in an embodiment of the present application;
FIG. 40 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application;
fig. 41 is a schematic view showing that the wiring board 10 is placed in a mold to form a molding cavity in step S30 in another embodiment of the present application;
fig. 42 shows a schematic view of another embodiment of the present application in which a liquid molding material is injected into a molding cavity and molded into the package 30.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
As mentioned above, as the mobile phone camera module is developed to have high pixel and high frame rate, the heat generated by the photosensitive chip during operation is increasingly large. The inventor of the present application finds that the superposition of factors such as heat accumulation and increase in the size of the photosensitive chip (the size of the photosensitive chip is increased due to high pixels) makes the photosensitive chip easily deformed, and the deformation is enough to cause the imaging quality of the camera module to be reduced. Specifically, under the development trend of the current mobile phone market (mobile phone camera module market), firstly, the area of the photosensitive chip is large, the power is high, and the generated heat is large; the area of the two photosensitive chips is large, the thickness of the two photosensitive chips is small, and the chips are easily influenced by foreign matters due to the proportion; thirdly, the photosensitive chip is influenced by the force generated by the deformation of foreign objects such as circuit boards and molding, so that the photosensitive chip is more prone to deformation. Based on this, the applicant has proposed a composite substrate capable of suppressing the above-mentioned distortion, and a photosensitive element and an image pickup module based on the composite substrate. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module according to an embodiment of the present application. Referring to fig. 1, in the present embodiment, the composite substrate 1000 includes a circuit board 10, a heat dissipation rib 20, and a back surface sealing portion 30. The wiring board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14. The heat dissipation ribs 20 are directly formed on the second surface 15. The material for manufacturing the heat dissipation ribs has good heat conductivity, and in the embodiment, the heat conductivity coefficient of the material adopted by the heat dissipation ribs is 10-1000W/(m.K), namely 10-1000W/(m.K). Specifically, the material of the heat dissipation rib may be copper, aluminum, silver, metal alloy, or heat conductive silicone grease. The back encapsulant 30 covers the second surface 15 and fills gaps between the heat sink ribs 20. Further, fig. 2 shows a perspective view of the composite substrate 1000 shown in fig. 1. Referring to fig. 2, the wiring board 10 may include a board body 11, a connector 12, and a flexible connection tape 13. Only the wiring board main body 11 is shown in fig. 1. In this embodiment, the heat dissipation ribs 20 are actually attached to the back surface of the wiring board main body 11, and therefore the connector 12 and the flexible connection tape 13 are omitted in some drawings. In this embodiment, the circuit board main body 11 may be a PCB. The heat dissipation ribs 20 are a plurality of linear strip-shaped heat dissipation ribs 21 arranged in parallel. Accordingly, the backside packaging part 30 is filled between the linear strip-shaped heat dissipation ribs 21 arranged in parallel, and covers the second surface 15. The back side encapsulant 30 is shown separated from the wiring board 10 in fig. 2 for clarity of illustration. The back side encapsulant 30 may be formed on the second surface 15 by a molding process. Of course, in other embodiments, the back side sealing portion 30 can be implemented by other sealing processes such as injection molding, mold pressing, etc., as long as the second surface 15 can be covered and the gap between the heat dissipation ribs 20 can be filled to realize sealing.
Here, based on different packaging methods, the back side packaging part is provided based on different packaging processes, and the heat dissipation rib is provided with different requirements, if the processing is performed by a transfer molding method, because a mold is required to press the surface of the circuit board to form a flow channel, the direction in which the heat dissipation rib is provided should preferably be parallel to a molded press-fit edge (i.e., an exposed edge of the circuit board), or at a certain angle, for example, at an angle of 45 degrees or less than 45 degrees with the press-fit edge, so as to facilitate the injection of the molding fluid and prevent the occurrence of an "short shot" condition. And the molding process is mainly encapsulated by molding powder. The surface flatness and precision of the molded package have certain differences relative to the molded package.
Further, fig. 3 shows a schematic front view of the composite substrate 1000 on which the photosensitive chip 50 is mounted in one embodiment of the present application. For convenience of understanding, the side facing the photosensitive surface is referred to as the front surface, and the side facing away from the photosensitive surface is referred to as the back surface. Referring to fig. 3, in the present embodiment, the photosensitive chip 50 is attached to the center of the circuit board 10. The area of the first surface 14 of the wiring board 10 for attaching the photosensitive chip 50 is referred to as a chip attaching area. Further, fig. 4 shows a schematic cross-sectional view of a photosensitive assembly 2000 including a composite substrate 1000 according to an embodiment of the present application. Referring to fig. 3 and 4 together, it can be seen that in the present embodiment, a portion of the heat dissipation rib 20 is located in a region of the second surface corresponding to the back of the chip attach region. Wherein, the linear heat dissipation ribs 21 are partially located in the back region of the chip attachment region, and two ends of the linear heat dissipation ribs 21 extend to the outside of the chip attachment region. The other part of the linear strip-shaped heat dissipation rib 21 is located at the edge area of the circuit board 10, that is, the part of the linear strip-shaped heat dissipation rib 21 is located outside the chip attachment area. In this embodiment, since at least a part of the heat dissipation ribs 20 are arranged in the region overlapping with the photosensitive chip, the distance between the photosensitive chip and the heat dissipation ribs can be shortened, and the heat dissipation efficiency can be increased. In this embodiment, the bottom surface of the heat dissipation rib is exposed outside the back surface packaging part, so as to improve the heat dissipation effect. In this embodiment, back portion heat dissipation muscle combines together with the encapsulation portion, has improved the structural strength of circuit board on the one hand, and on the other hand has improved the radiating efficiency of sensitization chip, avoids the heat accumulation too fast, has reduced the crooked stress of circuit board that leads to because of thermal expansion coefficient difference causes, consequently the sensitization subassembly of this application can follow two aspects and restrain the sensitization chip crooked.
Further, still referring to fig. 1, in one embodiment of the present application, a bottom surface of the backside encapsulation is flush with a bottom surface of the heat dissipation rib. In this embodiment, the back surface of the photosensitive component may be a flat surface, which is convenient for the implementation of the subsequent manufacturing process, is convenient for being adapted to other components of the terminal device (such as a mobile phone), and is more suitable for large-scale mass production. Further, in this embodiment, the thickness of the heat dissipation rib 20 may be 0.05mm-0.4mm, which ensures that the strength of the photosensitive assembly can be effectively enhanced without increasing the thickness of the camera module, and the bending effect of the photosensitive chip is suppressed by the dual functions of enhancing the structural strength and enhancing the heat dissipation, thereby effectively preventing the image quality (e.g., field curvature) of the camera module from decreasing. In addition, because the molded body can play a role in reinforcing the circuit board, the circuit board selected in the technical scheme can be thinner than the circuit board of the conventional design scheme, and the thickness of the circuit board is generally reduced by 0.1mm, so that the height of the module cannot be increased under certain conditions. The thickness of the conventional circuit board is generally 0.35mm or more (e.g., 0.35mm-0.45mm), while the thickness of the circuit board of the MOB module can be less than 0.3mm, and ideally less than 0.25 mm. Note that, in the present embodiment, the thickness refers to an axial dimension, i.e., a dimension in the optical axis direction of the camera module. Axial direction may also be understood as the normal direction of the light-sensing surface or first surface.
It should be noted that although in the above embodiments, the bottom surface of the back surface encapsulation portion is flush with the bottom surface of the heat dissipation rib, the application is not limited thereto. For example, fig. 40 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application. In this embodiment, the back side encapsulant 30 is a back side molding directly formed on the second surface 15 (i.e., the back side) of the circuit board by a molding process, and the back side molding covers the bottom surface of the heat dissipation rib 20 instead of being flush with the bottom surface of the heat dissipation rib 20. This scheme can help to improve product yield. Because of the possible lack of consistency of the incoming molding material, the problem of uneven bottom surface of the molding is sometimes encountered if the back encapsulant is to be directly made flush with the bottom surface and the heat sink ribs during molding. Therefore, in the embodiment, the back molding portion covers the bottom surface of the heat dissipation rib 20, so that the bottom surface 38 completely made of the molding material can be obtained, the bottom surface 38 can have high flatness, the process difficulty is reduced, the requirement on the quality of the molding material can be reduced, and the improvement of the product yield and the reduction of the production cost are facilitated. Further, in an embodiment of the present application, on the basis that the back surface molding portion covers the second surface and the bottom surface of the heat dissipation rib, a distance between the bottom surface 38 of the back surface molding portion and the bottom surface of the heat dissipation rib may be not greater than 0.1mm, and a distance between the bottom surface 38 of the back surface molding portion and the second surface 15 may be not greater than 0.2mm (i.e., a thickness of the back surface molding portion is not greater than 0.2 mm). The resulting composite substrate still has a small thickness. Further, in an embodiment of the present application, when the back molding part covers the second surface 15 and the bottom surface of the heat dissipation rib 20, the thickness of the circuit board may be further reduced to 0.25mm or less than 0.25 mm.
Further, still referring to fig. 3, in an embodiment of the present application, the photosensitive chip 50 is rectangular, the rectangle has a long side L and a short side W, and the heat dissipation rib 20 is formed by a plurality of parallel linear strip-shaped heat dissipation ribs. The plurality of parallel linear strip-shaped heat dissipation ribs may be parallel to the long side L of the photosensitive chip 50. The typical photosensitive chip is in a 16:9 rectangular shape, the warpage degree of the chip usually appears on the long side and the short side of the chip is different, the orientation of the heat dissipation rib adopted in the embodiment is more favorable for restraining and preventing the photosensitive chip from bending, so the heat dissipation rib is preferably arranged along the direction parallel to the long side of the photosensitive chip.
In another embodiment of the present application, the circuit board 10 (actually, the circuit board main body 11) has a rectangular shape having a long side and a short side, and the linear strip-shaped heat dissipation ribs are parallel to the long side of the circuit board 10. The trend of the heat dissipation rib that this embodiment adopted is favorable to restraining more and prevents that the sensitization from taking place the bending. Note that, in fig. 3, the long side direction of the photosensitive chip coincides with the long side direction of the wiring board, but the present application is not limited thereto, because the long side of the photosensitive chip and the long side of the wiring board may be in a perpendicular state in some cases.
Further, fig. 5 shows a schematic backside view of a composite substrate in a variant embodiment of the present application. Referring to fig. 5, in the present embodiment, another shape of the heat dissipation rib 20 is adopted, that is, the heat dissipation rib 20 is formed by a single strip-shaped heat dissipation rib integrally connected. The heat dissipating ribs 20 are substantially "m" shaped at a bottom view. The gaps between the heat dissipation ribs can be understood as gaps between different portions of a single heat dissipation rib. The back surface package portion 30 fills the gap to realize packaging. This embodiment can strengthen the structural strength of circuit board diagonal direction, horizontal line direction, perpendicular line direction, supports the circuit board in a plurality of directions, suppresses photosensitive assembly's four corners warpage, strengthens the ability that hinders photosensitive assembly crooked, alleviates photosensitive assembly crooked. In some cases, the chip is prone to be bent upward at the center due to the concentration of glue (i.e., glue) applied inside the chip in the middle, or due to the suction nozzle sucking the chip from the upper part to be attached to the circuit board, and the degree of bending may be increased in the subsequent processes. In a preferred embodiment of the present invention, the center of the heat dissipation rib structure of the heat dissipation rib is located at a position corresponding to the center area of the chip, and the center of the chip is reinforced and fixed, so as to suppress upward warpage of the center of the chip and suppress four corners of the photosensitive assembly, thereby suppressing field curvature of the chip.
Further, fig. 6 shows a schematic backside view of a composite substrate in another variant embodiment of the present application. Referring to fig. 6, in the present embodiment, another shape of the heat dissipation rib 20 is adopted, that is, the heat dissipation rib 20 is formed by a single strip-shaped heat dissipation rib integrally connected. The heat dissipating ribs 20 are substantially square spiral in a bottom view. Similar to the embodiment of fig. 5, in the present embodiment, the gap between the heat dissipation ribs may be understood as a gap between different portions of a single heat dissipation rib. The back surface package portion 30 fills the gap to realize packaging. This embodiment can strengthen the structural strength of circuit board, at a plurality of direction support circuit boards, strengthens the ability that hinders the sensitization subassembly crooked, alleviates the sensitization subassembly crooked.
It should be noted that other shapes of the heat sink ribs 20 may be used, such as "X" shaped heat sink ribs, "loop" shaped or annular shaped. The heat dissipating ribs 20 may also be a plurality of small heat dissipating ribs arranged in a scattered array. The heat dissipation ribs 20 may also be a combination of two or more of the foregoing, for example, a plurality of parallel linear strip-shaped heat dissipation ribs and a "meter" shaped heat dissipation rib may be disposed on the back of the same circuit board. Various combination modes can be flexibly set, and are not described in detail herein.
Further, in an embodiment of the present application, the heat dissipation rib may be made of a metal material. For example, a multilayer PCB board may be employed as the wiring board. The multi-layer PCB board has multiple layers, and each layer can be provided with circuits and designed functional circuits. The different layers can be conducted through copper columns (or other metal columns) so as to connect the whole circuit board into a whole (electrically). In this embodiment, a copper seed layer may be formed in a certain layer of the circuit board, and then copper pillars are implanted on the seed layer by electroplating and grown to a position outside the second surface (i.e., the back surface) of the circuit board, so as to form the required heat dissipation ribs. In this embodiment, the manufacturing process of the heat dissipation rib can be compatible with the process in the manufacturing of the circuit board, the mass production is easy, and the obtained composite substrate has high structural strength. The layer of the multi-layer PCB used to make the seed layer may not be used for circuit conduction, but may be dedicated to reinforcing the structural strength of the circuit board.
In another embodiment of the present application, the heat dissipating ribs may be formed using a thermally conductive colloidal substance. For example, the thermally conductive colloidal substance may be applied to the second surface (i.e., the back-side surface) of the circuit board in a desired shape, and then hardened to form the heat dissipating ribs. The thermally conductive colloidal substance may be, for example, thermally conductive silicone grease.
In yet another embodiment of the present application, the heat dissipating ribs may be molded and then attached to the second surface (i.e., the backside surface) of the circuit board by bonding, welding, or the like. The preformed heat sink ribs may be made of metal or hardened heat conductive colloidal substance, such as heat conductive silicone grease.
Further, still referring to fig. 4, according to an embodiment of the present application, a composite substrate based photosensitive assembly 2000 is provided. The photosensitive assembly 2000 includes a composite substrate. The composite substrate may include a wiring board 10, heat dissipation ribs 20, and a back side encapsulation portion 30. The photosensitive chip 40 is attached to the first surface 14 of the wiring board 10. The heat dissipation ribs 20 are directly formed on the second surface 15 of the circuit board 10. The back side encapsulant 30 fills the gaps between the heat sink ribs 20 and the second surface 15 to achieve an encapsulation effect. The photosensitive assembly 2000 further includes an electronic component 50, and the electronic component 50 may be mounted on the first surface 14 and disposed around the photosensitive chip 40. The electronic component 50 may be a passive device such as a capacitive element or an inductive element, or may be an active device such as a memory chip or an image processor chip. The photosensitive assembly can also include a metal Wire 60, and the metal Wire 60 can electrically connect the photosensitive chip and the circuit board through a Wire Bonding (also referred to as "Wire Bonding", "binding", or "routing") process. The metal line 60 may be a metal line with better conductivity, such as a gold line, an aluminum line, or a copper line.
Further, fig. 7 shows a composite substrate based photosensitive assembly 2000 according to another embodiment of the present application. The present embodiment differs from the previous embodiment (refer to fig. 4) in that the electronic component 50 is arranged on the back side of the wiring board 10, i.e., the electronic component 50 is mounted on the second surface 15. The back side packaging part 30 can wrap the electronic element 50 or fill around the electronic element 50, thereby realizing the packaging of the back side of the circuit board. In this embodiment, since the electronic component can be arranged on the back surface of the wiring board, a space for arranging the electronic component on the front surface of the wiring board can be omitted, thereby contributing to reduction in the radial dimension of the photosensitive assembly. In this embodiment, the radial dimension refers to a dimension in a direction perpendicular to an optical axis of the camera module. And the thickness direction of the circuit board may be referred to as an axial direction, which is parallel to the optical axis of the camera module. Note that the electronic components may be entirely disposed on the back surface of the wiring board, or may be partially disposed on the back surface of the wiring board, and partially disposed on the front surface of the wiring board.
Further, fig. 8 illustrates a composite substrate based photosensitive assembly 2000 according to yet another embodiment of the present application. The present embodiment differs from the embodiment of fig. 4 in that a secondary heat sink 22 is added. Wherein, the top surface of the secondary heat dissipation part 22 is connected with the bottom surface of the heat dissipation rib 20. The bottom surface of the back side encapsulation 30 may be flush with the bottom surface of the secondary heat sink member 22, and the bottom surface of the secondary heat sink member 22 is exposed outside the back side encapsulation 30. The area of the bottom surface of the secondary heat dissipation portion 22 is larger than the area of the bottom surface of the heat dissipation rib 20. Thus, the surface area of the heat dissipation member can be increased, and the heat dissipation efficiency can be improved. It is noted that fig. 8 is not the only implementation of the secondary heat sink 22, for example, in another embodiment, the longitudinal section of the secondary heat sink 22 may be trapezoidal such that the cross-sectional area of the secondary heat sink gradually increases from the top surface to the bottom surface thereof. The surface area of the heat dissipation component can be increased by the implementation mode, and the heat dissipation efficiency is improved.
Further, fig. 9 shows a schematic cross-sectional view of a photosensitive assembly of an embodiment of still another variation of the present application. Referring to fig. 9, in the present embodiment, the photosensitive assembly eliminates the backside packaging part, i.e., the heat dissipation ribs 20 are formed on (or attached to) the second surface (backside) of the circuit board 10. The bottom surface and the side surface of the heat dissipation rib 20 are exposed to the outside. The heat dissipation ribs 20 may be a plurality of linear strip-shaped heat dissipation ribs arranged in parallel, a plurality of heat dissipation ribs arranged in a scattered array, or a single strip-shaped heat dissipation rib, and the single strip-shaped heat dissipation rib is spiral or in a shape like a Chinese character 'mi', or in other strip-shaped shapes which can be connected into a whole but still have gaps between different parts; the ribs may be any combination of two or more of the above.
Further, in an embodiment of the present application, the photosensitive assembly may further include a front molding portion, and the front molding portion may be formed on the first surface and around the photosensitive chip through a molding process. In this embodiment, a space is provided between the front molding portion and the photosensitive chip, that is, the MOB process. Also, in the present embodiment, the top surface of the front molding portion is adapted to mount a lens assembly. Here, the lens assembly may be a lens assembly having a motor, or may be a lens assembly without a motor.
Further, in another embodiment of the present application, the photosensitive assembly may further include a front molding portion, the front molding portion may be formed on the first surface and around the photosensitive chip by a molding process, and the front molding portion extends toward the photosensitive chip and contacts the photosensitive chip (for example, the front molding portion may cover an edge region of the photosensitive chip), that is, an MOC process. Also, in the present embodiment, the top surface of the front molding portion is adapted to mount a lens assembly. Here, the lens assembly may be a lens assembly having a motor, or may be a lens assembly without a motor. The lens component and the photosensitive component are assembled together to obtain the camera module.
It should be noted that when the photosensitive assembly is packaged by the MOC process, the photosensitive chip may be more easily bent due to the molding body integrally formed on the photosensitive chip. For example, in a photosensitive assembly packaged by an MOC process, not only the bending of the photosensitive chip may occur after a long time use, but also the bending of the photosensitive chip may occur during the manufacturing process. For another example, in a photosensitive assembly packaged by an MOC or MOB process, not only the high-pixel and high-frame-rate camera module may be bent after a long time use, but also the bending phenomenon may occur in the camera module with a relatively low pixel count and frame rate. This is because the temperature change of the manufacturing environment is relatively large (for example, the temperature is increased to 150 degrees from room temperature and then decreased to room temperature) during the molding process, and the thermal expansion coefficients of the molding material and the circuit board are different, so that stress is easily generated between the molding material and the circuit board, and the photosensitive element of the MOC/MOB module is more easily bent. Therefore, for the photosensitive assembly packaged by the MOC/MOB process, the heat dissipation ribs in the foregoing embodiments are disposed on the back surface of the circuit board, so that a more significant effect can be achieved in terms of suppressing the bending of the photosensitive chip. Furthermore, the thickness requirement of the circuit board can be reduced by combining the molded body and the heat dissipation ribs, and meanwhile, the circuit board has good flatness, and the heat dissipation performance is remarkably improved compared with the existing product.
Further, in another embodiment of the present application, the front molding may be replaced with a lens holder (sometimes also referred to as a lens mount). The lens holder is mounted on the first surface after being molded. Specifically, the lens holder is mounted on the first surface and surrounds the photosensitive chip, and the top surface of the lens holder is suitable for mounting a lens component.
Further, in another embodiment of the present application, the photosensitive member may further include a color filter, and the color filter may be mounted to the front molding part or the lens holder. When the color filter is mounted to the front molding part, a top surface of the front molding part may form a stepped structure to which the color filter is mounted.
Further, in another embodiment of the present application, the photosensitive element may not include a color filter. A color filter assembly can be added in the camera module, and the color filter assembly comprises a lens base and a color filter arranged on the lens base. The photosensitive assembly may have a front molding portion, and a bottom portion of the mirror base is mounted on a top surface of the front molding portion. The top surface of the lens base is provided with a lens component.
It should be noted that, in the above embodiments, the photosensitive chips are all attached to the front surface, i.e. the first surface, of the circuit board, but the present application is not limited thereto. In a modified embodiment, the center of the wiring board may have a main through hole that can accommodate the photosensitive chip, and the photosensitive chip may be mounted in the main through hole. This fabrication process helps to reduce the axial dimension of the photosensitive assembly. I.e. reducing the size in the direction of the optical axis (referring to the optical axis of the camera module or lens assembly). FIG. 10 shows a schematic cross-sectional view of a photosensitive assembly of one variant embodiment of the present application. Referring to fig. 10, in the present embodiment, the circuit board and the photosensitive chip form a combined body, where a surface of the photosensitive chip facing the photosensitive surface is a front surface of the combined body, and a surface opposite to the front surface is a back surface of the combined body. Heat dissipating ribs are located on the back of the assembly, wherein the heat dissipating ribs are fabricated directly on or attached to the back of the assembly. In addition, in this embodiment, the back surface of the assembly includes the back surfaces of the circuit board and the photosensitive chip, and at least a part of the heat dissipation rib is located on the back surface of the photosensitive chip.
Further, according to another embodiment of the present application, a method for fabricating a photosensitive element is also provided, which includes the following steps S10-S40 performed in sequence.
In step S10, a wiring board 10 is prepared. Fig. 11 shows the wiring board 10 in step S10. The circuit board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14, wherein the first surface 14 has a chip attaching area. The circuit board 10 of this step may be a PCB, which may be manufactured by itself or ordered in the market (note that there is no such product in the market at present, in other words, the structure of the circuit board 10 itself in this step is not prior art).
In step S20, a heat dissipation rib 20 is formed on the second surface 15 (i.e., the back surface) of the circuit board 10. Fig. 12 shows a schematic diagram of the step S20 of manufacturing the heat dissipation ribs 20 on the second surface 15 of the circuit board 10. At least a part of the heat dissipation rib 20 is located directly below the chip attachment region (note that the wiring board 10 is turned upside down in fig. 12, and thus the heat dissipation rib 20 is located above the wiring board 10 in fig. 12), that is, an area on the second surface 15 overlapping the chip attachment region. In this embodiment, the heat dissipating ribs 20 may be provided in a predetermined shape. For example, the heat dissipation rib may be formed by a plurality of parallel linear strip-shaped heat dissipation ribs. In this embodiment, the thickness of the heat dissipation rib 20 may reach 0.1mm or less than 0.1 mm. The thickness of the heat dissipation rib refers to the size of the heat dissipation rib in the normal direction of the second surface, the thickness of the heat dissipation rib is the size of the heat dissipation rib exceeding the second surface, and if the root of the heat dissipation rib is located inside the circuit board, the part located inside the circuit board is not calculated within the thickness of the heat dissipation rib.
Step S30, covering a back-side encapsulation portion on the second surface, wherein the back-side encapsulation portion covers the second surface and fills gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are gaps between a plurality of heat dissipation ribs or gaps between different portions of a single heat dissipation rib; the bottom surface of the heat dissipation rib is exposed outside the back surface packaging part, and the bottom surface of the back surface packaging part is flush with the bottom surface of the heat dissipation rib. In this embodiment, the back side encapsulation portion may be formed on the second surface by a molding process. Specifically, fig. 13 shows a schematic diagram of the circuit board 10 placed in the mold to form the molding cavity in step S30 in an embodiment of the present application. Fig. 14 shows a schematic view of an embodiment of the present application in which liquid molding material is injected into the molding cavity and molded into the encapsulant 30. Referring to fig. 13, the wiring board 10 is placed in a mold including an upper mold 91 and a lower mold 92. The second surface 15 of the circuit board 10 faces upward, and the second surface 15 has heat dissipation ribs 20. The heat dissipating ribs 20 have gaps therebetween, the bottom surface of the upper mold 91 presses the end surfaces of the heat dissipating ribs 20, and the lower mold 92 bears against the first surface 14 of the circuit board 10. After the upper and lower molds are closed, a molding cavity is formed among the upper mold 91, the circuit board 10 and the heat dissipation ribs 20. Then, referring to fig. 14, a liquid molding material is injected into the molding cavity of fig. 13, and the liquid molding material is cured to form the encapsulant 30. Further, fig. 15 shows a composite substrate obtained after mold opening, which includes the wiring board 10, the heat dissipation ribs 20, and the sealing portion 30. In this step, the thickness of the back molding part manufactured by the molding process may be 0.1mm or less than 0.1 mm. It should be noted that although the above-described embodiment adopts a solution in which the bottom surface of the back surface molding portion is flush with the bottom surface of the heat dissipation rib, the present application is not limited thereto. For example, in another embodiment of the present application, the back molding part may cover both the second surface 15 and the bottom surface of the heat dissipation rib 20 (refer to fig. 40). In this embodiment, a gap 39 may be left between the upper mold 91 and the bottom surface of the heat dissipation rib 20 (the bottom surface of the heat dissipation rib 20 faces upward in fig. 13 to 14) (refer to fig. 41, and fig. 41 shows a schematic diagram of the circuit board 10 placed in the mold to form the molding cavity in step S30 in another embodiment of the present application). The gap 39 may be 0.1mm (other values are possible, for example 0.06mm, typically no more than 0.1 mm). Further, fig. 42 shows a schematic view of another embodiment of the present application in which a liquid molding material is injected into a molding cavity and molded into the package 30. Because of the possible lack of consistency of the incoming molding material, the problem of uneven bottom surface of the molding is sometimes encountered if the back encapsulant is to be directly made flush with the bottom surface and the heat sink ribs during molding. The back molding part covers the bottom surface of the heat dissipation rib, so that a bottom surface completely made of molding materials can be obtained, the bottom surface has high flatness, the process difficulty is reduced, the requirement on the quality of the molding materials can be reduced, the product yield is improved, and the production cost is reduced. Further, in an embodiment of the present application, when the back mold covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board may be further reduced to 0.25mm or less than 0.25 mm.
In step S40, a photosensitive chip and other components (such as electronic components, metal wires, a mirror base, and a color filter) are mounted on the first surface (i.e., the front surface) of the circuit board, thereby manufacturing the photosensitive assembly. Wherein, the photosensitive chip can be pasted on the chip attaching area of the first surface.
Further, in an embodiment, in the step S20, the heat dissipation rib may be directly formed on the second surface of the circuit board. For example, the circuit board may have a seed layer, and the metal layer is implanted on the seed layer so that the metal layer grows and exceeds the second surface, thereby forming the heat dissipation rib. For another example, in a modified embodiment, the second surface may be coated with a thermally conductive colloidal substance, and then the thermally conductive colloidal substance is hardened to form the heat dissipation rib.
Further, in another embodiment, the heat dissipation rib may be pre-formed and then attached to the second surface of the heat dissipation rib by welding or bonding.
In the above embodiments, the heat dissipation ribs are first fabricated and then molded to form the back side package portion. The present application is not so limited. For example, in another embodiment of the present application, another manufacturing method of a photosensitive assembly is also provided, and different from the manufacturing method of the foregoing embodiment, in this embodiment, a back side packaging portion may be formed by molding on the back side of a circuit board, and then the heat dissipation rib is manufactured or attached to the second surface (i.e., the back side) of the circuit board. Specifically, in the present embodiment, the execution order of the step S30 and the step S20 is reversed, that is, the step S30 is executed first and then the step S20 is executed. In step S30, the back side package portion may be formed on the second surface by a molding process, and during the molding process, a through hole may be left in the back side package portion by using a ram (or a protruding structure of an upper mold), and the through hole exposes a portion of the second surface outside the back side package portion. Fig. 17 shows a schematic view of the mold cavity formed after mold clamping in step S30 according to an embodiment of the present application. Referring to fig. 17, the upper mold 91 has a plurality of downward protruding structures 93, the protruding structures 93 are against the second surface 15 of the circuit board 10, and a molding cavity surrounding the protruding structures 93 can be formed between the upper mold 91 and the circuit board 10. FIG. 18 shows a schematic view of the molded product in step S30 according to an embodiment of the present application. Referring to fig. 18, it can be seen that a liquid molding material is injected into the molding cavity and cured, resulting in a back side encapsulant 30. As can be seen in fig. 18, the back encapsulant 30 may surround the raised structures 93, or the back encapsulant 30 fills the gaps between the raised structures 93 and the mold. Further, fig. 19 shows a schematic diagram of the mold opening (also referred to as mold release) in step S30 according to an embodiment of the present application. Referring to fig. 19, after the mold is opened, the back side packaging part 30 is reserved with a through hole 31, and the through hole 31 may be in a long strip shape. Step S20 is performed on the obtained wiring board having the back surface package part 30. In step S20, the heat dissipation ribs are formed in the through holes of the back surface sealing part, so that the composite substrate shown in fig. 15 is obtained.
Still further, in one embodiment, after the steps S20 and S30, the following steps S31 and S32 may also be performed.
Step S31, a secondary packaging part is manufactured on the bottom surface of the back packaging part by a molding process, the secondary packaging part having a secondary through hole exposing the bottom surface of the heat dissipation rib and a bordering area of the bottom surface of the back packaging part around the heat dissipation rib. Fig. 20 is a schematic diagram illustrating the mold cavity formed after mold clamping in step S31 according to an embodiment of the present application. Referring to fig. 20, in the present embodiment, the upper mold 91 may have a plurality of downward protruding structures 93, and these protruding structures 93 are against the upper surface (note that, since the composite substrate is inverted in fig. 20, the upper surface is actually the back surface) of the composite substrate (which may be composed of the circuit board 10, the heat dissipation ribs 20, and the back surface sealing portion 30) obtained after steps S20 and S30 are completed, in the present embodiment, the composite substrate is still actually a semi-finished product), and a molding cavity surrounding the protruding structures 93 may be formed between the upper mold 91 and the composite substrate. FIG. 21 is a schematic view of the molded product in step S31 according to an embodiment of the present application. Referring to fig. 21, it can be seen that the injection of the liquid molding material into the molding cavity and the curing thereof can result in the secondary molded portion, i.e., the secondary encapsulation portion 32, which reserves the secondary through hole (shown in fig. 22). Further, fig. 22 shows a schematic diagram of the mold opening (also referred to as mold release) in step S31 according to an embodiment of the present application. Referring to fig. 22, after the mold is opened, a composite substrate having a secondary packaging part 32 can be obtained. The secondary package 32 has a secondary through hole 33, and the secondary through hole 33 exposes the bottom surface of the heat-dissipating rib 20 (facing upward in fig. 22) and an adjoining area 34 of the bottom surface of the back package at the periphery of the heat-dissipating rib 20.
Step S32, fabricating a heat dissipation extension in the secondary through hole, and obtaining a composite substrate with the heat dissipation extension. FIG. 23 illustrates a composite substrate with heat dissipating extensions in one embodiment of the present application. The composite substrate can be used to fabricate a photosensitive assembly as shown in fig. 8. Referring to fig. 8 and 23, the top surface of the heat dissipation extension 22 is connected to the bottom surface of the heat dissipation rib 20, and the bottom surface of the heat dissipation extension 22 is flush with the bottom surface of the secondary packaging part 32 (note that the bottom surface is placed upward in fig. 23). The heat dissipation extension 22 is made by implanting a metal layer or pouring a thermally conductive colloidal substance and hardening it, or by bonding or welding a molded member.
Further, in an embodiment of the present application, the step S40 may further include: at least a portion of the electronic component is mounted on the second surface of the wiring board. The step of mounting the electronic component on the second surface may be performed prior to the step S30. Thus, in step S30, the backside encapsulation layer may cover the electronic component mounted on the second surface (or fill the gap around the electronic component) to achieve the encapsulation effect.
Further, in an embodiment, the step S40 may further include: and manufacturing a front molding part on the first surface of the circuit board, wherein the front molding part is manufactured on the first surface and surrounds the photosensitive chip through a molding process, and the top surface of the front molding part is suitable for mounting a lens component.
Further, in one embodiment, in step S30, the back packaging part is a back molding part, and the front molding part and the back molding part may be simultaneously molded on the circuit board by the same molding process. This will help to promote production efficiency and save costs.
Further, in one embodiment, in step S10, the prepared circuit board may be a circuit board panel formed by connecting a plurality of single circuit boards together. Fig. 16A shows a circuit board panel having connector portions. The circuit board splicing plate can be a soft and hard combined plate. Fig. 16B shows a circuit board panel without a connector portion. The circuit board panel can be a PCB or a hard board. Further, in this embodiment, in the step S20, the heat dissipation ribs are formed on the second surface (i.e., the back surface) of the circuit board jointed board. Namely, the heat dissipation ribs corresponding to the plurality of single circuit boards are manufactured at one time. In step S30, a back-sealing portion corresponding to the plurality of single circuit boards may be formed by one-time molding, and the back-sealing portion may be integrally connected to cover the second surface of the circuit board panels. In step S40, photosensitive chips may be respectively adhered (or otherwise mounted) on the first surfaces corresponding to the plurality of single circuit boards, so as to obtain a joined plate of photosensitive assemblies. Further, the method for manufacturing a photosensitive assembly of this embodiment further includes step S50: and cutting the spliced plate of the photosensitive assembly to obtain the separated single photosensitive assembly.
On the basis of the method for manufacturing the photosensitive assembly in the embodiment, the obtained photosensitive assembly can be further assembled with the lens assembly to obtain a complete camera module. The lens assembly may be a lens assembly with a motor or a lens assembly without a motor. The camera module obtained by assembly can be an automatic focusing camera module and also can be a fixed-focus camera module.
Further, fig. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to fig. 25, the camera module includes a lens assembly 3000 and a photosensitive assembly 2000. In this embodiment, the photosensitive assembly is added with a lens holder 2001 and a color filter 2002 mounted on the lens holder 2001 on the basis of the photosensitive assembly of the embodiment of fig. 1. The lens assembly 3000 may have a motor 3001, the bottom surface of which is mounted on the top surface of the lens holder.
Further, fig. 26 is a schematic cross-sectional view of a camera module according to another embodiment of the present application. The present embodiment is different from the embodiment of fig. 25 in that the electronic component 50 is mounted on the back surface of the wiring board 10, and the electronic component 50 is covered and wrapped by the back surface molding part 30.
Further, fig. 27 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 25 in that the heat dissipation extension 22 is added to the composite substrate of the photosensitive assembly 2000.
Further, fig. 28 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. This embodiment differs from the embodiment of fig. 25 in that the back molding portion is eliminated in the composite substrate of the photosensitive member.
Further, fig. 29 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 28 in that a front surface molding portion 2003 is formed on the upper surface of the wiring board 10 of the photosensitive member 2000. The motor bottom surface may be mounted on the top surface of the front molding 2003, the mirror mount 2001 (corresponding to the lens holder in the first several embodiments) is used only for mounting the color filter 2002, and the mirror mount 2001 is located on the inner side of the front molding 2003, the outer side of the electronic component 50.
Further, fig. 30 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 28 in that a front molding portion 2003 is formed on the upper surface of the wiring board 10 of the photosensitive member 2000. The lens holder 2001 is mounted on the top surface of the front molding portion 2003, the color filter 2002 is mounted on the lens holder 2001, and the lens assembly 3000 (the bottom surface of the motor) is mounted on the top surface of the lens holder 2001.
Further, fig. 31 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. This embodiment is different from the embodiment of fig. 30 in that the front surface molding portion 2003 covers the electronic component 50 and the metal wires and contacts the photosensitive chip 40. In this embodiment, the front surface molding portion 2003 may cover an edge area of the photosensitive chip, and the edge area may be a non-photosensitive area.
Further, according to an embodiment of the present application, there is also provided an electronic apparatus having the camera module according to any one of the foregoing embodiments. The electronic device may be, for example, a smartphone, a tablet computer, or the like.
Further, according to an embodiment of the present application, a method for manufacturing a composite substrate based on a jigsaw puzzle is also provided, which includes steps S1000-S4000.
Step S1000, a circuit board splicing plate is prepared. Fig. 32A shows a circuit board panel in an embodiment of the present application. Referring to fig. 32A, in the present embodiment, the circuit board panel 1 includes a plurality of circuit board units 2 connected together. Circuit board makeup 1 has the first surface and with the second surface opposite of first surface, wherein the first surface has a plurality of chip that are used for attached sensitization chip and pastes the district, and every circuit board unit 2 all has one the chip pastes the district, circuit board unit 2 is array distribution. The circuit board units 2 and the frame 3 of the circuit board jigsaw can be separated by insulating regions 4, as shown in fig. 32A. Referring to fig. 32A, the circuit board panel 1 is a rigid-flex board, wherein the rigid board part can form a circuit board main body 2A, and the flexible board part corresponds to a flexible connecting strip 2b and a connector 2c corresponding to the flexible connecting strip (note that the connector itself is not flexible). The board main body 2a, the flexible connection tape 2b, and the connector 2c together constitute one board unit 2. In this embodiment, there may be non-insulating regions 5 between adjacent board elements 2, in order to avoid the continuous width of the insulating regions 4 between adjacent board elements being too large. Since the wiring board is generally a printed wiring board, it is formed by laminating a plurality of conductive layers and insulating layers. The insulating regions 4 in fig. 32A are typically formed by etching away conductive material (e.g., copper material) of the conductive layer. Therefore, the insulation region of the circuit board panels may be thinner, and in order to prevent the high temperature molding flow in the subsequent molding step from damaging the thinner insulation region, in this embodiment, a non-insulation region 5 is further provided between the adjacent circuit board units 2. The non-insulating region 5 may also be understood as a non-etched region that may preserve greater thickness and structural strength to the panel. Of course, the circuit board panels are not limited to the configuration of fig. 32A, for example, fig. 32B shows another embodiment of the circuit board panel of the present application. Referring to fig. 32B, the insulation region 4 between adjacent board elements 2 in the board panel 1 may have a smaller width, so that the non-insulation region 5 between adjacent board elements 2 may be omitted. Further, fig. 32C shows a circuit board panel in yet another embodiment of the present application. In this embodiment, the circuit board panels are rigid boards, i.e., do not include flexible board portions. In the present embodiment, the circuit board unit 2 only includes a portion of the circuit board main body (for convenience of description, the circuit board main body is directly referred to as a circuit board), and the flexible connecting tape and the connector may be connected to the circuit board by a bonding process after the individual circuit board is obtained by cutting. Further, fig. 32D shows a circuit board panel in yet another embodiment of the present application. In this embodiment, no insulating region 4 is disposed between the circuit board units 2, and the insulating region 4 is only disposed between the circuit board units 2 and the frame 3 of the circuit board panel 1. The space utilization of circuit board makeup can be promoted to this embodiment, helps saving circuit board material.
Step S2000, at least one strip-shaped heat dissipation rib is arranged on the second surface. Fig. 33 is a schematic bottom view of a circuit board panel and a plurality of heat dissipating ribs according to an embodiment of the present disclosure. Referring to fig. 33, each of the strip-shaped heat dissipation ribs 6 extends to each of the circuit board units 2 in the same row, and at least a part of the strip-shaped heat dissipation ribs 2 passes through an overlapping area of the back surface of the chip attachment region (the chip attachment region is not shown in fig. 33). In this embodiment, the plurality of strip-shaped heat dissipation ribs 6 are arranged in parallel. In this step, the strip-shaped heat dissipation ribs may be disposed by growing a metal layer on the seed layer, may be disposed by attaching a preformed heat dissipation rib to the second surface, or may be disposed by coating a heat conductive silicone grease on the second surface and curing the heat conductive silicone grease. The strip-shaped heat dissipation ribs support the makeup circuit board, the whole strength of the makeup of the circuit board is enhanced, and when the temperature is raised in the subsequent manufacturing process (baking and molding process), the warping amount of the makeup of the circuit board can be reduced as much as possible, so that the flatness of the makeup of the circuit board is improved, and the flatness of chip installation is ensured.
Step S3000, forming a back molding portion on the second surface by a molding process, wherein a bottom surface of the back molding portion is flush with a bottom surface of the strip-shaped heat dissipation rib and forms a flat surface together. Further, in one embodiment, this step may be broken down into sub-steps S3100-S3300 described below.
In substep S3100, the upper mold and the lower mold are clamped. Fig. 34A shows a cross-sectional view of a closed circuit board panel in an embodiment of the present application. Referring to fig. 34A, the upper mold 8a is pressed on the pressing edge 7 of the second surface of the circuit board assembly 1 (i.e. the upper mold 8a can be pressed on the edge area of the second surface of the circuit board assembly to form the pressing edge 7), the lower mold 8b is pressed on the first surface of the circuit board assembly 1, and the inner surface of the upper mold 8a presses the strip-shaped heat dissipation rib 6, so that a molding cavity is formed among the second surface, the strip-shaped heat dissipation rib 6, and the upper mold 8 a. Furthermore, the strip-shaped heat dissipation ribs 6 have a direction that: and forming a flow channel of a molding flow among the strip-shaped heat dissipation ribs and/or between the strip-shaped heat dissipation ribs and a mold for the molding process. The design of the heat dissipation ribs can facilitate the flow of high-temperature molding flow, and avoid the phenomenon of 'short injection' of some circuit board units (such as those far away from the injection port of the molding flow), thereby ensuring the product yield. Fig. 34B is a cross-sectional view of a closed circuit board panel according to another embodiment of the present application. In this embodiment, a strip-shaped heat dissipation rib 6 is disposed in the edge region where the circuit board main body 2a and the flexible connection band 2b are connected, so that the upper mold 8a compresses the strip-shaped heat dissipation rib 6 located in the edge region, thereby avoiding leakage of the liquid molding material, and at this time, the upper mold 8a may not press against the circuit board main body 2a, thereby omitting the pressing edge 7 in fig. 34A. This will help reducing the size of the composite substrate, and then reduce the size of the photosensitive assembly and the camera module. Note that the panel molding of the present application is not limited to the case of fig. 34A and 34B, for example, in another embodiment, the inner surface of the upper mold 8a may have a gap (similar to the gap 39 in fig. 41) between the bottom surface of the bar-shaped heat dissipation rib 6 (the bottom surface of the bar-shaped heat dissipation rib 6 in fig. 34A is located above because the circuit board in fig. 34A is upside down). Thus, the molding portion can cover both the second bottom surface (back surface) of the circuit board and the strip-shaped heat dissipation ribs 6. Further, the gap between the bottom surface of the strip-shaped heat dissipation rib 6 and the inner surface of the upper mold 8a may be 0.1mm (or may be other values, such as 0.06mm, and is generally not greater than 0.1 mm). Because of the possible lack of consistency of the incoming molding material, the problem of uneven bottom surface of the molding is sometimes encountered if the back encapsulant is to be directly made flush with the bottom surface and the heat sink ribs during molding. The back molding part covers the bottom surface of the heat dissipation rib, so that a bottom surface completely made of molding materials can be obtained, the bottom surface has high flatness, the process difficulty is reduced, the requirement on the quality of the molding materials can be reduced, the product yield is improved, and the production cost is reduced. Further, in an embodiment of the present application, when the back mold covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board may be further reduced to 0.25mm or less than 0.25 mm.
And a substep S3200, injecting a liquid molding flow into the molding cavity, wherein the injection direction of the molding flow is consistent with the arrangement direction of the row of circuit board units. Fig. 35 shows the molding material flow direction in one embodiment of the present application. The arrow direction represents the flowing direction of the liquid molding flow, and it can be seen that the flowing direction is consistent with the arrangement direction of the circuit board units 2 in the same row and is also consistent with the trend of the strip-shaped heat dissipation ribs 6. The orientation of the strip-shaped heat dissipation rib 6 can be understood as the orientation of the axis of the strip-shaped heat dissipation rib 6.
And a substep S3300 of curing the injected liquid molding material to obtain the back molding part. Fig. 36 is a schematic bottom view of a composite substrate panel formed after back molding in accordance with an embodiment of the present application. Referring to fig. 36, after the molding is completed, the back mold 9 is attached to the second surface and fills the gaps between the plurality of parallel strip-shaped heat dissipation ribs 6. After sub-step S3300 is completed, the following step S4000 may be performed.
And step S4000, cutting along the boundary of the circuit board unit to obtain a single composite substrate. FIG. 37 is a schematic view of a cut composite substrate panel in one embodiment of the present application. The dashed lines in the figure represent cut lines. The cutting may be mechanical knife cutting, laser cutting, or any other suitable cutting method. In this step, the circuit board panels, the back molding portions, and the strip-shaped heat dissipation ribs may be cut together to separate the single composite substrate.
Further, fig. 38A is a perspective view of a single composite substrate made of the above panels according to an embodiment of the present application. Fig. 38B shows an exploded view of fig. 38A. For clarity of illustration, fig. 38A and 38B are both backside up, i.e., the bottom surface of the composite substrate is placed up. Referring to fig. 38A and 38B, in the present embodiment, the composite substrate includes a circuit board 2 (in the present embodiment, the circuit board 2 corresponds to a circuit board unit in an original jigsaw puzzle), heat dissipation ribs 6, and a back molding portion 9. The circuit board 2 has a first surface and a second surface 2h opposite to the first surface, and has a first side surface 2d and a second side surface 2e opposite to the first side surface 2d, wherein the first surface has a chip attaching region for attaching a photosensitive chip. Heat dissipation muscle 6 set up in the second surface 2h of circuit board, at least a part of heat dissipation muscle 6 be located with the region that the attached district of chip overlaps, heat dissipation muscle 6 is strip heat dissipation muscle, and at least one terminal surface of strip heat dissipation muscle extends to first side 2d or second side 2 e. The back molding part 9 is formed on the second surface 2h by a molding process, and the bottom surface of the back molding part 9 is flush with the bottom surface of the heat dissipation rib 6 and forms a flat surface together (note that the bottom surface in fig. 38A and 38B is placed upward). Further, at least one end surface 6a of the strip-shaped heat dissipation rib is a cut surface, and the cut surface is exposed on the side surface of the back molding part. Referring to fig. 37 in combination, it can be understood that when one composite substrate unit is located in the edge region of the composite substrate panel, for example, the composite substrate unit is the first composite substrate unit or the last composite substrate unit in the same row, each strip-shaped heat dissipation rib may have only one end surface as a cut surface in the corresponding cut composite substrate. When one composite substrate unit is located in the middle region of the composite substrate jointed board, that is, the composite substrate unit is the composite substrate unit located in the middle of the same row, then, in the cut corresponding composite substrate, both end surfaces 6a and 6B of each strip-shaped heat dissipation rib are cut surfaces (refer to fig. 38B).
Still referring to fig. 38A and 38B, in an embodiment of the present application, the bar-shaped heat dissipation rib has two end surfaces, and the two end surfaces 6a and 6B extend to the first side surface 2d and the second side surface 2e, respectively. Both end faces 6a, 6b are cut surfaces. The heat dissipation ribs 6 comprise a plurality of strip-shaped heat dissipation ribs, and the trend of the plurality of strip-shaped heat dissipation ribs is suitable for forming runners of molding flows among the plurality of strip-shaped heat dissipation ribs and between the strip-shaped heat dissipation ribs and a mold used for the molding process. The strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs. The linear strip-shaped heat dissipation ribs are arranged in parallel. The direction of injection of the molding flow in the molding process is a first direction from the first side surface 6a to the second side surface 6b, or a second direction opposite to the first direction. The linear strip-shaped heat dissipation rib may be parallel to the molding flow injection direction.
Further, still referring to fig. 38A and 38B, in one embodiment of the present application, the wiring board further has a third side face 2f perpendicular to the first side face 2d, and a fourth side face 2g opposite to the third side face 2 f. The axis of the linear strip-shaped heat dissipation rib may be parallel to the third side surface 2f or the fourth side surface 2g, or the axis of the linear strip-shaped heat dissipation rib may form an included angle of 45 degrees or less with the third side surface 2f or the fourth side surface 2 g. And, an edge region of the second surface 2h along the third side 2f and the fourth side 2g may have a press-fit edge for a molding process. Note that the stitched edge is not shown in fig. 38A and 38B, and is an exposed edge region of the second surface, which is not covered by the back mold 7. The press edge is generally an area uncovered by the molding part, which is formed by directly pressing the mold on the second surface (i.e. the surface to which the molding part is attached) of the circuit board in the molding process.
Further, in one embodiment of the present application, the heat dissipation ribs are made of a material having a thermal conductivity of 10 to 1000w/(m · degree). The heat dissipation rib can be made of metal, metal alloy or heat conduction silicone grease.
Further, in an embodiment of the present application, there is also provided a method for manufacturing a photosensitive assembly, where the method may include: manufacturing a composite substrate according to the steps S1000-S4000; and
and S5000, attaching a photosensitive chip to the chip attaching area corresponding to the photosensitive chip, and electrically connecting the photosensitive chip and the circuit board unit corresponding to the photosensitive chip through a lead bonding process.
And step S6000, mounting a formed lens base on the first surface of the circuit board unit, wherein the lens base surrounds the photosensitive chip.
In another embodiment of the present application, step S6000 may be replaced with step S6001.
Step S6001, a front surface molding portion is formed on the first surface of the wiring board unit by a molding process, and the front surface molding portion forms a light window around the photosensitive chip. FIG. 39 is a schematic front view of a panel of light sensing assemblies in an embodiment of the present application. In fig. 39, the first surface of the circuit board panel has been molded with front molding portion 9 a. The front molding 9a forms a light window 9b around the photosensitive chip. The front surface molding portion 9a may be based on MOC process or MOB process. The MOC process and the MOB process can refer to the above description, and are not described herein again.
It should be noted that the foregoing step S4000 may be performed before the steps S5000 and S6000 (or step S6001), that is, a single composite substrate is cut out, and then the photosensitive assembly is manufactured based on the single composite substrate. Step S4000 may also be performed after step S5000 and step S6000 (or step S6001), i.e., a photosensitive component jointed board is first manufactured based on the composite substrate jointed board, and then the composite substrate jointed board is cut to obtain a single photosensitive component. For the following scheme, in step S4000, the circuit board assembly, the back surface molding portion, the strip-shaped heat dissipation rib, and the front surface molding portion may be cut together to separate a single photosensitive assembly. The scheme of firstly manufacturing the photosensitive assembly jointed board based on the composite substrate jointed board and then cutting can be beneficial to improving the production efficiency of the photosensitive assembly.
Further, in an embodiment of the present application, a photosensitive assembly manufactured based on a jointed board is also provided, and the photosensitive assembly includes a composite substrate, a photosensitive chip, and a metal wire. The composite substrate is any of the composite substrates manufactured based on the jointed boards. The bottom surface of the photosensitive chip is attached to the chip attaching area of the composite substrate. And the metal wire electrically connects the photosensitive chip and the circuit board through a lead bonding process. The photosensitive assembly can further comprise a front molding part which is manufactured on the first surface and surrounds the photosensitive chip to form a light window. The photosensitive assembly may further include an electronic component mounted on the first surface, and the front molding portion wraps the electronic component. The front molding part may contact the photosensitive chip and cover an edge area of the photosensitive chip, i.e., may be fabricated based on an MOC process. The front molding part may also have a space with the photosensitive chip, i.e., may be fabricated based on a MOB process.
Further, in an embodiment of the present application, a camera module is further provided, where the camera module includes a photosensitive component manufactured based on a jointed board, and a lens component. The lens assembly is mounted on the top of the photosensitive assembly. The photosensitive element manufactured based on the jointed board can refer to the embodiments described above, and the details are not repeated herein.
Herein, the heat dissipation ribs may be understood as: the reinforcing rib has the function of heat dissipation.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (30)
1. The utility model provides a composite substrate, its module that makes a video recording that is used for, its characterized in that includes:
the circuit board is provided with a first surface, a second surface opposite to the first surface, a first side surface and a second side surface opposite to the first side surface, wherein the first surface is provided with a chip attaching area for attaching a photosensitive chip;
the heat dissipation rib is arranged on the second surface of the circuit board, at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area, the heat dissipation rib is a strip-shaped heat dissipation rib, and at least one end face of the strip-shaped heat dissipation rib extends to the first side face or the second side face; and
and the back molding part is manufactured on the second surface through a molding process and is integrated with the heat dissipation rib.
2. The composite substrate as claimed in claim 1, wherein at least one end surface of the strip-shaped heat dissipation rib is a cut surface.
3. The composite substrate as claimed in claim 1, wherein the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces extend to the first side surface and the second side surface respectively.
4. The composite substrate of claim 3, wherein both of the end faces are cut faces.
5. The composite substrate of claim 1, wherein the heat sink ribs comprise a plurality of strip-shaped heat sink ribs oriented to form runners for molding flow between the plurality of strip-shaped heat sink ribs and between the strip-shaped heat sink ribs and a mold used in the molding process.
6. The composite substrate of claim 5, wherein the strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs.
7. The composite substrate as claimed in claim 6, wherein the linear-shaped heat dissipating ribs are arranged in parallel.
8. The composite substrate of claim 5, wherein the mold flow injection direction in the molding process is a first direction from the first side to the second side or a second direction opposite the first direction.
9. The composite substrate of claim 8, wherein the strip-shaped heat sink ribs are parallel to the molding flow injection direction.
10. The composite substrate of claim 6, wherein the wiring board further has a third side perpendicular to the first side, and a fourth side opposite the third side; the axis of the linear strip-shaped heat dissipation rib is parallel to the third side face or the fourth side face, or the angle between the axis of the linear strip-shaped heat dissipation rib and the third side face or the fourth side face is less than 45 degrees; and an edge region of the second surface along the third side and the fourth side has a press edge for a molding process.
11. The composite substrate of claim 1, wherein the heat dissipation ribs are made of a material having a thermal conductivity of 10-1000w/(m · degree), and the heat dissipation ribs are made of a metal, a metal alloy, or a thermally conductive silicone grease.
12. The composite substrate of claim 1, wherein the back mold has a thickness of no greater than 0.2mm and the heat sink ribs have a thickness of no greater than 0.1 mm.
13. A photosensitive assembly, comprising:
the composite substrate of any one of claims 1-12;
the bottom surface of the photosensitive chip is attached to the chip attaching area; and
and the metal wire is used for electrically connecting the photosensitive chip with the circuit board through a wire bonding process.
14. The photosensitive assembly of claim 13, further comprising a lens holder attached to the first surface and surrounding the photosensitive chip to form an optical window.
15. A photosensitive assembly according to claim 14, further comprising an electronic component mounted to the first surface, and wherein the front molding encapsulates the electronic component.
16. The photosensitive assembly of claim 14, further comprising a front molding formed on the first surface and surrounding the photosensitive chip to form a light window, the front molding contacting the photosensitive chip and covering an edge region of the photosensitive chip.
17. The photosensitive assembly of claim 14, further comprising a front molding formed on the first surface and surrounding the photosensitive chip to form a light window, the front molding being spaced apart from the photosensitive chip.
18. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of any one of claims 13-17; and
the lens assembly is arranged at the top of the photosensitive assembly.
19. A method for manufacturing a composite substrate is characterized by comprising the following steps:
1) preparing a circuit board jointed board, wherein the circuit board jointed board comprises a plurality of circuit board units which are connected into a whole, the circuit board jointed board is provided with a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of chip attaching areas for attaching photosensitive chips, each circuit board unit is provided with one chip attaching area, and the circuit board units are distributed in an array;
2) arranging at least one strip-shaped heat dissipation rib on the second surface, wherein each strip-shaped heat dissipation rib extends to each circuit board unit in the same row, and at least one part of the strip-shaped heat dissipation ribs pass through an overlapping area of the back surface of the chip attaching area;
3) forming a back molding part on the second surface by a molding process, wherein the bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation rib and forms a flat surface together; and
4) and cutting along the boundary of the circuit board unit to obtain the single composite substrate.
20. The method for manufacturing a composite substrate according to claim 19, wherein in the step 2), the strip-shaped heat dissipation ribs are oriented to form a runner of a molding flow between a plurality of the strip-shaped heat dissipation ribs and/or between the strip-shaped heat dissipation ribs and a mold used in the molding process.
21. The method for manufacturing a composite substrate according to claim 20, wherein in the step 1), the circuit board jointed board is provided with a seed layer; in the step 2), the strip-shaped heat dissipation ribs are arranged in a manner that a metal layer grows on the basis of the seed layer.
22. The method for manufacturing a composite substrate according to claim 20, wherein in the step 2), the strip-shaped heat dissipation ribs are arranged by attaching pre-formed heat dissipation ribs to the second surface.
23. The method for manufacturing a composite substrate according to claim 20, wherein in the step 2), the strip-shaped heat dissipation ribs are arranged by coating and curing heat conductive silicone grease on the second surface.
24. A method of fabricating a composite substrate according to claim 20, wherein the step 3) comprises the sub-steps of:
31) closing an upper die and a lower die, wherein the upper die is pressed on the second surface, the lower die is pressed on the first surface, and the inner surface of the upper die presses the strip-shaped heat dissipation rib, so that a molding cavity is formed among the second surface, the strip-shaped heat dissipation rib and the upper die;
32) injecting a liquid molding flow into the molding cavity, wherein the injection direction of the molding flow is consistent with the arrangement direction of the row of circuit board units; and
33) the injected liquid molding material is cured to obtain the back molding part.
25. The method as claimed in claim 24, wherein in step 31), the upper mold is pressed against an edge region of the second surface of the circuit board panel.
26. The method for manufacturing a composite substrate according to claim 24, wherein in step 1), the circuit board units and the frames of the circuit board panels are separated by insulating regions;
and in the step 4), cutting the circuit board jointed board, the back molding part and the strip-shaped heat dissipation ribs together to separate the single composite substrate.
27. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps:
fabricating a composite substrate according to the method of fabricating a composite substrate of any one of claims 19 to 26;
the manufacturing method of the photosensitive assembly further comprises the following steps:
5) and attaching the photosensitive chip to the chip attaching area corresponding to the photosensitive chip, and electrically connecting the photosensitive chip and the circuit board unit corresponding to the photosensitive chip through a lead bonding process.
28. The method of fabricating a photosensitive assembly of claim 27, further comprising:
6) and mounting a molded lens base on the first surface of the circuit board unit, wherein the lens base surrounds the photosensitive chip.
29. The method of fabricating a photosensitive assembly of claim 27, further comprising:
6) a front molding part is formed on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip.
30. The method of claim 29, wherein step 4) is performed after step 6), and in step 4), the circuit board panels, the back surface molding portion, the strip-shaped heat dissipation ribs and the front surface molding portion are cut together to separate the individual photosensitive elements.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695388.4A CN112333350A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
| PCT/CN2020/100163 WO2021017752A1 (en) | 2019-07-30 | 2020-07-03 | Camera module, electronic device, composite substrate, photosensitive assembly and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695388.4A CN112333350A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112333350A true CN112333350A (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910695388.4A Pending CN112333350A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN112333350A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023004790A1 (en) * | 2021-07-30 | 2023-02-02 | 华为技术有限公司 | Optical chip and manufacturing method therefor, and electronic device |
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
-
2019
- 2019-07-30 CN CN201910695388.4A patent/CN112333350A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023004790A1 (en) * | 2021-07-30 | 2023-02-02 | 华为技术有限公司 | Optical chip and manufacturing method therefor, and electronic device |
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
| CN116504733B (en) * | 2023-06-28 | 2023-09-15 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
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