CN206340542U - A kind of QFN surface-adhered types RGB LED encapsulation modules - Google Patents
A kind of QFN surface-adhered types RGB LED encapsulation modules Download PDFInfo
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- CN206340542U CN206340542U CN201720312403.9U CN201720312403U CN206340542U CN 206340542 U CN206340542 U CN 206340542U CN 201720312403 U CN201720312403 U CN 201720312403U CN 206340542 U CN206340542 U CN 206340542U
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- Prior art keywords
- base plate
- metal base
- luminescence unit
- led encapsulation
- encapsulation modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The utility model provides a kind of QFN surface-adhered types RGB LED encapsulation modules, including luminescence unit package support and setting on the package support, the quantity at least two of the luminescence unit, the package support includes metal base plate and Insulating frame, the metal base plate is provided with the stent electrode for die bond and bonding wire in each luminescence unit region, the luminescence unit includes the key and line of the RGB LED chips being fixed on metal base plate and connection RGB LED chips and stent electrode, matcoveredn is set on the luminescence unit, the stent electrode is connected by being arranged on the pad at the metal base plate back side with external circuit.The utility model is directly contacted by using by metal base plate with pcb board, and chip heat can be exported quickly；The structure of bowl is formed by front, makes light-emitting area unique；Multiple luminescence units are integrated in an encapsulation module, production efficiency is further increased.
Description
Technical field
The utility model is related to SMD LED（Surface Mounted Devices, surface mount device）Encapsulate skill
Art, more particularly to QFN（Quad Flat No-leadPackage, quad flat non-pin package）Surface-adhered type RGB
LED encapsulation modules.
Background technology
As display screen industry is continued to develop, display screen is with LED by original DIP（dual inline-pin
Package, dual-inline package technology）Structure high-speed changes to SMD structures, and the LED of SMD structures has lightweight, individual
It is smaller, be increasingly accepted the advantages of automation is installed, lighting angle is big, color is uniform, decay is few, although typically SMD
LED has an above advantage, but there are that larger, the thermally conductive pathways length of decay, carrying electric current be low, production is complicated, and reliability is low,
Humidity resistance is low, and against weather is poor；If in the case where not changing the overall structure of product, to improve the reliability of product,
So far in the industry cycle still without preferable solution.
Existing small clearance display screen mainly uses the model packaging such as 2121,1515,1010,0808.As LED is aobvious
Packaging quantity in the diminution of display screen pel spacing, unit area is more and more so that cost of the packaging in whole screen
In, accounting is in rising trend.According to measuring and calculating, in small space distance LED display screen P1.9 and the product of smaller spacing model, packaging
Cost accounting has reached more than 70%.As long as density lifts a rank, rising for lamp bead demand is to improve 50% or so, also
It is that manufacturer's production capacity of all lamp beads need to increase by more than 50%.The full-color lamp bead that small spacing is used at present is mainly single
Form（As depicted in figs. 1 and 2）, using when due to enormous amount, low production efficiency, while easily going out quality problem.For list
Attachment the problem of, using COB（chip On board）The production efficiency of integrated module increases, but the integrated modules of COB
Equally existing different batches chip center value difference XOR substrate ink difference in problems, such as module causes colour development difference, whole
Shield uniformity poor, on the other hand, chip is mounted directly on circuit boards, lacks protection, it is impossible to ensure reliability, and luminescence unit
The maintenance cost that fails is high.
Therefore, prior art has yet to be improved and developed.
Utility model content
The purpose of this utility model is to provide a kind of QFN surface-adhered types RGB LED encapsulation modules, it is intended to solved existing
Mounted type RGB LED low production efficiencies, light scattered serious, packaging machinery intensity difference, poor sealing, weak heat-dissipating the problems such as.
To solve the above problems, the technical solution of the utility model is as follows：
A kind of QFN surface-adhered types RGB LED encapsulation modules, including package support and be arranged on the package support
Luminescence unit, the quantity at least two of the luminescence unit, the package support include metal base plate and Insulating frame, institute
State metal base plate and the stent electrode for die bond and bonding wire, the luminescence unit bag are provided with each luminescence unit region
The key and line of the RGB LED chips being fixed on the metal base plate and the connection RGB LED chips and stent electrode are included,
Matcoveredn is set on the luminescence unit, and the stent electrode is by being arranged on the pad and external circuit at the metal base plate back side
Connection.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the Insulating frame is in luminescence unit week
Enclose to form bowl.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the metal base plate front and/or reverse side are set
There is step.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, it is additionally provided with the metal base plate and the weldering
Disk highly concordant Support.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the protective layer is coarse non-reflective.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the quantity of the step is at least one.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the Support is circular, square or irregular
The supporting construction of shape, the quantity of the Support is at least one.
Described QFN surface-adhered type RGB LED encapsulation modules, wherein, the protective layer is with the semi-transparent of diffusant
Bright epoxy resin layer.
The beneficial effects of the utility model include：The QFN surface-adhered type RGB LED encapsulation modules that the utility model is provided
And its manufacture method, the mode of existing plating thin metal is replaced by using metal base plate, electric conductivity is enhanced, passes through gold
Category base plate is directly contacted with pcb board, and heat dissipation path is shorter, and chip heat can be exported quickly；The knot of bowl is formed by front
Structure, concentrates light, makes light-emitting area unique, and then makes display resolution, the bright dark contrast made etc. more excellent；By in metal
Step is made on base plate, it is ensured that the compactness and the stability of package support combined with Insulating frame；By multiple luminescence unit collection
In Cheng Yi encapsulation module, production efficiency is further increased, production cost is reduced.In addition, multiple luminescence units are integrated
On a module, display screen integrally anti-external mechanical strength capabilities can be effectively improved；Contrasted with existing integrated form module, advantage
It is that one template of the utility model is less comprising luminescence unit, can be prevented effectively from because of different batches chip center value difference XOR base
Leaf fat ink difference causes colour development difference, the poor problem of whole screen uniformity, and if luminescence unit failure occurs in integrated form module now
Maintenance cost is high, and the utility model maintenance cost is low.
Brief description of the drawings
The structural representation of the existing PPA supports of Fig. 1.
The structural representation of the existing CHIP type packages supports of Fig. 2.
A kind of Facad structure figure for QFN surface-adhered types RGB LED encapsulation modules that Fig. 3 provides for the utility model.
A kind of sectional view for QFN surface-adhered types RGB LED encapsulation modules that Fig. 4 provides for the utility model.
A kind of inverse layer structure figure for QFN surface-adhered types RGB LED encapsulation modules that Fig. 5 provides for the utility model.
The Facad structure for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 2 that Fig. 6 provides for the utility model
Figure.
The Facad structure for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 3 that Fig. 7 provides for the utility model
Figure.
The Facad structure for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 3 that Fig. 8 provides for the utility model
Figure.
The Facad structure for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 9 that Fig. 9 provides for the utility model
Figure.
A kind of manufacturing flow chart for QFN surface-adhered types RGB LED encapsulation modules that Figure 10 provides for the utility model.
The metal base plate for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 4 that Figure 11 provides for the utility model
Facad structure figure.
The metal base plate for the QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 4 that Figure 12 provides for the utility model
Inverse layer structure figure.
QFN surface-adhered type RGB LED encapsulation modules of one kind 1 × 4 that Figure 13 provides for the utility model do not cut gold
Belong to base plate Facad structure figure.
Description of reference numerals：100th, metal base plate；101st, stent electrode；102nd, pad；103rd, step；104th, Support；
200th, Insulating frame；201st, bowl；301st, RGB LED chips；302nd, key and line；400th, protective layer；400th, protective layer；701st, it is hot
Plastic material；702nd, metal；801st, resin；802nd, flat glue.
Embodiment
To make the purpose of this utility model, technical scheme and advantage clearer, clear and definite, develop simultaneously implementation referring to the drawings
The utility model is further described example.
Fig. 1 is the structural representation of the package support of existing PPA+ copper pin, because the package support of the type passes through
Thermoplastic is adjacent to by injection machine with metal, is not stained with and is connected together, when expanding with heat and contract with cold, and is easily produced between them
Gap, when End-Customer, extraneous water and steam enters in packaging body easily by gap when in use, so as to cause product to lose
Effect.Fig. 2 is the structural representation of existing CHIP type packages support, surrounds glass by using resin 801 and is compacted, then passes through
It is stained with copper platinum circuit etching to form, the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, and
Later stage is molded one layer of flat glue 802 as protective layer again in the plane, and this mode has no idea to form the protection of a cup, will
There are problems.On the other hand, the product shown in Fig. 1 and Fig. 2 is the product of single form, when carrying out follow-up note dress,
Production efficiency is extremely low.
Referring to Fig. 3-Fig. 5, a kind of QFN surface-adhered types RGB LED encapsulation modules provided for the utility model, including envelope
Dress support and the luminescence unit being arranged on the package support, the quantity at least two of the luminescence unit, it is preferable that
The quantity of the luminescence unit can be 2-1000, in the present embodiment, and the quantity of the luminescence unit is 4.The envelope
Filling support includes metal base plate 100 and Insulating frame 200, in actual applications, the material of metal base plate 100 can for copper or
Iron, it is preferable that surface gold-plating is silver-plated, to strengthen electric conductivity, convenient welding.The material of Insulating frame can for epoxy resin,
The materials such as PPA, PCT, are in the present embodiment epoxy resin.Metal base plate 100 is provided with each luminescence unit region
For the stent electrode 101 of die bond and bonding wire, in actual applications, the quantity of stent electrode 101 is four, by metal base plate
100 is etched or be stamped to form.The luminescence unit include being fixed on RGB LED chips 301 on the metal base plate and
Connect setting matcoveredn 400, the branch on the key and line 302 of the RGB LED chips and stent electrode, the luminescence unit
Frame electrode is connected by being arranged on the pad 102 at the back side of metal base plate 100 with external circuit.The utility model is by using metal
Base plate 100 is directly contacted with pcb board, and heat dissipation path is short, and chip heat can be exported quickly.In particular with LED display list
Packaging quantity in plane product is more and more, as long as density lifts a rank, and its heat produced is all very huge
, effectively heat can be discharged using structure of the present utility model.On the other hand, encapsulation module of the present utility model
With multiple luminescence units, it mounts efficiency will lift N times compared to the lamp bead of single form（N is the luminous list in encapsulation module
First quantity）.
Referring to Fig. 4, Insulating frame 200 forms bowl 201 around the luminescence unit., can by the setting of bowl 201
So that RGB LED light is more concentrated, light-emitting area is unique, it is to avoid around other luminescence units influence, and then make to make
Display resolution, bright dark contrast etc. it is more excellent.Meanwhile, the setting of bowl 201 further enhancing the machine to luminescence unit
Tool is protected, it is to avoid the problem of sealer comes off caused by external force is acted on.
In actual production, referring to Fig. 4, step 103 is provided with metal base plate 100, for strengthen metal base plate 100 with
Compactness and stability that Insulating frame 200 is combined, prevent the entrance of water and steam, while further enhancing the machinery of module
Intensity.Preferably, step 103 can be arranged on the front of metal base plate 100, can also be arranged on the reverse side of metal base plate 100, may be used also
To be set in the positive and negative of metal base plate 100 simultaneously, particular number the utility model of step 103 is not also limited.
Referring to Fig. 5, in actual production, it is additionally provided with metal base plate 100 and the highly concordant Support 104 of pad 102.
The setting of Support 104 can ensure the planarization of encapsulation module metal base plate 100 in manufacturing process, prevent metal bottom
Plate 100 is deformed or tilted in die stamping insulation framework.Preferably, Support 102 can be circular, square or other irregular shapes
The Support of shape or support column.The quantity of Support 102 can be one, or multiple, the utility model to this not yet
It is further to be limited.
Referring to Fig. 4, it is preferable that the rough surface of protective layer 400 is non-reflective, further protective layer 400 is with diffusant
Translucent epoxy layer.Protective layer 400 and the seamless combination of bowl 201, further prevent the entrance of water and steam, waterproof effect
Fruit is more far better than existing metal and plastic bonding.On the other hand, the rough surface of protective layer 400 is non-reflective, reduces the external world
The influence of light, further, the translucent epoxy adhesive tape have diffusant, with reference to the structure of bowl 201, form light saturating
Mirror, makes LED light line more concentrate.
Referring to Fig. 6 to Fig. 9, the encapsulation module embodiment with varying number luminescence unit provided for the utility model.
As shown in fig. 6, in the embodiment, the quantity of the luminescence unit is 2, and the quantity of luminescence unit is 3 in Fig. 7, is sent out in Fig. 9
The quantity of light unit is 9.In the utility model, the quantity of the luminescence unit is at least 2, it is preferable that described luminous
The quantity of unit is 2-16.Referring to Fig. 8, the arrangement form of the luminescence unit can also be inverted "L" shaped.For the hair
Arrangement mode the utility model of light unit is not limited, and both can be the arrangement of " one " font or M × N（M and N are equal
For integer）Ranks assembled arrangement, can also be other irregular spread geometries, the utility model is not limited to this.
It should be noted that for those of ordinary skills, can according to the above description be improved or converted, it is all these
Modifications and variations should all belong to the protection domain of the utility model appended claims.
Referring to Figure 10, it is the manufacturing process of above-mentioned QFN surface-adhered types RGB LED encapsulation modules, comprises the following steps：
Step 1：Metal base plate 100 is made into conducting wire by way of etching or punching press；
Step 2：Glue is wrapped on metal base plate 100 by moulding press, the stent electrode 101 of die bond and bonding wire is reserved,
Form package support；
Step 3：Metal is plated on stent electrode 101；
Step 4：By the die bond of RGB LED chips 301 on stent electrode 101, and bonding wire is carried out, form physics and electrically connect
Connect；
Step 5：The injection pressure protective layer 400 on the luminescence unit；
Step 6：Single package module is cut into by cutting machine.
Referring to Figure 11-Figure 13,1 × 4 provided for the utility model（I.e. one luminescence unit possesses 4 luminescence units）'s
The structure diagram of the metal base plate 100 of encapsulation module.In actual production, because stent electrode 101 need to be separate, otherwise will
Cause short circuit, and stent electrode 101 need to such as be electroplated, then all stent electrodes 101 must be connected together.This practicality is new
Type by step 1 by metal base plate 100 by first making conducting wire, and now all stent electrodes 101 also connect together, and are entering
After the plating of row step 3, then metal base plate 100 cut by cutting machine, makes all junctions of stent electrode 101 disconnections,
So as to solve above mentioned problem., can be with for having the situation of varying number luminescence unit in the encapsulation module referring to Figure 13
On the position that the junction of all stent electrodes 101 is arranged on to cutting machine cutting, can so ensure will in cutting action
The junction of all stent electrodes 101 is cut off.It should be noted that closure of the utility model to stent electrode 101
And the concrete shape that etches or be stamped and formed out of metal base plate 100 and circuit are not limited, those of ordinary skill in the art are come
Say, can according to the above description be improved or converted, all these modifications and variations should all belong to the appended power of the utility model
The protection domain that profit is required.
In actual applications, the step 1 is additionally may included in the front of metal base plate 100 and/or reverse side makes step
103.Further, the step 1 is additionally included in the back side of metal base plate 100 and made and the highly concordant Support of pad 102
104。
In actual production, the step 2 forms multiple bowls 201 in molding on metal base plate 100.Pass through bowl
201 setting, can be such that RGB LED light more concentrates, light-emitting area is unique, it is to avoid around other luminescence units shadow
Ring, and then make display resolution, the bright dark contrast made etc. more excellent.Meanwhile, the setting of bowl 201 further enhancing pair
The mechanical protection of luminescence unit, it is to avoid the problem of sealer comes off caused by external force is acted on.
In actual production, the injection pressure mode of the protective layer 400 of the step 5 can be by putting or filling by glue body
Mode is injected in the chamber of bowl 201, it is preferable that from the translucent epoxy glue body with diffusant, reuse heating
Mode is solidified, and the temperature of heating is preferably 100-300 degrees Celsius.Such a mode be full bowl protective layer, protective layer 400 with
The height of bowl 201 is concordant, and the height of bowl 201 can be 0.5-0.7mm, the stability of protective layer 400 that this kind of mode is made
It is higher.
The injecting glue mode can also be to be entered glue laminated in the chamber of bowl 201 by the MGP moulds designed, and the glue is liquid
Body glue or solid gum cake.Such a mode is half bowl protective layer, and the height of bowl 201 is slightly below the height of protective layer 400, bowl
201 height can be 0.3-0.5mm, and the protective layer cost that this kind of mode is supported is relatively low.
The utility model replaces the mode of existing plating thin metal by using metal base plate, enhances electric conductivity,
Directly contacted by metal base plate with pcb board, heat dissipation path is shorter, chip heat can be exported quickly；Bowl is formed by front
The structure of cup, concentrates light, makes light-emitting area unique, and then makes display resolution, the bright dark contrast made etc. more excellent；Pass through
Step is made on metal base plate, it is ensured that the compactness and the stability of package support combined with Insulating frame；Will be multiple luminous
Unit is integrated on a package support, further increases production efficiency, reduces production cost.
It should be appreciated that application of the present utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
Say, can according to the above description be improved or converted, all these modifications and variations should all belong to the appended power of the utility model
The protection domain that profit is required.
Claims (8)
1. a kind of QFN surface-adhered types RGB-LED encapsulation modules, including package support and it is arranged on the package support
Luminescence unit, it is characterised in that the quantity at least two of the luminescence unit, the package support includes metal base plate and exhausted
Edge framework, the metal base plate is provided with the stent electrode for die bond and bonding wire in each luminescence unit region, described
Luminescence unit includes the RGB LED chips being fixed on the metal base plate and connects the RGB LED chips and support electricity
Matcoveredn is set on the key and line of pole, the luminescence unit, and the stent electrode is by being arranged on the weldering at the metal base plate back side
Disk is connected with external circuit.
2. QFN surface-adhered types RGB-LED encapsulation modules according to claim 1, it is characterised in that the Insulating frame
Bowl is formed around the luminescence unit.
3. QFN surface-adhered types RGB-LED encapsulation modules according to claim 1, it is characterised in that the metal base plate
Front and/or reverse side are provided with step.
4. QFN surface-adhered types RGB-LED encapsulation modules according to claim 1, it is characterised in that the metal base plate
On be additionally provided with the Support concordant with the pad height.
5. QFN surface-adhered types RGB-LED encapsulation modules according to claim 1, it is characterised in that the protective layer table
Face is coarse non-reflective.
6. QFN surface-adhered types RGB-LED encapsulation modules according to claim 3, it is characterised in that the number of the step
Amount is at least one.
7. QFN surface-adhered types RGB-LED encapsulation modules according to claim 4, it is characterised in that the Support is
Circular, square or irregular shape supporting construction, the quantity of the Support is at least one.
8. QFN surface-adhered types RGB-LED encapsulation modules according to claim 5, it is characterised in that the protective layer is
Translucent epoxy layer with diffusant.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720312403.9U CN206340542U (en) | 2017-03-28 | 2017-03-28 | A kind of QFN surface-adhered types RGB LED encapsulation modules |
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| CN201720312403.9U CN206340542U (en) | 2017-03-28 | 2017-03-28 | A kind of QFN surface-adhered types RGB LED encapsulation modules |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847800A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method |
| CN108807355A (en) * | 2018-06-05 | 2018-11-13 | 深圳市汉华光电子有限公司 | A kind of adopting surface mounted LED that two sided is luminous |
| CN112382713A (en) * | 2020-10-27 | 2021-02-19 | 浙江英特来光电科技有限公司 | SMD full-color LED packaging structure based on flip-chip technology |
-
2017
- 2017-03-28 CN CN201720312403.9U patent/CN206340542U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847800A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method |
| CN108807355A (en) * | 2018-06-05 | 2018-11-13 | 深圳市汉华光电子有限公司 | A kind of adopting surface mounted LED that two sided is luminous |
| CN112382713A (en) * | 2020-10-27 | 2021-02-19 | 浙江英特来光电科技有限公司 | SMD full-color LED packaging structure based on flip-chip technology |
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Effective date of registration: 20200603 Address after: 271000 intersection of Taihe Road and Hesheng Road, Xintai Economic Development Zone, Tai'an City, Shandong Province Patentee after: Shandong jierunhong Photoelectric Technology Co.,Ltd. Address before: 271200 Xintai Economic Development Zone, Shandong, Tai'an Patentee before: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. |