CN201435411Y - high-power led packaging and mounting structures - Google Patents
high-power led packaging and mounting structures Download PDFInfo
- Publication number
- CN201435411Y CN201435411Y CN2009201425747U CN200920142574U CN201435411Y CN 201435411 Y CN201435411 Y CN 201435411Y CN 2009201425747 U CN2009201425747 U CN 2009201425747U CN 200920142574 U CN200920142574 U CN 200920142574U CN 201435411 Y CN201435411 Y CN 201435411Y
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- Prior art keywords
- led
- electrode
- power led
- heat sink
- mounting structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to high-power LED packaging and mounting structures, wherein the packaging structure comprises a heat sink component (a1), an electrode component (a2), a chip (a3), a gold wire (a4) and a condensing lens (a5), and the mounting structure comprises a secondary heat radiation component, an LED, a clamping plate, a bolt and a circuit lead wire. The high-power LED packaging and mounting structures have simple and compact structure, the electrode component particularly omits the manufacture of a complex lead wire framework which is adopted in the traditional LED technology,the production cost is lowered, the LED and the secondary heat radiation component directly conduct heat in the mounting structure of the high-power LED, and the contact area between the LED and thesecondary heat radiation component is bigger, thermal resistance is obviously reduced, the heat radiation effect of the LED is improved, and the heat radiation problem of a high-power LED module groupcan be obviously resolved when lighting. The high-power LED packaging and mounting structures can be widely used for high-power LED street lamp lighting, LED indoor lighting, LED projection lamps, LED miners' lamps, electric torches and the like.
Description
Technical field
The utility model relates to high-power LED encapsulation and mounting structure design, belongs to field of optoelectronic devices.
Background technology
Great power LED is as light source, because its power consumption is few, the life-span is long, particularly it has the response speed of nanosecond, and the dynamic control of brightness and color is more prone to, and can realize the dynamic change and the Digital Control of color; Can be widely used in each aspect of the modern life.Great power LED can be divided into according to its packaging technology difference: large scale epoxy encapsulation great power LED, imitative Piranha formula epoxy encapsulation great power LED, aluminium base (MCPCB) formula packaged high-power LED, TO packaged high-power LED, power-type SMD packaged high-power LED, the integrated packaged high-power LED of MCPCB or the like.In existing high-power LED encapsulation structure, exist great power LED resin-encapsulated framework cost higher, radiating effect is bad, influences problems such as product useful life.
Summary of the invention
The purpose of this utility model is in order to remedy the deficiency that existing high-power LED encapsulation structure exists, disclose a kind of simple in structure, radiating effect and to get light effect good, high-power LED encapsulation structure and this LED mounting structure of suitable batch production.
The utility model LED encapsulating structure partly is made up of heat sink member, package lens, led chip, electrode member, bonding gold wire, fluorescent material etc.
The top of heat sink member is provided with the fitting recess with prefocus cup, sealing lens; Prefocus cup can or be the parabola revolution for truncated cone-shaped groove, oval revolution, the chips welding position be the end of round platform groove or for the focal position of revolution so that meet the requirement of luminous intensity distribution.The bottom of heat sink member is provided with large-area substrates; The center is provided with the through-hole groove of assembling electrode member or is provided with the groove of assembling electrode in the side, and the substrate portion of heat sink member is as the electrode of LED, and its shape can be regular polygon, circle; Can be provided with through hole on the substrate so that LED assembles, upper surface of base plate is provided with the keyway of LED location assembling, and lower surface is provided with groove, for inlaying of insulated conductor in the electrode member.The heat sink member of the utility model LED has multi-functional: the function of heat conduction and heat radiation, optically focused, LED packaging frame (LED electrode suppor, lens arrangement support), electrode of LED, heat-conducting substrate, and the LED heat sink structure can once be stamped to form or form by the automatic lathe batch machining by copper, the aluminium with high thermal conductivity, is fit to produce in batches needs.
Electrode member is that poured with epoxy resin parcel electrode constitutes, and its assembling form is through hole plug-in type or side plug-in type.The electrode part is made of the welding electrode that is connected with bonding gold wire and the exit lead-in wire utmost point, and the lead-in wire electrode can be insulated conductor formula or copper sheet lead-in wire electrode.Electrode member is simple in structure, can save the making of complicated lead frame among traditional LED, reduces manufacturing cost.
Led chip can be single-chip or is multi-chip type.Prefocus cup in multi-chip type LED structure heat sink is 2-6, and led chip places prefocus cup respectively.
Package lens can be sphere shape, plate shaped, when package lens and the assembling of heat sink member, and can be bonding by epoxy resin cure.
Single-chip formula LED power of the present utility model can reach 1-3W, and multi-chip type LED power can reach 3-20W, can be widely used in high-power LED street lamp illumination, LED room lighting, LED projecting lamp, LED mine lamp, flashlight etc.
The mounting structure of this great power LED mainly partly is made up of secondary radiating component, LED, clamping plate, bolt, circuit lead etc.When installing, LED is assemblied between clamping plate and the secondary radiating component, by screw bolt reinforcing, the LED substrate bottom surface is closely contacted, to reduce thermal resistance with the secondary radiating component.In the utility model design, LED and the direct heat conduction of secondary radiating component, and the two contact area is bigger, thermal resistance obviously reduces, the utmost point is beneficial to scattering and disappearing of heat, can reduce the volume of secondary radiating component, and this structure is for the design of LED light fixture, can break away from the restriction of secondary radiating component volume, thus free more during Design of Luminaires.
Be provided with the circuit lead passage installing on the clamping plate, and the reinforcing by bolt, the ad hoc electrode of circuit lead and LED is linked, saved printed circuit board (PCB) use in the past on the one hand; On the other hand, save LED wire bonds technology in the past.Clamping plate and secondary radiating component can flexible dismounting, are convenient to the replacing of LED, brought convenience for the maintenance of LED light fixture.
The secondary radiating component has the heat radiation fin, has the insulating barrier of high heat conduction and screw is installed with the surface of LED substrate contacts.Clamping plate are provided with and the embedded groove of the step groove of LED bonding assembling, circuit lead, bolt hole etc.
The utility model positive effect compared with the prior art is, of the present utility model simple in structure, compact, particularly electrode member has saved the making of the complicated lead frame that adopts in traditional LED technology, has reduced production cost, in the mounting structure of great power LED, LED and the direct heat conduction of secondary radiating component, and the two contact area is bigger, and thermal resistance obviously reduces, and has improved the LED radiating effect, can obviously solve great power LED module when illumination heat dissipation problem, increase the useful life of LED.LED among the design and clamping structure, at high-power LED illumination, particularly LED modularity (dot matrix) illumination have mounting process easy (saved LED and aluminium base in the past be connected and with substrate on the welding of lead-in wire of circuit), and LED changes flexible.The utility model can be widely used in high-power LED street lamp illumination, LED room lighting, LED projecting lamp, LED mine lamp, flashlight etc.
Description of drawings
Accompanying drawing 1 is embodiment 1 a great power LED electrode through hole plug-in type a series encapsulating structure schematic perspective view;
Accompanying drawing 2 is embodiment 1 a great power LED electrode through hole plug-in type a series encapsulating structure cutaway view;
Accompanying drawing 3 is embodiment 2 a great power LED electrode through hole plug-in type b series encapsulating structure cutaway view;
Accompanying drawing 4 is the light collecting c series of embodiment 3 great power LED electrode side-plug-ins, a revolution encapsulating structure schematic perspective view;
Accompanying drawing 5 is the light collecting c series of embodiment 3 great power LED electrode side plug-in types, a revolution encapsulating structure vertical view;
Accompanying drawing 6 is the light collecting c series of embodiment 3 great power LED electrode side plug-in types, a revolution encapsulating structure cutaway view;
Accompanying drawing 7 is embodiment 4 a great power LED multi-chip type d series stereogram;
Accompanying drawing 8 is embodiment 4 a great power LED multi-chip type d series vertical view;
Accompanying drawing 9 is embodiment 4 a great power LED multi-chip type d series cutaway view;
Accompanying drawing 10 is embodiment 5 great power LED mounting structure stereograms;
Accompanying drawing 11 is embodiment 5 great power LED mounting structure parts explosions;
Accompanying drawing 12 is embodiment 5 great power LED mounting structure cutaway views;
Accompanying drawing 13 is embodiment 5 great power LED clamp region upward views;
Accompanying drawing 14 is that embodiment 6 great power LEDs are installed cutaway view;
Embodiment
Embodiment 1:
Present embodiment great power LED electrode through hole plug-in type a series encapsulating structure is made up of heat sink member (a1), electrode member (a2), chip (a3), spun gold (a4), collector lens (a5).Wherein, heat sink member (a1) is made of prefocus cup (a11), lens arrangement groove (a12), position, end key (a13), substrate (a14); Electrode member (a2) is made of spun gold welding electrode (a21), epoxy resin frame (a22), insulating barrier (a23), lead-in wire electrode (a24); Collector lens limit bead has been settled potting resin hand-hole (a51).
Embodiment 2:
Embodiment is a great power LED electrode through hole plug-in type b series encapsulating structure, and accompanying drawing 3 is embodiment 2 a great power LED electrode through hole plug-in type b series encapsulating structure cutaway view.
Present embodiment great power LED electrode through hole plug-in type b series encapsulating structure is made up of heat sink member (b1), electrode member (b2), chip (b3), spun gold (b4).Wherein, heat sink member (b1) is made of prefocus cup (b11), lens arrangement groove (b12), position, end key (b13), substrate (b14); Electrode member (b2) is made of spun gold welding electrode (b21), epoxy resin frame (b22), insulating barrier (b23), lead-in wire electrode (b24).
Embodiment 3:
Present embodiment is the light collecting c series of great power LED electrode side-plug-in, a revolution encapsulating structure, and accompanying drawing 4, accompanying drawing 5, accompanying drawing 6 are respectively embodiment 3 great power LED electrode side-plug-ins, the light collecting c series of revolution encapsulating structure schematic perspective view, vertical view and cutaway view.
Present embodiment great power LED electrode side-plug-in, the light collecting c series of revolution encapsulating structure are made up of heat sink member (c1), electrode member (c2), chip (c3), spun gold (c4), lens (c5).Wherein, heat sink member (c1) is made of prefocus cup (c11), lens arrangement groove (c12), substrate (c13); Electrode member (c2) is made of spun gold welding electrode (c21), epoxy resin frame (c22), insulating barrier (c23), lead-in wire electrode (c24).
Embodiment 4:
Present embodiment is a great power LED multi-chip type d series structure, and accompanying drawing 7, accompanying drawing 8, accompanying drawing 9 are respectively present embodiment great power LED multi-chip type d series structure stereogram, vertical view and cutaway view.
Present embodiment is that great power LED multi-chip type d series structure is made up of heat sink member (d1), electrode member (d2), chip (d3), spun gold (d4).Wherein, heat sink member (d1) is made of prefocus cup (d11), lens arrangement groove (d12), positioning key (d13), substrate (d14); Electrode member (d2) is made of spun gold welding electrode (d21), epoxy resin frame (d22), insulating barrier (d23), lead-in wire electrode (d24).
Embodiment 5:
Present embodiment is the design of great power LED mounting structure.Accompanying drawing 10, accompanying drawing 11, accompanying drawing 12, accompanying drawing 13 are respectively stereogram, mounting structure parts explosion, mounting structure cutaway view and the clamp region upward view of great power LED mounting structure.
Present embodiment great power LED mounting structure is made up of secondary radiating component (e1), LED structure (e2), clamping plate (e3), bolt (e4), negative terminals (e5), positive terminal (e6).Wherein, secondary radiating component (e1) is made of high heat conductive insulating layer (e11), screw (e12), fin (e13); LED structure (e2) is made of LED positioning key (e21), LED lead-in wire electrode (e22); Clamping plate (e3) are made of LED installing hole (e31), electrode caulking groove (e32), bolt hole (e33), LED positioning spline (e34).
Embodiment 6:
Present embodiment is the design of great power LED mounting structure.Accompanying drawing 14 is installed cutaway view for the present embodiment great power LED.
Present embodiment great power LED mounting structure is made up of LED (f1), clamping plate (f2), bolt (f3), electrode terminal (f4), circuit lead (f5).Wherein LED (f1) is made of LED electrode (f11), LED electrode framework (f12), lens (f13).
Claims (7)
1, a kind of high-power LED encapsulation and mounting structure is characterized in that, described high-power LED encapsulation structure is made up of heat sink member, package lens, led chip, electrode member, bonding gold wire; Described great power LED mounting structure is made up of secondary radiating component, LED, clamping plate, bolt, circuit lead.
2, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that,
The top of the heat sink member of described LED encapsulating structure is provided with the fitting recess with prefocus cup, sealing lens, prefocus cup can or be the parabola revolution for truncated cone-shaped groove, oval revolution, the chips welding position be the end of round platform groove or for the focal position of revolution so that meet the requirement of luminous intensity distribution;
Described heat sink member is provided with the through-hole groove of assembling electrode member or is provided with the groove of assembling electrode in the side;
The bottom of described heat sink member is provided with large-area substrates, and the substrate portion of described heat sink member is as the electrode of LED, and its shape can be regular polygon, circle;
Can be provided with through hole on the substrate of described heat sink member so that LED assembles, upper surface of base plate is provided with the keyway of LED location assembling, and lower surface is provided with groove, for inlaying of insulated conductor in the electrode member.
3, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED encapsulating structure electrode member is that poured with epoxy resin parcel electrode constitutes, its assembling form is through hole plug-in type or side plug-in type, the electrode part is made of the welding electrode that is connected with bonding gold wire and the exit lead-in wire utmost point, and the lead-in wire electrode can be insulated conductor formula or copper sheet lead-in wire electrode.
4, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED encapsulating structure led chip can be single-chip or for multi-chip type, and the prefocus cup in multi-chip type LED structure heat sink is 2-6, and led chip places prefocus cup respectively.
5, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that, described LED encapsulating structure package lens can be sphere shape, plate shaped, when package lens and the assembling of heat sink member, and can be bonding by epoxy resin cure.
6, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that, the heat sink member of described LED encapsulating structure can once be stamped to form or form by the automatic lathe batch machining by copper, the aluminium with high heat conduction.
7, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED mounting structure middle clamp plate is provided with step groove, the embedded groove of circuit lead, the bolt hole with the assembling of LED bonding, LED is assemblied between clamping plate and the secondary radiating component, pass through screw bolt reinforcing, the LED substrate bottom surface can closely contact with the secondary radiating component, reduces thermal resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201425747U CN201435411Y (en) | 2009-04-28 | 2009-04-28 | high-power led packaging and mounting structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201425747U CN201435411Y (en) | 2009-04-28 | 2009-04-28 | high-power led packaging and mounting structures |
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| Publication Number | Publication Date |
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| CN201435411Y true CN201435411Y (en) | 2010-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009201425747U Expired - Fee Related CN201435411Y (en) | 2009-04-28 | 2009-04-28 | high-power led packaging and mounting structures |
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| CN (1) | CN201435411Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820044A (en) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
| CN103988015A (en) * | 2011-12-28 | 2014-08-13 | 黎昌兴 | Led light source |
| CN106981555A (en) * | 2017-03-21 | 2017-07-25 | 江苏稳润光电有限公司 | A kind of tazza high reliability purple LED packaging and its manufacture method |
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
-
2009
- 2009-04-28 CN CN2009201425747U patent/CN201435411Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820044A (en) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
| CN101820044B (en) * | 2010-04-09 | 2013-01-16 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
| CN103988015A (en) * | 2011-12-28 | 2014-08-13 | 黎昌兴 | Led light source |
| CN103988015B (en) * | 2011-12-28 | 2016-11-09 | 黎昌兴 | Led light source |
| CN106981555A (en) * | 2017-03-21 | 2017-07-25 | 江苏稳润光电有限公司 | A kind of tazza high reliability purple LED packaging and its manufacture method |
| CN107527978A (en) * | 2017-08-15 | 2017-12-29 | 江苏稳润光电科技有限公司 | A kind of high-power ultraviolet LED Vacuum Package device and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100331 Termination date: 20120428 |