CN103697351A - LED (Light Emitting Diode) fluorescent lamp component - Google Patents
LED (Light Emitting Diode) fluorescent lamp component Download PDFInfo
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- CN103697351A CN103697351A CN201310642544.3A CN201310642544A CN103697351A CN 103697351 A CN103697351 A CN 103697351A CN 201310642544 A CN201310642544 A CN 201310642544A CN 103697351 A CN103697351 A CN 103697351A
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- led
- fluorescent material
- transparency carrier
- transparent
- fluorescent
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) fluorescent lamp component which comprises a transparent lamp tube shell, a transparent buckle, a metal electrode and LED illuminating units, wherein the LED illuminating units are fixed in the transparent lamp tube shell through the transparent buckle; the LED illuminating units are electrically connected with one another through wires; each of the LED illuminating units comprises a transparent base plate, a metal electrode, a plurality of LED chips and a fluorescent powder wrapping layer; the metal electrode is fixed on the transparent base plate; the LED chips are fixed on one side of the transparent base plate or on the side surface of the transparent base plate by using glue; the metal electrode is connected with the LED chips and the LED chips are connected with one another through metal wires, so as to form a serial and parallel connection structure; the fluorescent powder wrapping layer is wrapped on the LED chips. The LED fluorescent lamp component provided by the invention can realize uniform illumination in a wide-angle space and can increase the luminous efficiency by above 50%.
Description
Technical field
The present invention relates to a kind of LED fluorescent lamp assembly, relate in particular to a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting.
Background technology
Semiconductor light-emitting-diode (LED) illumination is considered to one of 21 century field most with prospects, and it, also will be for promoting energy-saving and emission-reduction, set up conservation-minded society and make major contribution when causing illumination revolution.
Traditional multi-chip LED fluorescent lamp, generally adopts aluminium base, copper base or ceramic substrate, and substrate itself is opaque, thus above substrate, weld after LED light source particle, the bright dipping that can only make progress is larger for design, the luminous intensity distribution restriction of light fixture.
Take bulb lamp as example, when opaque substrate module is directly used in lamp, can only reach the effect of half luminous intensity distribution type (beam angle is less than 180 degree) bulb lamp; (beam angle is greater than 180 degree to want to realize the full luminous intensity distribution of standard (beam angle is greater than 180 degree) in national and foreign standards and full luminous intensity distribution type, and the luminous flux of 135 ~ 180 degree in regions be not less than total light flux 5%) requirement, just must in light fixture, increase secondary optical lens, increase the cost of light fixture.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting is provided.
The object of the invention is to be achieved through the following technical solutions: a kind of LED fluorescent lamp assembly, it comprises Transparent lamp tube shell, transparent buckle, lamp holder and a plurality of LED luminescence unit, all LED luminescence units are all fixed in Transparent lamp tube shell by transparent buckle, and connect successively by electric wire, series circuit two ends are connected with the both positive and negative polarity of lamp holder respectively; Each LED luminescence unit is comprised of transparency carrier, two metal electrodes, a plurality of LED chip and fluorescent material integuments, described metal electrode is fixed on transparency carrier, LED chip is fixed near transparency carrier one side or is fixed on the section of transparency carrier side with glue, between metal electrode and LED chip and LED chip all with metal wire, be connected each other, form series and parallel structure; Fluorescent material integument is wrapped on LED chip; In the glue of bonding LED chip, be mixed with fluorescent material, the mass content of fluorescent material is 5-20 ﹪; Fluorescent material integument is epoxy resin, Merlon, polysulfones or the organosilicon material that is mixed with fluorescent material, and the mass content of fluorescent material is 20-85 ﹪; One or more in aluminate, silicate, nitride, nitrogen oxide and fluogermanate of fluorescent material are mixed and are formed by any proportioning.
Further, the material of described transparency carrier is glass, pottery or plastics.
Further, the material of described metal electrode is Ag, Au, Pd, Cu, AuSn, AuSi, AuIn, NiAu or NiPd.
Further, the material of described metal wire is a kind of in Au, Ag, Al, Cu, AuAg, AlSi.
Further, described metal electrode is fixed on transparency carrier by serigraphy.
Further, described fluorescent material integument is wrapped on LED chip by a glue mode or mould envelope mode.
Further, reflector layer is coated in side, described transparency carrier two ends, prevents that blue light from overflowing.
Further, described transparent buckle inner surface scribbles reflector layer, to improve luminous efficiency.
The invention has the beneficial effects as follows, the present invention adopts transparency carrier, and luminescence chip is directly fixed on to transparency carrier one side or is fixed on transparency carrier side, such LED luminescence component can be luminous to wide-angle when energising, not only significantly increase lighting angle, also can improve light extraction efficiency more than 50%, for light fixture, can realize luminous intensity distribution design flexibly, and save the cost of radiator.
Accompanying drawing explanation
Fig. 1 is LED fluorescent lamp modular construction schematic diagram of the present invention;
Fig. 2 is LED fluorescent lamp schematic cross-section of the present invention;
Fig. 3 is the luminescence unit schematic diagram in LED fluorescent lamp assembly embodiment 1 of the present invention, embodiment 2;
Fig. 4 is the luminescence unit schematic diagram in LED fluorescent lamp assembly embodiment 3 of the present invention, embodiment 4;
Fig. 5 is the luminescence unit schematic diagram in embodiment 5;
In figure, Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3, LED luminescence unit 4, transparency carrier 5, metal electrode 6, LED chip 7, fluorescent material integument 8, metal wire 9.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further details.
As shown in Fig. 1 ~ 3, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting, comprises Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3 and a plurality of LED luminescence unit 4; LED luminescence unit 4 is all fixed in Transparent lamp tube shell 1 by transparent buckle 2, and connects successively by electric wire, and series circuit two ends are connected with the both positive and negative polarity of lamp holder 3 respectively.Each LED luminescence unit 4 is comprised of transparency carrier 5, two metal electrodes 6, ten LED chips 7, fluorescent material integuments 8, the material of metal electrode 6 is Ag, by screen printing technique, be deposited on transparency carrier 5, the material of transparency carrier 5 is glass, LED chip 7 is fixed near transparency carrier 5 one sides by being mixed with the glue of fluorescent material, ten LED chips 7 are connected in parallel between two metal electrodes 6 by metal wire 9, form 1 string 10 structure, the material of metal wire 9 is Au, and fluorescent material integument 8 is wrapped on LED chip 7 by a glue mode.In described glue, be mixed with aluminate and silicate fluorescent powder, the mass content of fluorescent material is 5 ﹪.Fluorescent material integument 8 is the Merlon that are mixed with fluorescent material, and the mass content of fluorescent material is 85 ﹪.The LED fluorescent lamp assembly of this embodiment, can realize wide-angle space uniform luminous, can improve luminous efficiency more than 50%.
As shown in Fig. 1 ~ 3, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting, comprises Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3 and a plurality of LED luminescence unit 4; LED luminescence unit 4 is all fixed in Transparent lamp tube shell 1 by transparent buckle 2, and connects successively by electric wire, and series circuit two ends are connected with the both positive and negative polarity of lamp holder 3 respectively.Each LED luminescence unit 4 is comprised of transparency carrier 5, two metal electrodes 6, ten LED chips 7, fluorescent material integuments 8, the material of metal electrode 6 is Pd, by screen printing technique, be deposited on transparency carrier 5, the material of transparency carrier 5 is transparent plastic, LED chip 7 is fixed near transparency carrier 5 one sides by being mixed with the glue of fluorescent material, ten LED chips 7 are connected in parallel between two metal electrodes 6 by metal wire 9, form 1 string 10 structure, the material of metal wire 9 is Ag, and fluorescent material integument 8 is wrapped on LED chip 7 by a glue mode.In described glue, be mixed with aluminate and silicate fluorescent powder, the mass content of fluorescent material is 20 ﹪.Fluorescent material integument 8 is the epoxy resin that is mixed with fluorescent material, and the mass content of fluorescent material is 20 ﹪.The LED fluorescent lamp assembly of this embodiment, can realize wide-angle space uniform luminous, can improve luminous efficiency more than 50%.
Embodiment 3
As shown in Fig. 1 ~ Fig. 3, as shown in Fig. 1 ~ 3, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting, comprises Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3 and a plurality of LED luminescence unit 4; LED luminescence unit 4 is all fixed in Transparent lamp tube shell 1 by transparent buckle 2, and connects successively by electric wire, and series circuit two ends are connected with the both positive and negative polarity of lamp holder 3 respectively.Each LED luminescence unit 4 is comprised of transparency carrier 5, two metal electrodes 6, ten LED chips 7, fluorescent material integuments 8, the material of metal electrode 6 is Au, by screen printing technique, be deposited on transparency carrier 5, the material of transparency carrier 5 is pottery, LED chip 7 is fixed near transparency carrier 5 one sides by being mixed with the glue of fluorescent material, ten LED chips 7 are connected in parallel between two metal electrodes 6 by metal wire 9, form 1 string 10 structure, the material of metal wire 9 is Al, and fluorescent material integument 8 is wrapped on LED chip 7 by a glue mode.In described glue, be mixed with aluminate and fluogermanate fluorescent material, the mass content of fluorescent material is 10 ﹪.Fluorescent material integument is the polysulfones that is mixed with fluorescent material, and the mass content of fluorescent material is 70 ﹪.The LED fluorescent lamp assembly of this embodiment, can realize wide-angle space uniform luminous, can improve luminous efficiency more than 50%.
Embodiment 4
As shown in Figure 1, Figure 2, Figure 4 shows, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting, comprises Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3 and a plurality of LED luminescence unit 4; LED luminescence unit 4 is all fixed in Transparent lamp tube shell 1 by transparent buckle 2, and connects successively by electric wire, and series circuit two ends are connected with the both positive and negative polarity of lamp holder 3 respectively.Wherein, each LED luminescence unit 4 is comprised of transparency carrier 5, metal electrode 6,12 LEDs chips 7, fluorescent material integument 8, the material of metal electrode 6 is Cu, by evaporation coating technique, be deposited on transparency carrier 5, the material of transparency carrier 5 is glass, LED chip 7 is fixed on transparency carrier 5 one sides by being mixed with the glue of fluorescent material, between metal electrode 6 and LED chip 7 and be all connected with metal wire 9 between LED chip 7, form 2 string 6 structures, the material of metal wire 9 is Cu, and fluorescent material integument 8 is wrapped on LED chip 7 by mould envelope mode.In described glue, be mixed with aluminate and Nitride phosphor, the mass content of fluorescent material is 20 ﹪.Fluorescent material integument is the organic silica gel that is mixed with fluorescent material, and the mass content of fluorescent material is 85 ﹪.The LED fluorescent lamp assembly of this embodiment, can realize wide-angle space uniform luminous, can improve luminous efficiency more than 50%.
As shown in Figure 1, Figure 2, Figure 5, a kind of LED fluorescent lamp assembly of wide-angle uniformly light-emitting, comprises Transparent lamp tube shell 1, transparent buckle 2, lamp holder 3 and a plurality of LED luminescence unit 4; LED luminescence unit 4 is all fixed in Transparent lamp tube shell 1 by transparent buckle 2, and connects successively by electric wire, and series circuit two ends are connected with the both positive and negative polarity of lamp holder 3 respectively.Wherein, each LED luminescence unit is comprised of transparency carrier 5, metal electrode 6,18 LEDs chips 7, fluorescent material integument 8, and the material of metal electrode 6 is AuSn, by screen printing technique, is fixed on transparency carrier 5; The material of transparency carrier 5 is pottery, LED chip 7 is fixed on the side of transparency carrier 5, between metal electrode 6 and LED chip 7 and be all connected with metal wire 9 between LED chip 7, form 18 string 1 structures, the material of metal wire 9 is AuAg, and fluorescent material integument 8 is wrapped on LED chip 7 by mould envelope mode.In described glue, be mixed with aluminate and fluogermanate fluorescent material, the mass content of fluorescent material is 15 ﹪.Fluorescent material integument 8 is the organic silica gels that are mixed with fluorescent material, and the mass content of fluorescent material is 50 ﹪.The LED fluorescent lamp assembly of this embodiment, can realize wide-angle space uniform luminous, can improve luminous efficiency more than 50%.
In the side of transparency carrier 5, coat phosphor reflector layer and prevent that blue light from overflowing, can realize two-sided or multifaceted light-emitting, reach the effect of wide-angle uniformly light-emitting.Material selection AuSi, AuIn, NiAu or the NiPd of metal electrode 6, the material of metal wire 9 is AlSi.
At transparent buckle 2 inner surfaces, scribble reflector layer, to improve luminous efficiency.
Above-described embodiment is used for the present invention that explains, rather than limits the invention, and in the protection domain of spirit of the present invention and claim, any modification and change that the present invention is made, all fall into protection scope of the present invention.
Claims (8)
1. a LED fluorescent lamp assembly, it is characterized in that, it comprises Transparent lamp tube shell (1), transparent buckle (2), lamp holder (3) and a plurality of LED luminescence unit (4), all LED luminescence units (4) are all fixed in Transparent lamp tube shell (1) by transparent buckle (2), and connect successively by electric wire, series circuit two ends are connected with the both positive and negative polarity of lamp holder (3) respectively; Each LED luminescence unit (4) is comprised of transparency carrier (5), two metal electrodes (6), a plurality of LED chip (7) and fluorescent material integument (8), described metal electrode (6) is fixed on transparency carrier (5), LED chip (7) is fixed near transparency carrier (5) one sides or is fixed on the section of transparency carrier (5) side with glue, between metal electrode (6) and LED chip (7) and LED chip (7) all with metal wire (9), be connected each other, form series and parallel structure; Fluorescent material integument (8) is wrapped on LED chip (7); In the glue of bonding LED chip (8), be mixed with fluorescent material, the mass content of fluorescent material is 5-20 ﹪; Fluorescent material integument (5) is epoxy resin, Merlon, polysulfones or the organosilicon material that is mixed with fluorescent material, and the mass content of fluorescent material is 20-85 ﹪; One or more in aluminate, silicate, nitride, nitrogen oxide and fluogermanate of fluorescent material are mixed and are formed by any proportioning.
2. LED fluorescent lamp assembly according to claim 1, is characterized in that, the material of described transparency carrier (5) is glass, pottery or plastics.
3. LED fluorescent lamp assembly according to claim 1, is characterized in that, the material of described metal electrode (6) is Ag, Au, Pd, Cu, AuSn, AuSi, AuIn, NiAu or NiPd.
4. a kind of LED fluorescent lamp assembly according to claim 1, is characterized in that, the material of described metal wire (9) is a kind of in Au, Ag, Al, Cu, AuAg, AlSi.
5. LED fluorescent lamp assembly according to claim 1, is characterized in that, described metal electrode (6) is fixed on transparency carrier (5) by serigraphy.
6. LED fluorescent lamp assembly according to claim 1, is characterized in that, described fluorescent material integument (8) is wrapped on LED chip (7) by a glue mode or mould envelope mode.
7. LED fluorescent lamp assembly according to claim 1, is characterized in that, reflector layer is coated in described transparency carrier (5) side, two ends, prevents that blue light from overflowing.
8. LED fluorescent lamp assembly according to claim 1, is characterized in that, described transparent buckle (2) inner surface scribbles reflector layer, to improve luminous efficiency.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310642544.3A CN103697351A (en) | 2013-12-03 | 2013-12-03 | LED (Light Emitting Diode) fluorescent lamp component |
| PCT/CN2014/075434 WO2015081649A1 (en) | 2013-12-03 | 2014-04-16 | Led fluorescent lamp assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310642544.3A CN103697351A (en) | 2013-12-03 | 2013-12-03 | LED (Light Emitting Diode) fluorescent lamp component |
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| Publication Number | Publication Date |
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| CN103697351A true CN103697351A (en) | 2014-04-02 |
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| CN201310642544.3A Pending CN103697351A (en) | 2013-12-03 | 2013-12-03 | LED (Light Emitting Diode) fluorescent lamp component |
Country Status (2)
| Country | Link |
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| CN (1) | CN103697351A (en) |
| WO (1) | WO2015081649A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081649A1 (en) * | 2013-12-03 | 2015-06-11 | 杭州杭科光电股份有限公司 | Led fluorescent lamp assembly |
| CN106641780A (en) * | 2016-11-15 | 2017-05-10 | 浙江阳光美加照明有限公司 | LED photovoltaic panel and LED gas-filled lamp applying same |
| CN112066276A (en) * | 2019-06-10 | 2020-12-11 | 宁波天炬光电科技有限公司 | LED light source module and lighting device |
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| JP3152509U (en) * | 2009-03-13 | 2009-08-06 | 株式会社日本ギャラクシーエンジニアリング | LED straight tube lamp structure |
| CN203162846U (en) * | 2013-04-03 | 2013-08-28 | 广州众恒光电科技有限公司 | T8 LED illuminating lamp tube |
| CN103322453A (en) * | 2013-06-08 | 2013-09-25 | 杭州杭科光电股份有限公司 | Light-emitting diode (LED) light source module capable of emitting light evenly in full space |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102147061A (en) * | 2010-02-09 | 2011-08-10 | 刘世全 | Modular integrally-luminous LED planar light source fluorescent lamp and manufacturing method thereof |
| CN201651857U (en) * | 2010-02-10 | 2010-11-24 | 江苏生日快乐光电科技有限公司 | Integrated packaging type LED lamp tube |
| EP2553316B8 (en) * | 2010-03-26 | 2015-07-08 | iLumisys, Inc. | Led light tube with dual sided light distribution |
| CN103335226A (en) * | 2013-06-19 | 2013-10-02 | 福建省万邦光电科技有限公司 | LED (light emitting diode) bulb lamp capable of emitting lights in all directions |
| CN103697351A (en) * | 2013-12-03 | 2014-04-02 | 杭州杭科光电股份有限公司 | LED (Light Emitting Diode) fluorescent lamp component |
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2013
- 2013-12-03 CN CN201310642544.3A patent/CN103697351A/en active Pending
-
2014
- 2014-04-16 WO PCT/CN2014/075434 patent/WO2015081649A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152509U (en) * | 2009-03-13 | 2009-08-06 | 株式会社日本ギャラクシーエンジニアリング | LED straight tube lamp structure |
| CN203162846U (en) * | 2013-04-03 | 2013-08-28 | 广州众恒光电科技有限公司 | T8 LED illuminating lamp tube |
| CN103322453A (en) * | 2013-06-08 | 2013-09-25 | 杭州杭科光电股份有限公司 | Light-emitting diode (LED) light source module capable of emitting light evenly in full space |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081649A1 (en) * | 2013-12-03 | 2015-06-11 | 杭州杭科光电股份有限公司 | Led fluorescent lamp assembly |
| CN106641780A (en) * | 2016-11-15 | 2017-05-10 | 浙江阳光美加照明有限公司 | LED photovoltaic panel and LED gas-filled lamp applying same |
| CN112066276A (en) * | 2019-06-10 | 2020-12-11 | 宁波天炬光电科技有限公司 | LED light source module and lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015081649A1 (en) | 2015-06-11 |
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Application publication date: 20140402 |