CN102447049A - LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator - Google Patents

LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator Download PDF

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Publication number
CN102447049A
CN102447049A CN2011104565248A CN201110456524A CN102447049A CN 102447049 A CN102447049 A CN 102447049A CN 2011104565248 A CN2011104565248 A CN 2011104565248A CN 201110456524 A CN201110456524 A CN 201110456524A CN 102447049 A CN102447049 A CN 102447049A
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China
Prior art keywords
led
led chip
encapsulating structure
chip
cob
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CN2011104565248A
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Chinese (zh)
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CN102447049B (en
Inventor
秦会斌
祁姝琪
丁申冬
夏琦
许振军
陈丹萍
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Hangzhou Dianzi University
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Hangzhou Dianzi University
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Priority to CN 201110456524 priority Critical patent/CN102447049B/en
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Abstract

The invention relates to an LED (light-emitting diode) package structure based on a COB (chip on board) package technology and an LED illuminator. The existing package structure has the problems of large volume, multiple particles, difficulty in heat dissipation, exceed standard glare, high cost and the like when being applied to an indoor illuminator. The LED package structure provided by the invention comprises a base plate and multiple groups of LED chip package structures, wherein the multiple groups of LED chip package structures are arranged on the base plate and surrounded by silica gels; and a mixture of fluorescent powder and glue is filled in the surrounded region and is of a plane shape on the top of the surrounded region. The LED illuminator comprises the LED package structure, wherein groups of LED chip package structures in the LED package structure are connected in parallel between an upper bus and a lower bus. According to the invention, The structure is simple and practicable, heat dissipation property is good and the reflection effect is good.

Description

A kind of LED encapsulating structure and LED lighting device based on the COB encapsulation technology
Technical field
The invention belongs to LED encapsulation technology field, relate in particular to a kind of LED encapsulating structure and LED lighting device based on the COB encapsulation technology.
Background technology
Existing room lighting LED matrix mainly uses led chip is packaged into individual devices, like the SMD packagings of SMD such as 3020,3528,5050.There are problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height in the SMD package application in interior illuminator.
Also there are some uses that the COB encapsulating structure of circular groove is arranged.There is the COB encapsulation of circular groove to solve some problems that many connection in series-parallel application of SMD bring; But groove needs machinery to carry out secondary process; And when carrying out the COB encapsulation, need put fluorescent glue one by one, cause the production cycle long, some glue is uneven; Because the method point fluorescent glue is outer gibbosity, causes LED to go out the relatively poor problem of light consistency.
Summary of the invention
The objective of the invention is to the deficiency to prior art, first technical problem of solution is: the COB encapsulating structure that shortcomings such as a kind of SMD of overcoming formula LED volume is big, heat radiation is difficult, cost is high, dazzle exceeds standard are provided.
Second technical problem that the present invention solves is: a kind of LED lighting device based on the COB encapsulation technology is provided, and this device encapsulation is simple, and fluorescent glue is evenly distributed, thereby eliminates hot spot, makes the bright dipping of LED lighting device even.
The present invention solves the technical scheme that first technical problem adopts:
A kind of LED encapsulating structure based on the COB encapsulation technology comprises substrate, organizes the led chip encapsulating structure more.Many group led chip encapsulating structures are arranged on the substrate, and are surrounded by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top.
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects through gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
Said led chip is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Said substrate is rectangular-shaped high-thermal conductive metal base plate.
Said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, and described encapsulating material is the amalgam of fluorescent material and glue.
The present invention solves second technical scheme that technical problem adopted:
A kind of LED lighting device comprises aforesaid LED encapsulating structure; Every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
Beneficial effect of the present invention: compare prior art; The present invention proposes a kind of encapsulating structure based on the COB encapsulation technology; But on substrate, surround the silica gel of heat conduction, the encapsulating material that when packaging LED chips, uses fluorescent material and glue to be mixed and made into, said encapsulating material are filled in and surround the zone and be plane; Avoided because fluorescent glue is outer gibbosity; Cause LED to go out the relatively poor problem of light consistency, also can simplify packaging process, and the lighting device of a kind of simple and practical, thermal diffusivity good, reflecting effect good, colourity is even, temperature resistant capability is strong, packaging cost is low LED is provided.
Description of drawings
Fig. 1 is prior art constructions figure;
Fig. 2 is the cross sectional representation of single-chip package structure in the embodiment of the invention;
Fig. 3 is the structural representation of LED lighting device in the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is further specified.
The present invention has avoided the SMD encapsulation to have problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.As shown in Figure 1, in Fig. 1, SMD paster LED light source 2 is welded in pcb board 1, and every spacing is bigger, and the point-like effect is obvious, and frame of broken lines is represented the dark space 3 that produces, and the hot spot that when using lighting device, produces causes dazzle to exceed standard.
As shown in Figure 2, the cross sectional representation for single-chip package structure in the embodiments of the invention comprises: substrate 5 and a led chip encapsulation unit 7; Led chip encapsulation unit 7 is arranged on the substrate 5, and is surrounded by silica gel 15; The amalgam of filling fluorescent material and glue in this surrounds the zone, described amalgam are plane surrounding regional top;
Described led chip encapsulation unit 7 comprises led chip 8, elargol 18 and the coating 19 that sets gradually from top to bottom; Coating 19 is arranged on the solid brilliant position of substrate 5, and led chip 8 is fixed on the coating 19 of said substrate 5 through elargol 18; Led chip 8 upper surface electrodes are connected with substrate 5 upper surface routing positions through gold thread 16.
Said led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Said substrate 5 is rectangular-shaped high-thermal conductive metal base plate.
Said silica gel 15 is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, and described encapsulating material is the amalgam of fluorescent material and glue.
Said coating 19, optional gold, silver of material or aluminium, thermal conductivity is high, reflecting effect is good;
Said encapsulating material 14 light transmittances are high, refractive index is high, good fluidity, be prone to solidify, and block with cofferdam silica gel 15 and prevent its outflow.Led chip 8 is a blue chip, and technology is ripe relatively, and conversion efficiency is high; Said fluorescent material is blue-light excited ruddiness and gold-tinted fluorescent material; Said glue is epoxide-resin glue, and ratio is prone to allotment, and cost is low.
As shown in Figure 3, be the structural representation of LED lighting device in the embodiment of the invention.A kind of LED encapsulating structure 4 based on the COB encapsulation technology comprises substrate 5, organizes led chip encapsulating structure 6 more, and said led chip encapsulating structure 6 is arranged on the substrate 5, and is surrounded by silica gel 15; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulating structure 6 comprises the led chip encapsulation unit 7 of a plurality of serial connections, and the structure of each led chip encapsulation unit 7 as above instance is said.
Connect through gold thread 16 between the adjacent LED chip packaging unit 7, described gold thread 16 1 ends and led chip upper surface electrode are fixed, and the pad 11 between the other end and the led chip encapsulation unit 7 is fixing.
Said led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side, shortens the routing distance, has improved operability and reliability, and has practiced thrift the cost of gold thread 16.
Surround with silica gel 15 on the said substrate 5, rectangular being arranged on around the led chip 8 highly is no more than 1mm.After the cold curing, cover with point gum machine and to be coated with encapsulating material 14, need not to put one by one glue; Only need the average mark glue of layouting; Because encapsulating material 14 self good mobility makes it be plane, silica gel 15 surrounds it, and the upper surface of encapsulating material 14 is no more than silica gel 15; With this illuminating source that forms is area source, no point-like effect, free from glare.
Every group of led chip encapsulating structure 6 is connected in parallel between bus 12 and the following bus 13.Two its substrate 5 head and the tail that are provided with LED encapsulating structure 4 are together seamless spliced, are communicated with through lead-in wire between plate 17.
In sum, the embodiment of the invention adopts the LED encapsulating structure 4 based on the COB encapsulation technology, has avoided SMD paster class LED lighting device problem, the problem includes: problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.Also eliminated in the COB encapsulation that groove is set, owing to need the heat sink groove of processing, put fluorescent glue one by one, caused the production cycle long, some glue is uneven, and because the method point fluorescent glue is outer gibbosity, causes LED to go out the relatively poor problem of light consistency.Through selecting the silica gel 15 that cohesiveness is strong, heat conduction and heat radiation property is good to surround; Prevent that encapsulating material 14 from overflowing, make things convenient for control point glue amount, and protected encapsulating material 14 well; Make it to have good adhesion strength and heat dispersion, further improved the useful life of LED lighting device.The present invention once can organize the LED lighting device by encapsulated moulding more, and is simple and practical, thermal diffusivity good, go out that light consistency is good, reflecting effect good, colourity is even, temperature resistant capability is strong, packaging cost is low.
Giving an example of the above near-sighted specific embodiment of the invention can not assert that practical implementation of the present invention is confined to these explanations, does not address part in detail and is those skilled in the art's common practise.Under the prerequisite that does not break away from the present invention's design, any simple deduction, equivalent transformation of making is also within protection scope of the present invention.

Claims (5)

1. the LED encapsulating structure based on the COB encapsulation technology comprises substrate, organizes the led chip encapsulating structure more, it is characterized in that: organize the led chip encapsulating structure more and be arranged on the substrate, and surrounded by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects through gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
2. a kind of LED encapsulating structure as claimed in claim 1 based on the COB encapsulation technology, it is characterized in that: said led chip is the chip of bipolar electrode, routing position pad is positioned at solid brilliant position dual-side.
3. a kind of LED encapsulating structure based on the COB encapsulation technology as claimed in claim 1, it is characterized in that: said substrate is rectangular-shaped high-thermal conductive metal base plate.
4. a kind of LED encapsulating structure as claimed in claim 1 based on the COB encapsulation technology, it is characterized in that: said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, described encapsulating material is the amalgam of fluorescent material and glue.
5. a LED lighting device comprises a plurality of LED encapsulating structures as claimed in claim 1, it is characterized in that: every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
CN 201110456524 2011-12-31 2011-12-31 LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator Expired - Fee Related CN102447049B (en)

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CN 201110456524 CN102447049B (en) 2011-12-31 2011-12-31 LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102938402A (en) * 2012-07-11 2013-02-20 周海兵 Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof
CN103047556A (en) * 2012-09-14 2013-04-17 孙百贵 Manufacture method of light-emitting diode (LED) lamp based on chip on board (COB) device
CN103258944A (en) * 2013-05-31 2013-08-21 江苏索尔光电科技有限公司 Method for manufacturing LED package
CN104347605A (en) * 2013-08-06 2015-02-11 惠州市华阳光电技术有限公司 Light-emitting diode packaging process
CN106067510A (en) * 2016-07-28 2016-11-02 马建芳 A kind of LED light source application module based on SMT paster technique die bond
CN108036204A (en) * 2017-12-14 2018-05-15 广东雷腾智能光电有限公司 A kind of COB light source for eliminating veiling glare

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101783384A (en) * 2010-02-04 2010-07-21 九江联辉光电有限公司 Method for sealing large-power LED
JP2010532929A (en) * 2007-07-06 2010-10-14 エルジー イノテック カンパニー リミテッド Light emitting device package
CN202373627U (en) * 2011-12-31 2012-08-08 杭州电子科技大学 Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010532929A (en) * 2007-07-06 2010-10-14 エルジー イノテック カンパニー リミテッド Light emitting device package
CN101783384A (en) * 2010-02-04 2010-07-21 九江联辉光电有限公司 Method for sealing large-power LED
CN202373627U (en) * 2011-12-31 2012-08-08 杭州电子科技大学 Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102938402A (en) * 2012-07-11 2013-02-20 周海兵 Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof
CN103047556A (en) * 2012-09-14 2013-04-17 孙百贵 Manufacture method of light-emitting diode (LED) lamp based on chip on board (COB) device
CN103258944A (en) * 2013-05-31 2013-08-21 江苏索尔光电科技有限公司 Method for manufacturing LED package
CN104347605A (en) * 2013-08-06 2015-02-11 惠州市华阳光电技术有限公司 Light-emitting diode packaging process
CN106067510A (en) * 2016-07-28 2016-11-02 马建芳 A kind of LED light source application module based on SMT paster technique die bond
CN108036204A (en) * 2017-12-14 2018-05-15 广东雷腾智能光电有限公司 A kind of COB light source for eliminating veiling glare

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