CN104300070A - Bendable LED lamp filament and bulb structure thereof - Google Patents
Bendable LED lamp filament and bulb structure thereof Download PDFInfo
- Publication number
- CN104300070A CN104300070A CN201410521305.7A CN201410521305A CN104300070A CN 104300070 A CN104300070 A CN 104300070A CN 201410521305 A CN201410521305 A CN 201410521305A CN 104300070 A CN104300070 A CN 104300070A
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- transparent glass
- led
- chip
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 17
- 239000007789 gas Substances 0.000 claims description 12
- 241000218202 Coptis Species 0.000 claims description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000009877 rendering Methods 0.000 abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a bendable LED lamp filament and a bulb structure of the bendable LED lamp filament. The LED lamp filament comprises a transparent glass substrate, an LED chip, a fluorescent powder adhesive layer, two electrodes arranged on the outer arc face and the inner arc face of the transparent glass substrate, an electrode outgoing line and a gold line, and the electrode outgoing line and the gold line are arranged at the two ends of the transparent glass substrate. The LED chip comprises a plurality of chip units, and each chip unit is formed by three blue light LED chips and a red light LED chip. The blue light LED chips and the red light LED chips are all flip chips, and the chips are arranged on the electrodes according to the sequence of a P-N junction. An LED lamp is formed by a plurality of LED lamp filaments, a bulb shell, a lamp screw base and heat radiation and protection gas. The LED lamp filaments are connected and sealed in the bulb shell in a pairwise series connection and pairwise parallel connection mode. The transparent glass substrate is arranged in an arc shape, the light emitting angle is effectively increased, and light emitting efficiency is effectively improved. The blue light chips and the red light chips are arranged alternately, and the color rendering index of the LED lamp filament is effectively improved.
Description
Technical field
The present invention relates to LED and lighting field thereof, refer in particular to a kind of bent LED silk and bulb structure thereof.
Background technology
Along with the development of science and technology, LED progressively instead of traditional lighting light fixture.Existing LED generally comprises LED silk, is arranged on the LED chip of LED support both sides and wraps the fluorescent glue of LED chip.Existing LED is generally adopt blue chip and fluorescent material excited white light, and its color rendering index is lower.In addition, what existing LED support generally adopted is that the metal material such as copper, aluminium injects PPA formation, due to the opaqueness of material itself, the side that its rising angle can arrange chip at it at most realizes 180 °, and As time goes on PPA material is easy to aging and yellow variable color, affects its light extraction efficiency.
Summary of the invention
An object of the present invention is for the deficiencies in the prior art, provide a kind of bent LED silk, this LED silk overcomes the shortcomings such as LED color rendering index is low, light extraction efficiency is low, blue light leakage lamp.
LED silk of the present invention comprises transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; Described transparent glass substrate is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Described blue-light LED chip and red LED chip are flip-chip, and chip is set in sequence on the electrode of the outer intrados of transparent glass substrate by P-N junction; Electrode on the outer intrados of transparent glass substrate is electrically connected by the electrode outlet line of gold thread with transparent glass substrate two ends; Transparent glass substrate, LED chip adopt encapsulating technology to be enclosed with fluorescent material glue-line.
The arc length of described transparent glass substrate is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm;
The material of described fluorescent material glue-line is the composite material of fluorescent material and silica gel;
LED silk of the present invention adopts arc clear glass as base plate for packaging (i.e. transparent glass substrate), increase the radiation exiting surface of globular bulb light source, and then increase its luminous flux, improve light extraction efficiency, adopt blue-light LED chip and red LED chip hybrid package mode, effectively add the color rendering index of LED silk, show the real property of object under light more really.
Another object of the present invention there is provided a kind of LED, by multiple above-mentioned LED silk, cell-shell, lamp screw base, heat radiation protection gas composition; Cell-shell is fixedly connected with lamp screw base, and multiple above-mentioned LED silk adopts two strings two mode also to connect and is sealed in cell-shell, and is filled with heat radiation protection gas in cell-shell;
Described heat radiation protection gas is the inert gases such as helium, hydrogen, helium hydrogen mixed gas, nitrogen or neon.
The present invention forms the main body of LED silk by transparent glass substrate being arranged to arc; Described baseplate material adopts transparent glass substrate, effectively increases rising angle and improves light extraction efficiency; Blue chip interval red light chips is set in the both sides of described substrate, effectively raise the color rendering index of LED silk, adopt 360 ° of molding encapsulating mode point glue, phosphor gel wraps LED silk completely, effectively prevent LED and dazzles the shortcoming such as light and blue light leakage.
Accompanying drawing explanation
Fig. 1 is LED silk schematic diagram of the present invention;
Fig. 2 is LED lamp structure schematic diagram of the present invention;
Wherein 1-1 is transparent glass substrate, 1-2 is blue-light LED chip, 1-3 is red LED chip, 1-4 is fluorescent material glue-line, 1-5 is electrode, 1-6 is electrode outlet line, 1-7 gold thread, 1 is LED silk, 2 be cell-shell, 3 be lamp screw base, 4 be heat radiation protection gas.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further described.
As shown in Figure 1, LED silk 1 of the present invention comprise transparent glass substrate 1-1, LED chip, fluorescent material glue-line 1-4, two be located at electrode 1-5 on the outer intrados of transparent glass substrate 1-1, the electrode outlet line 1-6 at transparent glass substrate 1-1 two ends, gold thread 1-7; Described transparent glass substrate 1-1 is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chip 1-2 and red LED chip 1-3; Described blue-light LED chip 1-2 and red LED chip 1-3 is flip-chip, and chip is set in sequence on the electrode 1-5 of the outer intrados of transparent glass substrate 1-1 by P-N junction; Electrode 1-5 on the outer intrados of transparent glass substrate 1-1 is electrically connected with the electrode outlet line 1-6 at transparent glass substrate 1-1 two ends by gold thread 1-7; Transparent glass substrate 1-1, LED chip adopt encapsulating technology to be enclosed with fluorescent material glue-line 1-4.
The arc length of described transparent glass substrate 1-1 is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm;
The material of described fluorescent material glue-line 1-4 is the composite material of fluorescent material and silica gel;
LED silk 1 of the present invention adopts arc clear glass as base plate for packaging (i.e. transparent glass substrate 1-1), increase the radiation exiting surface of globular bulb light source, and then increase its luminous flux, improve light extraction efficiency, adopt blue-light LED chip and red LED chip hybrid package mode, effectively add the color rendering index of LED silk, show the real property of object under light more really.
As shown in Figure 2, a kind of LED is made up of multiple above-mentioned LED silk 1, cell-shell 2, lamp screw base 3, heat radiation protection gas 4; Cell-shell 2 is fixedly connected with lamp screw base 3, and multiple above-mentioned LED silk 1 adopts two strings two mode also to connect and is sealed in cell-shell 2, and is filled with heat radiation protection gas 4 in cell-shell 2;
Described heat radiation protection gas 4 is the inert gases such as helium, hydrogen, helium hydrogen mixed gas, nitrogen or neon.
Above-described embodiment is not that the present invention is not limited only to above-described embodiment for restriction of the present invention, as long as meet application claims, all belongs to protection scope of the present invention.
Claims (2)
1. bent LED silk and a bulb structure thereof, is characterized in that comprising transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; Described transparent glass substrate is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Described blue-light LED chip and red LED chip are flip-chip, and chip is set in sequence on the electrode of the outer intrados of transparent glass substrate by P-N junction; Electrode on the outer intrados of transparent glass substrate is electrically connected by the electrode outlet line of gold thread with transparent glass substrate two ends; Transparent glass substrate, LED chip adopt encapsulating technology parcel fluorescent material glue-line;
The arc length of described transparent glass substrate is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm.
2. a LED, is characterized in that by multiple LED silk as claimed in claim 1, cell-shell, lamp screw base, heat radiation protection gas composition; Cell-shell is fixedly connected with lamp screw base, and multiple LED silk as claimed in claim 1 adopts two strings two mode also to connect and is sealed in cell-shell, and is filled with heat radiation protection gas in cell-shell;
Described heat radiation protection gas is inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410521305.7A CN104300070A (en) | 2014-09-30 | 2014-09-30 | Bendable LED lamp filament and bulb structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410521305.7A CN104300070A (en) | 2014-09-30 | 2014-09-30 | Bendable LED lamp filament and bulb structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104300070A true CN104300070A (en) | 2015-01-21 |
Family
ID=52319724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410521305.7A Pending CN104300070A (en) | 2014-09-30 | 2014-09-30 | Bendable LED lamp filament and bulb structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104300070A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106555942A (en) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | LED light source module and the bubble shape lamp including which |
| CN109661858A (en) * | 2016-09-05 | 2019-04-19 | 昕诺飞控股有限公司 | LED and including LED lighting devices |
| CN113048410A (en) * | 2021-05-11 | 2021-06-29 | 史杰 | LED light source device and mood bulb |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2779508A1 (en) * | 1998-06-03 | 1999-12-10 | Valeo Vision | Curved lighting assembly for automobile signalling |
| CN201779545U (en) * | 2010-06-19 | 2011-03-30 | 比亚迪股份有限公司 | LED luminous curved glass |
| CN202338805U (en) * | 2011-11-29 | 2012-07-18 | 苏州晶能科技有限公司 | LED (light-emitting diode) transparent light-emitting device capable of enhancing heat dissipation |
| CN103904197A (en) * | 2014-03-24 | 2014-07-02 | 东莞市雷明灯照明科技有限公司 | LED lamp filament piece, manufacturing method of LED lamp filament piece and LED lamp filament piece bulb |
| CN203733792U (en) * | 2013-12-24 | 2014-07-23 | 深圳市源磊科技有限公司 | Led filament |
| CN203744086U (en) * | 2013-12-26 | 2014-07-30 | 上海顿格电子贸易有限公司 | Bulb with light emitting diode flexible lamp filament |
| CN204088373U (en) * | 2014-09-30 | 2015-01-07 | 杭州电子科技大学 | Bent LED silk and bulb structure thereof |
-
2014
- 2014-09-30 CN CN201410521305.7A patent/CN104300070A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2779508A1 (en) * | 1998-06-03 | 1999-12-10 | Valeo Vision | Curved lighting assembly for automobile signalling |
| CN201779545U (en) * | 2010-06-19 | 2011-03-30 | 比亚迪股份有限公司 | LED luminous curved glass |
| CN202338805U (en) * | 2011-11-29 | 2012-07-18 | 苏州晶能科技有限公司 | LED (light-emitting diode) transparent light-emitting device capable of enhancing heat dissipation |
| CN203733792U (en) * | 2013-12-24 | 2014-07-23 | 深圳市源磊科技有限公司 | Led filament |
| CN203744086U (en) * | 2013-12-26 | 2014-07-30 | 上海顿格电子贸易有限公司 | Bulb with light emitting diode flexible lamp filament |
| CN103904197A (en) * | 2014-03-24 | 2014-07-02 | 东莞市雷明灯照明科技有限公司 | LED lamp filament piece, manufacturing method of LED lamp filament piece and LED lamp filament piece bulb |
| CN204088373U (en) * | 2014-09-30 | 2015-01-07 | 杭州电子科技大学 | Bent LED silk and bulb structure thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106555942A (en) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | LED light source module and the bubble shape lamp including which |
| CN109661858A (en) * | 2016-09-05 | 2019-04-19 | 昕诺飞控股有限公司 | LED and including LED lighting devices |
| CN113048410A (en) * | 2021-05-11 | 2021-06-29 | 史杰 | LED light source device and mood bulb |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150121 |
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| WD01 | Invention patent application deemed withdrawn after publication |