CN201363572Y - LED light source module - Google Patents

LED light source module Download PDF

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Publication number
CN201363572Y
CN201363572Y CNU200820061084XU CN200820061084U CN201363572Y CN 201363572 Y CN201363572 Y CN 201363572Y CN U200820061084X U CNU200820061084X U CN U200820061084XU CN 200820061084 U CN200820061084 U CN 200820061084U CN 201363572 Y CN201363572 Y CN 201363572Y
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CN
China
Prior art keywords
led
light source
metal heat
conducting substrate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU200820061084XU
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Chinese (zh)
Inventor
黄金鹿
缪应明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd.
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黄金鹿
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Publication date
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Priority to CNU200820061084XU priority Critical patent/CN201363572Y/en
Application granted granted Critical
Publication of CN201363572Y publication Critical patent/CN201363572Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an LED light source module comprising a metal heat conducting base plate (1), a fixed framework (2), a printing anode (3), a printing cathode (4), LED wafers (5), a connecting gold wire (6), fluorescent powder (7) and an encapsulated silicone lens (8). The anode and the cathode are printed on an insulated heat conducting layer of the metal heat conducting base plate, and a peripheral framework is fixed on the metal heat conducting base plate; the LED wafers are fixed in an LED wafer mounting depression of the metal heat conducting base plate; each group of the wafers are connected in series and then the anode and the cathode are respectively welded with the printing anode and the printing cathode; the wafer array is encapsulated and sealed by silica gel; and the light-emitting surface of the LED light source is arranged to be a cambered lens light-emitting surface by using a method of silicone material molding and encapsulation. In the LED light source module, the anode and the cathode are directly printed on the metal heat conducting base plate, so that the structure of the light source module is simplified; and the light-emitting surface of the LED light source is molded into a cambered light-emitting lens by silicone through molding and encapsulation, and the light-emitting angle can be changed, so that ideal light spot effect and higher light-emitting efficiency can be obtained.

Description

A kind of led light source module
Technical field
The utility model relates to a kind of lamp light source that is used to throw light on, and says it is a kind of led light source module definitely.
Background technology
Along with the enforcement of national energy policy and being rooted in the hearts of the people of energy-saving and emission-reduction, LED as energy-saving illumination light source of new generation more and more widely be applied to various illumination occasions, the application of led light source can be divided into two developing direction, the one, single encapsulates, and forms pointolite array, and another kind then is with the led array overall package, common encapsulating material adopts silica gel, then use optical lens secondary light-distribution or reflector reflective again, make the fitting structure complexity, secondary light-distribution has also increased the loss of light.The light fixture light efficiency made from regard to the method that makes led light source module increase lens carry out luminous intensity distribution is had a greatly reduced quality like this, for this reason, how to select novel integrated encapsulation method for use and solve focus and the difficult point that optics luminous intensity distribution problem becomes led light source research in once light-distribution.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of led light source module, the preparation method that prints electrode by employing substitutes the preparation method of metal electrode in the market, changes the purpose that the light shooting angle obtains desirable hot spot thereby reach by the shape that changes light source encapsulation silica gel simultaneously.
The utility model for solve that its technical problem adopts technical scheme be:
A kind of led light source module, form by metal heat-conducting substrate (1), fixed frame (2), printing anodal (3), printing negative pole (4), LED wafer (5), connection gold thread (6), fluorescent material (7) and encapsulation silica-gel lens (8), the LED luminescent wafer is formed array arrangement by the gold thread connection in series-parallel and is placed in the light source bracket that heat-conducting substrate and fixed frame constitute and by the encapsulation of insulating heat-conductive silica gel, forms a toroidal lens light-emitting area and a plane thermal conductive surface.It is characterized in that: both positive and negative polarity is printed on the metal heat-conducting substrate insulating heat-conductive layer; and be provided with insulating protective layer (being similar to printed circuit board (PCB)) on the surface of printing electrode; peripheral frame is fixed in metal heat-conducting substrate by screw or embedded mode; the LED wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit; both positive and negative polarity welds with both positive and negative polarity respectively after every group of wafer tandem; the wafer array is by silica gel potting (wherein add fluorescent material and can obtain white light near natural daylight); the exiting surface of led light source is arranged to the lens light-emitting area (both played the effect of seal protection LED wafer, and reached the requirement of luminous intensity distribution again because the silica gel after the mold pressing embedding moulding forms lens) of cambered surface with the method for silica gel material mold pressing embedding.
Described metal heat-conducting substrate is made by the high metal material of thermal conductivities such as copper or aluminium; comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator; establish the LED wafer of array on the installed surface pit is installed; installed surface is established the insulating heat-conductive layer; both positive and negative polarity is laid on the insulating heat-conductive layer in the mode of printed circuit board (PCB); and be provided with insulating protective layer on the surface of printing electrode; installation pit inner surface is coated with reflector layer and (is convenient to the light that LED sends is reflected; improve light extraction efficiency); the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface.Metal heat-conducting substrate also should be established the installing hole that is connected usefulness with lamp radiator, the attaching parts that the position corresponding with the frame support has through wires hole and be connected the screw hole or the alternate manner of usefulness with peripheral frame.
Described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
Described LED wafer (5) is a semiconductor light-emitting diode chip.
Described led light source chip by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.
The beneficial effects of the utility model are:
By integrated encapsulation technology with the plurality of LEDs wafer package on a flat heat conduction base, can realize that it is simple in structure, packaging cost is low more than single the power hectowatt, reach the luminous flux and the power requirement of lighting source.The utility model directly is printed on both positive and negative polarity on the metal heat-conducting substrate, (practices well is established the metallic plate both positive and negative polarity to simplify light source module structure, be fixed in the fixed frame), the light-emitting area of led light source is shaped to a curved surface light emission lens by silica gel by the mold pressing embedding, can change the beam projecting angle, thereby obtain desirable hot spot effect, the secondary light-distribution of the optical lens of comparing can reduce the loss of light, makes the light extraction efficiency of LED improve about 10%.
Description of drawings:
Fig. 1 is the utility model schematic diagram;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the B-B profile of Fig. 1;
Fig. 4 is the metal heat-conducting substrate schematic diagram;
Fig. 5 is the C-C profile of Fig. 4;
Fig. 6 is the D-D profile of Fig. 4;
Fig. 7 is the fixed frame vertical view;
Fig. 8 is the stationary frame structure schematic diagram.
The specific embodiment
Embodiment: as Fig. 1,2, shown in 3, a kind of led light source module, by metal heat-conducting substrate (1), fixed frame (2), printing anodal (3), printing negative pole (4), LED wafer (5), connect gold thread (6), fluorescent material (7) and encapsulation silica-gel lens (8) are formed, the mode that fixed frame is linked closely by screw or embedding is fixed in metal heat-conducting substrate, so constitute the led light source support, the LED luminescent wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit, and by gold thread (6) connection in series-parallel composition array arrangement, the wafer array forms a toroidal lens light-emitting area and a plane thermal conductive surface by insulating heat-conductive silica gel encapsulation (wherein add fluorescent material 7 and can obtain white light near natural daylight).The lens light-emitting area that the exiting surface of led light source is arranged to cambered surface with the method for silica gel material mold pressing embedding (had both played the effect of seal protection LED wafer; because forming lens, the silica gel after the mold pressing embedding moulding reaches the requirement of luminous intensity distribution again); silica-gel lens (8) plane of incidence closely fills up light source bracket; the lens exiting surface is a curved surface, designs according to hot spot requirement, silica gel refractive properties and the LED wafer characteristics of luminescence.
As Fig. 4; 5; shown in 6; described metal heat-conducting substrate main body (11) is made by the high metal material of thermal conductivities such as copper or aluminium; comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator; establish the LED wafer of array on the installed surface pit (13) is installed; installed surface is established insulating heat-conductive layer (12); both positive and negative polarity (3; 4) mode with printed circuit board (PCB) is laid on the insulating heat-conductive layer; and printing electrode (3; 4) surface is provided with insulating protective layer; installation pit inner surface is coated with reflector layer and (is convenient to the light that LED sends is reflected; improve light extraction efficiency); the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface.Metal heat-conducting substrate also should be established the installing hole (14) that is connected usefulness with lamp radiator, and the position corresponding with the frame support has through wires hole and be connected the screw hole (15) of usefulness or the attaching parts of alternate manner with peripheral frame.
Shown in Fig. 7,8, described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, its integral body is a back-shaped framework (21), with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or screw hole (22) screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
Described LED wafer (5) is a semiconductor light-emitting diode chip.Can select multiple model for use, Chang Yong 0.5W, 1W, 3W and 5W generally select 1W for use in the market, even can select the crystal grain of one of the 8W, the 10W that are are researching and developing for use.
Described led light source chip by adjusting single LED luminescent wafer power and increase or reduce LED luminescent wafer number and change its power and luminous flux.

Claims (4)

1. led light source module; by metal heat-conducting substrate (1); fixed frame (2); printing anodal (3); printing negative pole (4); LED wafer (5); connect gold thread (6); fluorescent material (7) and encapsulation silica-gel lens (8) are formed; the LED luminescent wafer is formed array arrangement by the gold thread connection in series-parallel and is placed in the light source bracket that heat-conducting substrate and fixed frame constitute and by insulating heat-conductive silica gel and encapsulate; form a toroidal lens light-emitting area and a plane thermal conductive surface; it is characterized in that: both positive and negative polarity is printed on the metal heat-conducting substrate insulating heat-conductive layer; and the printing both positive and negative polarity the surface be provided with insulating protective layer; peripheral frame is fixed in metal heat-conducting substrate by screw or embedded mode; the LED wafer is fixed in metal heat-conducting substrate LED wafer to be installed in the pit; both positive and negative polarity welds with the printing both positive and negative polarity respectively after every group of wafer tandem; the wafer array is by the silica gel potting, and the exiting surface of led light source is arranged to the lens light-emitting area of cambered surface with the method for silica gel material mold pressing embedding.
2. a kind of led light source module according to claim 1, it is characterized in that: described metal heat-conducting substrate is made by the high metal material of thermal conductivities such as copper or aluminium, comprise the fixed installation of LED wafer face and the radiating surface that is connected with lamp radiator, establish the LED wafer of array on the installed surface pit is installed, installed surface is established the insulating heat-conductive layer, both positive and negative polarity is laid on the insulating heat-conductive layer in the mode of printed circuit board (PCB), the pit inner surface is installed is coated with reflector layer, the pit quantity and spacing should be decided according to intending packaged LED wafer number, and polishing is done on the radiating surface surface; Metal heat-conducting substrate is established the installing hole that is connected usefulness with lamp radiator simultaneously, screw hole or hasp and buckle class attaching parts that the position corresponding with the frame support has through wires hole and be connected usefulness with peripheral frame.
3. a kind of led light source module according to claim 1, it is characterized in that: described peripheral frame anti-agingly has certain elastically-deformable insulating materials mold pressing to form by high temperature resistant, with the one side of metal heat-conducting substrate contact the imbedded and fastened attaching parts can be set or the screw hole screw is connected, so that correspondence is installed on the metal heat-conducting substrate.
4. a kind of led light source module according to claim 1 is characterized in that: described LED wafer (5) is a semiconductor light-emitting diode chip.
CNU200820061084XU 2008-12-26 2008-12-26 LED light source module Expired - Fee Related CN201363572Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU200820061084XU CN201363572Y (en) 2008-12-26 2008-12-26 LED light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU200820061084XU CN201363572Y (en) 2008-12-26 2008-12-26 LED light source module

Publications (1)

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CN201363572Y true CN201363572Y (en) 2009-12-16

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102032483A (en) * 2010-09-27 2011-04-27 陈炜旻 Light-emitting diode (LED) plane light source
CN102095162A (en) * 2011-02-01 2011-06-15 苏州奥浦迪克光电技术有限公司 Lens for surface light source and surface light source light-emitting system
CN102130225A (en) * 2010-12-14 2011-07-20 黄金鹿 Packaging method for improving light efficiency of integrated LED light source
CN102168822A (en) * 2011-05-06 2011-08-31 姚怀举 LED (light-emitting diode) flat lamp
CN102661509A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power light emitting diode (LED) radiating module with metal radiating device
CN102661507A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (Light Emitting Diode) thermal module of metal radiator with heat tube
CN102661508A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (Light Emitting Diode) horizontal-insertion lamp with metal radiator
CN102720953A (en) * 2011-03-31 2012-10-10 王强 Three-dimensional LED lamp structure
CN102856473A (en) * 2012-08-17 2013-01-02 上舜照明(中国)有限公司 Packaging adjustment method of LED (light-emitting diode) light source
CN103162100A (en) * 2011-12-08 2013-06-19 苏州市世纪晶源电力科技有限公司 Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip
CN103208574A (en) * 2012-01-13 2013-07-17 重庆四联光电科技有限公司 Light emitting diode (LED) packaging structure
WO2014104913A1 (en) 2012-12-27 2014-07-03 Optogan New Technologies Of Light Llc Module with light-emitting diodes
CN105870309A (en) * 2015-02-06 2016-08-17 Lg伊诺特有限公司 Light-emitting device package and lighting apparatus including the package
CN107092137A (en) * 2017-06-28 2017-08-25 威海金丰电子有限公司 Specular removal planar array type liquid crystal backlight
CN107482105A (en) * 2016-06-07 2017-12-15 王圣然 A kind of light emitting diode with microlens array encapsulation
CN108278499A (en) * 2017-01-06 2018-07-13 松下知识产权经营株式会社 Led light source device and led lamp
CN110770643A (en) * 2017-06-15 2020-02-07 夏普株式会社 Illumination device and display device
CN111076110A (en) * 2019-12-05 2020-04-28 深圳市威尔晟光电有限公司 Magical color flexible lamp strip with inverted structure
CN115199993A (en) * 2022-05-18 2022-10-18 深圳市力子光电科技有限公司 Lens type electrical element and light-emitting equipment

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102032483A (en) * 2010-09-27 2011-04-27 陈炜旻 Light-emitting diode (LED) plane light source
CN102032483B (en) * 2010-09-27 2013-06-26 陈炜旻 Light-emitting diode (LED) plane light source
CN102130225A (en) * 2010-12-14 2011-07-20 黄金鹿 Packaging method for improving light efficiency of integrated LED light source
CN102095162A (en) * 2011-02-01 2011-06-15 苏州奥浦迪克光电技术有限公司 Lens for surface light source and surface light source light-emitting system
CN102720953A (en) * 2011-03-31 2012-10-10 王强 Three-dimensional LED lamp structure
CN102168822A (en) * 2011-05-06 2011-08-31 姚怀举 LED (light-emitting diode) flat lamp
CN103162100A (en) * 2011-12-08 2013-06-19 苏州市世纪晶源电力科技有限公司 Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip
CN103208574B (en) * 2012-01-13 2016-04-13 重庆四联光电科技有限公司 LED encapsulation structure
CN103208574A (en) * 2012-01-13 2013-07-17 重庆四联光电科技有限公司 Light emitting diode (LED) packaging structure
CN102661508A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (Light Emitting Diode) horizontal-insertion lamp with metal radiator
CN102661507A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (Light Emitting Diode) thermal module of metal radiator with heat tube
CN102661509A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power light emitting diode (LED) radiating module with metal radiating device
CN102856473A (en) * 2012-08-17 2013-01-02 上舜照明(中国)有限公司 Packaging adjustment method of LED (light-emitting diode) light source
CN102856473B (en) * 2012-08-17 2015-04-29 上舜照明(中国)有限公司 Packaging adjustment method of LED (light-emitting diode) light source
WO2014104913A1 (en) 2012-12-27 2014-07-03 Optogan New Technologies Of Light Llc Module with light-emitting diodes
CN105870309A (en) * 2015-02-06 2016-08-17 Lg伊诺特有限公司 Light-emitting device package and lighting apparatus including the package
CN107482105A (en) * 2016-06-07 2017-12-15 王圣然 A kind of light emitting diode with microlens array encapsulation
CN108278499A (en) * 2017-01-06 2018-07-13 松下知识产权经营株式会社 Led light source device and led lamp
CN108278499B (en) * 2017-01-06 2020-08-14 松下知识产权经营株式会社 LED light source device and LED lamp
CN110770643A (en) * 2017-06-15 2020-02-07 夏普株式会社 Illumination device and display device
CN110770643B (en) * 2017-06-15 2022-03-04 夏普株式会社 Illumination device and display device
CN107092137A (en) * 2017-06-28 2017-08-25 威海金丰电子有限公司 Specular removal planar array type liquid crystal backlight
CN111076110A (en) * 2019-12-05 2020-04-28 深圳市威尔晟光电有限公司 Magical color flexible lamp strip with inverted structure
CN115199993A (en) * 2022-05-18 2022-10-18 深圳市力子光电科技有限公司 Lens type electrical element and light-emitting equipment

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Legal Events

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C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd.

Assignor: Huang Jinlu

Contract record no.: 2012320000247

Denomination of utility model: LED light source module and LED bulb lamp, spot lamp and down lamp therewith

Granted publication date: 20091216

License type: Exclusive License

Record date: 20120319

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Owner name: ZHENJIANG YANGZI ELECTROMECHANICAL EQUIPMENT CO.,

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Address after: 212200 No. 108 Yang Yang North Road, Yangzhong Development Zone, Jiangsu, China

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Patentee before: Huang Jinlu

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Owner name: JIANGSU YANGTZE ELECTROMECHANICAL SCIENCE + TECHNO

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Address after: 212132, 76, Yinhe Road, Dagang District, Zhenjiang, Jiangsu

Patentee after: Jiangsu Yangtze Electromechanical Science & Technology Co.,Ltd.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091216

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EXPY Termination of patent right or utility model