CN202013883U - High-power LED (Light Emitting Diode) module sealing structure - Google Patents

Abstract

The utility model relates to a high-power LED module packaging structure, which effectively solves the problems of poor heat dissipation, complicated installation, and difficulty in mass production. The chip is installed on the front of the heat-dissipating insulating substrate. There are multiple LED chips, forming a uniform array row. After the chips are connected in series or in parallel through gold wires, they are welded together with the positive and negative electrode terminals. The powder layer, LED chip, gold wire and phosphor layer are encapsulated in the pit on the upper part of the heat-dissipating and insulating substrate by potting glue. There is a lens for encapsulation on the potting glue, and a radiator is installed at the rear of the heat-dissipating and insulating substrate. The structure of the utility model Novel and unique, easy to install and use, low cost, high brightness, good light quality, good heat dissipation effect and long service life.

Description

High power LED module packaging structure

1. Technical field

The utility model relates to the field of LED lighting, in particular to a high-power LED module packaging structure.

2. Background technology

Light-emitting diodes belong to the fourth generation of light sources. They have the advantages of energy saving, environmental protection, small size, and long life. , with the maturity of high-power LED technology, the field of application is more extensive, but due to structural problems, self-use for lighting, and heat dissipation problems have always restricted the development and application of high-power LEDs. Usually, there are three heat dissipation channels for LED lamps: 1. Chip, phosphor layer, potting glue, lens, to the environment; 2, chip, gold wire, electrode pins to the environment; 3, chip, die-bonding glue, thermal layer, adhesive glue, heat sink, to the environment. The third channel is the main heat dissipation channel, and about 98% of the heat energy is lost to the surrounding environment through this channel. Therefore, shortening and improving the main heat dissipation channel will greatly improve the LED heat dissipation effect and reduce the LED junction temperature. When the LED module package is used in a lighting system, the installation is complicated and it is not easy to produce in batches. Therefore, its improvement and innovation are technical problems that need to be solved urgently.

3. Contents of the invention

In view of the above problems, in order to overcome the defects of the prior art, the purpose of this utility model is to provide a high-power LED module packaging structure with excellent heat dissipation and combinable installation, which can effectively solve the problems of poor heat dissipation, complicated installation, and difficulty in mass production .

The technical scheme of the utility model is as follows:

High-power LED module packaging structure, including heat sink, LED chip, gold wire, phosphor, electrode, LED chip is mounted on the front of the heat-dissipating insulating substrate, LED chips are multiple, forming a uniform array row, between each chip through the gold After the wires are connected in series or in parallel, they are welded together with the positive and negative electrode terminals. There are phosphor layers around and on the top of the LED chip. There is a lens used for encapsulation on the sealant, and a heat sink is installed at the rear of the heat-dissipating insulating substrate.

The utility model has the advantages of novel and unique structure, convenient installation and use, low cost, high brightness, good light quality, good heat dissipation effect and long service life.

4. Description of drawings

Fig. 1 is the three-dimensional structural diagram of the present utility model.

Fig. 2 is a front view in section of the chip package of the present invention.

5. Specific implementation

Below in conjunction with accompanying drawing, the specific embodiment of the utility model is described in detail.

As shown in Figure 1-2, the utility model includes a heat sink, LED chips, gold wires, fluorescent powder, and electrodes. The LED chips 6 are installed on the front surface of the heat-dissipating insulating substrate 12, and there are multiple LED chips to form a uniformly distributed array row. After each chip is connected in series or in parallel with the gold wire 11, it is welded together with the positive and negative electrode terminals 4. There is a phosphor layer 9 around and on the top of the LED chip, and the LED chip, gold wire and phosphor layer are encapsulated by potting silica gel. In the pit on the upper part of the heat-dissipating and insulating substrate, there is a lens 10 for encapsulation on the potting glue, and a radiator 2 is installed at the rear of the heat-dissipating and insulating substrate.

In order to ensure the use effect and facilitate installation and maintenance, the LED chip is fastened on the heat dissipation insulation substrate through silver glue, solid crystal glue or total gold welding, and the LED chip 6 has a potting silicone wall 7; There is a reflective layer 8 on the inner wall of the pit on the upper part of the substrate; one end of the radiator 2 has a triangular groove 1, and the other end has a triangular convex groove 3; the heat dissipation and insulating substrate 12, LED chip 6, potting silica gel and lens 10 are packaged together to form an LED lamp 5 .

The heat sink is made of high thermal conductivity alloy materials such as copper, aluminum or magnesium. There are N pits on the substrate in the LED chip packaging area. The inner walls of the pits are silver-plated or have a reflective layer. There are high-power LED chips, which are bonded to the bottom of the pit by solid crystal glue or co-metal and directly connected to the substrate of the heat sink, and then the silicone with a suitable viscosity coefficient is used to draw glue or glue around the LED chip with a glue dispenser. Dispensing, coating a layer of silicone wall around the LED chip, the silicone wall can be glued and dispensed one or more times according to the thickness of the phosphor silica gel required, and the product coated with the silicone wall is baked and waited for After the silicone fence is cured, wires are made. After the wires are finished, a layer of phosphor silica gel is poured into the predetermined area, and then baked and cured. Since the silica gel cloth is used around the LED chip, the phosphor silica gel will not flow due to fluid mechanics. Outside the non-luminous area, the phosphor silica gel on the entire surface of the actual LED chip can be uniformly coated, which will not cause waste of phosphor silica gel and increase the overall luminous efficiency. A plurality of power LED chips can be arranged in the encapsulation area at the same time to realize encapsulation and integration of high-power LED light sources. There are series or parallel electrode terminals 4 of LED groups at both ends of the pit, and each encapsulation structure forms an LED lamp.

Both ends of the heat sink are also provided with triangular grooves and triangular convex grooves, which can facilitate and quickly install and increase or decrease the quantity and power of the packaged light source modules.

The LED chips generally use high-power semiconductor diodes, and currently a single 2W LED chip with high luminous efficiency and stable performance is commonly used.

The positive effect of the utility model is that about 50% of the expensive fluorescent powder is saved in the packaging compared with the traditional one, and the LED chip is connected to the heat sink through the heat dissipation insulating substrate, the heat dissipation channel is shortened, and the calorific value is greatly reduced. Compared with the original packaging structure , Under the same conditions, it can reduce the LED junction temperature by about 5-20°C, which is energy-saving, non-environmental pollution, safe, and has a long service life.

Claims (4)

1. high-power LED module encapsulating structure, comprise radiator, led chip, gold thread, fluorescent material, electrode, it is characterized in that, led chip (6) is contained on radiating insulating substrate (12) front, led chip is a plurality of, constitute uniform array row, each chip chamber is by behind gold thread (11) serial or parallel connection, weld together with positive and negative electrode binding post (4), phosphor powder layer (9) is arranged at around the led chip and top, led chip, gold thread and phosphor powder layer are packaged in by embedding silica gel in the pit on radiating insulating substrate top, are useful on the lens (10) of encapsulation on the casting glue, and radiator (2) is equipped with at radiating insulating substrate rear portion.

2. high-power LED module encapsulating structure according to claim 1 is characterized in that, embedding silica gel enclosing wall (7) is arranged outside the described led chip (6).

3. high-power LED module encapsulating structure according to claim 1 is characterized in that, on the pit inwall on described radiating insulating substrate top reflector layer (8) is arranged.

4. high-power LED module encapsulating structure according to claim 1 is characterized in that, described radiator (2) one ends have triangular groove (1), and the other end has triangular tongue (3).

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