CN206340568U - A kind of QFN surface mounts RGB LED packages - Google Patents
A kind of QFN surface mounts RGB LED packages Download PDFInfo
- Publication number
- CN206340568U CN206340568U CN201720312410.9U CN201720312410U CN206340568U CN 206340568 U CN206340568 U CN 206340568U CN 201720312410 U CN201720312410 U CN 201720312410U CN 206340568 U CN206340568 U CN 206340568U
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- China
- Prior art keywords
- base plate
- metal base
- rgb
- wire welding
- bowl
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides a kind of QFN surface mounts RGB LED packages, including metal base plate and Insulating frame, the metal base plate front is provided with luminous zone, described light divides into four die bond wire welding areas, for die bond bonding wire, it is connected between the die bond wire welding area by Insulating frame, the Insulating frame forms bowl around the luminous zone, provided with RGB LED chips and the connection RGB LED chips and the key and line of die bond wire welding area in the bowl, the RGB LED chips and key and line are encapsulated in the bowl by the translucent epoxy glue with diffusant, the metal base plate reverse side is provided with the pad for being used for being connected with external circuit.The utility model concentrates light by bowl structure, makes light-emitting area unique, and then make the display resolution made more excellent；Directly contacted by metal base plate with pcb board, enhance heat dispersion.
Description
Technical field
The utility model is related to SMD LED encapsulation technologies, more particularly to QFN（Quad Flat No-
LeadPackage, quad flat non-pin package）Surface mount RGB LED packages and its manufacture method.
Background technology
As display screen industry is continued to develop, display screen is with LED by original DIP（dual inline-pin
Package, dual-inline package technology）Structure high-speed is to SMD（Surface Mounted Devices, surface mount device
Part）Structure changes, the LED of SMD structures have it is lightweight, individual it is smaller, automation is installed, lighting angle is big, color is uniform, decline
The advantages of reduction, is increasingly accepted, although general SMD LED have an above advantage, but there are that decay is larger, lead
Hot path length, carrying electric current are low, production is complicated, and reliability is low, and humidity resistance is low, the problems such as against weather is poor.If do not changed
In the case of the overall structure for becoming product, the reliability of product is improved, so far in the industry cycle still without preferable solution.
In existing SMD RGB LED manufactures, using PLCC4（Plastic Leaded Chip Carrier 4,
Special pin chip package）The product of structure（Such as 3528,2121,1010 equal-specifications）, but said structure is all using common
Mode：PPA+ copper or iron pin（As shown in Figure 1）, or PCB+ copper platinum plating modes（As shown in Figure 2）.This two kinds of modes
Product has inborn deficiency, as PPA+ metal pins modes, is to be entered thermoplastic 701 with metal 702 by injection machine
Row is adjacent to, and is not stained with and is connected together, when expanding with heat and contract with cold, easy generation gap between them, when End-Customer is outer when in use
The water and steam on boundary enter in packaging body easily by gap, so as to cause product failure；And PCB schemes are mainly used in small
Away from it also has its inborn deficiency, and it is to surround glass by using resin 801 to be compacted first, then by being stained with copper platinum
Circuit etching is formed, and the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, and the later stage is flat
One layer of flat glue 802 is molded on face again as protective layer, this mode has no idea to form the protection of a cup, can exist following
Problem：Because being to be stained with conjunction by two layers, edge is not protected, and water and steam are easy to by entering lamp body between the two
Between, cause product failure；Circuit is to be used for conductive and radiating by electroplating the very thin metal of last layer, is radiated poor.
Therefore, prior art has yet to be improved and developed.
Utility model content
It is an object of the invention to provide a kind of QFN surface mounts RGB LED packages and its manufacture method, it is intended to solves
Existing SMD RGB LED packages heat dispersion is poor, poor waterproof properties the problem of.
To solve the above problems, the technical solution of the utility model is as follows：
A kind of QFN surface mounts RGB LED packages, including metal base plate and Insulating frame, the metal base plate front
Provided with luminous zone, it is described it is luminous divide into four die bond wire welding areas, for die bond bonding wire, by insulating between the die bond wire welding area
Framework is connected, and the Insulating frame is formed around the luminous zone is provided with RGB LED chips and company in bowl, the bowl
The key and line of the RGB LED chips and die bond wire welding area are connect, the RGB LED chips and key and line pass through with diffusant
Translucent epoxy glue is encapsulated in the bowl, and the metal base plate reverse side is provided with the weldering for being used for being connected with external circuit
Disk.
Described QFN surface mount RGB LED packages, wherein, the metal base plate front and/or reverse side are provided with platform
Rank.
Described QFN surface mount RGB LED packages, wherein, it is additionally provided with the metal base plate high with the pad
The concordant Support of degree.
Described QFN surface mount RGB LED packages, wherein, four regions of the luminous zone are divided into positioned at centre
For placing " L " shape of RGB LED chips or the chip weld zone of inverted "L" shaped and being located at the upper left corner, the upper right corner and the right side respectively
The first wire welding area, the second wire welding area and the 3rd wire welding area of inferior horn.
Described QFN surface mount RGB LED packages, wherein, the protective layer is coarse non-reflective.
Described QFN surface mount RGB LED packages, wherein, the protective layer is the epoxy resin with diffusant
Layer.
The beneficial effects of the utility model include：The utility model provide QFN surface mount RGB LED packages and its
Manufacture method, using QFN encapsulating structure, the mode of existing plating thin metal is replaced by using metal base plate, enhances and leads
Electrical property, is directly contacted, heat dissipation path is shorter by metal base plate with pcb board, and chip heat can be exported quickly；Pass through front
The structure of bowl is formed, light is concentrated, makes light-emitting area unique, and then makes display resolution, bright dark contrast for making etc. more
It is excellent；By making step on metal base plate, it is ensured that the compactness and the stability of package support combined with Insulating frame.
Brief description of the drawings
The structural representation of the existing PPA supports of Fig. 1.
The structural representation of the existing CHIP type packages supports of Fig. 2.
A kind of profile for QFN surface mounts RGB LED packages that Fig. 3 provides for the utility model.
A kind of front elevation for QFN surface mounts RGB LED packages that Fig. 4 provides for the utility model.
A kind of back view for QFN surface mounts RGB LED packages that Fig. 5 provides for the utility model.
A kind of manufacturing flow chart for QFN surface mounts RGB LED packages that Fig. 6 provides for the utility model.
Description of reference numerals：1st, metal base plate；2nd, Insulating frame；101st, step；102nd, Support；103rd, pad；104、
First wire welding area；105th, the second wire welding area；106th, the 3rd wire welding area；107th, chip weld zone；201st, bowl；202nd, epoxy resin
Glue；301st, RGB LED chips；302nd, key and line；701st, thermoplastic；702nd, metal；801st, resin；802nd, flat glue.
Embodiment
To make the purpose of this utility model, technical scheme and advantage clearer, clear and definite, develop simultaneously implementation referring to the drawings
The utility model is further described example.
Fig. 1 is the structural representation of the package support of existing PPA+ copper pin, because the package support of the type passes through
Thermoplastic is adjacent to by injection machine with metal, is not stained with and is connected together, when expanding with heat and contract with cold, and is easily produced between them
Gap, when End-Customer, extraneous water and steam enters in packaging body easily by gap when in use, so as to cause product to lose
Effect.Fig. 2 is the structural representation of existing CHIP type packages support, surrounds glass by using resin and is compacted, then by being stained with
Upper copper platinum circuit etching is formed, and the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, then
Phase is molded one layer of flat glue as protective layer again in the plane, and this mode has no idea to form the protection of a cup, there will be
Problems.
Referring to Fig. 3-Fig. 5, a kind of QFN surface mounts RGB LED packages provided for the utility model, including metal bottom
Plate 1 and Insulating frame 2.The material of metal base plate 1 can be copper or iron etc., and electroplate or gold-plated strengthens electric conductivity, convenient weldering
Connect.Insulating frame 2 can be made of thermoplasticity or thermosets, it is preferred to use thermosets is made, it is ensured that
During product use, the stability of Insulating frame 2 will not be influenceed because of temperature change；Further, its material can be with
It is in the present embodiment epoxy resin for the material such as epoxy resin, PPA, PCT.Existing electricity is replaced by using metal base plate 1
The mode of thin metal is plated, electric conductivity is enhanced, meanwhile, directly contacted by metal base plate 1 with pcb board, heat dissipation path is shorter,
Chip heat can be exported quickly.
The front of metal base plate 1 is provided with luminous zone, and described light divides into four die bond wire welding areas, for die bond bonding wire, institute
State and be connected by Insulating frame between die bond wire welding area.The shape and structure of the die bond wire welding area are not limited.Preferably, for
QFN surface mounting structures are closed, the die bond bonding wire is divided into positioned at the middle core for being used to place the inverted "L" shaped of RGB LED chips
Piece weld zone 107 and respectively be located at the upper left corner, first wire welding area 104 in the upper right corner and the lower right corner, the second wire welding area 105 and
3rd wire welding area 106, aforementioned four die bond wire welding area constitutes a square overall luminous zone.
Insulating frame 2 forms bowl 201 around the luminous zone, in bowl 201 provided with RGB LED chips 301 and
Connect RGB LED chips 301 and the key and line 302 of die bond wire welding area.The structure of bowl 201 is formed by front, light is concentrated,
Make light-emitting area unique, and then make display resolution, the bright dark contrast made etc. more excellent.In actual applications, RGB LED cores
Piece 301 can select to be fixed on chip weld zone 107, the first wire welding area 104, the second wire welding area 105 or the 3rd by crystal-bonding adhesive
On the one of region in wire welding area 106, it is preferable that can select RGB LED chips 301 by crystal-bonding adhesive to be fixed on chip weldering
Connect in area 107, the first wire welding area 104, the second wire welding area 105 or the 3rd wire welding area 106 one of them as public polar region, favorably
Concentrated in light.RGB LED chips 301 and key and line 302 are encapsulated in institute by the translucent epoxy glue with diffusant
State in bowl, translucent epoxy glue prevents that steam from penetrating into, compared with the simple mould of technology with the formation protective layer of bowl 201
The protective layer of pressure is different, because the material of bowl 201 is similarly epoxide-resin glue, because the protective layer of the utility model formation is same
Bowl 201 can combine closely, and the waterproof effect than the bonding of the metal and plastics of prior art is far better.On the other hand,
The translucent epoxy adhesive tape has diffusant, with reference to the structure of bowl 201, forms optical lens, LED light line is more collected
In.The reverse side of metal base plate 1 is provided with the pad 103 for being used for being connected with external circuit.
In actual applications, the front of metal base plate 1 and/or reverse side are provided with step 101, for strengthening the metal base plate
1 compactness and stability combined with Insulating frame 2, prevents the entrance of water and steam, while further enhancing the machine of support
Tool intensity.Preferably, the tow sides of metal base plate 1 are provided with step 101.
Referring to Fig. 5, it is additionally provided with the reverse side of metal base plate 1 and the highly concordant Support 102 of pad 103.Supporting construction 102
Setting can ensure the planarization of metal base plate 1 in support manufacturing process.Preferably, Support 102 can be circular, square
Or Support or the support column of irregular shape.
Referring to Fig. 6, a kind of manufacturing process of the QFN surface mounts RGB LED packages provided for the utility model, including
Following steps：
Step 1：Metal base plate 1 is made into conducting wire by way of etching or punching press, made at the back side of metal base plate 1
Pad 103；In actual production, to improve production efficiency, multiple package supports are disposably produced, one piece big metallic plate can be entered
Row processing, while etching multiple metal base plates 1, and is cut in subsequent handling.
Step 2：Glue is wrapped on metal base plate 1 by moulding press, the metal electrode of die bond and bonding wire is reserved, tool is formed
There is the package support of bowl shape；To ensure swelling stress release of the metal base plate 1 under subsequent high temperature, with single metal base plate 1
For unit, release hollow out is made on each unit periphery, and takes around datum line of the datum line as follow-up cutting action.
Step 3：Metal is plated on the metal electrode by plating or depositional mode, is conducive to follow-up welding, leads
It is electric and reflective.
Step 4：By the die bond of RGB LED chips 301 in the bowl 201 of the package support, and carry out bonding wire, formation
Reason is electrically connected with.
Step 5：Epoxide-resin glue of the injection pressure with diffusant is protected and optical lens in bowl 201.The injecting glue side
Formula can inject the epoxide-resin glue liquid of the diffusant in the bowl chamber by way of putting or filling, and reuse heating
Mode solidified, the temperature of heating is preferably 100-300 degrees Celsius.Such a mode be full bowl protective layer, protective layer with
The height of bowl 201 is concordant, and the height of bowl 201 can be 0.5-0.7mm, and the protective layer stability that this kind of mode is made is more
It is high.
The injecting glue mode can also be to be pressed into institute by the MGP moulds designed by the epoxide-resin glue of the diffusant
State in bowl chamber, the epoxide-resin glue of the diffusant is liquid glue or solid gum cake.Such a mode is half bowl protective layer, bowl
The height of cup 201 is slightly below the height of protective layer, and the height of bowl 201 can be 0.3-0.5mm, the protection that this kind of mode is supported
Layer cost is relatively low.
In actual applications, the manufacture method of described QFN surface mount RGB LED packages, wherein, the step 1
It is additionally included in the front of metal base plate 1 and/or reverse side makes step 101, is made at the back side of metal base plate 1 and the height of pad 103
Concordant Support 102.
In actual applications, after packaging body making is completed, also need to carry out baking aging to the packaging body, it is entered one
Step is stable, and baking temperature is 100-300 degrees Celsius, then is cut into single led product by cutting machine.
It should be appreciated that application of the present utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
Say, can according to the above description be improved or converted, all these modifications and variations should all belong to the appended power of the utility model
The protection domain that profit is required.
Claims (6)
1. a kind of QFN surface mounts RGB-LED packaging bodies, it is characterised in that including metal base plate and Insulating frame, the metal
Base plate front is provided with luminous zone, it is described it is luminous divide into four die bond wire welding areas, for die bond bonding wire, the die bond wire welding area it
Between be connected by Insulating frame, the Insulating frame forms bowl around the luminous zone, and RGB LED cores are provided with the bowl
Piece and the connection RGB-LED chips and the key and line of die bond wire welding area, the RGB LED chips and key and line pass through protection
Layer is encapsulated in the bowl, and the metal base plate reverse side is provided with the pad for being used for being connected with external circuit.
2. QFN surface mounts RGB-LED packaging bodies according to claim 1, it is characterised in that the metal base plate front
And/or reverse side is provided with step.
3. QFN surface mounts RGB-LED packaging bodies according to claim 1, it is characterised in that on the metal base plate also
Provided with the Support concordant with the pad height.
4. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the luminous zone
Four regions are divided into be used to place " L " shape of RGB LED chips or the chip weld zone of inverted "L" shaped and respectively position positioned at middle
The first wire welding area, the second wire welding area and the 3rd wire welding area in the upper left corner, the upper right corner and the lower right corner.
5. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the protective layer table
Face is coarse non-reflective.
6. QFN surface-adhered types RGB-LED package supports according to claim 5, it is characterised in that the protective layer is
Epoxy resin layer with diffusant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720312410.9U CN206340568U (en) | 2017-03-28 | 2017-03-28 | A kind of QFN surface mounts RGB LED packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720312410.9U CN206340568U (en) | 2017-03-28 | 2017-03-28 | A kind of QFN surface mounts RGB LED packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206340568U true CN206340568U (en) | 2017-07-18 |
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| CN201720312410.9U Active CN206340568U (en) | 2017-03-28 | 2017-03-28 | A kind of QFN surface mounts RGB LED packages |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
| CN108550682A (en) * | 2018-05-15 | 2018-09-18 | 深圳市泛珠科技发展有限公司 | A kind of LED light |
-
2017
- 2017-03-28 CN CN201720312410.9U patent/CN206340568U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
| CN108550682A (en) * | 2018-05-15 | 2018-09-18 | 深圳市泛珠科技发展有限公司 | A kind of LED light |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200527 Address after: 271000 intersection of Taihe Road and Hesheng Road, Xintai Economic Development Zone, Tai'an City, Shandong Province Patentee after: Shandong jierunhong Photoelectric Technology Co., Ltd Address before: 271200 Xintai Economic Development Zone, Shandong, Tai'an Patentee before: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. |