CN201425272Y - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN201425272Y CN201425272Y CN2009201542420U CN200920154242U CN201425272Y CN 201425272 Y CN201425272 Y CN 201425272Y CN 2009201542420 U CN2009201542420 U CN 2009201542420U CN 200920154242 U CN200920154242 U CN 200920154242U CN 201425272 Y CN201425272 Y CN 201425272Y
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- led
- monocrystal
- encapsulating structure
- reflecting wall
- matrix
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Abstract
The utility model discloses an LED packaging structure, which comprises a heat conducting substrate and a plurality of LED single crystals. A bottom reflecting layer is arranged on the heat conductingsubstrate, the LED single crystals are arranged on the heat conducting substrate attached with the reflecting layer in a matrix form, reflecting ledges are uniformly arranged among the matrix-arrayedLED single crystals in longitude and latitude directions, and a peripheral reflecting wall is arranged on the periphery of the matrix of the LED single crystals. Through the LED packaging structure,light of each LED single crystal emitted to the lateral side and the bottom is reflected towards the front, thereby greatly increasing luminous strength and lighting effect of chips. The LED packagingstructure is reasonable and economical and has a wide application range.
Description
Technical field
The utility model relates to field of semiconductor illumination, is specifically related to a kind of LED encapsulating structure.
Background technology
Light emitting diode (LED) as the 4th generation light source, have advantages such as energy-saving and environmental protection, volume is little, the life-span is long, indicator lamp, display board, LCD have been widely used at present, and in all kinds of electric equipment products such as ordinary luminaire, decorating lighting lamp, along with the maturation day by day of great power LED technology, application is extensive further.
The led chip of producing is to be arranged in to encapsulate on the thermal conductive substrate of plane with a plurality of monocrystal to form at present, and the direct light that this packaged type can only utilize the LED monocrystal upwards to send can not utilize its scattering in light all around, and light efficiency is lower.
The utility model content
Technical problem to be solved in the utility model provides a kind of high-power high light efficiency LED encapsulating structure of group encapsulates.
The utility model LED encapsulating structure comprises thermal conductive substrate and a plurality of LED monocrystal, it is characterized in that, the bottom reflection layer is set on thermal conductive substrate, the LED monocrystal is matrix and arranges on the thermal conductive substrate that is arranged at the reflecting layer, direction of warp and weft is equipped with reflective ridge between the LED monocrystal that rectangular is arranged, and the height of reflective ridge is equal to or less than the height of LED monocrystal; Be provided with peripheral reflecting wall in LED monocrystal matrix periphery, the height of peripheral reflecting wall is a little more than the height of LED monocrystal.
Reflective ridge can be a mentioned ridge-shaped, and its cross section is triangle or chevron; Reflective ridge can also the stupefied shape in the side of being, its cross section is a rectangle or trapezoidal.
The periphery reflecting wall is installed on the thermal conductive substrate, around LED monocrystal matrix.The periphery reflecting wall totally can be circle, ellipse, rectangle or other polygons.The transition of periphery reflecting wall and base plate can be right angle, inclined-plane, is more suitable for selecting for use arc.
The top layer of described bottom reflection layer, reflective ridge and the inwall of peripheral reflecting wall can be reflectance coatings, also can be the speculum of device.
The utility model LED encapsulating structure, between the LED monocrystal, bottom surface and LED monocrystal matrix periphery all be provided with catoptric arrangement, every piece of LED monocrystal light all to side and that send the bottom all is reflected forwards, the luminous intensity and the light efficiency of chip have been improved, economical rationality has wide range of applications.
Description of drawings
Fig. 1 is the utility model plan structure schematic diagram;
Fig. 2 is the utility model embodiment one cross-sectional view;
Fig. 3 is the utility model embodiment two cross-sectional view;
Fig. 4 is the utility model embodiment three cross-sectional view.
Parts that number in the figure is represented or position are the 1-thermal conductive substrate; 2-periphery reflecting wall; 3-bottom reflection layer; The 4-LED monocrystal; The 5-reflective ridge; The 6-installing hole; The 7-electrode contact; 8-periphery reflecting wall and thermal conductive substrate transition position.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, the utility model LED encapsulating structure is provided with bottom reflection layer 3 on thermal conductive substrate 1.Nine pieces of LED monocrystal 4 are set on bottom reflection layer 3, and matrix is arranged, and every piece of LED monocrystal 4 power are 1.225W.Direction of warp and weft all is provided with reflective ridge 5 between LED monocrystal 4.In LED monocrystal 4 matrix peripheries peripheral reflecting wall 2 is set, present embodiment periphery reflecting wall 2 totally is circular.
Mixture with silica gel and YAG gold-tinted fluorescent material on the LED monocrystal 4 in the periphery reflecting wall 2 encapsulates.The encapsulation of silica gel+YAG can overcome the defective of the aging and expansion coefficient difference of resin that traditional hard epoxy encapsulation brought, guarantees minimum light decay, increases service life.Thermal conductive substrate 1 can adopt high thermal conductivity coefficient metal materials such as gold, silver, copper, aluminium, copper are silver-plated to make, and wherein the cost performance with the silver-plated material of copper is the best.4 connections of LED monocrystal can be adopted single gold thread structure.In order to prevent gold thread fracture, to guarantee not open circuit, not short circuit, present embodiment connects 4 in LED monocrystal and adopts two gold thread structures, and outside fix in the positive and negative lead wires is drawn by the packaging bodies in the peripheral reflecting wall 2, is soldered to the electrode contact 7 that is positioned on the thermal conductive substrate 1.In the present embodiment, heat carrier has with external and leads the installing hole that radiator is connected, be equipped with balanced installing hole can increase effectively with externally lead, the flatness that is connected of radiating element, thermal resistance is reduced.During practical application, the thermal conductive substrate 5 of the utility model LED encapsulating structure directly can be connected with a bigger metal heat sink.The control of LED encapsulating structure and holding circuit are positioned at around it, can not influence the heat radiation of LED encapsulating structure.
Embodiment illustrated in fig. 2, peripheral reflecting wall 2 at right angles intersects with thermal conductive substrate 1, the stupefied shape in reflective ridge 5 sides of being, and reflective ridge 5 cross sections are rectangle.
Embodiment illustrated in fig. 3, peripheral reflecting wall 2 is chamfered transition with thermal conductive substrate 1, and reflective ridge 5 is sloping stupefied shape, and reflective ridge 5 cross sections are trapezoidal.
Embodiment illustrated in fig. 4, peripheral reflecting wall 2 and 1 curved transition of thermal conductive substrate, reflective ridge 5 is sharp stupefied shape, reflective ridge 5 cross sections are chevron.
Claims (6)
1. LED encapsulating structure, comprise thermal conductive substrate and a plurality of LED monocrystal, it is characterized in that, the bottom reflection layer is set on thermal conductive substrate, the LED monocrystal is matrix and arranges on the thermal conductive substrate that is arranged at the reflecting layer, direction of warp and weft is equipped with reflective ridge between the LED monocrystal that rectangular is arranged, and the height of reflective ridge is equal to or less than the height of LED monocrystal; Be provided with peripheral reflecting wall in LED monocrystal matrix periphery, the height of peripheral reflecting wall is a little more than the height of LED monocrystal.
2. LED encapsulating structure according to claim 1 is characterized in that described reflective ridge is a mentioned ridge-shaped, and its cross section is triangle or chevron.
3. LED encapsulating structure according to claim 1 is characterized in that, the stupefied shape in the described reflective ridge side of being, and its cross section is a rectangle or trapezoidal.
4. LED encapsulating structure according to claim 1 is characterized in that, described peripheral reflecting wall totally is circular or oval.
5. LED encapsulating structure according to claim 1 is characterized in that, the transition of described peripheral reflecting wall and base plate is right angle, inclined-plane or arc.
6. LED encapsulating structure according to claim 1 is characterized in that, the top layer of described bottom reflection layer, reflective ridge and the inwall of peripheral reflecting wall are reflectance coating or device speculum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201542420U CN201425272Y (en) | 2009-05-15 | 2009-05-15 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201542420U CN201425272Y (en) | 2009-05-15 | 2009-05-15 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201425272Y true CN201425272Y (en) | 2010-03-17 |
Family
ID=42024722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201542420U Expired - Fee Related CN201425272Y (en) | 2009-05-15 | 2009-05-15 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201425272Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197227A (en) * | 2014-08-15 | 2014-12-10 | 厦门市瀚锋光电科技有限公司 | Strip-shaped combined light source |
| CN108458260A (en) * | 2017-02-17 | 2018-08-28 | 法雷奥照明公司 | The light emitting module of volume with reduction |
| CN111640846A (en) * | 2020-05-25 | 2020-09-08 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet LED packaging and lamp |
-
2009
- 2009-05-15 CN CN2009201542420U patent/CN201425272Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197227A (en) * | 2014-08-15 | 2014-12-10 | 厦门市瀚锋光电科技有限公司 | Strip-shaped combined light source |
| CN108458260A (en) * | 2017-02-17 | 2018-08-28 | 法雷奥照明公司 | The light emitting module of volume with reduction |
| CN111640846A (en) * | 2020-05-25 | 2020-09-08 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet LED packaging and lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANDONG SHUNDE INTERNATIONAL NEW LIGHT SOURCE R + Free format text: FORMER OWNER: SONG GUANG Effective date: 20100729 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 264200 ROOM 201, BUILDING 16, HONGQI STREET, HUANCUI DISTRICT, WEIHAI CITY,SHANDONG PROVINCE TO: 264209 NO.69, HONGKONG ROAD, JINGJI DISTRICT, WEIHAI CITY, SHANDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100729 Address after: 264209 No. 69, Hongkong Road, Jing Jing District, Shandong, Weihai Patentee after: Shandong International New Light Source R&D Co., Ltd. Shunde Address before: 264200, Room 201, building 16, Hongqi Street, Huancui District, Shandong, Weihai Patentee before: Song Guang |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100317 Termination date: 20150515 |
|
| EXPY | Termination of patent right or utility model |