CN101958387A - Novel LED light resource module packaging structure - Google Patents

Abstract

The invention provides a novel LED light resource module packaging structure belonging to the processing field of lighting equipment. The novel LED light resource module packaging structure comprises a metal substrate, a circuit board, a reflective cup and an LED chip and is characterized in that the circuit board is embedded on the metal substrate and is exposed out of the upper surface of the metal substrate; the reflective cup is fixed above the circuit board and the metal substrate; at least one LED chip is arranged in the reflective cup and is stuck on the metal substrate on the bottom of the reflective cup by insulating glue; the upper surface of the LED chip is coated with a mixed layer of glue and fluorescent powder; and the LED chip is connected to the circuit board by leads.

Description

New LED light source module packaging structure

【Technical field】

The invention relates to a lighting device, in particular to an LED light source module.

【Background technique】

LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various low-voltage lighting devices. The packaging structure of traditional high-power LED chips or multi-chip LED light source modules with a high degree of integration is generally It is realized by using a metal substrate. The specific structure generally uses a high thermal conductivity metal (such as copper, aluminum, etc.) The LED chip is installed in the center, and the LED chip is connected to the circuit connection layer, and then a glue and phosphor powder mixed layer is coated on the upper surface of the LED chip to complete the package. In the above-mentioned traditional LED light source module packaging structure, since the LED chip and the circuit connection layer need to be connected by leads, but the LED chip is arranged inside the reflector cup, and the circuit board is arranged outside the reflector cup, so in the production process In the process, it is easy to damage the lead wire between the LED chip and the circuit board due to artificial breakage, which greatly reduces the production efficiency, and the production process becomes more complicated, which increases the production cost, and because the traditional metal substrate needs to use a large The insulating layer of the large area leads to poor heat dissipation performance of the entire package structure, which is not conducive to the life of the product.

【Content of invention】

The technical problem to be solved by the present invention is to provide a new LED light source module packaging structure with better heat dissipation performance and lower production cost.

The present invention is achieved in the following way: a novel LED light source module packaging structure, including a metal substrate, a circuit board, a reflector and an LED chip, characterized in that the circuit board is embedded in the metal substrate and exposed on the metal substrate A reflective cup is fixed above the surface, the circuit board and the metal substrate, and at least one LED chip is installed in the reflective cup. The layer is mixed with phosphor powder, and the LED chips are connected to the circuit board through wires.

An electroplated reflective layer is provided on the upper surface of the metal substrate.

The reflective cup is ring-shaped and made by injection molding or spot molding.

One end of the metal base plate is provided with a buckle, and the corresponding position of the other end is provided with a corresponding slot.

The present invention has the following advantages: by adopting the above-mentioned packaging method, the LED chip, the circuit board and the wires between them can all be packaged under the mixed layer of glue and phosphor powder, which can be directly completed in one step in the process of LED chip packaging. , which greatly improves the production efficiency, reduces the damage of the wires in the production process, and saves the production cost; besides the reflection of light, the reflective cup can also firmly install the circuit board inside the metal substrate; at the same time, because the LED chip can be directly It is installed and fixed on the metal substrate, which can greatly improve the heat dissipation performance and prolong the life of the product.

【Description of drawings】

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of the overall structure of the packaging structure of the novel LED light source module of the present invention.

Fig. 2 is a cross-sectional view along line A-A of Fig. 1 .

Fig. 3 is a schematic side view of the package structure of the novel LED light source module of the present invention.

Fig. 4 is a schematic diagram of the connection structure among the metal substrate, the circuit board and the reflective cup of the novel LED light source module packaging structure of the present invention.

【Detailed ways】

The present invention will be described in detail below in conjunction with specific embodiments.

Please refer to Fig. 1 to Fig. 4, which are the novel LED light source module package structure described in the present invention, including a metal substrate 1, a circuit board 2, a reflector 3 and an LED chip 4, and the metal substrate embedded in the metal substrate 1 There is a strip-shaped groove 11 in the middle, and a circuit board 2 is embedded in the groove 11, and the circuit board 2 is exposed on the upper surface of the metal substrate 1. The circuit board 2 is provided with a prefabricated connection circuit, and the circuit board 2 The two ends of the board 2 are respectively led to the two ends of the metal substrate 1 to form positive and negative electrodes. There are several reflective cups 3 fixed above the circuit board 2 and the metal substrate 1. Several LED chips 4 are installed in the reflective cups 3. The LED chips 4 pass through Insulation glue is attached to the rest of the circuit board 2 on the metal substrate 1 at the bottom of the reflector 3, the upper surface of the LED chip 4 is coated with a glue and phosphor powder mixed layer 5, and the LED chip 4 is connected by a wire 6 to circuit board 2. The upper surface of the metal substrate 1 is provided with an electroplated reflective layer 7. In this embodiment, the reflective layer is a silver-plated layer. The reflective cup 3 is ring-shaped. In this embodiment, a circular reflective cup is used. Made by injection molding or spot molding. At the same time, it can also be realized by adopting a square annular reflector cup in the present invention. One end of the metal substrate 1 is provided with a buckle 8 that is wide outside and narrow inside, and the corresponding position at the other end is provided with a slot 9 of the same shape, so that multiple identical modules can be easily buckled. Connected together, such as used in the purpose of long strip lights.

Claims (4)

1. A novel LED light source module packaging structure, comprising a metal substrate, a circuit board, a reflector and an LED chip, characterized in that: the circuit board is embedded in the metal substrate and exposed on the upper surface of the metal substrate, and the circuit board and A reflective cup is fixed above the metal substrate, and at least one LED chip is installed in the reflective cup. The LED chip is glued to the metal substrate at the bottom of the reflective cup through insulating glue. The upper surface of the LED chip is coated with a mixed layer of glue and fluorescent powder. , the LED chips are connected to the circuit board through wires. 2. The novel LED light source module packaging structure according to claim 1, wherein an electroplated reflective layer is provided on the upper surface of the metal substrate. 3. The packaging structure of the novel LED light source module according to claim 1, wherein the reflector is ring-shaped and made by injection molding or point molding. 4. The packaging structure of the novel LED light source module according to claim 1, characterized in that: one end of the metal substrate is provided with a buckle, and the corresponding position of the other end is provided with a corresponding slot.

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