CN103035820A - Three-dimensional light-emitting diode (LED) white light device - Google Patents

Three-dimensional light-emitting diode (LED) white light device Download PDF

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Publication number
CN103035820A
CN103035820A CN2012105529614A CN201210552961A CN103035820A CN 103035820 A CN103035820 A CN 103035820A CN 2012105529614 A CN2012105529614 A CN 2012105529614A CN 201210552961 A CN201210552961 A CN 201210552961A CN 103035820 A CN103035820 A CN 103035820A
Authority
CN
China
Prior art keywords
fluorescent powder
white light
led
light
substrate
Prior art date
Application number
CN2012105529614A
Other languages
Chinese (zh)
Inventor
朱晓飚
胡建红
Original Assignee
浙江中宙光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浙江中宙光电股份有限公司 filed Critical 浙江中宙光电股份有限公司
Priority to CN2012105529614A priority Critical patent/CN103035820A/en
Publication of CN103035820A publication Critical patent/CN103035820A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

The invention discloses a three-dimensional light-emitting diode (LED) white light device which comprises a transparent base plate, LED wafers, gold threads and fluorescent powder bodies, wherein the LED wafers, the gold threads and the fluorescent powder bodies are arranged on the base plate. Lead terminals are arranged at two ends of the base plate in a bonding mode, two ends of each gold thread are respectively connected with one LED wafer and one lead terminal, transparent silica gel is filled in the fluorescent powder bodies, the base plate is fixedly arranged in the fluorescent powder bodies, fluorescent powder containing yttrium aluminum garnet or nitride and materials with light transmittance performance are arranged in the fluorescent powder bodies. The three-dimensional LED white light device is close to glowing effect of filaments of traditional lamps in glowing form.

Description

Three-dimensional LED white light parts

Technical field

The present invention relates to a kind of three-dimensional LED white light parts.

Background technology

At present, the LED white light on the market all adopts the hairdo production that excites at blue light wafer coating fluorescent glue.This kind production technology has determined that the bright dipping of LED can't realize all-round light fully.The LED light fixture that adopts this kind light source to produce also can't be realized the filament light-emitting of similar conventional incandescent, the tubulose illumination effect of fluorescent lamp.In a lot of occasions, illuminating effect can't be compared with conventional lamp, so that there is defective in the aspects such as the convenience of LED light fixture replacement conventional light source, comfort level.

Summary of the invention

Thereby for the all-round light of can't realizing that overcomes existing LED white light existence can not replace the shortcoming of conventional light source fully on convenience and comfort level, the invention provides a kind of three-dimensional LED white light parts.

The technical solution used in the present invention is:

Three-dimensional LED white light parts, comprise transparency carrier, be arranged at the LED wafer on the described substrate, gold thread and fluorescent powder, the two ends of described substrate are bonded with lead terminal, and described gold thread two ends are connected with lead terminal with described LED wafer respectively, are filled with transparent silica gel in the described fluorescent powder, it is characterized in that: described substrate is installed in the described fluorescent powder, comprises fluorescent material and light transmission material with yttrium-aluminium-garnet or nitride in the described fluorescent powder.

Further, described light transmission material is polymethyl methacrylate, Merlon or organosilicon material.

Further, described fluorescent powder also comprises the inorganic compound pulvis, and described inorganic compound pulvis is one or more the compound of combination in any in Si, Al or the Ti element, and the particle diameter of described inorganic compound pulvis is 10nm ~ 10um.

Further, described fluorescent powder surface is provided with microstructured bodies, and described microstructured bodies can be spherical, rhombus or square, and the particle diameter of described microstructured bodies is 10nm ~ 10um.

Further, described fluorescent powder can be cylindrical, rhombus, square or spherical.

Further, described substrate is SiO 2Or Al 2O 3Make, or made by the compound that Ga, P element form.

The refractive index of transparent silica gel of the present invention has high light transmittance between 1.4 ~ 1.7, with outside fluorescent powder, can form seamless adhesion, and the light that increases wafer takes out efficient, reaches simultaneously the effect of protection LED wafer.The light that wafer sends through exciting of fluorescent powder, can form colour temperature from 2000K ~ 15000K scope white light color interior, that meet lighting demand.

Beneficial effect of the present invention is embodied in:

1, the bright dipping form of white light parts is determined by outside fluorescent powder, can be cylindrical, rhombus, square body, spheroid, and it is convenient to realize;

2, the substrate of transparent material is so that the bright dipping of six faces of LED wafer is all fully excited the LED white light parts of luminous efficiency ultra-traditional explained hereafter far away;

3, can be on luminous form, near the filament light-emitting effect of conventional lamp.

Description of drawings

Fig. 1 is front view of the present invention.

Fig. 2 is end view of the present invention.

Embodiment

See figures.1.and.2, three-dimensional LED white light parts, comprise transparency carrier 1, be arranged at the LED wafer 2 on the described substrate 1, gold thread 3 and fluorescent powder 5, the two ends of described substrate 1 are bonded with lead terminal 4, are connected with lead terminal with described LED wafer 2 respectively and are connected in described gold thread 3 two ends, be filled with transparent silica gel 7 in the described fluorescent powder 5, described substrate 1 is installed in the described fluorescent powder 5, comprises fluorescent material and light transmission material with yttrium-aluminium-garnet or nitride in the described fluorescent powder 5.

Further, described light transmission material is polymethyl methacrylate, Merlon or organosilicon material.

Further, described fluorescent powder 5 also comprises the inorganic compound pulvis, and described inorganic compound pulvis is one or more the compound of combination in any in Si, Al or the Ti element, and the particle diameter of described inorganic compound pulvis is 10nm ~ 10um.

Further, described fluorescent powder 5 surfaces are provided with microstructured bodies 6, and described microstructured bodies 6 can be spherical, rhombus or square, and the particle diameter of described microstructured bodies 6 is 10nm ~ 10um.

Further, described fluorescent powder 5 can be cylindrical, rhombus, square or spherical.

Further, described substrate 1 is SiO 2Or Al 2O 3Make, or made by the compound that Ga, P element form.

The refractive index of transparent silica gel 7 of the present invention has high light transmittance between 1.4 ~ 1.7, with outside fluorescent powder, can form seamless adhesion, and the light that increases wafer takes out efficient, reaches simultaneously the effect of protection LED wafer.The light that wafer sends through exciting of fluorescent powder, can form colour temperature from 2000K ~ 15000K scope white light color interior, that meet lighting demand.

The described content of this specification embodiment only is enumerating the way of realization of inventive concept; protection scope of the present invention should not be regarded as only limiting to the concrete form that embodiment states, protection scope of the present invention also reaches in those skilled in the art conceives the equivalent technologies means that can expect according to the present invention.

Claims (6)

1. three-dimensional LED white light parts, comprise transparency carrier, be arranged at the LED wafer on the described substrate, gold thread and fluorescent powder, the two ends of described substrate are bonded with lead terminal, and described gold thread two ends are connected with lead terminal with described LED wafer respectively, are filled with transparent silica gel in the described fluorescent powder, it is characterized in that: described substrate is installed in the described fluorescent powder, comprises fluorescent material and light transmission material with yttrium-aluminium-garnet or nitride in the described fluorescent powder.
2. three-dimensional LED white light parts as claimed in claim 1, it is characterized in that: described light transmission material is polymethyl methacrylate, Merlon or organosilicon material.
3. three-dimensional LED white light parts as claimed in claim 2, it is characterized in that: described fluorescent powder also comprises the inorganic compound pulvis, described inorganic compound pulvis is one or more the compound of combination in any in Si, Al or the Ti element, and the particle diameter of described inorganic compound pulvis is 10nm ~ 10um.
4. three-dimensional LED white light parts as claimed in claim 3, it is characterized in that: described fluorescent powder surface is provided with microstructured bodies, and described microstructured bodies can be spherical, rhombus or square, and the particle diameter of described microstructured bodies is 10nm ~ 10um.
5. three-dimensional LED white light parts as claimed in claim 4, it is characterized in that: described fluorescent powder can be cylindrical, rhombus, square or spherical.
6. such as the described three-dimensional LED white light parts of one of claim 1 ~ 5, it is characterized in that: described substrate is SiO 2Or Al 2O 3Make, or made by the compound that Ga, P element form.
CN2012105529614A 2012-12-18 2012-12-18 Three-dimensional light-emitting diode (LED) white light device CN103035820A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012105529614A CN103035820A (en) 2012-12-18 2012-12-18 Three-dimensional light-emitting diode (LED) white light device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012105529614A CN103035820A (en) 2012-12-18 2012-12-18 Three-dimensional light-emitting diode (LED) white light device

Publications (1)

Publication Number Publication Date
CN103035820A true CN103035820A (en) 2013-04-10

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Country Status (1)

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CN (1) CN103035820A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325927A (en) * 2013-07-05 2013-09-25 江苏华英光宝科技股份有限公司 LED (light-emitting diode) support emitting light at 360 degrees, LED lamp post with support, and preparation method of support
CN103794601A (en) * 2014-01-20 2014-05-14 江苏华英光宝科技股份有限公司 Plug-in type LED fluorescent crystal plate, manufacturing method thereof, and LED lamp bulb
CN103855147A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and lamp
CN103855146A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
CN103855143A (en) * 2014-01-06 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and light-emitting device
CN104300073A (en) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 360-degree complete cycle type LED lamp filament based on purple light chips
WO2015127698A1 (en) * 2014-02-26 2015-09-03 深圳市瑞丰光电子股份有限公司 Led filament and illuminator
CN105674108A (en) * 2016-03-24 2016-06-15 海宁博华照明电器有限公司 Novel LED lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1618925A (en) * 2004-10-12 2005-05-25 罗维鸿 Method of producing white light LED with uniform light and colour
WO2008060584A2 (en) * 2006-11-15 2008-05-22 The Regents Of The University Of California High light extraction efficiency sphere led
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN102339927A (en) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 Light emitting diode
CN203085638U (en) * 2012-12-18 2013-07-24 浙江中宙光电股份有限公司 Stereo LED white-light device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1618925A (en) * 2004-10-12 2005-05-25 罗维鸿 Method of producing white light LED with uniform light and colour
WO2008060584A2 (en) * 2006-11-15 2008-05-22 The Regents Of The University Of California High light extraction efficiency sphere led
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN102339927A (en) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 Light emitting diode
CN203085638U (en) * 2012-12-18 2013-07-24 浙江中宙光电股份有限公司 Stereo LED white-light device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325927A (en) * 2013-07-05 2013-09-25 江苏华英光宝科技股份有限公司 LED (light-emitting diode) support emitting light at 360 degrees, LED lamp post with support, and preparation method of support
CN103855143A (en) * 2014-01-06 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and light-emitting device
CN103855147A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 LED lamp filament and lamp
CN103855146A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
WO2015103812A1 (en) * 2014-01-13 2015-07-16 深圳市瑞丰光电子股份有限公司 Led filament and luminaire
CN103855146B (en) * 2014-01-13 2017-01-25 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
CN103794601A (en) * 2014-01-20 2014-05-14 江苏华英光宝科技股份有限公司 Plug-in type LED fluorescent crystal plate, manufacturing method thereof, and LED lamp bulb
WO2015127698A1 (en) * 2014-02-26 2015-09-03 深圳市瑞丰光电子股份有限公司 Led filament and illuminator
CN104300073A (en) * 2014-11-04 2015-01-21 常州晶玺照明有限公司 360-degree complete cycle type LED lamp filament based on purple light chips
CN105674108A (en) * 2016-03-24 2016-06-15 海宁博华照明电器有限公司 Novel LED lamp

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Application publication date: 20130410

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