CN204375760U - There is the encapsulating structure for sensitive chip of flare openings - Google Patents
There is the encapsulating structure for sensitive chip of flare openings Download PDFInfo
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- CN204375760U CN204375760U CN201420844367.7U CN201420844367U CN204375760U CN 204375760 U CN204375760 U CN 204375760U CN 201420844367 U CN201420844367 U CN 201420844367U CN 204375760 U CN204375760 U CN 204375760U
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- chip
- flare openings
- encapsulating structure
- framework
- openings
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Abstract
The utility model relates to a kind of encapsulating structure for sensitive chip with flare openings; it comprises framework (1); described framework (1) forms flare openings (3) by pre-plastic package material (2); described flare openings (3) top is provided with chip (4); described chip (4) front is provided with layer of transparent protecting glue (6); projection (5) is provided with in described transparent protective film (6); described chip (4) is electrically connected by projection (5) and framework (1), and described chip (4) is filled with plastic packaging material (7) around.A kind of encapsulating structure for sensitive chip with flare openings of the utility model, it can solve the stop problem of traditional base openings to side light signal.
Description
Technical field
The utility model relates to a kind of encapsulating structure for sensitive chip with flare openings, belongs to technical field of semiconductor encapsulation.
Background technology
Traditional sensitive chip, generally can be used in the bonding circle encapsulant of chip circumference and on substrate, increase the process of clear glass or other light transmissive materials and structure to protect sensitive chip and to be provided for the region of light penetration.The type encapsulation due between chip with substrate light transmissive material district for air and chip are connected by the encapsulant of chip circumference and bump and lower substrate, when paster upper plate, the air of beneath chips is added thermal expansion, may directly cause chip rupture or warpage of packaging assembly, or the problem that on substrate, clear material region is peeled off, product failure or life-span are significantly shortened.Which needs on substrate, increase clear glass or light transmissive material simultaneously, also makes the cost of manufacture of substrate improve.
Photosensitive encapsulation traditional in addition, exposes to realize chip photosensitive region, and another kind of method is on substrate, make opening (see Figure 12).But this opening can stop the light come in a part of side, affect the Signal reception of inside chip, the range of application of this encapsulation can be limited.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of encapsulating structure for sensitive chip with flare openings, and it can solve the stop problem of traditional base openings to side light signal.
Another object of the present utility model is to provide a kind of encapsulating structure for sensitive chip with flare openings, its adopts the mode of whirl coating or printing to carry out transparent adhesive tape coating at sensitive chip photosurface, can solve the traditional approach problem that air expands in paster process and the high problem of substrate cost.
The purpose of this utility model is achieved in that a kind of encapsulating structure for sensitive chip with flare openings; it comprises framework; described framework forms flare openings by pre-plastic package material; chip is provided with above described flare openings; described chip front side is provided with layer of transparent protecting glue; be provided with projection in described transparent protective film, described chip is electrically connected by projection and framework, and described chip circumference is filled with plastic packaging material.
Lens are provided with in described flare openings.
Compared with prior art, the utility model has following beneficial effect:
1, the utility model is by trumpet-shaped opening, the stop problem of conventional substrate opening to side light signal can be solved, ambient light signal can reflect by scioptics, the luminous energy of side is made to arrive chip photosensitive region, improve the light signal strength that inside chip receives, the encapsulation scope of application can be expanded;
2, the utility model passes through the mode of whirl coating or printing transparent protecting glue, protecting glue and chip photosensitive region are directly fitted, and by complete preservation below chip, blend compounds and substrate combine, transparent material conventional substrate needing increase can be saved, reduce the cost of manufacture of substrate;
3, the utility model is by the mode of whirl coating or printing transparent protecting glue, can solve that tradition is photosensitive to be encapsulated in air through Reflow Soldering time and to expand and cause the problem of product failure or the lost of life.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram with the encapsulating structure for sensitive chip of flare openings of the utility model.
Fig. 2 ~ Figure 11 is a kind of each operation schematic diagram with the encapsulating structure process for sensitive chip of flare openings of the utility model.
Figure 12 is the schematic diagram of traditional encapsulating structure for sensitive chip.
Wherein:
Framework 1
Pre-plastic package material 2
Flare openings 3
Chip 4
Projection 5
Transparent protective film 6
Plastic packaging material 7.
Embodiment
See Fig. 1; a kind of encapsulating structure for sensitive chip with flare openings of the utility model; it comprises framework 1; described framework 1 forms flare openings 3 by pre-plastic package material 2; be provided with chip 4 above described flare openings 3, described chip 4 front is provided with layer of transparent protecting glue 6, is provided with projection 5 in described transparent protective film 6; described chip 4 is electrically connected by projection 5 and framework 1, is filled with plastic packaging material 7 around described chip 4.
Its process is as follows:
Step one, see Fig. 2, get a metal support plate;
Step 2, see Fig. 3, electroplate out inside and outside pin in metal support plate front;
Step 3, see Fig. 4, by plastic package die, pre-plastic package is carried out to pin inside and outside metal support plate front, thus form flare openings in metal support plate front;
Step 4, see Fig. 5, pre-plastic package region, abrasive metal support plate front, until expose outer pin;
Step 5, see Fig. 6, etching remove metal support plate, formed framework;
Step 6, see Fig. 7, get a disk, layer of transparent protecting glue is applied by the mode of whirl coating or printing at disk bumping surface (chip photosensitive region), photosensitive region is used for for the protection of chip lug face, then the mode of Ultraviolet radiation or baking is used to make transparent protective film carry out one-step solidification, make transparent protective film together with disk strong bonded, the height of transparent protective film flushes a little less than projection or with projection;
Step 7, see Fig. 8, disk is divided into the single chips for load;
Step 8, see Fig. 9, by flip-chip on the framework with flare openings, and by Reflow Soldering, chip lug and framework output pin are formed to be electrically connected, meanwhile transparent protective film can soften and complete regelate;
Step 9, see Figure 10, the protection of plastic packaging material plastic packaging is carried out to chip;
Step 10, carry out anti oxidation layer plating in step 9 plastic packaging afterframe surface exposure metal surface outside;
Step 11, the framework completing anti oxidation layer plating to be cut, form independently single encapsulating structure.
See Figure 11, after step 11 completes, on frame openings place point, lens can be formed by transparent adhesive tape.
Claims (2)
1. one kind has the encapsulating structure for sensitive chip of flare openings; it is characterized in that: it comprises framework (1); described framework (1) forms flare openings (3) by pre-plastic package material (2); described flare openings (3) top is provided with chip (4); described chip (4) front is provided with layer of transparent protecting glue (6); projection (5) is provided with in described transparent protective film (6); described chip (4) is electrically connected by projection (5) and framework (1), and described chip (4) is filled with plastic packaging material (7) around.
2. a kind of encapsulating structure for sensitive chip with flare openings according to claim 1, is characterized in that: described flare openings is provided with lens in (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844367.7U CN204375760U (en) | 2014-12-26 | 2014-12-26 | There is the encapsulating structure for sensitive chip of flare openings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844367.7U CN204375760U (en) | 2014-12-26 | 2014-12-26 | There is the encapsulating structure for sensitive chip of flare openings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204375760U true CN204375760U (en) | 2015-06-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420844367.7U Active CN204375760U (en) | 2014-12-26 | 2014-12-26 | There is the encapsulating structure for sensitive chip of flare openings |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204375760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465797A (en) * | 2014-12-26 | 2015-03-25 | 江苏长电科技股份有限公司 | Packaging structure provided with trumpet-shaped opening and used for light-sensing chip and technological method |
-
2014
- 2014-12-26 CN CN201420844367.7U patent/CN204375760U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465797A (en) * | 2014-12-26 | 2015-03-25 | 江苏长电科技股份有限公司 | Packaging structure provided with trumpet-shaped opening and used for light-sensing chip and technological method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |