CN101958387A - Novel LED light resource module packaging structure - Google Patents
Novel LED light resource module packaging structure Download PDFInfo
- Publication number
- CN101958387A CN101958387A CN2010102292468A CN201010229246A CN101958387A CN 101958387 A CN101958387 A CN 101958387A CN 2010102292468 A CN2010102292468 A CN 2010102292468A CN 201010229246 A CN201010229246 A CN 201010229246A CN 101958387 A CN101958387 A CN 101958387A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- led chip
- reflector
- led light
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The invention provides a novel LED light resource module packaging structure belonging to the processing field of lighting equipment. The novel LED light resource module packaging structure comprises a metal substrate, a circuit board, a reflective cup and an LED chip and is characterized in that the circuit board is embedded on the metal substrate and is exposed out of the upper surface of the metal substrate; the reflective cup is fixed above the circuit board and the metal substrate; at least one LED chip is arranged in the reflective cup and is stuck on the metal substrate on the bottom of the reflective cup by insulating glue; the upper surface of the LED chip is coated with a mixed layer of glue and fluorescent powder; and the LED chip is connected to the circuit board by leads.
Description
[technical field]
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of led light source module.
[background technology]
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, the encapsulating structure of the multi-chip LED light source module that traditional high-power LED chip or degree of integration are higher generally adopts metal substrate to realize, concrete structure generally adopts at the high-thermal conductive metal with reflector (as copper, aluminium etc.) as basic unit, again insulating barrier and circuit articulamentum are compounded in the basic unit, form whole metal substrate, led chip is installed by central authorities at reflector, led chip is connected to the circuit articulamentum, again the upper surface of led chip is applied a glue and the fluorescent material mixed layer is finished encapsulation.In above-mentioned traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the circuit articulamentum is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people, greatly reduce production efficiency, and it is more complicated that production process also becomes, increase production cost, and because traditional metal substrate need adopt large-area insulating barrier, cause the heat dispersion of whole encapsulating structure relatively poor, be unfavorable for the life-span of product.
[summary of the invention]
The technical problem to be solved in the present invention is to provide a kind of heat dispersion better, and can save the Novel LED light source module package structure of production cost.
The present invention is achieved in that a kind of Novel LED light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board be embedded metal substrate and outside be exposed at the upper surface of metal substrate, wiring board and metal substrate upper fixed have reflector, at least one led chip is installed in the reflector, this led chip is bonded at by insulating cement on the metal substrate of bottom of reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board by lead.
The upper surface of described metal substrate is provided with a reflector layer of electroplating.
Described reflector is a ring-type, makes by injection moulding or the some mode of moulding.
One end of described metal substrate is provided with a buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
The present invention has following advantage: adopt above-mentioned packaged type, can make led chip and wiring board and the lead between them, all be encapsulated in below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost; Wherein reflector can also be fixedly mounted in wiring board metal substrate inside except as the reflection of light effect; Because led chip can directly be fixed on the metal substrate, can improve heat dispersion widely simultaneously, improve the life-span of product.
[description of drawings]
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram of Novel LED light source module package structure of the present invention.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the side schematic view of Novel LED light source module package structure of the present invention.
Fig. 4 is the syndeton schematic diagram between metal substrate, wiring board and the reflector of Novel LED light source module package structure of the present invention.
[embodiment]
The present invention will be described in detail below in conjunction with specific embodiment.
See also Fig. 1 to shown in Figure 4, it is Novel LED light source module package structure of the present invention, comprise metal substrate 1, wiring board 2, reflector 3 and led chip 4, the described groove 11 that is provided with a strip in the centre of metal substrate 1 that is embedded, be embedded with wiring board 2 in the groove 11, and these wiring board 2 outer upper surfaces that are exposed at metal substrate 1, wiring board 2 is provided with ready made connecting circuit, the two ends that the two ends of wiring board 2 lead to metal substrate 1 respectively form both positive and negative polarity, the upper fixed of wiring board 2 and metal substrate 1 has some reflectors 3, some led chips 4 are installed in the reflector 3, this led chip 4 is bonded at all the other positions outside the wiring board 2 on the metal substrate 1 of bottom of reflector 3 by insulating cement, the upper surface of described led chip 4 is coated with glue and fluorescent material mixed layer 5, and led chip 4 is connected on the wiring board 2 by lead 6.The upper surface of described metal substrate 1 is provided with a reflector layer 7 of electroplating, and this reflector layer adopts silver coating in the present embodiment, and described reflector 3 is a ring-type, and what adopt in the present embodiment is circular reflector, makes by injection moulding or the some mode of moulding.Also can adopt square ring-type reflector to realize among the present invention simultaneously.One end of described metal substrate 1 is provided with a buckle wide outside and narrow inside 8, and the opposite position of the other end is provided with the draw-in groove 9 that shape is identical with it, so just can easily a plurality of same modules be snapped together, as using on the purposes of long strip type lamp bar.
Claims (4)
1. Novel LED light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board be embedded metal substrate and outside be exposed at the upper surface of metal substrate, wiring board and metal substrate upper fixed have reflector, at least one led chip is installed in the reflector, this led chip is bonded at by insulating cement on the metal substrate of bottom of reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board by lead.
2. Novel LED light source module package structure according to claim 1 is characterized in that: the upper surface of described metal substrate is provided with a reflector layer of electroplating.
3. Novel LED light source module package structure according to claim 1 is characterized in that: described reflector is a ring-type, makes by injection moulding or the some mode of moulding.
4. Novel LED light source module package structure according to claim 1 is characterized in that: an end of described metal substrate is provided with a buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102292468A CN101958387A (en) | 2010-07-16 | 2010-07-16 | Novel LED light resource module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102292468A CN101958387A (en) | 2010-07-16 | 2010-07-16 | Novel LED light resource module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101958387A true CN101958387A (en) | 2011-01-26 |
Family
ID=43485611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102292468A Pending CN101958387A (en) | 2010-07-16 | 2010-07-16 | Novel LED light resource module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101958387A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252201A (en) * | 2011-07-06 | 2011-11-23 | 福建省万邦光电科技有限公司 | Light-emitting diode (LED) ball-bulb lamp in convex-cup shape |
| CN102278709A (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | Convex cup base structure for packaging LED light source module |
| CN102278622A (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | LED light source module packaging structure with convex cup structure |
| CN102593325A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED light source module packaging structure |
| CN102593323A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED (light-emitting diode) surface light source packaging piece |
| CN103794698A (en) * | 2012-10-31 | 2014-05-14 | 展晶科技(深圳)有限公司 | Light-emitting diode |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237557A (en) * | 2005-01-27 | 2006-09-07 | Kyocera Corp | Light emitting device |
| CN101132041A (en) * | 2007-09-11 | 2008-02-27 | 东南大学 | Encapsulation structure for improving light extraction efficiency of power light-emitting diodes |
| US20090010009A1 (en) * | 2007-07-06 | 2009-01-08 | Xianghong Yang | Led flat-plate type multi-chip high power light source |
| US20100006886A1 (en) * | 2008-07-10 | 2010-01-14 | Brilliant Technology Co., Ltd. | High power light emitting diode chip package carrier structure |
| CN201758139U (en) * | 2010-07-16 | 2011-03-09 | 福建中科万邦光电股份有限公司 | Novel LED light source module packaging structure |
-
2010
- 2010-07-16 CN CN2010102292468A patent/CN101958387A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237557A (en) * | 2005-01-27 | 2006-09-07 | Kyocera Corp | Light emitting device |
| US20090010009A1 (en) * | 2007-07-06 | 2009-01-08 | Xianghong Yang | Led flat-plate type multi-chip high power light source |
| CN101132041A (en) * | 2007-09-11 | 2008-02-27 | 东南大学 | Encapsulation structure for improving light extraction efficiency of power light-emitting diodes |
| US20100006886A1 (en) * | 2008-07-10 | 2010-01-14 | Brilliant Technology Co., Ltd. | High power light emitting diode chip package carrier structure |
| CN201758139U (en) * | 2010-07-16 | 2011-03-09 | 福建中科万邦光电股份有限公司 | Novel LED light source module packaging structure |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278709A (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | Convex cup base structure for packaging LED light source module |
| CN102278622A (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | LED light source module packaging structure with convex cup structure |
| CN102252201A (en) * | 2011-07-06 | 2011-11-23 | 福建省万邦光电科技有限公司 | Light-emitting diode (LED) ball-bulb lamp in convex-cup shape |
| CN102593325A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED light source module packaging structure |
| CN102593323A (en) * | 2012-03-10 | 2012-07-18 | 江苏索尔光电科技有限公司 | LED (light-emitting diode) surface light source packaging piece |
| CN103794698A (en) * | 2012-10-31 | 2014-05-14 | 展晶科技(深圳)有限公司 | Light-emitting diode |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD. Effective date: 20110321 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20110321 Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Applicant after: Fujian Wanban optoelectronic Technology Co., Ltd. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Applicant before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd. |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110126 |