CN201363572Y - LED light source module - Google Patents
LED light source module Download PDFInfo
- Publication number
- CN201363572Y CN201363572Y CNU200820061084XU CN200820061084U CN201363572Y CN 201363572 Y CN201363572 Y CN 201363572Y CN U200820061084X U CNU200820061084X U CN U200820061084XU CN 200820061084 U CN200820061084 U CN 200820061084U CN 201363572 Y CN201363572 Y CN 201363572Y
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- led
- light source
- metal heat
- conducting substrate
- wafer
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Abstract
The utility model relates to an LED light source module comprising a metal heat conducting base plate (1), a fixed framework (2), a printing anode (3), a printing cathode (4), LED wafers (5), a connecting gold wire (6), fluorescent powder (7) and an encapsulated silicone lens (8). The anode and the cathode are printed on an insulated heat conducting layer of the metal heat conducting base plate, and a peripheral framework is fixed on the metal heat conducting base plate; the LED wafers are fixed in an LED wafer mounting depression of the metal heat conducting base plate; each group of the wafers are connected in series and then the anode and the cathode are respectively welded with the printing anode and the printing cathode; the wafer array is encapsulated and sealed by silica gel; and the light-emitting surface of the LED light source is arranged to be a cambered lens light-emitting surface by using a method of silicone material molding and encapsulation. In the LED light source module, the anode and the cathode are directly printed on the metal heat conducting base plate, so that the structure of the light source module is simplified; and the light-emitting surface of the LED light source is molded into a cambered light-emitting lens by silicone through molding and encapsulation, and the light-emitting angle can be changed, so that ideal light spot effect and higher light-emitting efficiency can be obtained.
Description
Technical field
The utility model relates to a kind of lamp light source that is used to throw light on, and says it is a kind of led light source module definitely.
Background technology
Along with the enforcement of national energy policy and being rooted in the hearts of the people of energy-saving and emission-reduction, LED as energy-saving illumination light source of new generation more and more widely be applied to various illumination occasions, the application of led light source can be divided into two developing direction, the one, single encapsulates, and forms pointolite array, and another kind then is with the led array overall package, common encapsulating material adopts silica gel, then use optical lens secondary light-distribution or reflector reflective again, make the fitting structure complexity, secondary light-distribution has also increased the loss of light.The light fixture light efficiency made from regard to the method that makes led light source module increase lens carry out luminous intensity distribution is had a greatly reduced quality like this, for this reason, how to select novel integrated encapsulation method for use and solve focus and the difficult point that optics luminous intensity distribution problem becomes led light source research in once light-distribution.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of led light source module, the preparation method that prints electrode by employing substitutes the preparation method of metal electrode in the market, changes the purpose that the light shooting angle obtains desirable hot spot thereby reach by the shape that changes light source encapsulation silica gel simultaneously.
The utility model for solve that its technical problem adopts technical scheme be:
A kind of led light source module, form by metal heat-conducting substrate (1), fixed frame (2), printing anodal (3), printing negative pole (4), LED wafer (5), connection gold thread (6), fluorescent material (7) and encapsulation silica-gel lens (8), the LED luminescent wafer is formed array arrangement by the gold thread connection in series-parallel and is placed in the light source bracket that heat-conducting substrate and fixed frame constitute and by the encapsulation of insulating heat-conductive silica gel, forms a toroidal lens light-emitting area and a plane thermal conductive surface.It is characterized in that: both positive and negative polarity is printed on the metal heat-conducting substrate insulating heat-conductive layer; and be provided with insulating protective layer (being similar to printed circuit board (PCB)) on the surface of printing electrode; peripheral frame is fixed in metal heat-conducting substrate by screw or embedded mode; the LED wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit; both positive and negative polarity welds with both positive and negative polarity respectively after every group of wafer tandem; the wafer array is by silica gel potting (wherein add fluorescent material and can obtain white light near natural daylight); the exiting surface of led light source is arranged to the lens light-emitting area (both played the effect of seal protection LED wafer, and reached the requirement of luminous intensity distribution again because the silica gel after the mold pressing embedding moulding forms lens) of cambered surface with the method for silica gel material mold pressing embedding.
Described metal heat-conducting substrate is made by the high metal material of thermal conductivities such as copper or aluminium; comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator; establish the LED wafer of array on the installed surface pit is installed; installed surface is established the insulating heat-conductive layer; both positive and negative polarity is laid on the insulating heat-conductive layer in the mode of printed circuit board (PCB); and be provided with insulating protective layer on the surface of printing electrode; installation pit inner surface is coated with reflector layer and (is convenient to the light that LED sends is reflected; improve light extraction efficiency); the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface.Metal heat-conducting substrate also should be established the installing hole that is connected usefulness with lamp radiator, the attaching parts that the position corresponding with the frame support has through wires hole and be connected the screw hole or the alternate manner of usefulness with peripheral frame.
Described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
Described LED wafer (5) is a semiconductor light-emitting diode chip.
Described led light source chip by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.
The beneficial effects of the utility model are:
By integrated encapsulation technology with the plurality of LEDs wafer package on a flat heat conduction base, can realize that it is simple in structure, packaging cost is low more than single the power hectowatt, reach the luminous flux and the power requirement of lighting source.The utility model directly is printed on both positive and negative polarity on the metal heat-conducting substrate, (practices well is established the metallic plate both positive and negative polarity to simplify light source module structure, be fixed in the fixed frame), the light-emitting area of led light source is shaped to a curved surface light emission lens by silica gel by the mold pressing embedding, can change the beam projecting angle, thereby obtain desirable hot spot effect, the secondary light-distribution of the optical lens of comparing can reduce the loss of light, makes the light extraction efficiency of LED improve about 10%.
Description of drawings:
Fig. 1 is the utility model schematic diagram;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the B-B profile of Fig. 1;
Fig. 4 is the metal heat-conducting substrate schematic diagram;
Fig. 5 is the C-C profile of Fig. 4;
Fig. 6 is the D-D profile of Fig. 4;
Fig. 7 is the fixed frame vertical view;
Fig. 8 is the stationary frame structure schematic diagram.
The specific embodiment
Embodiment: as Fig. 1,2, shown in 3, a kind of led light source module, by metal heat-conducting substrate (1), fixed frame (2), printing anodal (3), printing negative pole (4), LED wafer (5), connect gold thread (6), fluorescent material (7) and encapsulation silica-gel lens (8) are formed, the mode that fixed frame is linked closely by screw or embedding is fixed in metal heat-conducting substrate, so constitute the led light source support, the LED luminescent wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit, and by gold thread (6) connection in series-parallel composition array arrangement, the wafer array forms a toroidal lens light-emitting area and a plane thermal conductive surface by insulating heat-conductive silica gel encapsulation (wherein add fluorescent material 7 and can obtain white light near natural daylight).The lens light-emitting area that the exiting surface of led light source is arranged to cambered surface with the method for silica gel material mold pressing embedding (had both played the effect of seal protection LED wafer; because forming lens, the silica gel after the mold pressing embedding moulding reaches the requirement of luminous intensity distribution again); silica-gel lens (8) plane of incidence closely fills up light source bracket; the lens exiting surface is a curved surface, designs according to hot spot requirement, silica gel refractive properties and the LED wafer characteristics of luminescence.
As Fig. 4; 5; shown in 6; described metal heat-conducting substrate main body (11) is made by the high metal material of thermal conductivities such as copper or aluminium; comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator; establish the LED wafer of array on the installed surface pit (13) is installed; installed surface is established insulating heat-conductive layer (12); both positive and negative polarity (3; 4) mode with printed circuit board (PCB) is laid on the insulating heat-conductive layer; and printing electrode (3; 4) surface is provided with insulating protective layer; installation pit inner surface is coated with reflector layer and (is convenient to the light that LED sends is reflected; improve light extraction efficiency); the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface.Metal heat-conducting substrate also should be established the installing hole (14) that is connected usefulness with lamp radiator, and the position corresponding with the frame support has through wires hole and be connected the screw hole (15) of usefulness or the attaching parts of alternate manner with peripheral frame.
Shown in Fig. 7,8, described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, its integral body is a back-shaped framework (21), with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or screw hole (22) screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
Described LED wafer (5) is a semiconductor light-emitting diode chip.Can select multiple model for use, Chang Yong 0.5W, 1W, 3W and 5W generally select 1W for use in the market, even can select the crystal grain of one of the 8W, the 10W that are are researching and developing for use.
Described led light source chip by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.
Claims (4)
1. led light source module; by metal heat-conducting substrate (1); fixed frame (2); printing anodal (3); printing negative pole (4); LED wafer (5); connect gold thread (6); fluorescent material (7) and encapsulation silica-gel lens (8) are formed; the LED luminescent wafer is formed array arrangement by the gold thread connection in series-parallel and is placed in the light source bracket that heat-conducting substrate and fixed frame constitute and by insulating heat-conductive silica gel and encapsulate; form a toroidal lens light-emitting area and a plane thermal conductive surface; it is characterized in that: both positive and negative polarity is printed on the metal heat-conducting substrate insulating heat-conductive layer; and the printing both positive and negative polarity the surface be provided with insulating protective layer; peripheral frame is fixed in metal heat-conducting substrate by screw or embedded mode; the LED wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit; both positive and negative polarity welds with the printing both positive and negative polarity respectively after every group of wafer tandem; the wafer array is by the silica gel potting, and the exiting surface of led light source is arranged to the lens light-emitting area of cambered surface with the method for silica gel material mold pressing embedding.
2. a kind of led light source module according to claim 1, it is characterized in that: described metal heat-conducting substrate is made by the high metal material of thermal conductivities such as copper or aluminium, comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator, establish the LED wafer of array on the installed surface pit is installed, installed surface is established the insulating heat-conductive layer, both positive and negative polarity is laid on the insulating heat-conductive layer in the mode of printed circuit board (PCB), the pit inner surface is installed is coated with reflector layer, the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface; Metal heat-conducting substrate is established the installing hole that is connected usefulness with lamp radiator simultaneously, screw hole or hasp and buckle class attaching parts that the position corresponding with the frame support has through wires hole and be connected usefulness with peripheral frame.
3. a kind of led light source module according to claim 1, it is characterized in that: described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
4. a kind of led light source module according to claim 1 is characterized in that: described LED wafer (5) is a semiconductor light-emitting diode chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820061084XU CN201363572Y (en) | 2008-12-26 | 2008-12-26 | LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820061084XU CN201363572Y (en) | 2008-12-26 | 2008-12-26 | LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201363572Y true CN201363572Y (en) | 2009-12-16 |
Family
ID=41474237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820061084XU Expired - Fee Related CN201363572Y (en) | 2008-12-26 | 2008-12-26 | LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201363572Y (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032483A (en) * | 2010-09-27 | 2011-04-27 | 陈炜旻 | Light-emitting diode (LED) plane light source |
| CN102095162A (en) * | 2011-02-01 | 2011-06-15 | 苏州奥浦迪克光电技术有限公司 | Lens for surface light source and surface light source light-emitting system |
| CN102130225A (en) * | 2010-12-14 | 2011-07-20 | 黄金鹿 | Packaging method for improving light efficiency of integrated LED light source |
| CN102168822A (en) * | 2011-05-06 | 2011-08-31 | 姚怀举 | LED (light-emitting diode) flat lamp |
| CN102661507A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power LED (Light Emitting Diode) thermal module of metal radiator with heat tube |
| CN102661508A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power LED (Light Emitting Diode) horizontal-insertion lamp with metal radiator |
| CN102661509A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power light emitting diode (LED) radiating module with metal radiating device |
| CN102720953A (en) * | 2011-03-31 | 2012-10-10 | 王强 | Three-dimensional LED lamp structure |
| CN102856473A (en) * | 2012-08-17 | 2013-01-02 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN103208574A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Light emitting diode (LED) packaging structure |
| WO2014104913A1 (en) | 2012-12-27 | 2014-07-03 | Optogan New Technologies Of Light Llc | Module with light-emitting diodes |
| CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
| CN107092137A (en) * | 2017-06-28 | 2017-08-25 | 威海金丰电子有限公司 | Specular removal planar array type liquid crystal backlight |
| CN107482105A (en) * | 2016-06-07 | 2017-12-15 | 王圣然 | A kind of light emitting diode with microlens array encapsulation |
| CN108278499A (en) * | 2017-01-06 | 2018-07-13 | 松下知识产权经营株式会社 | Led light source device and led lamp |
| CN110770643A (en) * | 2017-06-15 | 2020-02-07 | 夏普株式会社 | Illumination device and display device |
| CN111076110A (en) * | 2019-12-05 | 2020-04-28 | 深圳市威尔晟光电有限公司 | Magical color flexible lamp strip with inverted structure |
| CN115199993A (en) * | 2022-05-18 | 2022-10-18 | 深圳市力子光电科技有限公司 | Lens type electrical element and light-emitting equipment |
-
2008
- 2008-12-26 CN CNU200820061084XU patent/CN201363572Y/en not_active Expired - Fee Related
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032483A (en) * | 2010-09-27 | 2011-04-27 | 陈炜旻 | Light-emitting diode (LED) plane light source |
| CN102032483B (en) * | 2010-09-27 | 2013-06-26 | 陈炜旻 | Light-emitting diode (LED) plane light source |
| CN102130225A (en) * | 2010-12-14 | 2011-07-20 | 黄金鹿 | Packaging method for improving light efficiency of integrated LED light source |
| CN102095162A (en) * | 2011-02-01 | 2011-06-15 | 苏州奥浦迪克光电技术有限公司 | Lens for surface light source and surface light source light-emitting system |
| CN102720953A (en) * | 2011-03-31 | 2012-10-10 | 王强 | Three-dimensional LED lamp structure |
| CN102168822A (en) * | 2011-05-06 | 2011-08-31 | 姚怀举 | LED (light-emitting diode) flat lamp |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN103208574B (en) * | 2012-01-13 | 2016-04-13 | 重庆四联光电科技有限公司 | LED encapsulation structure |
| CN103208574A (en) * | 2012-01-13 | 2013-07-17 | 重庆四联光电科技有限公司 | Light emitting diode (LED) packaging structure |
| CN102661509A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power light emitting diode (LED) radiating module with metal radiating device |
| CN102661508A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power LED (Light Emitting Diode) horizontal-insertion lamp with metal radiator |
| CN102661507A (en) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | High-power LED (Light Emitting Diode) thermal module of metal radiator with heat tube |
| CN102856473A (en) * | 2012-08-17 | 2013-01-02 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
| CN102856473B (en) * | 2012-08-17 | 2015-04-29 | 上舜照明（中国）有限公司 | Packaging adjustment method of LED (light-emitting diode) light source |
| WO2014104913A1 (en) | 2012-12-27 | 2014-07-03 | Optogan New Technologies Of Light Llc | Module with light-emitting diodes |
| CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
| CN107482105A (en) * | 2016-06-07 | 2017-12-15 | 王圣然 | A kind of light emitting diode with microlens array encapsulation |
| CN108278499A (en) * | 2017-01-06 | 2018-07-13 | 松下知识产权经营株式会社 | Led light source device and led lamp |
| CN108278499B (en) * | 2017-01-06 | 2020-08-14 | 松下知识产权经营株式会社 | LED light source device and LED lamp |
| CN110770643A (en) * | 2017-06-15 | 2020-02-07 | 夏普株式会社 | Illumination device and display device |
| CN110770643B (en) * | 2017-06-15 | 2022-03-04 | 夏普株式会社 | Illumination device and display device |
| CN107092137A (en) * | 2017-06-28 | 2017-08-25 | 威海金丰电子有限公司 | Specular removal planar array type liquid crystal backlight |
| CN111076110A (en) * | 2019-12-05 | 2020-04-28 | 深圳市威尔晟光电有限公司 | Magical color flexible lamp strip with inverted structure |
| CN115199993A (en) * | 2022-05-18 | 2022-10-18 | 深圳市力子光电科技有限公司 | Lens type electrical element and light-emitting equipment |
| CN115199993B (en) * | 2022-05-18 | 2024-04-12 | 深圳市力子光电科技有限公司 | Lens type electrical element and light-emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd. Assignor: Huang Jinlu Contract record no.: 2012320000247 Denomination of utility model: LED light source module and LED bulb lamp, spot lamp and down lamp therewith Granted publication date: 20091216 License type: Exclusive License Record date: 20120319 |
|
| ASS | Succession or assignment of patent right |
Owner name: ZHENJIANG YANGZI ELECTROMECHANICAL EQUIPMENT CO., Free format text: FORMER OWNER: HUANG JINLU Effective date: 20120808 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 225500 TAIZHOU, JIANGSU PROVINCE TO: 212200 ZHENJIANG, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20120808 Address after: 212200 No. 108 Yang Yang North Road, Yangzhong Development Zone, Jiangsu, China Patentee after: Zhenjiang Yangzi Electromechanical Equipment Co., Ltd. Address before: 225500 room 114, Worker Village, Jiangyan Town, Jiangsu, Jiangyan, 107 Patentee before: Huang Jinlu |
|
| ASS | Succession or assignment of patent right |
Owner name: JIANGSU YANGTZE ELECTROMECHANICAL SCIENCE + TECHNO Free format text: FORMER OWNER: ZHENJIANG YANGZI ELECTROMECHANICAL EQUIPMENT CO., LTD. Effective date: 20120918 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 212200 ZHENJIANG, JIANGSU PROVINCE TO: 212132 ZHENJIANG, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20120918 Address after: 212132, 76, Yinhe Road, Dagang District, Zhenjiang, Jiangsu Patentee after: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd. Address before: 212200 No. 108 Yang Yang North Road, Yangzhong Development Zone, Jiangsu, China Patentee before: Zhenjiang Yangzi Electromechanical Equipment Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091216 Termination date: 20151226 |
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| EXPY | Termination of patent right or utility model |