CN108012056A - A kind of camera module packaging technology and structure - Google Patents
A kind of camera module packaging technology and structure Download PDFInfo
- Publication number
- CN108012056A CN108012056A CN201711223800.XA CN201711223800A CN108012056A CN 108012056 A CN108012056 A CN 108012056A CN 201711223800 A CN201711223800 A CN 201711223800A CN 108012056 A CN108012056 A CN 108012056A
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- China
- Prior art keywords
- sensitive chip
- layer
- camera module
- optical filter
- plastic packaging
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of camera module packaging technology and structure, which includes step：With degradable paste adhesive encapsulated layer on the photosensitive area of sensitive chip；Sensitive chip and component are connected to module group substrates；Annular plastic packaging layer is molded on module group substrates, by component be wrapped in and wrap up from circumferential direction sensitive chip；Degrade degradable viscose glue, encapsulated layer is peeled off from the photosensitive area of sensitive chip；Degradable viscose glue is removed, optical filter and camera lens are carried on annular plastic packaging layer；The above-mentioned first surface mount package layer on sensitive chip of the degradable viscose glue of technology utilization, so as to avoid that the pollution of sensitive chip photosensitive area is caused in processing procedure afterwards, controlled with this to reach easy to processing procedure, the purpose of yield is improved, after module semi-finished product complete, i.e., after the completion of annular plastic packaging layer injection, before carrying optical filter and camera lens, encapsulated layer is peeled off from photosensitive area, so as to avoid encapsulated layer from causing light refraction, reflection and energy loss, achievees the purpose that to improve image effect.
Description
Technical field
The present invention relates to camera module encapsulation technology field, more particularly to a kind of camera module packaging technology and knot
Structure.
Background technology
At present, the manufacture craft of camera module mainly has two kinds, and one kind is COB techniques, which is encapsulated using bare chip
Mode, bare chip is fragile, and easily contaminated, the very difficult control of processing procedure, production yield is low, so being difficult really to realize batch at present
Amount production；Another kind is CSP techniques, which adds encapsulated layer on bare chip, but due to light penetration encapsulated layer
When can cause slight refraction, reflection and energy loss, the mould that its image effect directly makes of the COB techniques of bare chip
Group effect is good.
Therefore, how to improve current module manufacture craft, it is reduced the contaminated risk of bare chip, so as to
Controlled in processing procedure, improve yield, while ensure the image effect of camera module, become those skilled in the art's weight urgently to be resolved hurrily
Want technical problem.
The content of the invention
In view of this, first purpose of the invention is to provide a kind of camera module packaging technology, so that it can either
The contaminated risk of bare chip is reduced, in order to which processing procedure controls, improves yield, while ensures the impact effect of camera module, this
Second purpose of invention is to provide a kind of camera module encapsulating structure based on above-mentioned camera module packaging technology.
To achieve the above object, the present invention provides following technical solution：
A kind of camera module packaging technology, including step：
With degradable paste adhesive encapsulated layer on the photosensitive area of sensitive chip；
The sensitive chip and component are connected to module group substrates；
Annular plastic packaging layer is molded on the module group substrates, by the component be wrapped in and from circumferential direction described in parcel
Sensitive chip；
Degrade the degradable viscose glue, the encapsulated layer is peeled off from the photosensitive area of the sensitive chip；
The degradable viscose glue is removed, optical filter and camera lens are carried on the annular plastic packaging layer.
Preferably, the sensitive chip is soldered to the module group substrates by bottom weld layer.
Preferably, the bottom weld layer includes pad or multiple welding tin balls.
Preferably, the upper surface of the annular plastic packaging layer and the upper surface flush of the encapsulated layer.
Preferably, the annular plastic packaging layer is in inverted L-shaped, and component described in the portion envelops vertical with the module group substrates is simultaneously
The sensitive chip is wrapped up from circumferential direction, the part parallel with the module group substrates is pressed in the side of the sensitive chip photosensitive area
Edge.
Preferably, the degradable viscose glue is the light sensation viscose glue that can be degraded under ultraviolet irradiation.
Preferably, the degradable viscose glue be coated on the encapsulated layer circumferential edge and the sensitive chip it is photosensitive
The corresponding annular region in area.
A kind of camera module encapsulating structure, including module group substrates, sensitive chip, component, annular plastic packaging layer, optical filter with
And camera lens, the annular plastic packaging layer wrap up the component and wrap up the sensitive chip in the circumferential, the optical filter and
The camera lens is equipped on the annular plastic packaging layer successively from top to bottom, the sensitive chip by bottom weld layer with it is described
Module group substrates connect.
Preferably, the optical filter is erected on the annular plastic packaging layer by stent, and the optical filter is arranged at described
The photosurface of the sensitive chip is provide with wherein by the hollow hole of stent, the stent and the optical filter, the optical filter with
The photosurface of the sensitive chip is opposite.
Preferably, stent tabular in a ring, the hollow hole are stepped hole, and the depth of the big end of the stepped hole
Not less than the thickness of the optical filter.
To realize above-mentioned first purpose, camera module packaging technology provided by the invention, including step：In sensitive chip
Photosensitive area on degradable paste adhesive encapsulated layer；Sensitive chip and component are connected to module group substrates；In module base
Annular plastic packaging layer is molded on plate, by component be wrapped in and wrap up from circumferential direction sensitive chip；Degrade degradable viscose glue, will seal
Layer is filled to peel off from the photosensitive area of sensitive chip；Degradable viscose glue is removed, optical filter and camera lens are carried on annular plastic packaging layer；Thus
As it can be seen that above-mentioned technique is the improvement carried out in existing CSP techniques, at the beginning of encapsulation, using degradable viscose glue first in photosensitive core
On piece surface mount package layer, so as to avoid causing the pollution of sensitive chip photosensitive area in processing procedure afterwards, is easy to this to reach
Processing procedure controls, and improves the purpose of yield, after module semi-finished product complete, i.e., after the completion of annular plastic packaging layer injection, carries filter
Before mating plate and camera lens, encapsulated layer is peeled off from photosensitive area, so as to avoid refraction, reflection and energy that encapsulated layer causes light from damaging
Lose, achieve the purpose that to improve image effect.
To realize above-mentioned second purpose, present invention also offers a kind of camera module encapsulating structure, camera module envelope
Assembling structure uses above-mentioned camera module packaging technology, since the camera module packaging technology has above-mentioned technique effect,
The camera module encapsulating structure made of the technique should also have corresponding technique effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is that the structure in camera module packaging technology provided in an embodiment of the present invention after sensitive chip surface mount package layer is shown
It is intended to；
Fig. 2 is that sensitive chip installs the knot to module group substrates in camera module packaging technology provided in an embodiment of the present invention
Structure schematic diagram；
Fig. 3 is that the structure in camera module packaging technology provided in an embodiment of the present invention after the annular plastic packaging layer of injection formation is shown
It is intended to；
Fig. 4 is that the structure diagram before encapsulated layer is peeled off in camera module packaging technology provided in an embodiment of the present invention；
Fig. 5 is that the structure diagram after encapsulated layer is peeled off in camera module packaging technology provided in an embodiment of the present invention：
Fig. 6 is the structure diagram after the completion of camera module packaging technology provided in an embodiment of the present invention.
In figure：
1 is sensitive chip；2 be encapsulated layer；3 be degradable viscose glue；4 be package floor；5 be welding tin ball；6 be first device
Part；7 be module group substrates；8 be annular plastic packaging layer；9 be optical filter；10 be stent；11 be camera lens.
Embodiment
First purpose of the present invention is to provide a kind of camera module encapsulating structure, the knot of the camera module encapsulating structure
Structure design can reduce the contaminated risk of bare chip, in order to which processing procedure controls, improve yield, while ensure the shadow of camera module
Effect is rung, second object of the present invention is to provide a kind of camera module encapsulation knot based on above-mentioned camera module packaging technology
Structure.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
- Fig. 6 is please referred to Fig.1, Fig. 1 is sensitive chip attachment envelope in camera module packaging technology provided in an embodiment of the present invention
The structure diagram after layer is filled, Fig. 2 is that sensitive chip is installed to mould in camera module packaging technology provided in an embodiment of the present invention
Structure diagram after group substrate, Fig. 3 are that injection forms annular modeling in camera module packaging technology provided in an embodiment of the present invention
Structure diagram after sealing, Fig. 4 are that the knot before encapsulated layer is peeled off in camera module packaging technology provided in an embodiment of the present invention
Structure schematic diagram, Fig. 5 are that the structure diagram after encapsulated layer, figure are peeled off in camera module packaging technology provided in an embodiment of the present invention
6 be the structure diagram after the completion of camera module packaging technology provided in an embodiment of the present invention.
A kind of camera module encapsulating structure provided in an embodiment of the present invention, including step：
S101：Encapsulated layer 2 is pasted with degradable viscose glue 3 on the photosensitive area of sensitive chip 1；
S102：The sensitive chip 1 and component 6 are connected to module group substrates 7；
S103：Annular plastic packaging layer 8 is molded on the module group substrates 7, by the component 6 be wrapped in and from circumferential direction
Wrap up the sensitive chip 1；
S104：Degrade the degradable viscose glue 3, the encapsulated layer 2 is peeled off from the photosensitive area of the sensitive chip 1；
S105：The degradable viscose glue 3 is removed, optical filter 9 and camera lens 11 are carried on the annular plastic packaging layer 8.
Compared with prior art, camera module packaging technology provided by the invention is the improvement carried out in former CSP techniques,
At the beginning of encapsulation, using the first surface mount package layer 2 on sensitive chip 1 of degradable viscose glue 3, so as to avoid making in processing procedure afterwards
Into the pollution of 1 photosensitive area of sensitive chip, controlled with this to reach easy to processing procedure, the purpose of yield is improved, in module semi-finished product system
After the completion of work, i.e., after the completion of annular plastic packaging layer 8 is molded, before carrying optical filter 9 and camera lens 11, encapsulated layer 2 is peeled off from photosensitive area,
So as to avoid encapsulated layer 2 from causing the refraction, reflection and energy loss of light, achieve the purpose that to improve image effect.
In embodiments of the present invention, encapsulated layer 2 is packaged glass piece, and certainly, encapsulated layer 2 can also use other materials.
Sensitive chip 1 can be bundled on module group substrates 7 by gold thread, but this fixed form, and binding gold thread is positioned at sense
The side of optical chip 1, can cause the gap between sensitive chip 1 and other components 6 to increase, be unfavorable for whole camera module
Miniaturization, therefore, in embodiments of the present invention, sensitive chip 1 is soldered to module group substrates 7 by bottom weld layer, so as to reduce
Space shared by sensitive chip 1, makes camera module volume smaller.
Specifically, as shown in Figure 1, bottom weld layer includes being connected to the more of 1 bottom of sensitive chip by package floor 4
A welding tin ball 5, further, bottom weld layer can also be the pad for being arranged at 4 bottom of package floor, so as to reduce scolding tin
Height, further reduce camera module volume.
In embodiments of the present invention, the upper surface of annular plastic packaging layer 8 and the upper surface flush of encapsulated layer 2.
Further optimize above-mentioned technical proposal, annular plastic packaging layer 8 is in inverted L-shaped, and the portion envelops vertical with module group substrates 7 are first
Device 6 simultaneously wraps up sensitive chip 1 from circumferential direction, and the part parallel with module group substrates 7 is pressed in the edge of 1 photosensitive area of sensitive chip.
Preferably, in embodiments of the present invention, degradable viscose glue 3 is that the light sensation that can be degraded under ultraviolet irradiation glues
Glue, naturally it is also possible to using the viscose glue that can be degraded under other modes, do not limit herein.
For ease of the stripping of encapsulated layer 2, in embodiments of the present invention, degradable viscose glue 3 is coated on the peripheral edge of encapsulated layer 2
The corresponding annular region of the photosensitive area of edge and sensitive chip 1, alternatively, degradable viscose glue 3 can also be coated on the week of encapsulated layer 2
To the bottom edge at edge and encapsulated layer 2.
Above-mentioned technique is in processing procedure, and the intensity of sensitive chip 1 is far longer than the bare chip of COB techniques, during plastic packaging
It can bear the pressure of bigger, it is not easy to be injection molding mould and damage by pressure, and injection mold does not have to special avoidance photosensitive region, design one
A plane cavity, is pressed onto 2 surface of encapsulated layer, and injection mold is low-cost, and production yield is high, its exploitation and volume production cost are all
It is very low, suitable for various types of sensitive chips 1.
Based on above-mentioned camera module packaging technology, the embodiment of the present invention additionally provides a kind of camera module encapsulating structure, should
Camera module encapsulating structure is made using above-mentioned camera module packaging technology, which includes module group substrates 7, photosensitive core
Piece 1, component 6, annular plastic packaging layer 8, optical filter 9 and camera lens 11, annular plastic packaging layer 8 wrap up component 6 and wrap in the circumferential
Sensitive chip 1 is wrapped up in, optical filter 9 and camera lens 11 are equipped on annular plastic packaging layer 8 successively from top to bottom, and sensitive chip 1 passes through
Bottom weld layer is connected with module group substrates 7.Since the camera module packaging technology has above-mentioned technique effect, using this
The camera module encapsulating structure that technique makes should also have corresponding technique effect
Preferably, optical filter 9 is erected on annular plastic packaging layer 8 by stent 10, and optical filter 9 is arranged at the hollow out of stent 10
The photosurface of sensitive chip 1 is provide with wherein by hole, stent 10 with optical filter 9, and optical filter 9 is opposite with the photosurface of sensitive chip 1.
Further optimize above-mentioned technical proposal, to reduce the height of camera module, in embodiments of the present invention, stent 10 is in
Annular plate-like, hollow hole is stepped hole, and the depth of the big end of stepped hole is not less than the thickness of optical filter 9.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
1. a kind of camera module packaging technology, it is characterised in that including step：
With degradable paste adhesive encapsulated layer on the photosensitive area of sensitive chip；
The sensitive chip and component are connected to module group substrates；
Annular plastic packaging layer is molded on the module group substrates, by the component be wrapped in and wrap up from circumferential direction described photosensitive
Chip；
Degrade the degradable viscose glue, the encapsulated layer is peeled off from the photosensitive area of the sensitive chip；
The degradable viscose glue is removed, optical filter and camera lens are carried on the annular plastic packaging layer.
2. camera module packaging technology according to claim 1, it is characterised in that the sensitive chip is welded by bottom
Layer is soldered to the module group substrates.
3. camera module packaging technology according to claim 2, it is characterised in that the bottom weld layer include pad or
Multiple welding tin balls.
4. according to the camera module packaging technology described in claim 1-3 any one, it is characterised in that the annular plastic packaging layer
Upper surface and the encapsulated layer upper surface flush.
5. camera module packaging technology according to claim 4, it is characterised in that the annular plastic packaging layer is in inverted L-shaped, with
Component described in the vertical portion envelops of the module group substrates simultaneously wraps up the sensitive chip from circumferential direction, with the module group substrates
Parallel part is pressed in the edge of the sensitive chip photosensitive area.
6. according to the camera module packaging technology described in claim 1-3 and 5 any one, it is characterised in that described degradable
Viscose glue is the light sensation viscose glue that can be degraded under ultraviolet irradiation.
7. according to the camera module packaging technology described in claim 1-3 and 5 any one, it is characterised in that described degradable
Viscose glue is coated on the corresponding annular region of photosensitive area of the circumferential edge and the sensitive chip of the encapsulated layer.
8. a kind of camera module encapsulating structure, it is characterised in that including module group substrates, sensitive chip, component, annular plastic packaging
Layer, optical filter and camera lens, the annular plastic packaging layer wraps up the component and wraps up the sensitive chip in the circumferential, described
Optical filter and the camera lens are equipped on the annular plastic packaging layer successively from top to bottom, and the sensitive chip is welded by bottom
Layer is connect to be connected with the module group substrates.
9. camera module encapsulating structure according to claim 8, it is characterised in that the optical filter is erected at by stent
On the annular plastic packaging layer, the optical filter is arranged at the hollow hole of the stent, and the stent is with the optical filter by described in
The photosurface of sensitive chip is provide with wherein, and the optical filter is opposite with the photosurface of the sensitive chip.
10. camera module encapsulating structure according to claim 9, it is characterised in that stent tabular in a ring, it is described
Hollow hole is stepped hole, and the depth of the big end of the stepped hole is not less than the thickness of the optical filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711223800.XA CN108012056A (en) | 2017-11-29 | 2017-11-29 | A kind of camera module packaging technology and structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711223800.XA CN108012056A (en) | 2017-11-29 | 2017-11-29 | A kind of camera module packaging technology and structure |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922855A (en) * | 2018-07-12 | 2018-11-30 | 信利光电股份有限公司 | The production method and camera module base of chip-scale micro-plastic seal camera module base |
| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| CN110941068A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN110941069A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN110941070A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN111361070A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111361071A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN112233987A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
| CN112887518A (en) * | 2019-11-29 | 2021-06-01 | 南昌欧菲光电技术有限公司 | Camera module, preparation method thereof and intelligent terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108922855A (en) * | 2018-07-12 | 2018-11-30 | 信利光电股份有限公司 | The production method and camera module base of chip-scale micro-plastic seal camera module base |
| CN110941068A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN110941069A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN110941070A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| CN111361070A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111361071A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371970B (en) * | 2018-12-26 | 2022-03-15 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN112233987A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
| CN112233987B (en) * | 2019-07-15 | 2022-11-01 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
| CN112887518A (en) * | 2019-11-29 | 2021-06-01 | 南昌欧菲光电技术有限公司 | Camera module, preparation method thereof and intelligent terminal |
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