CN107911587B - Camera module packaging process and structure - Google Patents
Camera module packaging process and structure Download PDFInfo
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- CN107911587B CN107911587B CN201711224388.3A CN201711224388A CN107911587B CN 107911587 B CN107911587 B CN 107911587B CN 201711224388 A CN201711224388 A CN 201711224388A CN 107911587 B CN107911587 B CN 107911587B
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- chip
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- camera module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a camera module packaging process and a structure, wherein the packaging process comprises the following steps: packaging an optical filter on a light sensing area of the light sensing chip; connecting the photosensitive chip and the component to the module substrate; the module substrate is injected with an annular plastic packaging layer, the components are wrapped in the annular plastic packaging layer, and the photosensitive chip and the optical filter are wrapped in the module substrate from the circumferential direction; carrying a lens on the annular plastic packaging layer; the process is an improvement on the prior CSP process, and the light sensitive chip is directly packaged by using the light filter at the beginning of the process, so that the pollution of the light sensitive area of the light sensitive chip in the subsequent process is avoided, an additional packaging structure is not required, the process is simpler, and the adverse effect of the packaging structure on the image effect is avoided, thereby achieving the purposes of facilitating the process control and improving the yield.
Description
Technical Field
The invention relates to the technical field of camera module packaging, in particular to a camera module packaging process and structure.
Background
At present, two main manufacturing processes are available for the camera module, one is a COB process, the process adopts a bare chip packaging mode, the bare chip is fragile and easy to pollute, the manufacturing process is very difficult to control, the production yield is low, and therefore batch production is difficult to realize really at present; the other is the CSP process, which adds a packaging layer on the bare chip, but because light penetrates the packaging layer to cause slight refraction, reflection and energy loss, the imaging effect is not good as that of a module manufactured by the COB process of the bare chip.
Therefore, how to improve the current module manufacturing process to reduce the risk of bare chip contamination, so as to facilitate process control, improve yield, and ensure the image effect of the camera module becomes an important technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, a first objective of the present invention is to provide a camera module packaging process, so that the camera module packaging process can reduce the risk of bare chips being contaminated, facilitate process control, improve yield, and ensure the effect of the camera module.
In order to achieve the purpose, the invention provides the following technical scheme:
a camera module packaging process comprises the following steps:
packaging an optical filter on a light sensing area of the light sensing chip;
connecting the photosensitive chip and the component to a module substrate;
an annular plastic package layer is injected on the module substrate, the components are wrapped inside, and the photosensitive chip and the optical filter are wrapped on the periphery;
and carrying a lens on the annular plastic packaging layer.
Preferably, the photosensitive chip is soldered to the module substrate through a bottom solder layer.
Preferably, the bottom soldering layer comprises a pad or a plurality of solder balls.
Preferably, the upper surface of the annular plastic package layer is not lower than the upper surface of the optical filter.
Preferably, the filter is a high temperature resistant blue glass filter.
Preferably, the optical filter is attached to the photosensitive area of the photosensitive chip through an adhesive layer, the cross section of the adhesive layer is L-shaped, the part of the adhesive layer perpendicular to the photosensitive chip is attached to the side wall of the photosensitive chip, and the part of the adhesive layer parallel to the photosensitive chip is located between the photosensitive chip and the optical filter.
Preferably, the annular injection molded layer is made of epoxy resin.
Preferably, the module substrate is a flexible printed circuit, a rigid printed circuit, or a flexible-rigid printed circuit.
A camera module packaging structure comprises a module substrate, a photosensitive chip, a component, an annular plastic package layer, an optical filter and a lens, wherein the optical filter is packaged on the photosensitive chip, the component is wrapped by the annular plastic package layer, the photosensitive chip and the optical filter are wrapped by the annular plastic package layer in the circumferential direction, the lens is carried on the annular plastic package layer, and the photosensitive chip is connected with the module substrate through a bottom welding layer.
In order to achieve the first object, the present invention provides a process for packaging a camera module, comprising the steps of: packaging an optical filter on a light sensing area of the light sensing chip; connecting the photosensitive chip and the component to the module substrate; the module substrate is injected with an annular plastic packaging layer, the components are wrapped in the annular plastic packaging layer, and the photosensitive chip and the optical filter are wrapped in the module substrate from the circumferential direction; carrying a lens on the annular plastic packaging layer; the process is an improvement on the prior CSP process, and the light sensitive chip is directly packaged by using the light filter at the beginning of the process, so that the pollution of the light sensitive area of the light sensitive chip in the subsequent process is avoided, an additional packaging structure is not required, the process is simpler, and the adverse effect of the packaging structure on the image effect is avoided, thereby achieving the purposes of facilitating the process control and improving the yield.
In order to achieve the second object, the present invention further provides a camera module packaging structure, which adopts the camera module packaging process, and the camera module packaging process has the technical effects, so that the camera module packaging structure manufactured by the camera module packaging process also has corresponding technical effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a camera module packaging process according to an embodiment of the present invention after a light-sensing chip is attached to an optical filter;
fig. 2 is a schematic structural diagram of a camera module packaging process according to an embodiment of the present invention after a sensor chip is mounted on a module substrate;
fig. 3 is a schematic structural diagram of the camera module packaging process according to the embodiment of the present invention after injection molding into an annular molding layer;
fig. 4 is a schematic structural diagram of a completed camera module packaging process according to an embodiment of the present invention.
In the figure:
1 is a photosensitive chip; 2 is an optical filter; 3 is a sticking layer; 4 is a packaging bottom plate; 5 is a solder ball; 6 is a component; 7 is a module substrate; 8 is an annular plastic packaging layer; and 9 is a lens.
Detailed Description
A first object of the present invention is to provide a camera module package structure, which can reduce the risk of contamination of a bare chip, so as to facilitate process control, improve yield, and ensure the effect of a camera module.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, fig. 1 is a schematic structural diagram of a camera module provided in an embodiment of the present invention after a light sensing chip is attached to an optical filter, fig. 2 is a schematic structural diagram of the camera module provided in the embodiment of the present invention after the light sensing chip is mounted on a module substrate, fig. 3 is a schematic structural diagram of the camera module provided in the embodiment of the present invention after being injection-molded into an annular molding layer, and fig. 4 is a schematic structural diagram of the camera module provided in the embodiment of the present invention after being completed in the camera module packaging process.
The embodiment of the invention provides a camera module packaging structure, which comprises the following steps:
s101: packaging an optical filter 2 on a light sensing area of the light sensing chip 1;
s102: connecting the photosensitive chip 1 and the component 6 to the module substrate 7;
s103: an annular plastic package layer 8 is injected on the module substrate 7, the component 6 is wrapped in the annular plastic package layer, and the photosensitive chip 1 and the optical filter 2 are wrapped on the periphery of the component 6;
s104: a lens 9 is mounted on the annular plastic package layer 8.
Compared with the prior art, the camera module packaging process provided by the invention is an improvement on the original CSP process, and the optical filter 2 is directly used for packaging the photosensitive chip 1 at the beginning of the process, so that the pollution of the photosensitive area of the photosensitive chip 1 in the subsequent process is avoided, an additional packaging structure is not required, the process is simpler, and the adverse effect of the packaging structure on the image effect is avoided, so that the purposes of facilitating the process control and improving the yield are achieved.
The photosensitive chip 1 can be bound on the module substrate 7 through the gold thread, however, in the fixing mode, the binding gold thread is positioned on the side surface of the photosensitive chip 1, so that the gap between the photosensitive chip 1 and other components 6 is increased, and the miniaturization of the whole camera module is not facilitated, therefore, in the embodiment of the invention, the photosensitive chip 1 is welded to the module substrate 7 through the bottom welding layer, so that the space occupied by the photosensitive chip 1 is reduced, and the camera module is smaller in size.
Specifically, as shown in fig. 1, the bottom solder layer includes a plurality of solder balls 5 connected to the bottom of the photosensitive chip 1 through the package substrate 4, and further, the bottom solder layer may also be a pad disposed at the bottom of the package substrate 4, so as to reduce the height of the solder balls and further reduce the volume of the camera module.
Preferably, in order to facilitate the installation of the lens 9, in the embodiment of the present invention, the upper surface of the annular molding layer 8 is not lower than the upper surface of the optical filter 2.
In order to avoid the high temperature influence of the injection molding process from damaging the optical filter 2, in the embodiment of the present invention, the optical filter 2 is a high temperature resistant blue glass optical filter 2.
Further optimize above-mentioned technical scheme, light filter 2 pastes in the sensitization district of sensitization chip 1 through pasting layer 3, the cross section of pasting layer 3 is the L shape, it pastes layer 3 and sensitization chip 1 vertically part and pastes the part that layer 3 and sensitization chip 1 are parallel in between sensitization chip 1 and light filter 2 in the lateral wall of sensitization chip 1, paste layer 3 and the cooperation of light filter 2 for L shape through this kind of cross section, can wrap up in and form the protective layer to 1 circumference edge of sensitization chip and upper surface, avoid the material of moulding plastics damage sensitization chip 1.
The annular injection molding layer can be made of any resin material capable of being melted by heat, and in the embodiment of the invention, the annular injection molding layer is made of epoxy resin.
Preferably, in the embodiment of the present invention, the module substrate 7 includes, but is not limited to, a flexible printed circuit, a rigid-flex printed circuit, or other types of printed circuit.
In the manufacturing process, the strength of the packaged photosensitive chip 1 is far greater than that of a bare chip of a COB (chip on Board) process, the bare chip can bear greater pressure in the plastic packaging process and is not easily crushed by an injection mold, the injection mold does not need to specially avoid a photosensitive area, a plane cavity is designed and is pressed on the surface of the optical filter 2, the injection mold is low in cost and high in production yield, development and volume production cost of the injection mold is low, and the optical filter is suitable for various types of photosensitive chips 1.
The utility model provides a module packaging structure makes a video recording, this module packaging structure makes a video recording adopts foretell module packaging technology of making a video recording to make, including module base plate 7, sensitization chip 1, components and parts 6, annular plastic envelope 8, light filter 2 and camera lens 9, light filter 2 encapsulates on sensitization chip 1, 8 parcel components and parts 6 of annular plastic envelope and from upwards wrapping up sensitization chip 1 and light filter 2 in circumference, camera lens 9 is carried on annular plastic envelope 8, sensitization chip 1 is connected with module base plate 7 through the bottom welding layer. Because the camera module packaging process has the technical effects, the camera module packaging structure manufactured by the process also has the corresponding technical effects.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The camera module packaging process is characterized by comprising the following steps:
the optical filter is packaged on a light sensing area of a light sensing chip, the optical filter is attached to the light sensing area of the light sensing chip through an adhesive layer, the cross section of the adhesive layer is L-shaped, the part of the adhesive layer, which is perpendicular to the light sensing chip, is attached to the side wall of the light sensing chip, and the part of the adhesive layer, which is parallel to the light sensing chip, is positioned between the light sensing chip and the optical filter;
connecting the photosensitive chip and the component to a module substrate;
an annular plastic package layer is injected on the module substrate, the components are wrapped inside, and the photosensitive chip and the optical filter are wrapped on the periphery;
and carrying a lens on the annular plastic packaging layer.
2. The camera module packaging process of claim 1, wherein the photosensitive chip is soldered to the module substrate by a bottom solder layer.
3. The process of packaging a camera module of claim 2, wherein the bottom solder layer comprises a solder pad or a plurality of solder balls.
4. The process for packaging a camera module according to any one of claims 1-3, wherein the upper surface of the annular plastic encapsulation layer is not lower than the upper surface of the optical filter.
5. The process for encapsulating a camera module according to any one of claims 1-3, wherein the filter is a high temperature resistant blue glass filter.
6. The process for encapsulating a camera module according to any one of claims 1 to 3, wherein the annular injection molding layer is made of epoxy resin.
7. The process for packaging a camera module according to any one of claims 1-3, wherein the module substrate is a flexible printed circuit, a rigid printed circuit, or a rigid-flex printed circuit.
8. The utility model provides a module packaging structure makes a video recording, its characterized in that, includes module base plate, sensitization chip, components and parts, annular plastic envelope, light filter and camera lens, the light filter through paste the layer subsides adorn in the sensitization district of sensitization chip, paste the layer with the light filter cooperation forms with the protective layer that the sensitization chip circumference edge and upper surface were wrapped up in with the sensitization chip with annular plastic envelope keeps apart, annular plastic envelope parcel components and parts and from upwards wrapping up in circumference sensitization chip and light filter, the camera lens is carried on annular plastic envelope, the sensitization chip pass through the bottom welding layer with the module base plate is connected.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711224388.3A CN107911587B (en) | 2017-11-29 | 2017-11-29 | Camera module packaging process and structure |
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| CN201711224388.3A CN107911587B (en) | 2017-11-29 | 2017-11-29 | Camera module packaging process and structure |
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| CN107911587A CN107911587A (en) | 2018-04-13 |
| CN107911587B true CN107911587B (en) | 2020-08-28 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108943564B (en) * | 2018-06-19 | 2021-01-12 | 昆山丘钛微电子科技有限公司 | Injection molding method and camera module |
| CN109274876B (en) * | 2018-11-05 | 2021-05-07 | 中芯集成电路（宁波）有限公司 | Photosensitive assembly and packaging method thereof, lens module and electronic equipment |
| CN111371970B (en) * | 2018-12-26 | 2022-03-15 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371969B (en) * | 2018-12-26 | 2021-08-10 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN109905584A (en) * | 2019-03-28 | 2019-06-18 | 昆山丘钛微电子科技有限公司 | Camera module and terminal |
| CN110139019A (en) * | 2019-06-28 | 2019-08-16 | 信利光电股份有限公司 | Optical filter and sensitive chip assemble method in camera module and camera module |
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511206A (en) * | 2014-09-26 | 2016-04-20 | 宁波舜宇光电信息有限公司 | Image module and photosensitive chip packaging structure and method thereof |
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| KR20040033193A (en) * | 2002-10-11 | 2004-04-21 | (주)그래픽테크노재팬 | Semiconductor Package For Image Sensor And Making Method |
| CN103700634B (en) * | 2013-11-06 | 2016-06-22 | 南昌欧菲光电技术有限公司 | Camera module and encapsulating structure thereof and method for packing |
| CN104065858A (en) * | 2014-05-08 | 2014-09-24 | 惠州海格科技有限公司 | Camera and manufacturing method thereof |
| CN104555898A (en) * | 2014-12-05 | 2015-04-29 | 华进半导体封装先导技术研发中心有限公司 | Method for reusing seal cover in wafer level package |
| CN205792874U (en) * | 2016-03-12 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module and photosensory assembly thereof |
| CN107071252A (en) * | 2017-05-16 | 2017-08-18 | 昆山丘钛微电子科技有限公司 | Direct attaching type miniaturization cam device of optical filter and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105511206A (en) * | 2014-09-26 | 2016-04-20 | 宁波舜宇光电信息有限公司 | Image module and photosensitive chip packaging structure and method thereof |
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