CN106373935A - Paddle-free frame package process and package structure - Google Patents
Paddle-free frame package process and package structure Download PDFInfo
- Publication number
- CN106373935A CN106373935A CN201610914057.1A CN201610914057A CN106373935A CN 106373935 A CN106373935 A CN 106373935A CN 201610914057 A CN201610914057 A CN 201610914057A CN 106373935 A CN106373935 A CN 106373935A
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- China
- Prior art keywords
- island
- chip
- paddle
- free
- cured film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/85002—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate being a removable or sacrificial coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention relates to a paddle-free frame package process and package structure. The structure comprises a paddle-free frame (1), wherein a curing film (2) is pasted on a front surface of the paddle-free frame (1), a chip (3) is arranged on the curing film (2), the chip (3) and the paddle-free frame (1) are electrically connected by electrical connection parts (4), a plastic package material (5) wraps the paddle-free frame (1), the curing film (2) and the electrical connection parts (4), and the plastic package material (5) is exposed out of a back surface of the paddle-free frame (1). According to the paddle-free frame package process and package structure, the curing film is pasted on the paddle-free frame and is cured to form a chip support structure having a paddle effect, the problem of routing instability and swinging or chip lifting during routing caused by too small contact area of the chip and a pin can be effectively solved, and meanwhile, the problem of frame warpping caused by large proportion difference between copper areas of two sides of a pre-package frame can also be prevented.
Description
Technical field
The present invention relates to a kind of island-free framework encapsulation technique and its encapsulating structure, belong to technical field of semiconductor encapsulation.
Background technology
Pass through the lead frame island-free product that etching is formed at present, be frame on pin during chip load.In fact,
When chip carrier is on pin, because chip is too little with pins contact area, routing shakiness is led to be rocked or chip stress during routing
While the abnormal phenomena lifting.
Although the pre-packaged framework of island-free can reach, by pre-fill plastic packaging material, the purpose supporting chip, island-free is pre-
Encapsulating framework amasss proportional difference greatly due to framework both sides copper face, can produce framework warpage issues, and load glue can be in plastic packaging material
Upper diffusion, stains on framework pin, affects product yield and reliability.
Content of the invention
The technical problem to be solved is to provide a kind of island-free framework encapsulation technique for above-mentioned prior art
And its encapsulating structure, it forms the chip supporting structure of Ji Dao effect, Neng Gouyou after pasting cured film solidification on island-free framework
Effect solves the problems, such as that chip and pins contact area are too little and leads to routing shakiness to be rocked or chip-side lifts, simultaneously during routing
It can be avoided that pre-packaged framework both sides copper face amasss the framework warpage issues that proportional difference leads to greatly.
The present invention the adopted technical scheme that solves the above problems is: a kind of island-free framework encapsulation technique, described technique
Comprise the steps:
Step one, by cured film be arranged on conversion film on；
Step 2, the one side that conversion film is provided with cured film are attached on the interior pin of island-free framework；
Step 3, cured film is solidified, cured film removes conversion film after completing solidification；
Step 4, in cured film arrange chip；
Step 5, it is electrically connected with chip and island-free framework with electrical connection member；
Step 6, encapsulating, are coated framework, cured film, chip, are electrically connected with part with plastic packaging material.
Described cured film is fow film or fod film.
Described electric connection part is bonding wire.
A kind of island-free framework encapsulation structure, it includes island-free framework, and described island-free framework front is covered with solidification
Film, described cured film is provided with chip, and described chip and island-free framework are electrically connected with by being electrically connected with part, institute
State island-free framework, cured film, be electrically connected with part outside be all encapsulated with plastic packaging material, the described island-free framework back side is exposed to plastic packaging
Material.
Compared with prior art, it is an advantage of the current invention that:
1st, form the chip supporting structure of Ji Dao effect after patch cured film solidification on island-free framework, be capable of propping up of reinforced frame
Support ability, can effectively solve the problem that chip and pins contact are too little and leads to routing shakiness to be rocked or asking of lifting of chip-side during routing
Topic, the stability of chip and product yield when improving routing；
2nd, compared with pre-packaged technology: (1) can avoid the warpage issues of framework；(2) chip load glue can be avoided in plastic packaging
Diffusion (it is fine that load glue spreads management and control effect on this kind of film) on material.
Brief description
Fig. 1 is a kind of schematic diagram of present invention island-free framework encapsulation structure.
Fig. 2 ~ Fig. 7 is a kind of each operation flow chart of present invention island-free framework encapsulation technique.
Wherein:
Island-free framework 1
Cured film 2
Chip 3
It is electrically connected with part 4
Plastic packaging material 5.
Specific embodiment
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
As shown in figure 1, one of the present embodiment island-free framework encapsulation structure, it includes island-free framework 1, described nothing
Base island framework 1 front is covered with cured film 2, and described cured film 2 is provided with chip 3, and described chip 3 and island-free framework 1 lead to
Cross electric connection part 4 to be electrically connected with, described island-free framework 1, cured film 2, outer being all encapsulated with of electric connection part 4 are moulded
Envelope material 5, described island-free framework 1 back side is exposed to plastic packaging material 5.
Its process is as follows:
Step one, referring to Fig. 2, cured film is arranged on conversion film, required size is dimensioned to according to island-free framework,
Cured film can be fow film or fod film etc.；
The characteristic of above-mentioned cured film: this film has half mobility before curing, by changing pad pasting, alignment method is mounted on hollow out
The framework back side will not be flowed to from frame gap when on framework and stain profile；When by heating, film is changed into by half flow regime
Solid-state, also will not flow to the framework back side from frame gap in the process, after this film changes into solid-state, add at normal temperatures or again
Heat also will not revert to half flow regime；
Step 2, referring to Fig. 3, the one side that conversion film is provided with cured film is attached on the interior pin of island-free framework, makes solidification
Film is attached on the interior pin of island-free framework；
Step 3, referring to Fig. 4, cured film is solidified, cured film complete solidification after remove conversion film；
Step 4, referring to Fig. 5, cured film carries out positive cartridge chip by load glue；
Step 5, referring to Fig. 6, be electrically connected with part and be electrically connected with chip and island-free framework, being electrically connected with part is bonding wire；
Step 6, referring to Fig. 7, encapsulate, coated framework, cured film, chip, be electrically connected with part with plastic packaging material, and island-free
The framework back side is exposed to plastic packaging material.
In addition to the implementation, present invention additionally comprises there being other embodiment, all employing equivalents or equivalence replacement
The technical scheme that mode is formed, all should fall within the scope of the hereto appended claims.
Claims (4)
1. a kind of island-free framework encapsulation technique is it is characterised in that described technique comprises the steps:
Step one, by cured film be arranged on conversion film on；
Step 2, the one side that conversion film is provided with cured film are attached on the interior pin of island-free framework；
Step 3, cured film is solidified, cured film removes conversion film after completing solidification；
Step 4, in cured film arrange chip；
Step 5, electric connection part are electrically connected with chip and island-free framework；
Step 6, encapsulating, are coated framework, cured film, chip, are electrically connected with part with plastic packaging material.
2. a kind of island-free framework encapsulation technique according to claim 1 it is characterised in that: described cured film is fow film
Or fod film.
3. a kind of island-free framework encapsulation technique according to claim 1 it is characterised in that: described electric connection part be
Bonding wire.
4. a kind of island-free framework encapsulation structure it is characterised in that: it includes island-free framework (1), described island-free framework (1)
Front is covered with cured film (2), and described cured film (2) is provided with chip (3), and described chip (3) is led to island-free framework (1)
Cross electric connection part (4) to be electrically connected with, described island-free framework (1), cured film (2), electric connection part (4) are equal outward
It is encapsulated with plastic packaging material (5), described island-free framework (1) back side is exposed to plastic packaging material (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610914057.1A CN106373935B (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation technique and its encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610914057.1A CN106373935B (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation technique and its encapsulating structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106373935A true CN106373935A (en) | 2017-02-01 |
| CN106373935B CN106373935B (en) | 2019-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610914057.1A Active CN106373935B (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation technique and its encapsulating structure |
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| Country | Link |
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| CN (1) | CN106373935B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108171299A (en) * | 2017-12-19 | 2018-06-15 | 中电智能卡有限责任公司 | A kind of processing technology of smart card |
| WO2019227918A1 (en) * | 2018-05-31 | 2019-12-05 | 江苏长电科技股份有限公司 | Base-island-free frame packaging structure and process method therefor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042904A1 (en) * | 2000-05-09 | 2001-11-22 | Chikao Ikenaga | Frame for semiconductor package |
| US7633144B1 (en) * | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| CN201752004U (en) * | 2010-04-30 | 2011-02-23 | 江苏长电科技股份有限公司 | Packaging structure for arranging chip directly |
| CN103390564A (en) * | 2012-05-08 | 2013-11-13 | Nxp股份有限公司 | Film based IC packaging method and packaged IC device |
| CN104505380A (en) * | 2014-12-19 | 2015-04-08 | 日月光封装测试(上海)有限公司 | Semiconductor packaging body and manufacturing method thereof |
| CN205039143U (en) * | 2015-08-20 | 2016-02-17 | 南昌欧菲生物识别技术有限公司 | Electron device and electronic equipment |
| CN206250189U (en) * | 2016-10-20 | 2017-06-13 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation structure |
-
2016
- 2016-10-20 CN CN201610914057.1A patent/CN106373935B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042904A1 (en) * | 2000-05-09 | 2001-11-22 | Chikao Ikenaga | Frame for semiconductor package |
| US7633144B1 (en) * | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| CN201752004U (en) * | 2010-04-30 | 2011-02-23 | 江苏长电科技股份有限公司 | Packaging structure for arranging chip directly |
| CN103390564A (en) * | 2012-05-08 | 2013-11-13 | Nxp股份有限公司 | Film based IC packaging method and packaged IC device |
| CN104505380A (en) * | 2014-12-19 | 2015-04-08 | 日月光封装测试(上海)有限公司 | Semiconductor packaging body and manufacturing method thereof |
| CN205039143U (en) * | 2015-08-20 | 2016-02-17 | 南昌欧菲生物识别技术有限公司 | Electron device and electronic equipment |
| CN206250189U (en) * | 2016-10-20 | 2017-06-13 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108171299A (en) * | 2017-12-19 | 2018-06-15 | 中电智能卡有限责任公司 | A kind of processing technology of smart card |
| WO2019227918A1 (en) * | 2018-05-31 | 2019-12-05 | 江苏长电科技股份有限公司 | Base-island-free frame packaging structure and process method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106373935B (en) | 2019-04-16 |
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