CN201539737U - LED lamp - Google Patents

LED lamp Download PDF

Info

Publication number
CN201539737U
CN201539737U CN2009202055963U CN200920205596U CN201539737U CN 201539737 U CN201539737 U CN 201539737U CN 2009202055963 U CN2009202055963 U CN 2009202055963U CN 200920205596 U CN200920205596 U CN 200920205596U CN 201539737 U CN201539737 U CN 201539737U
Authority
CN
China
Prior art keywords
led
translucent cover
light fixture
led light
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009202055963U
Other languages
Chinese (zh)
Inventor
肖兆新
胡建华
龚伟斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUIFENG PHOTOELECTRONIC CO Ltd SHENZHEN CITY
Shenzhen Refond Optoelectronics Co Ltd
Original Assignee
RUIFENG PHOTOELECTRONIC CO Ltd SHENZHEN CITY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RUIFENG PHOTOELECTRONIC CO Ltd SHENZHEN CITY filed Critical RUIFENG PHOTOELECTRONIC CO Ltd SHENZHEN CITY
Priority to CN2009202055963U priority Critical patent/CN201539737U/en
Application granted granted Critical
Publication of CN201539737U publication Critical patent/CN201539737U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

The utility model provides an LED lamp, which is adaptable to indoor illumination. The LED lamp comprises an LED module, a driving circuit, a radiating block, a transparent cover, a fluorescent powder layer and a packaging material, wherein the LED module consists of a substrate and an LED chip arranged on the front side of the substrate, the driving circuit is electrically connected with the LED module, the radiating block contacts with the back of the substrate, the transparent cover is disposed above the LED chip and covers the whole LED chip, a distance between the inner surface of the transparent cover and the LED chip ranges from 0.5cm to 10cm, the fluorescent powder layer is arranged on the inner surface of the transparent cover, and the packaging material is filled in the transparent cover. Besides, the outer surface of the transparent cover is a convex-and-concave structure at the micro level after being processed and micro fins are manufactured on the surface of the radiating block. A structure that the fluorescent powder layer is distant from the chip is favorable for increasing excitation efficiency of fluorescent powder, the LED chip keeps working at a low temperature due to fine radiating performance of the integral lamp, the LED lamp is higher in light emitting efficiency by aids of the packaging materials and the transparent cover, and then product reliability is increased greatly and service life thereof is prolonged.

Description

A kind of LED light fixture
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of LED fitting structure.
Background technology
At present, the LED light fixture replaces traditional fluorescent lamp and bulb, be the trend of lighting source development, it also is the policy that many countries carry out energetically, its main cause: compare with bulb with traditional fluorescent lamp, the LED light fixture has long, the high and low power consumption of light efficiency of life-span, advantages such as starting resistor is low, reaction is fast, environmental protection.One document number is that the utility model patent of CN2729906Y discloses a kind of large-power light-emitting diodes colour mixture luminescent device, and it comprises: lead frame, and its surface comprises outward extending electrode pin; Be arranged on one of them surperficial luminescence chip of described lead frame, the lead-in wire of described luminescence chip and described pin are connected as a single entity; Lens, it is arranged at described lead frame surface and is positioned at described luminescence chip top; Phosphor powder layer, it is coated in the lens surface relative with described luminescence chip; Transparent silica gel, it is filled in described luminescence chip and applies between the lens surface of phosphor powder layer; The surface is through the metal substrate of oxidation processes, and it is fixed in the another one surface of described lead frame; The plastic encapsulation body, it closes the lead frame surface around described substrate and the lens.Described phosphor powder layer is located at the plane of crown lens, and is near from luminescence chip, and the pitch match between phosphor powder layer and the chip is not good, and the fluorescent material launching efficiency is low, influences the light efficiency of luminescent device, energy-conservation inadequately.In addition, described lens outer surface is a smooth surface, total reflection probability height, and light extraction efficiency is low.
The utility model content
The purpose of this utility model is the LED light fixture that provides a kind of energy-saving effect good to be intended to solve the low problem of LED light fixture light efficiency.
The utility model is achieved in that a kind of LED light fixture, comprising: the LED module, and described LED module is made of substrate and the led chip that is located at substrate front side; The drive circuit that is electrically connected with the LED module; The radiating block that contacts with substrate back; The translucent cover of being located at the led chip top and whole led chips being covered, the spacing between described translucent cover inner surface and the described led chip is 0.5~10cm; Be located at the phosphor powder layer of translucent cover inner surface; Be filled with encapsulating material in the described translucent cover.
Described translucent cover outer surface is through handling the uneven structure that forms on the microcosmic.
Described translucent cover inner surface is coated with dissimilar phosphor powder layers and the led chip module is complementary.
Described encapsulating material is full of whole translucent cover.
Described heat dissipation block surface has little fin.
Compare with prior art, the beneficial effects of the utility model are: phosphor powder layer helps improving the launching efficiency of fluorescent material away from the structure of chip.Uneven structure on the described translucent cover outer surface formation microcosmic can reduce the total reflectivity of translucent cover, the light extraction efficiency of favourable raising light fixture.According to the market demand, described translucent cover inner surface is coated with dissimilar phosphor powder layers and the led chip module is complementary, thereby the utlity model has the photochromic characteristics of more options.Thereby described encapsulating material is full of the translucent cover that whole translucent cover is close to encapsulating material to be covered with phosphor powder layer, the heat that led chip produces promptly passes through encapsulating material, translucent cover, substrate and radiating block, whole light fixture forms a good radiator, chip is worked under lower temperature, and light extraction efficiency is higher.In a word, the whole good heat radiation of the utility model makes led chip work be in lower temperature, and encapsulating material and translucent cover make this LED light fixture have higher light-emitting efficiency simultaneously, and product reliability obtains to promote greatly, and prolong service life.
Description of drawings
Fig. 1 is the utility model first embodiment LED light fixture orthogonal view;
Fig. 2 is a LED module vertical view among Fig. 1;
Fig. 3 is Figure 1A portion enlarged drawing;
Fig. 4 is the utility model second embodiment LED light fixture sectional side view;
Fig. 5 is the utility model the 3rd embodiment LED light fixture orthogonal view;
Fig. 6 is Fig. 5 B portion enlarged drawing.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.Alleged LED light fixture refers to by the light with two kinds of different colours and mixes the luminescent device that the back forms required color light in this specification, wherein a kind of light of color is produced by led chip, and the light of another kind of color is the fluorescence that fluorescent material is excited to produce under preceding a kind of color of light irradiation.Be that example describes with the white light LEDs light fixture below.
As shown in Figure 1, 2, the LED light fixture that the utility model first embodiment provides is the LED lamp plate, it has the LED module that is made of substrate 6 and the led chip 3 that is installed in substrate front side, described substrate 6 adopts aluminium base, copper base or the ceramic substrate of high heat conduction, and metal substrate must be handled through insulating; Described led chip 3 can be the combination of blue chip, ultraviolet light chip or blue chip and red light chips with wave band or different-waveband.Described LED module is electrically connected with drive circuit 1, and described drive circuit 1 is built in substrate or is printed in substrate surface.Described substrate 6 back sides are provided with the radiating block 8 that contacts with its face, and 6 of described radiating block 8 and described substrates are provided with securing member 7, and their contact-making surface is coated heat-conducting glue (conduction estersil) back and carried out fastening to it; For strengthening radiating effect, described heat dissipation block surface also is shaped on little fin 10.Described substrate 6 one sides are provided with the translucent cover 2 that whole led chips are covered, and described translucent cover 2 is flat box-like or semi-cylindrical, and its inner surface is a smooth surface; Spacing between described translucent cover 2 horizontal inner surfaces and the described led chip is 0.5~5cm.Described translucent cover 2 outer surfaces as shown in Figure 3, can reduce the total reflectivity of translucent cover like this through handling the uneven structure that forms on the microcosmic, and this encapsulates the light extraction efficiency of favourable raising light fixture; Described translucent cover 2 is made by glass, silica gel or other material, characteristics such as have high stability, high transmission rate, insulating properties are good, shock-resistant, gas permeability is low.According to the market demand, described translucent cover inner surface is coated with the phosphor powder layer 4 that is complementary with the led chip module equably, described phosphor powder layer 4 firmly is bonded in the translucent cover inner surface, and phosphor powder layer helps improving the launching efficiency of fluorescent material away from the structure of chip.For the demanding LED light fixture of colour rendering index, available blue-light LED chip module and secondary colour (green+yellow+redness) fluorescent material coupling, perhaps ultraviolet leds chip module and secondary colour (blueness+green+redness) fluorescent material coupling, or hybrid chip (blue chip+red light chips) module and yellow fluorescent powder coupling; For the less demanding LED light fixture of colour rendering index, can be directly with blue-light LED chip module and yellow fluorescent powder coupling; Described fluorescent material is high excitability fluorescent material, and light efficiency, color and spatial light intensity that parameters such as the granularity of fluorescent material that in addition can be by changing phosphor powder layer, consumption, coating position, shape, solid brilliant position change the LED light fixture distribute; Thereby the utlity model has the photochromic characteristics of more options.After described translucent cover inner surface is coated with and is covered with phosphor powder layer curing, packaging LED chips, fill encapsulating material 5 in the described transparent cover, described encapsulating material 5 can be to have high-termal conductivity, high stability, high transmission rate, high index of refraction, big specific heat capacity, gas, liquid or solid that insulating properties is good; Thereby described encapsulating material 5 is full of the translucent cover 2 that whole translucent cover 2 is close to encapsulating material 5 to be covered with phosphor powder layer, the heat that led chip 3 produces promptly passes through encapsulating material 5, translucent cover 2, substrate 6 and radiating block 8, whole light fixture forms a good radiator, chip is worked under lower temperature, light extraction efficiency is higher, and this encapsulating material also helps the light extraction efficiency that improves chip.
As shown in Figure 4, the LED light fixture that the utility model second embodiment provides is the LED fluorescent tube, the present embodiment and the first embodiment difference are the profile of translucent cover 2, present embodiment translucent cover 2 is ring groove shape or interior empty hemispherical, and the phosphor powder layer and the average headway between the described led chip that are coated on the inner concave of described translucent cover are 0.5~10cm.
As shown in Figure 5, the LED light fixture that the utility model the 3rd embodiment provides is the LED bulb, the present embodiment and the first embodiment difference are the profile of translucent cover 2 equally, present embodiment translucent cover 2 is a hollow bowling sphere, also sphere, elliposoidal etc., the phosphor powder layer and the average headway between the described led chip that are coated on described translucent cover inner surface are 0.5~10cm.The lamp holder of this LED bulb is made of the radiating block 8 with little fin 10, the screw thread latch closure 9 that is located at the radiating block afterbody and the drive circuit 1 that passes screw thread latch closure and radiating block in addition, and drive circuit 1 also plays fastening radiating block 8 and LED module herein.
The whole good heat radiation of the utility model makes led chip work be in lower temperature, and encapsulating material and translucent cover make this LED light fixture have higher light-emitting efficiency simultaneously, and product reliability obtains to promote greatly, and prolong service life.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims (9)

1. LED light fixture comprises: the LED module, and described LED module is made of substrate and the led chip that is located at substrate front side; The drive circuit that is electrically connected with the LED module; The radiating block that contacts with substrate back; The translucent cover of being located at the led chip top and whole led chips being covered; Be located at the phosphor powder layer of translucent cover inner surface; Be filled with encapsulating material in the described translucent cover, it is characterized in that, the spacing between described translucent cover inner surface and the described led chip is 0.5~10cm.
2. LED light fixture as claimed in claim 1 is characterized in that, described LED light fixture is the LED lamp plate, and the translucent cover of this lamp plate is flat box-like or semi-cylindrical, and the spacing between horizontal inner surface of the translucent cover of this lamp plate and the described led chip is 0.5~5cm.
3. LED light fixture as claimed in claim 1 is characterized in that, described translucent cover is ring groove shape or interior empty hemispherical, and the phosphor powder layer and the average headway between the described led chip that are coated on the inner concave of described translucent cover are 0.5~10cm.
4. LED light fixture as claimed in claim 1, it is characterized in that, described LED light fixture is the LED bulb, and the translucent cover of this bulb is a hollow bowling sphere, and the phosphor powder layer and the average headway between the described led chip that are coated on described translucent cover inner surface are 0.5~10cm.
5. as any one described LED light fixture of claim 1~4, it is characterized in that described translucent cover outer surface is through handling the uneven structure that forms on the microcosmic.
6. LED light fixture as claimed in claim 1 is characterized in that, described translucent cover inner surface is coated with dissimilar phosphor powder layers and the led chip module is complementary.
7. LED light fixture as claimed in claim 1 is characterized in that described encapsulating material is full of whole translucent cover.
8. LED light fixture as claimed in claim 4 is characterized in that, the lamp holder of described bulb is made of the radiating block with little fin, the drive circuit that is located at the screw thread latch closure of radiating block afterbody and passes screw thread latch closure and radiating block.
9. LED light fixture as claimed in claim 1 is characterized in that described heat dissipation block surface has little fin.
CN2009202055963U 2009-10-14 2009-10-14 LED lamp Expired - Fee Related CN201539737U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202055963U CN201539737U (en) 2009-10-14 2009-10-14 LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202055963U CN201539737U (en) 2009-10-14 2009-10-14 LED lamp

Publications (1)

Publication Number Publication Date
CN201539737U true CN201539737U (en) 2010-08-04

Family

ID=42591190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202055963U Expired - Fee Related CN201539737U (en) 2009-10-14 2009-10-14 LED lamp

Country Status (1)

Country Link
CN (1) CN201539737U (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102155665A (en) * 2011-04-14 2011-08-17 翁小翠 LED (light emitting diode) lamp bulb with high light-emitting rate
CN102252299A (en) * 2011-06-27 2011-11-23 成都曙光光纤网络有限责任公司 Radiating system for light-emitting diode (LED) lamp and LED lamp
CN102853291A (en) * 2012-04-24 2013-01-02 中山大学 Detachable LED (Light Emitting Diode) light engine
CN102889478A (en) * 2011-07-21 2013-01-23 天津思博科科技发展有限公司 LED (light-emitting diode) natural dodging lamp
CN103022327A (en) * 2013-01-04 2013-04-03 北京半导体照明科技促进中心 LED packaging structure and method for manufacturing same
CN103438364A (en) * 2013-07-28 2013-12-11 曾文超 Light-emitting diode (LED) lamp
CN103562632A (en) * 2011-04-04 2014-02-05 陶瓷技术有限责任公司 LED lamp comprising an LED as the luminaire and a glass or plastic lampshade
TWI426202B (en) * 2010-12-17 2014-02-11 Genius Electronic Optical Co Optical lighting module
CN103836418A (en) * 2014-03-07 2014-06-04 上海亚明照明有限公司 High-light-effect and ultra-high-color-development high-voltage alternating-current warm white LED (light emitting diode) and acquisition method thereof
CN106848031A (en) * 2015-12-04 2017-06-13 财团法人工业技术研究院 The encapsulating structure of ultraviolet light-emitting diodes
CN109237329A (en) * 2017-07-06 2019-01-18 总督科技股份有限公司 The anti-dazzle structure of LED lamp tube

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426202B (en) * 2010-12-17 2014-02-11 Genius Electronic Optical Co Optical lighting module
CN103562632A (en) * 2011-04-04 2014-02-05 陶瓷技术有限责任公司 LED lamp comprising an LED as the luminaire and a glass or plastic lampshade
CN102155665A (en) * 2011-04-14 2011-08-17 翁小翠 LED (light emitting diode) lamp bulb with high light-emitting rate
CN102252299A (en) * 2011-06-27 2011-11-23 成都曙光光纤网络有限责任公司 Radiating system for light-emitting diode (LED) lamp and LED lamp
CN102889478A (en) * 2011-07-21 2013-01-23 天津思博科科技发展有限公司 LED (light-emitting diode) natural dodging lamp
CN102853291A (en) * 2012-04-24 2013-01-02 中山大学 Detachable LED (Light Emitting Diode) light engine
CN102853291B (en) * 2012-04-24 2015-05-20 中山大学 Detachable LED (Light Emitting Diode) light engine
CN103022327A (en) * 2013-01-04 2013-04-03 北京半导体照明科技促进中心 LED packaging structure and method for manufacturing same
CN103438364A (en) * 2013-07-28 2013-12-11 曾文超 Light-emitting diode (LED) lamp
CN103836418A (en) * 2014-03-07 2014-06-04 上海亚明照明有限公司 High-light-effect and ultra-high-color-development high-voltage alternating-current warm white LED (light emitting diode) and acquisition method thereof
CN103836418B (en) * 2014-03-07 2016-06-08 上海亚明照明有限公司 High-voltage alternating warm white LED and the preparation method thereof of high light efficiency superelevation colour developing
CN106848031A (en) * 2015-12-04 2017-06-13 财团法人工业技术研究院 The encapsulating structure of ultraviolet light-emitting diodes
US10134963B2 (en) 2015-12-04 2018-11-20 Industrial Techology Research Institute Package structure of an ultraviolet light emitting diode
CN109237329A (en) * 2017-07-06 2019-01-18 总督科技股份有限公司 The anti-dazzle structure of LED lamp tube

Similar Documents

Publication Publication Date Title
CN201539737U (en) LED lamp
US10879435B2 (en) Light emitting diodes, components and related methods
US9287475B2 (en) Solid state lighting component package with reflective polymer matrix layer
US9897789B2 (en) Light emitting device package and lighting device having the same
US9960322B2 (en) Solid state lighting devices incorporating notch filtering materials
CN102859258A (en) Enhanced color rendering index emitter through phosphor separation
CN101958316B (en) LED integrated packaging power source module
US9593812B2 (en) High CRI solid state lighting devices with enhanced vividness
CN100489386C (en) Non-reflection high light extracting rate unit WLED power expanding type high power WLED light source
JP2010267571A (en) Lighting device
CN101192638A (en) Luminous diode element
CN103050615B (en) A kind of White LED with high color rendering property device
JP2014060328A (en) Light-emitting device
CN104505456A (en) High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof
CN202100964U (en) LED (light emitting diode) energy-saving lamp tube with wide spectrum
CN201462517U (en) LED bulb featuring different white light excitation modes
CN104157637A (en) MCOB LED package structure
CN203586033U (en) 360-degree non-light-tight car lamp
CN207674244U (en) Intelligent LED ground light
WO2015072120A1 (en) Light emitting device, light emitting module, lighting device and lamp
CN203312357U (en) Patch type LED light source with all-angle lighting
KR101185533B1 (en) Production method of line type led lighting unit and line type led lighting unit by this production method
CN103557454A (en) White-light LED (Light Emitting Diode) three dimensional light source module allowing light emitting in 360 degrees
CN205016556U (en) Full period -luminosity LED light source with protective layer
CN103697351A (en) LED (Light Emitting Diode) fluorescent lamp component

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100804

Termination date: 20161014