CN101276866B - High power LED bracket as well as high power LED made by the same - Google Patents
High power LED bracket as well as high power LED made by the same Download PDFInfo
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- CN101276866B CN101276866B CN2008100271489A CN200810027148A CN101276866B CN 101276866 B CN101276866 B CN 101276866B CN 2008100271489 A CN2008100271489 A CN 2008100271489A CN 200810027148 A CN200810027148 A CN 200810027148A CN 101276866 B CN101276866 B CN 101276866B
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- heat sink
- power led
- bracket
- led
- high power
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Abstract
The invention discloses a high power LED bracket and a high power LED manufactured with the bracket; the main components comprises thermal sink, a thermal sink adhering part, a pipe support part, an electrode part, a connecting part for connecting each part and a plurality of unit, a plastic rubber, a LED chip, and a package rubber, comprising the following steps of adhering the thermal sink on a lead bracket to from the thermal sink adhering part through die cutting, packaging the thermal sink, the lead bracket by the plastic rubber and forming a high power LED bracket, and then finishing pipe core installation, gold thread bonding and packaging, cutting and blending connected member to form independent high power LED respectively. The invention pastes the thermal sink to the lead frame directly, which provides a high power LED bracket with high production efficiency, and flexible adjustment of light emitting characteristic, for application of packaging and manufacturing high power LED.
Description
Technical field
The present invention relates to electronic technology field, the great power LED that more particularly relates to a kind of high-power LED bracket and utilize this support to make.
Background technology
5 years in 10 years, as the solid-state illumination lamp of new light sources, will engender each corner with light-emitting diode (LED) in traditional lighting market.Aspect the encapsulation of device, each big LED manufacturing enterprise of the world various power-type LED products that released one after another.The name of U.S. lumileds company application is called " SURFACE MOUNTABLE LED PACKAGE ", the patent No. is the patent of " US6274924 ", introduced a kind of high-power LED encapsulation structure with radiating block, as shown in Figure 1, it is characterized in that: on the basis of PLCC type LED plastic packaging framework 1-1, add radiating block 1-2, metallic support 1-3 goes up plastic packaging white or black colloid 1-4, form cavity, fixed electrode lead-in wire 1-3 and radiating block 1-2, chip 1-5 and heat sink 1-6 are placed in the reflector 1-7 of radiating block 1-2, and optical lens 1-8 is installed in the framework top.
And for example the name of U.S. Cree company application is called " POWER SURFACE MOUNTLIGHT EMITTING DIE PACKAGE ", the patent No. is the patent of " US7264378 ", introduced a kind of power LED encapsulating structure, as shown in Figure 2, it is characterized in that: chip 2-1 directly is placed on the ceramic substrate 2-2 that is printed with circuit, ceramic substrate 2-2 and circuit thereof are formed heat radiation and the conductive structure of LED, ceramic substrate 2-2 installs a metal reflection cavity 2-3 in the top, and support of lens 2-4 also forms optical texture.
As the patent No. is the power led and manufacture method of " 200410027393.1 " application, a kind of great power LED manufacture method of using the metal material of special shape as down-lead bracket has been proposed, down-lead bracket directly constitutes the heat sink 3-1 of great power LED, but material design alteration expense height, in case design typification, to be difficult to change, can not adapt to flexible and changeable application demand.Therefore need the high novel product of a kind of production efficiency of exploitation, to satisfy the growing market demand.
Summary of the invention
Purpose of the present invention is exactly provide for the deficiency that solves prior art a kind of not only simple in structure, production efficiency is high, and the low high-power LED bracket of cost.
Another object of the present invention provide a kind of not only simple in structure, production efficiency is high, and the low great power LED of cost.
The present invention adopts following technical solution to realize above-mentioned purpose: a kind of high-power LED bracket, it is characterized in that, comprise the down-lead bracket that constitutes by electrode part, the heat sink connecting portion that mounts portion, body support portion and connection each several part, electrode part mainly is made of two metal substrates of mutually insulated, heat sink mounting is pasted with heat sinkly in the portion, the periphery encapsulation plastic packaging colloid of heat sink and down-lead bracket also forms half encapsulating structure.
As further specifying of such scheme, the described heat sink reflector that led chip is installed that is provided with, heat sink is circular, square or rectangle.
The described heat sink portion of mounting is a plane, square groove, rectangular recess, circular groove or bending wall.
Described heat sink and down-lead bracket surface gold-plating or silver.
Described down-lead bracket and on the heat sink formation one led support monomer structure that mounts, a plurality of led support monomers connect and compose the array structure of the capable N row of M, M 〉=1, N 〉=1.
A kind of great power LED that utilizes high-power LED bracket to prepare comprises led support, led chip and packing colloid, it is characterized in that, described led chip is placed on heat sink in half encapsulating structure of led support, and packing colloid encapsulates described led chip.
The beneficial effect that the present invention adopts above-mentioned technical solution to reach is:
1, the present invention adopts a metal substrate as stock, carry out the punching press shaping, form the heat sink connecting portion that mounts portion, body support portion, electrode part and connect each several part and a plurality of unit, form down-lead bracket, can directly the heat sink technology of SMT that adopts be mounted on the down-lead bracket, and can make array structure by monomer, be applicable to production in enormous quantities.
But 2 flexible products go out light characteristic, and the present invention is simple in structure, are made of down-lead bracket, heat sink, plastic packaging colloid, led chip and packing colloid, can produce out the different power LED product of light characteristic by adjusting combination heat sink and support.
Description of drawings
Fig. 1 is the known lumileds power led figure of company;
Fig. 2 is the known Cree power led figure of company;
Fig. 3 is known power light-emitting diode figure;
Fig. 4～Fig. 5 finishes schematic diagram for the down-lead bracket punching press of great power LED of the present invention;
Fig. 6～Fig. 7 is the heat sink assembling schematic diagram of great power LED of the present invention;
Fig. 8～Fig. 9 finishes schematic diagram for the down-lead bracket injection moulding of great power LED of the present invention;
Figure 10～Figure 11 is for the tube core of great power LED of the present invention is laid, the gold thread bonding is finished schematic diagram;
Figure 12～Figure 13 finishes schematic diagram for the encapsulation of great power LED of the present invention;
Figure 14～Figure 15 is for the pin of great power LED of the present invention thrusts, the bending schematic diagram;
Figure 16 is a final products profile schematic diagram of the present invention.
Description of reference numerals: 1, down-lead bracket 1-1, LED plastic packaging framework 1-2, radiating block 1-3, metallic support 1-4, colloid 1-5, chip 1-6, heat sink 1-7, reflector 1-8, optical lens 2, heat sink 2-1, chip 2-2, ceramic substrate 2-3, metal reflection cavity 2-4, support of lens 3, plastic packaging colloid 3-1, heat sink 4, led chip 5, packing colloid
Embodiment
As Fig. 4～shown in Figure 14, high-power LED bracket of the present invention and the great power LED that utilizes this support to make, it comprises down-lead bracket 1, heat sink 2, plastic packaging colloid 3, led chip 4 and packing colloid 5, led chip 4 is placed in heat sink 2 surfaces, down-lead bracket 1 comprises electrode part, the heat sink portion that mounts, body support portion and the connecting portion that connects each several part, electrode part mainly is made of two metal substrates of mutually insulated, heat sink 2 are mounted on heat sink mounting in the portion, heat sink 2 is circular, square or rectangle, and has a reflector that led chip is installed, the heat sink portion of mounting is a plane, square groove, rectangular recess, circular groove or bending wall, heat sink 2 and the silver coated or golden layer in down-lead bracket 1 surface, plastic packaging colloid 3 packaging heat sinks 2 and down-lead bracket 1, and form half encapsulating structure, thus form high-power LED bracket with reflection cavity.
The present invention makes the method for great power LED, and it may further comprise the steps:
1, die-cut: as to use a metal substrate as basic material, carry out punching molding, form the heat sink connecting portion that mounts portion, body support portion, electrode part and connect each several part and a plurality of unit, form down-lead bracket;
2, heat sink mounting: be mounted on the described heat sink portion that mounts with heat sink, and weld together;
3, electroplate: described down-lead bracket and affiliated heat sink surface are electroplated one deck gold or silver-colored;
4, plastic packaging moulding: adopt half encapsulating structure to encapsulate described heat sink and described down-lead bracket, form high-power LED bracket with reflection cavity;
5, chip mount: in the reflection cavity of described down-lead bracket, lay led chip, and carry out the gold thread bonding, described led chip is linked to each other with corresponding electrode part;
6, encapsulation: described led chip and described reflection cavity are encapsulated;
7, connecting muscle thrusts: thrust being connected and bending of great power LED that encapsulation finishes and down-lead bracket, separation forming independently great power LED.
Described heat sink being mounted on after heat sink on the down-lead bracket mount portion links together by modes such as reflow soldering, ultra-sonic welded.
The present invention is not limited to the foregoing description; describedly heat sinkly can also adopt other version except being designed to circle, square or rectangle, any those skilled in the art can do numerous modifications and variations; under the spirit that does not break away from invention, all in the claimed scope of the present invention.
Claims (5)
1. high-power LED bracket, comprise the down-lead bracket that constitutes by electrode part, the heat sink connecting portion that mounts portion, body support portion and connection each several part, electrode part mainly is made of two metal substrates of mutually insulated, heat sink mounting is pasted with heat sinkly in the portion, the periphery encapsulation plastic packaging colloid of heat sink and down-lead bracket also forms half encapsulating structure; The described heat sink reflector that led chip is installed that is provided with, heat sink is circular or square; It is characterized in that the described heat sink portion of mounting is square groove or circular groove.
2. high-power LED bracket according to claim 1 is characterized in that, described heat sink and down-lead bracket surface gold-plating or silver.
3. high-power LED bracket according to claim 1 is characterized in that, described down-lead bracket and on the heat sink formation one led support monomer structure that mounts, a plurality of led support monomers connect and compose the array structure of the capable N row of M, M 〉=1, N 〉=1.
4. high-power LED bracket according to claim 1 is characterized in that, described heat sink be rectangle; The described heat sink portion of mounting is a rectangular recess.
5. any described great power LED that utilizes high-power LED bracket to prepare in the claim 1～4, comprise led support, led chip and packing colloid, it is characterized in that, described led chip is placed on heat sink in half encapsulating structure of led support, and packing colloid encapsulates described led chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100271489A CN101276866B (en) | 2008-04-01 | 2008-04-01 | High power LED bracket as well as high power LED made by the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100271489A CN101276866B (en) | 2008-04-01 | 2008-04-01 | High power LED bracket as well as high power LED made by the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101276866A CN101276866A (en) | 2008-10-01 |
| CN101276866B true CN101276866B (en) | 2011-10-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008100271489A Active CN101276866B (en) | 2008-04-01 | 2008-04-01 | High power LED bracket as well as high power LED made by the same |
Country Status (1)
| Country | Link |
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| CN (1) | CN101276866B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867005A (en) * | 2010-06-13 | 2010-10-20 | 天津市卓辉电子有限公司 | Method for bonding a plurality of LED chips on thermal conducting substrate |
| CN102456818A (en) * | 2010-11-03 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | Lead frame with light-emitting diode |
| CN103165039B (en) * | 2013-04-02 | 2015-06-17 | 佛山市国星光电股份有限公司 | High-contrast light-emitting diode (LED) display module and production method thereof |
| CN104167413A (en) * | 2014-08-26 | 2014-11-26 | 桂林电子科技大学 | Lead frame type high-power LED light source module and encapsulating method thereof |
| CN106328640A (en) * | 2016-10-27 | 2017-01-11 | 深圳市彩立德照明光电科技有限公司 | LED packaging base material, packaging method and LED packaged device |
| CN107068836A (en) * | 2017-03-03 | 2017-08-18 | 深圳市长方集团股份有限公司 | Vertical great power LED multidigit support and vertical great power LED preparation method |
| CN106783836A (en) * | 2017-03-27 | 2017-05-31 | 广东美的制冷设备有限公司 | SPM, the preparation method of SPM and power electronic equipment |
| CN111933776B (en) * | 2020-07-29 | 2022-06-28 | 佛山市国星光电股份有限公司 | Support array, single support, device array and light-emitting device |
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2008
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| CN101276866A (en) | 2008-10-01 |
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