CN202839748U - White light source module based on flip LED chips - Google Patents
White light source module based on flip LED chips Download PDFInfo
- Publication number
- CN202839748U CN202839748U CN2012204889641U CN201220488964U CN202839748U CN 202839748 U CN202839748 U CN 202839748U CN 2012204889641 U CN2012204889641 U CN 2012204889641U CN 201220488964 U CN201220488964 U CN 201220488964U CN 202839748 U CN202839748 U CN 202839748U
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- China
- Prior art keywords
- led chips
- flip led
- light source
- white light
- source module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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Abstract
The utility model relates to a white light source module based on flip LED chips. The technical scheme adopted is that a plurality of flip LED chips are attached to a heat dissipation substrate; and a plate containing fluorescent powder is at one time integrally arranged on the plurality of flip LED chips. The utility model aims at providing the white light source module which has the advantages of simplifying the production process, saving the production cost, improving the production efficiency, maintaining good heat dissipation performances, reducing light degradation, and reducing the packaging volume.
Description
Technical field
The utility model relates to the lighting source field, relates in particular to a kind of white light source module based on flip LED chips.
Background technology
Light-emitting diode (LED) is a kind of low voltage semiconductor solid luminescence device, it is to utilize the solid semiconductor wafer as luminescent material, when two ends add forward voltage, charge carrier in the semiconductor can occur compoundly to cause photo emissions and produce light, be the most popular current light source technology, the characteristics of LED white light source are: energy-conservation; Use low-tension supply (between 6 ~ 24V), fail safe is good; Volume is little; Life-span is long; Response time is fast; Without poisonous metal mercury to pollution of environment etc.Along with the Application and Development of high-powered LED lamp, the LED lamp is from point-source of light to the function lighting future development, and its prospect is quite wide.The manufacture method of tradition LED is the stepped construction that epitaxial growth comprises N-shaped semiconductor material layer, luminescent layer and p-type semiconductor material layer on substrate.For blue light and green diode, usually adopt sapphire as substrate, and adopt the indium gallium nitride epitaxial structure as stepped construction.Because Sapphire Substrate is dielectric substrate, so the positive pole of LED and negative pole all are arranged on the front.
Owing to improve constantly for the luminous efficiency of LED and the requirement of brightness, the flip LED device has replaced above-mentioned traditional LED device gradually, with as high power LED device.As light-emitting area, and fit with heat sink district as the silicon substrate of conductive structure by the electrode of chip front side with the back side for flip LED.Therefore the heat sink district of flip LED chips and substrate approaches, and radiating effect increases.In addition, the area of device can be added to 1mm * 1mm, drive current even can reach 300 or 500mA, and power reaches 1W.
High power LED device is mainly used in white-light illuminating.Application number be CN201110266599.X patent disclosure a kind of high whiteness substrate based LED lamp bar, comprise lamp holder, radiator, the led light source module, power unit and fluorescent tube, described led light source module, comprise base and led chip, described base comprises substrate and is arranged on the reflector that is arranged in a linear on the substrate, each reflector bottom is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, the light-emitting area whiteness of LED 〉=70 be used for to be installed on the described reflector, the getting optical efficiency and will greatly promote of chip, reducing light energy conversion is the loss of heat energy, therefore improves heat dispersion, uses and improves the life-span.But this LED lamp bar need to encapsulate the packaging technology of fluorescent material, and in potting process, the coating of fluorescent material is restive, causes the phenomenon of white light irregular colour, has affected colour temperature and the color coordinates of the white light of emission, thereby causes the finished product yield to reduce.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of and can either simplifies the production technology link, saves production cost, enhances productivity, and can keep preferably heat dispersion again, reduces light decay, dwindles the white light source module of encapsulation volume.
The technical solution adopted in the utility model is: several flip LED chips are attached on this heat-radiating substrate; And a plate that contains fluorescent material, disposable integral is coated on this several flip LED chips tops.
Described substrate adopts aluminium base or copper base.
Described aluminium base or copper base have reflector.
The aluminium base of described reflector or copper base adopt stamped recess one-body molded.
Weld by Sillim's alloy between described flip LED chips and the described heat-radiating substrate.
The described plate that contains fluorescent material is clear glass or transparent flexible plastics or epoxy resin or silica gel.
The described flexographic plate that contains fluorescent material is film or adhesive tape.
Described flip LED chips is drawn both positive and negative polarity through connected in series or in parallel to heat-radiating substrate.
Compared with prior art, the utlity model has following advantage:
(1) owing to adopt flip LED to be packaged into the white light source module, can adopt large driven current density, under the prerequisite that guarantees equal-wattage, reduce the usage quantity of led chip, help to reduce encapsulation volume, be conducive to large batch of suitability for industrialized production;
(2) owing to weld by Sillim's alloy between flip LED chips and the described heat-radiating substrate, reduced the routing process procedure, simplification of flowsheet can be saved manufacturing cost greatly;
(3) adopt aluminium base or copper base as heat-radiating substrate, so that the flip LED chips epitaxial loayer directly directly contacts with the heat dissipation metal substrate, can solve well heat dissipation problem;
(4) adopt the plate material that contains fluorescent material directly to be coated on the flip LED chips top, can reduce the operation that applies fluorescent material, enhance productivity, can also overcome the fluorescent material uniformity problem more rambunctious that applies.
Description of drawings
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is present embodiment 1 described white light source module cutaway view based on flip LED chips.
Fig. 2 is present embodiment 2 described white light source module cutaway views based on flip LED chips.
Fig. 3 is present embodiment 2 described white light source module vertical views based on flip LED chips.
Parts symbol description among the figure:
101,201: heat-radiating substrate; 102,202: flip LED chips; 103,203: the plate that contains fluorescent material; 104,204: Sillim's alloy; 105,205: the positive source wire; 106,206: the power cathode wire; 207: reflector.
Embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
Embodiment 1
As shown in Figure 1, be a kind of white light source module cutaway view based on flip LED chips.A kind of white light source module based on flip LED chips comprises 6 flip LED chips 102, is galliumnitride base LED chip for example, be attached on this heat-radiating substrate 101, and for example be aluminum cooling substrates; And a plate 103 that contains fluorescent material, for example select yellow YAG fluorescent material, be transparent epoxy resin adhesive tape shape plate, disposable integral is coated on this 6 inverted gallium nitride base LED chips tops.
Further, weld by Sillim's alloy 104 between described flip LED chips 102 and the described heat-radiating substrate 101; Described flip LED chip 102 is connected to heat-radiating substrate 101 with the series connection form, and the positive source wire 105 of drawing is connected with the power cathode wire for connecting power positive cathode, so that the white light source module can work.
In sum, owing to adopt flip LED to be packaged into the white light source module, can adopt large driven current density, under the prerequisite that guarantees equal-wattage, reduce the usage quantity of led chip, help to reduce encapsulation volume; Because by Sillim's alloy welding, do not need routing between flip LED chips and the described heat-radiating substrate, simplification of flowsheet is saved manufacturing cost; Adopt aluminium base as heat-radiating substrate, so that the flip LED chips epitaxial loayer directly directly contacts with the heat dissipation metal substrate, can solve well heat dissipation problem; The transparent epoxy resin plate that employing contains fluorescent material directly is coated on the flip LED chips top, can reduce the operation that applies fluorescent material, enhances productivity, can also be so that the thickness attenuation of white light source module is beneficial to integrated application.
Embodiment 2
Another kind shown in Fig. 2 and 3 comprises 10 flip LED chips 202 based on the white light source module of flip LED chips, is galliumnitride base LED chip for example, be attached on this heat-radiating substrate 201, and for example be the copper heat-radiating substrate; And a plate 203 that contains fluorescent material, for example select yellow YAG fluorescent material, be the rigid plate of transparent epoxy resin, disposable integral is coated on this 10 inverted gallium nitride base LED chips tops.
Further, weld by Sillim's alloy 204 between described flip LED chips 202 and the described heat-radiating substrate 201; Described heat-radiating substrate 201 has reflector 207, and described reflector 207 employing stamped recess and heat-radiating substrate 201 are one-body molded; Described LED chip 202 is connected to heat-radiating substrate 201 with the series connection form, and the positive source wire 205 of drawing is connected with the power cathode wire for connecting power positive cathode, so that the white light source module can work.
In sum, embodiment 2 because heat-radiating substrate also has the groove of stamping out as reflector, can further strengthen the light extraction efficiency of flip-chip except the advantage with embodiment 1, improve the light efficiency of white light source; Flip-chip places reflector, and the clear glass plate is rigidity, and can smoothly be coated on the heat-radiating substrate top, can further dwindle the volume of white light source module.
Claims (7)
1. the white light source module based on flip LED chips is characterized in that comprising: a heat-radiating substrate; Several flip LED chips are attached on this heat-radiating substrate; And a plate that contains fluorescent material, integral coating is in these several flip LED chips tops.
2. a kind of white light source module based on flip LED chips according to claim 1 is characterized in that: described substrate employing aluminium base or copper base.
3. a kind of white light source module based on flip LED chips according to claim 1, it is characterized in that: described substrate has reflector.
4. a kind of white light source module based on flip LED chips according to claim 1 is characterized in that: weld by Sillim's alloy between described flip LED chips and the described heat-radiating substrate.
5. a kind of white light source module based on flip LED chips according to claim 1 is characterized in that: the described plate that contains fluorescent material is flexographic plate or rigid version.
6. a kind of white light source module based on flip LED chips according to claim 5, it is characterized in that: the described flexographic plate that contains fluorescent material is film or adhesive tape.
7. a kind of white light source module based on flip LED chips according to claim 1 is characterized in that:
Described flip LED chips is drawn both positive and negative polarity through connected in series or in parallel to heat-radiating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204889641U CN202839748U (en) | 2012-09-24 | 2012-09-24 | White light source module based on flip LED chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204889641U CN202839748U (en) | 2012-09-24 | 2012-09-24 | White light source module based on flip LED chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839748U true CN202839748U (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204889641U Expired - Lifetime CN202839748U (en) | 2012-09-24 | 2012-09-24 | White light source module based on flip LED chips |
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| CN (1) | CN202839748U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168004A (en) * | 2013-05-16 | 2014-11-26 | 太阳诱电株式会社 | Electronic component and method of fabricating the same |
| CN104576626A (en) * | 2013-10-22 | 2015-04-29 | 泰谷光电科技股份有限公司 | Flip chip type light emitting diode element packaging structure |
| CN105575957A (en) * | 2016-02-22 | 2016-05-11 | 易美芯光（北京）科技有限公司 | COB light source for white light LED |
| WO2017054248A1 (en) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Flip-chip led module |
-
2012
- 2012-09-24 CN CN2012204889641U patent/CN202839748U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168004A (en) * | 2013-05-16 | 2014-11-26 | 太阳诱电株式会社 | Electronic component and method of fabricating the same |
| CN104576626A (en) * | 2013-10-22 | 2015-04-29 | 泰谷光电科技股份有限公司 | Flip chip type light emitting diode element packaging structure |
| WO2017054248A1 (en) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Flip-chip led module |
| CN105575957A (en) * | 2016-02-22 | 2016-05-11 | 易美芯光（北京）科技有限公司 | COB light source for white light LED |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |