CN204375728U - For the encapsulating structure of sensitive chip - Google Patents
For the encapsulating structure of sensitive chip Download PDFInfo
- Publication number
- CN204375728U CN204375728U CN201420839265.6U CN201420839265U CN204375728U CN 204375728 U CN204375728 U CN 204375728U CN 201420839265 U CN201420839265 U CN 201420839265U CN 204375728 U CN204375728 U CN 204375728U
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- encapsulating structure
- sensitive chip
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
- H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
The utility model relates to a kind of encapsulating structure for sensitive chip, belongs to technical field of semiconductor encapsulation.Described encapsulating structure comprises substrate (1); described substrate (1) is provided with opening (2); described opening (2) top is provided with chip (3); described chip (3) front arranges layer of transparent protecting glue (5); projection (4) is provided with in described transparent protective film (5); described chip (3) is electrically connected by projection (4) and substrate (1), and described chip (3) is filled with plastic packaging material (6) around.A kind of encapsulating structure for sensitive chip of the utility model, its adopts the mode of whirl coating or printing to carry out transparent adhesive tape coating at sensitive chip photosurface, can solve problem that traditional approach expands at paster process chips lower air and the high problem of substrate cost.
Description
Technical field
The utility model relates to a kind of encapsulating structure for sensitive chip, belongs to technical field of semiconductor encapsulation.
Background technology
Traditional sensitive chip, generally can be used in the bonding circle encapsulant of chip circumference and on substrate, increase the process of clear glass or other light transmissive materials and structure to protect sensitive chip and to be provided for the region (see Fig. 7) of light penetration.The type encapsulation due between chip with substrate light transmissive material district for air and chip are connected by the encapsulant of chip circumference and bump and lower substrate, when paster upper plate, the air of beneath chips is added thermal expansion, may directly cause chip rupture or warpage of packaging assembly, or the problem that on substrate, clear material region is peeled off, product failure or life-span are significantly shortened.Which needs on substrate, increase clear glass or light transmissive material simultaneously, also makes the cost of manufacture of substrate improve.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, a kind of encapsulating structure for sensitive chip is provided, its adopts the mode of whirl coating or printing to carry out transparent adhesive tape coating at sensitive chip photosurface, can solve the traditional approach problem that air expands in paster process and the high problem of substrate cost.
The purpose of this utility model is achieved in that a kind of encapsulating structure for sensitive chip; it comprises substrate; described substrate is provided with opening; described overthe openings is provided with chip; described chip front side arranges layer of transparent protecting glue; be provided with projection in described transparent protective film, described chip is connected with electrical property of substrate by projection, and described chip circumference is filled with plastic packaging material.
Lens are provided with in described opening.
Compared with prior art, the utility model has following beneficial effect:
1, the utility model passes through the mode of whirl coating or printing transparent protecting glue, protecting glue and chip photosensitive region are directly fitted, and by complete preservation below chip, blend compounds and substrate combine, transparent material conventional substrate needing increase can be saved, reduce the cost of manufacture of substrate;
2, the utility model is by the mode of whirl coating or printing transparent protecting glue, can solve that tradition is photosensitive to be encapsulated in air through Reflow Soldering time and to expand and cause the problem of product failure or the lost of life;
3, form lens at base openings place point transparent adhesive tape, not only can strengthen the penetrating light intensity of light, and lens and base openings suitability that transparent adhesive tape is formed are flexible, mounting process is simple, is also subject to high temperature CTE expansion effects little.
Accompanying drawing explanation
fig. 1 is the schematic diagram of a kind of encapsulating structure for sensitive chip of the utility model.
Fig. 2 ~ Fig. 6 is each operation schematic diagram of a kind of encapsulating structure process for sensitive chip of the utility model.
Fig. 7 is the schematic diagram of the encapsulating structure being conventionally used to sensitive chip.
Wherein:
Substrate 1
Opening 2
Chip 3
Projection 4
Transparent protective film 5
Plastic packaging material 6.
Embodiment
See Fig. 1; a kind of encapsulating structure for sensitive chip of the utility model; it comprises substrate 1; described substrate 1 is provided with opening 2; be provided with chip 3 above described opening 2, described chip 3 front arranges layer of transparent protecting glue 5, is provided with projection 4 in described transparent protective film 5; described chip 3 is electrically connected by projection 4 and substrate 1, is filled with plastic packaging material 6 around described chip 3.
Its process is as follows:
Step one, see Fig. 2, get a disk, layer of transparent protecting glue is applied by the mode of whirl coating or printing at disk bumping surface (chip photosensitive region), photosensitive region is used for for the protection of chip lug face, then the mode of Ultraviolet radiation or baking is used to make transparent protective film carry out one-step solidification, make transparent protective film together with disk strong bonded, the height of transparent protective film flushes a little less than projection or with projection;
Step 2, see Fig. 3, disk is divided into the single chips for load;
Step 3, see Fig. 4, flip-chip is just had on the substrate of opening to photosensitive area, and make chip lug and substrate output pin form electric connection by Reflow Soldering, meanwhile transparent protective film can soften and complete regelate, and the substrate that wherein photosensitive area has an opening can replace with transparency carrier;
Step 4, see Fig. 5, the protection of plastic packaging material plastic packaging is carried out to chip;
Step 5, carry out anti oxidation layer plating in step 4 plastic packaging metacoxal plate surface exposure metal surface outside;
Step 6, the product completing anti oxidation layer plating to be cut, form independently single encapsulating structure.
See Fig. 6, after step 6 completes, on base openings place point, lens can be formed by transparent adhesive tape.
Claims (2)
1. the encapsulating structure for sensitive chip; it is characterized in that: it comprises substrate (1); described substrate (1) is provided with opening (2); described opening (2) top is provided with chip (3); described chip (3) front arranges layer of transparent protecting glue (5); be provided with projection (4) in described transparent protective film (5), described chip (3) is electrically connected by projection (4) and substrate (1), and described chip (3) is filled with plastic packaging material (6) around.
2. a kind of encapsulating structure for sensitive chip according to claim 1, is characterized in that: described opening is provided with lens in (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420839265.6U CN204375728U (en) | 2014-12-26 | 2014-12-26 | For the encapsulating structure of sensitive chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420839265.6U CN204375728U (en) | 2014-12-26 | 2014-12-26 | For the encapsulating structure of sensitive chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204375728U true CN204375728U (en) | 2015-06-03 |
Family
ID=53331923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420839265.6U Active CN204375728U (en) | 2014-12-26 | 2014-12-26 | For the encapsulating structure of sensitive chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204375728U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485319A (en) * | 2014-12-26 | 2015-04-01 | 江苏长电科技股份有限公司 | Package structure for light-sensing chip and process method thereof |
-
2014
- 2014-12-26 CN CN201420839265.6U patent/CN204375728U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485319A (en) * | 2014-12-26 | 2015-04-01 | 江苏长电科技股份有限公司 | Package structure for light-sensing chip and process method thereof |
| CN104485319B (en) * | 2014-12-26 | 2017-09-26 | 江苏长电科技股份有限公司 | Encapsulating structure and process for sensitive chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104851961B (en) | The chip-scale packaging method and structure of luminescent device | |
| CN107123718B (en) | A kind of upside-down mounting high-power LED encapsulation structure and its preparation method and application | |
| TWI597786B (en) | Semiconductor package structure and manufacturing method thereof | |
| CN103985723B (en) | Method for packing and encapsulating structure | |
| CN104979447B (en) | Flip LED encapsulating structure and production method | |
| CN108012056A (en) | A kind of camera module packaging technology and structure | |
| CN105281706A (en) | Surface acoustic wave filter encapsulation structure and manufacturing method | |
| CN108075024B (en) | Fingerprint identification module and its manufacturing method with light-emitting function | |
| CN103199187A (en) | Light-emitting diode (LED) encapsulating baseplate and encapsulating structure and manufacturing method thereof | |
| WO2018187963A1 (en) | Optical fingerprint sensor and packaging method therefor | |
| US20090166831A1 (en) | Sensor semiconductor package and method for fabricating the same | |
| CN104485319B (en) | Encapsulating structure and process for sensitive chip | |
| CN204375728U (en) | For the encapsulating structure of sensitive chip | |
| CN204204900U (en) | A kind of LED encapsulation structure | |
| CN204375760U (en) | There is the encapsulating structure for sensitive chip of flare openings | |
| TWI528596B (en) | Led package and method of manufacturing the same | |
| CN104810462A (en) | ESOP8 lead frame of medium-and high-power LED driving chip | |
| CN113380725A (en) | Chip packaging structure and packaging method | |
| CN104465797A (en) | Packaging structure provided with trumpet-shaped opening and used for light-sensing chip and technological method | |
| CN203055984U (en) | COB LED packaging structure | |
| CN106373935A (en) | Paddle-free frame package process and package structure | |
| TWI416641B (en) | Method for manufacturing a semiconductor structure | |
| CN207368010U (en) | A kind of flexible LED filament | |
| CN205160485U (en) | Surface acoustic wave filter packaging structure | |
| CN204538086U (en) | Multi-chip encapsulated LED structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |