CN205877785U - Use power built -in ball bubble lamp of 2 pi LED filaments - Google Patents
Use power built -in ball bubble lamp of 2 pi LED filaments Download PDFInfo
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- CN205877785U CN205877785U CN201620764860.7U CN201620764860U CN205877785U CN 205877785 U CN205877785 U CN 205877785U CN 201620764860 U CN201620764860 U CN 201620764860U CN 205877785 U CN205877785 U CN 205877785U
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- 239000000758 substrate Substances 0.000 claims description 39
- 239000007789 gas Substances 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 5
- 229910052734 helium Inorganic materials 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 150000004760 silicates Chemical class 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical class [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 210000003101 oviduct Anatomy 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- QYZBCWXZSYTIOY-UHFFFAOYSA-N Mercuric oxide Chemical compound [O-2].[Hg+2] QYZBCWXZSYTIOY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 2
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 229910052756 noble gas Inorganic materials 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses an use power built -in ball bubble lamp of 2 pi LED filaments relates to the lighting technology field. This use power built -in ball bubble lamp of 2 pi LED filaments personally experiences sth. Part of the body, has the stem stem of support, support and multilayer link, one 2 at least pi LED filament, driver and lamp holder including the cell -shell. The cell -shell body forms the vacuum seal cavity with stem stem vacuum seal, be equipped with high thermal conductivity gas in the vacuum seal cavity, stem stem, multilayer link, LED filament and the driver fixed on the support all are located inside the vacuum seal cavity, the support is located the tip of stem stem, and the upper portion at the support is fixed to the driver, 2 pi LED filament, driver and lamp holder be the series connection in proper order. The utility model has the advantages of production efficiency is high, luminous and the radiating effect is good, longe -lived, with low costs.
Description
Technical field
This utility model relates to lighting technical field, is specifically related to a kind of on-chip power bulb lamp using 2 π LED filament.
Background technology
Considerations based on energy-conserving and environment-protective, electric filament lamp is the most gradually abandoned by people.And LED bulb has life-span length, light efficiency
The features such as high, radiationless and shock resistance, the most progressively replace electric filament lamp.But, owing to LED light source self luminescence has sensing
Property, after the light sent is even across the diffusion of diffusion shell, compared with can be existing with the conventional incandescent lights of omnirange luminous intensity distribution
The light distribution angle of LEDbulb lamp still seem the narrowest, light distribution angle is the most all below 120 °, and light can not reach the back of the body of lamp
Portion, can form shadow.Occur in that the LED packaging of filament, and the bulb lamp made of LED filament the most in recent years.
The most common LED filament bulb lamp, the general LED lamp bar using 4 Π luminescences is sealed in the cell-shell being filled with gas
In, and driver is contained in lamp holder.This assembling mode driver being contained in lamp holder also exists following defect: due to lamp
Head is conducting metal, so can put into lamp holder after driver insulation sleeve to be put, needs manual operations, and operation is loaded down with trivial details, efficiency
Low, and due to the narrow space in lamp holder, make lamp holder inadequate with the bonding space of bulb housing after putting into driver, bonding jail
Degree declines, and easily comes off, and bonding needs the high temperature through 300 degree, this aging effects to the electronic device in driver
Greatly, resultant fault rate is high；The most this LED filament luminous for 4 Π, its principle is by saturating at linear of LED chip die bond
On substrate such as bright substrate such as sapphire, glass etc., by whole substrate fluorescent material glue-line molding after bonding wire, being derived from one can
Realize 360 degree of luminous LED encapsulating products.But, current this packing forms there is problems in that due to transparent material such as
The thermal conductivity of glass, sapphire, organic plastics etc. is the most relatively low, causes LED chip to accumulate more heat transfer, and junction temperature raises；Due to lamp
Whole area or the most areas of substrate are covered by silk phosphor gel in encapsulation process, and the heat radiation having completely cut off substrate is led to
Road, so at present this LED filament product the most on the market exists without effectively heat radiation, can not large driven current density, high in cost of production one be
Row problem；The positive and negative colour temperature difference of filament is big, even if using transparent glass or sapphire substrate, filament there is also blue light side leakage
Problem；The assembling difficulty of filament at present, production cost is high.
Summary of the invention
This utility model for solve the problems referred to above, it is provided that a kind of production efficiency height, good heat dissipation effect, life-span length, cost
The on-chip power bulb lamp of low a kind of use 2 π LED filament.
To achieve these goals, technical solutions of the utility model are as follows:
A kind of on-chip power bulb lamp using 2 π LED filament, this bulb lamp includes bulb shell 1, with exhaustor 21, props up
Frame 22, multilamellar connect the stem stem 2 of end 23, at least one 2 π LED filament 3, driver 4 and lamp holder 5；Bulb shell 1 and stem stem 2 vacuum
Seal and form vacuum-sealed cavity body；High thermal conductivity gas 6 it is provided with in vacuum-sealed cavity body；Stem stem 2, it is fixed on support 22
LED filament 3 and driver 4 are respectively positioned on portion in vacuum-sealed cavity body；Support 22 is positioned at the end of stem stem 2, and driver 4 is fixed on props up
Frame 22 upper；The bottom of support 22 is provided with tinsel 26；Support 22 upper end is provided with electrode outlet line 25；2 π LED filament 3 one
End is connected in series with tinsel 26, and the other end is connected in series by electrode outlet line 25 with driver 4；Driver 4 is led to lamp holder 5
Cross external electrode lead-out wire 7 to connect.The function of driver is available for 2 π LED filament 3 for outer electric main or outer D/C power being converted into
The DC source of work.
Further, above-mentioned 2 π LED filament 3 include substrate 31, be positioned on substrate 31 the most a string, with identical PN junction side
To the LED chip 32 being connected in series；2 π LED filament 3 two ends are provided with electrode pin electricity 33；Electrode pin electricity 33 passes through insulant
36 fix with substrate 31 two ends；LED chip 32 is connected in series with electrode pin electricity 33；Substrate 31 is metal material substrate；Substrate
31 surfaces are provided with high reflection layer, and high reflection layer is silver coating or chromium coating or nickel coating；LED chip 32 be blue-light LED chip,
One in red LED chip, green LED chip, yellow light LED chip, purple LED chip or its combination in any.
Further, on aforesaid substrate, surface with LED chip is provided with phosphor powder layer 35；Phosphor powder layer 35 transversal
Face is semicircle, half elliptic or rectangle；Phosphor powder layer 35 material is YAG series bloom, yellowish green powder, or silicate series is yellow
Powder, yellowish green powder, orange powder, or nitride, nitrous oxides series Hydrargyri Oxydum Rubrum or YAG series phosphor powder, silicate series fluorescent material, nitridation
Thing, the combination in any of nitrous oxides series fluorescent material.
Further, the material of aforesaid substrate 31 is transparent materials；A length of 5mm ~ the 200mm of substrate 31, width is
0.3mm ~ 5 mm, thickness is 0.1mm ~ 3mm；The preferred a length of 10mm ~ 100mm of substrate 31, width is 0.5mm ~ 2mm, thick
Degree is 0.2mm ~ 1.0mm.
Further, above-mentioned driver 4 includes actuator housing 42 and drive circuit 41；Drive circuit 41 is positioned at driver
The inside of housing 42, drive circuit 41 is any one in resistance-capacitance depressurization power supply, linear constant current power supply or switch constant current source.
Further, the upper port of above-mentioned stem stem 2 is additionally provided with oviduct 11；Exhaustor 21 is positioned at the inside of stem stem 2；Row
The upper port of trachea 21 is provided with sealing by fusing head 24.
Further, above-mentioned high thermal conductivity gas 6 is the one in helium, hydrogen, nitrogen, argon or its combination in any.
After installation fixes 2 π LED filament and driver, stem stem and bulb shell are by high temperature sealing by fusing, and sealing-in is integral；Again through row
Exhaustor is shut after the high thermal conductivity gas being filled with by gas.The pressure of the high thermal conductivity gas being filled with is at room temperature 100-
1500Torr.By being filled with the gas of low viscosity coefficient high thermal conductivity so that seal cell-shell content and be easily formed the right of effectively heat radiation
The heat timely and effective convection current of energy produced when stream, 2 π LED filament and driver work and conduction of heat cause bulb shell and distribute.Separately
Outward, 2 π LED filament and driver are by the noble gases such as helium or other low viscosity coefficient high thermal conductivity gas shield and seal, complete
Entirely not affected by the steam etc. in surrounding, the life-span making LED filament and driver is longer.
Further, above-mentioned bulb shell 1 is transparent bulb case, or milky white cell-shell, or frosted cell-shell, or coloured cell-shell, or portion
Point surface is with the cell-shell in reflecting layer, or part surface is with the cell-shell of prism, or the lensed cell-shell of part surface band.
Further, above-mentioned bulb shell 1 uses A type cell-shell or G type cell-shell or PAR type cell-shell, T-shaped cell-shell, candle type bubble
Shell, p-type cell-shell, PS type cell-shell, BR type cell-shell, ER type cell-shell or BRL type cell-shell；Lamp holder 5 uses E14 type or E27 type or E26
Type or E40 type or GU type or BX type or BA type or EP type or EX type or GY type or GX type or GR type or GZ type or G
Type.
Compared with prior art, the beneficial effects of the utility model are:
(1) in driver and 2 π LED filament are both placed in the bulb shell sealed by this utility model, therefore high working voltage
Being isolated in cell-shell, it is safe and reliable, overcomes existing LED bulb radiator easy band high-tension electricity, unsafe problem；
(2) production efficiency is high.Driver is placed in the cell-shell that space is bigger by this utility model, does not affect the viscous of lamp holder and bulb housing
Knot, and lamp holder and the bonding of cell-shell are same with the Binder Phase of conventional incandescent, it is possible to use machine assembles, and substantially increases life
Produce efficiency；(3) life-span is long.Driver and 2 π LED filament are all sealed in inert gas filled cell-shell, the most not by surrounding
The impact of the steam etc. of environment.It addition, this utility model uses 2 π LED filament, its substrate uses the metal material of good heat conduction effect
Material, and only one side is coated with the luminous bisque of heat-conducting effect difference, then by the convection current of low viscosity coefficient high thermal conductivity gas
Conductive force so that the heat that 2 π LED filament produce is led away rapidly；Meanwhile, drive and be built in sealing cell-shell, produce
Heat also led away rapidly by low viscosity coefficient high thermal conductivity gas, electronic component operating temperature is low, and the life-span is long；(4) luminous effect
The best.This utility model uses 2 π light extracting LED filaments, and its one side is luminous, does not deposit double-edged colour temperature difference；Simultaneously because dissipate
Thermal effect is good, and its luminous efficiency is higher；(5) low cost.This utility model LED filament lamp, completely dispenses with metal heat sink, uses
2 π light extracting LED filaments, wherein substrate is mainly metal material, easy integrated molding, and cost is relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of on-chip power bulb lamp using 2 π light extracting LED filaments；
Fig. 2 is the structural representation of 2 π LED filament in this utility model；
Fig. 3 is the cross-sectional view of 2 π LED filament in this utility model；
Fig. 4 is multi-layer connector and the supporting schematic diagram of exhaustor in another embodiment of this utility model；
In figure: 1-bulb shell；2-stem stem；3-2 π LED filament；4-driver；5-lamp holder；6-high thermal conductivity gas；Outside 7-
Electrode outlet line；11-oviduct；21-exhaustor；22-support；23-multilamellar connects end；24-sealing by fusing head；25-electrode outlet line；
26-tinsel；31-substrate；32-LED chip；33-electrode pin；34-plain conductor；35-phosphor powder layer；36-insulate material
Material；41-drive circuit；42-actuator housing.
Detailed description of the invention
With specific embodiment, this utility model is further described below in conjunction with the accompanying drawings, in order to the skill in this area
Art personnel understand this utility model.
Fig. 1 is the structural representation according to a kind of on-chip power bulb lamp using 2 π light extracting LED filaments of the present utility model
Figure.
A kind of on-chip power bulb lamp using 2 π LED filament, this bulb lamp includes bulb shell 1, with exhaustor 21, props up
Frame 22, multilamellar connect the stem stem 2 of end 23, at least one 2 π LED filament 3, driver 4 and lamp holder 5；Bulb shell 1 and stem stem 2 vacuum
Seal and form vacuum-sealed cavity body；High thermal conductivity gas 6 it is provided with in vacuum-sealed cavity body；Stem stem 2, it is fixed on support 22
LED filament 3 and driver 4 are respectively positioned on portion in vacuum-sealed cavity body；Support 22 is positioned at the end of stem stem 2, and driver 4 is fixed on props up
Frame 22 upper；The bottom of support 22 is provided with tinsel 26；Support 22 upper end is provided with electrode outlet line 25；2 π LED filament 3 one
End is connected in series with tinsel 26, and the other end is connected in series by electrode outlet line 25 with driver 4；Driver 4 is led to lamp holder 5
Cross external electrode lead-out wire 7 to connect.The function of driver is available for 2 π LED filament 3 for outer electric main or outer D/C power being converted into
The DC source of work.
As shown in Figures 2 and 3, in the present embodiment, 2 π LED filament 3 include substrate 31, be positioned on substrate 31 at least one
String, the LED chip 32 being connected in series with identical PN junction direction；2 π LED filament 3 two ends are provided with electrode pin electricity 33；Electrode pin
Electricity 33 is fixed with substrate 31 two ends by insulant 36；LED chip 32 is connected in series with electrode pin electricity 33；Substrate 31 is ferrum
Matter substrate；Substrate 31 surface is provided with high reflection layer, and high reflection layer is silver coating；LED chip 32 is blue-light LED chip.
In the present embodiment, on substrate 31, the surface with LED chip 32 is provided with phosphor powder layer 35；The horizontal stroke of phosphor powder layer 35
Cross section is semicircle；Phosphor powder layer 35 material is YAG series bloom.
In the present embodiment, the material of substrate 31 is transparent materials；The a length of 100mm of substrate 31, width is 1 mm, thick
Degree is 0.5mm.
In the present embodiment, driver 4 includes actuator housing 42 and drive circuit 41；Drive circuit 41 is positioned at drive shell
The inside of body 42, drive circuit 41 is resistance-capacitance depressurization power supply.
In the present embodiment, the upper port of stem stem 2 is additionally provided with oviduct 11；Exhaustor 21 is positioned at the inside of stem stem 2；Aerofluxus
The upper port of pipe 21 is provided with sealing by fusing head 24.
In the present embodiment, high thermal conductivity gas 6 is helium.After installation fixes 2 π LED filament 3 and driver 4, stem stem
2 pass through high temperature sealing by fusing with bulb shell 1, and sealing-in is integral；After aerofluxus and the high thermal conductivity gas 6 that is filled with, exhaustor is sealed again
Extremely.The pressure of the high thermal conductivity gas 6 being filled with is at room temperature 100-1500Torr.By being filled with low viscosity coefficient high thermal conductivity
Gas 6 so that seal cell-shell content and be easily formed and effectively dissipate convection of heat, produce when 2 π LED filament 3 and driver 4 work
The heat timely and effective convection current of energy and conduction of heat cause bulb shell and distribute.It addition, 2 π LED filament 3 and driver 4 are protected by helium
And seal, not affected by the steam etc. in surrounding, the life-span making LED filament 3 and driver 4 is longer.
In the present embodiment, bulb shell 1 is transparent bulb case.
In the present embodiment, bulb shell 1 uses A type cell-shell；Lamp holder 5 uses E14 type.
Driver 4 and 2 π LED filament 3 is both placed in the bulb shell sealed by this utility model, therefore high working voltage
Being isolated in bulb shell 1, it is safe and reliable, overcomes existing LED bulb radiator easy band high-tension electricity, unsafe asks
Topic；Driver 4 is placed in the bigger bulb shell in space 1, does not affect the bonding of lamp holder 5 and bulb shell 1, and lamp holder 5 and bubble
The bonding of housing 1 is same with the Binder Phase of conventional incandescent, it is possible to use machine assembles, and substantially increases production efficiency；Drive
Dynamic device 4 and 2 π LED filament 3 is all sealed in inert gas filled cell-shell, the most not by the shadow of steam etc. of surrounding
Ring.It addition, this utility model uses 2 π LED filament 3, its substrate uses the metal material of good heat conduction effect, and only one side
It is coated with the luminous bisque of heat-conducting effect difference, then by the convective heat transfer effect of low viscosity coefficient high thermal conductivity gas 6 so that 2 π
The heat that LED filament 3 produces is led away rapidly；Meanwhile, driver 4 be built in sealing bulb shell 1 in, the heat of generation also by
Low viscosity coefficient high thermal conductivity gas 6 is led away rapidly, and electronic component operating temperature is low, and the life-span is long；This utility model uses 2 π LED
Filament 3, its one side is luminous, does not deposit double-edged colour temperature difference；Simultaneously because good heat dissipation effect, its luminous efficiency is higher；This
Utility model LED filament lamp, completely dispenses with metal heat sink, uses 2 π LED filament 3, and wherein substrate is mainly metal material, holds
Easily integrated molding, cost is relatively low.
Embodiment of above is only in order to illustrate this utility model and and technical scheme described by unrestricted this utility model；
Therefore although this utility model is had been carried out describing in detail by this specification with reference to each above-mentioned embodiment, but ability
Territory it is to be appreciated by one skilled in the art that still this utility model can be modified or equivalent；And all do not take off
From technical scheme and the improvement thereof of spirit and scope of the present utility model, it all should be contained at claim model of the present utility model
In the middle of enclosing.
Claims (9)
1. the on-chip power bulb lamp using 2 π LED filament, it is characterised in that this bulb lamp includes bulb shell (1), with
Exhaustor (21), support (22), multilamellar connect the stem stem (2) of end (23), at least one 2 π LED filament (3), driver (4) and
Lamp holder (5)；Described bulb shell (1) seals with stem stem (2) vacuum and forms vacuum-sealed cavity body；It is provided with in described vacuum-sealed cavity body
High thermal conductivity gas (6)；Described stem stem (2), the LED filament (3) being fixed on support (22) and driver (4) are respectively positioned on vacuum
Seal inside cavity；Described support (22) is positioned at the end of stem stem (2), and described driver (4) is fixed on the upper of support (22)；Institute
The bottom stating support (22) is provided with tinsel (26)；Described support (22) upper end is provided with electrode outlet line (25)；Described 2 π
LED filament (3) one end is connected in series with tinsel (26), and the other end passes through electrode outlet line (25) company of series connection with driver (4)
Connect；Described driver (4) is connected by external electrode lead-out wire (7) with lamp holder (5).
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 1, it is characterised in that described 2 π LED
The LED chip the most a string, that be connected in series with identical PN junction direction that filament (3) includes substrate (31), is positioned on substrate (31)
(32)；Described 2 π LED filament (3) two ends are provided with electrode pin electricity (33)；Described electrode pin electricity (33) passes through insulant
(36) fix with substrate (31) two ends；Described LED chip (32) is connected in series with electrode pin electricity (33)；Described substrate (31) is
Metal material substrate；Described substrate (31) surface is provided with high reflection layer, and described high reflection layer is silver coating or chromium coating or plates
Nickel dam；Described LED chip (32) is blue-light LED chip, red LED chip, green LED chip, yellow light LED chip, purple LED
One in chip or its combination in any.
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 2, it is characterised in that described substrate
On be provided with phosphor powder layer (35) with the surface of LED chip；The cross section of described phosphor powder layer (35) is semicircle, semiellipse
Shape or rectangle；The material of described phosphor powder layer (35) is YAG series bloom, yellowish green powder, or silicate series bloom, yellowish green
Powder, orange powder, or nitride, nitrous oxides series Hydrargyri Oxydum Rubrum or YAG series phosphor powder, silicate series fluorescent material, nitride, nitrogen oxygen
The combination in any of compound series phosphor powder.
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 3, it is characterised in that described substrate
(31) material is transparent materials；A length of 5mm ~ the 200mm of described substrate (31), width is 0.3mm ~ 5 mm, and thickness is
0.1mm~3mm。
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 4, it is characterised in that described driving
Device (4) includes actuator housing (42) and drive circuit (41)；Described drive circuit (41) is positioned at actuator housing (42)
Portion, described drive circuit (41) is any one in resistance-capacitance depressurization power supply, linear constant current power supply or switch constant current source.
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 5, it is characterised in that described stem stem 2
Upper port be additionally provided with oviduct (11)；Described exhaustor (21) is positioned at the inside of stem stem (2)；Described exhaustor (21) upper
Port is provided with sealing by fusing head (24).
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 6, it is characterised in that described height is led
Conductivity gas (6) is the one in helium, hydrogen, nitrogen, argon or its combination in any.
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 7, it is characterised in that described cell-shell
Body (1) is transparent bulb case, or milky white cell-shell, or frosted cell-shell, or coloured cell-shell, or part surface is with the cell-shell in reflecting layer,
Or part surface is with the cell-shell of prism, or the lensed cell-shell of part surface band.
A kind of on-chip power bulb lamp using 2 π LED filament the most as claimed in claim 8, it is characterised in that described cell-shell
Body (1) uses A type cell-shell or G type cell-shell or PAR type cell-shell, T-shaped cell-shell, candle type cell-shell, p-type cell-shell, PS type cell-shell, BR type
Cell-shell, ER type cell-shell or BRL type cell-shell；Described lamp holder (5) use E14 type or E27 type or E26 type or E40 type or GU type,
Or BX type or BA type or EP type or EX type or GY type or GX type or GR type or GZ type or G type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620764860.7U CN205877785U (en) | 2016-07-20 | 2016-07-20 | Use power built -in ball bubble lamp of 2 pi LED filaments |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620764860.7U CN205877785U (en) | 2016-07-20 | 2016-07-20 | Use power built -in ball bubble lamp of 2 pi LED filaments |
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|---|---|
| CN205877785U true CN205877785U (en) | 2017-01-11 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106015991A (en) * | 2016-07-20 | 2016-10-12 | 山东晶泰星光电科技有限公司 | Power source built-in bulb lamp using 2pi LED lamp filaments |
| CN107940269A (en) * | 2017-10-27 | 2018-04-20 | 厦门阳光恩耐照明有限公司 | A kind of bulb lamp light source moulding process |
-
2016
- 2016-07-20 CN CN201620764860.7U patent/CN205877785U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106015991A (en) * | 2016-07-20 | 2016-10-12 | 山东晶泰星光电科技有限公司 | Power source built-in bulb lamp using 2pi LED lamp filaments |
| CN107940269A (en) * | 2017-10-27 | 2018-04-20 | 厦门阳光恩耐照明有限公司 | A kind of bulb lamp light source moulding process |
| CN107940269B (en) * | 2017-10-27 | 2020-10-30 | 厦门阳光恩耐照明有限公司 | Light source forming process for bulb lamp |
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Effective date of registration: 20231211 Granted publication date: 20170111 |