TWI470164B - LED bulbs and can be 4π out of the LED light bar - Google Patents

LED bulbs and can be 4π out of the LED light bar Download PDF

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Publication number
TWI470164B
TWI470164B TW100135326A TW100135326A TWI470164B TW I470164 B TWI470164 B TW I470164B TW 100135326 A TW100135326 A TW 100135326A TW 100135326 A TW100135326 A TW 100135326A TW I470164 B TWI470164 B TW I470164B
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Taiwan
Prior art keywords
led
light
led light
transparent
wafer
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TW100135326A
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Chinese (zh)
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TW201221847A (en
Inventor
Shichao Ge
Huabin Liu
Tiehan Ge
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Zhejiang Ledison Optoelectronics Co Ltd
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Priority to CN2010206174061U priority Critical patent/CN201944638U/en
Priority to CN2010206852040U priority patent/CN201944605U/en
Priority to CN2010106100927A priority patent/CN102109115B/en
Priority to CN201120148206U priority patent/CN202132734U/en
Priority to CN2011201481956U priority patent/CN202281057U/en
Priority to CN2011203196519U priority patent/CN202281062U/en
Application filed by Zhejiang Ledison Optoelectronics Co Ltd filed Critical Zhejiang Ledison Optoelectronics Co Ltd
Publication of TW201221847A publication Critical patent/TW201221847A/en
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Publication of TWI470164B publication Critical patent/TWI470164B/en

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Description

LED bulb and LED light strip capable of 4π light output

The present invention relates to the field of lighting technology, and in particular to LED lighting strips and LED bulbs using the same.

In the prior art, bulb-shaped LED bulbs, which can replace incandescent lamps, mostly consist of one or more power LEDs, a metal-based circuit board (MPCB), a heat sink with a series of fins, and a switching power supply. And a constant current device driver, a connector, an anti-glare bubble and an electrical connector. At present, the luminous efficiency of such lamps has reached the level of fluorescent energy-saving lamps that are currently being used in large quantities, and the overall lamp efficiency is 40-70 lm/W, but the efficiency of white LED lamp beads has reached 130 lm/W, LED bulbs. The efficiency needs to be further improved. The main problem with the existing LED bulbs is that the cost and price are too high, which is several times that of fluorescent energy-saving lamps of the same luminous flux, which is difficult to promote. The high cost is not mainly the LED chip itself, but because of the high cost of the aluminum alloy heat sink and the driver including the transformer switching power supply and the constant current device, and the LED package; the transformer switching power supply and the constant current device driver not only cost High, and low efficiency, this driver contains components such as triodes, transformers, electrolytic capacitors and other non-long-lived components, so that its life cannot match the LED, its nominal average life is generally less than 25,000 hours, and the life of the LED itself should be 50000-100000 hours. That is to say, the LED lamp of the prior art alternative incandescent lamp has lower overall lamp efficiency, too high cost and long service life; if the LED bulb replaces the incandescent lamp and the fluorescent energy-saving lamp which is being used in a large amount, it becomes universal Master of lighting Flow, its efficiency needs to be further improved, the cost should be greatly reduced, the service life should be longer, the volume and weight are similar to incandescent lamps.

The LED's illumination is derived from the PN junction of the LED. It is originally a 4 π illuminator. The prior art LED is used for concentrating or connecting with a metal heat sink. The PN junction has a reflective layer, a reflective bowl or a heat sink on one side, which is originally 4 The π-emitting illuminant is made into an illuminant of 2 π or less than 2 π; this causes the 2 π light that is incident on one side of the heat sink to be reflected, multi-reflected, and absorbed to be emitted, and is emitted toward the illuminating surface. 2 π light also has some of the light that is totally reflected back to the heat sink to be reflected, multiple reflections and various absorptions before it can be emitted, thus greatly reducing the light output rate of the PN junction, that is, reducing the efficiency of the LED. At present, the internal quantum efficiency of LED PN junction luminescence is close to 90%, while the external quantum efficiency is only about 30%; the internal quantum efficiency is 90%, that is, only 10% of the injected electrons in the PN junction are missing and no photons are generated. 90% of the injected electrons and each electron produce a photon; however, the external quantum efficiency is only about 30%. Among them, the PN junction which is originally 4 π luminescence is one of the important reasons. If the PN junction of the LED is 4 π, it will greatly improve the luminous efficiency of the LED.

In this regard, some people have done research before, such as Chinese patent 200510089384.X, which puts a single LED wafer floating in the light-transmitting material to make the wafer 4 π emit light; but it does not solve the heat dissipation problem of the wafer, the wafer has no support plate. The dangling placement and the electrical lead-out on the wafer are very poorly reliable. Only a single low-power chip can be used, making it difficult to make a reliable lamp with sufficient output luminous flux. Another example is the US-issued patent 2007/0139949, which uses a plurality of small wafers mounted in series on a transparent transparent heat-conducting substrate such as sapphire, diamond, GaN or an opaque heat-conducting substrate such as copper or SiC, and then uses a heat-conducting lead wire and a bracket to connect. Lamp heat dissipation, plus one The bulb is not vacuum-sealed, the bulb is air and communicates with the surrounding atmosphere to form an incandescent lamp-shaped LED bulb; the thermally conductive transparent substrate sapphire, diamond, etc. described in the patent are very expensive, difficult to use, and opaque such as copper and SiC. It can't emit light 4 π; its heat dissipation path is wafer-heat-conducting substrate-thermal conduction lead-heat-conducting bracket-lamp, heat conduction path to the lamp head, it is difficult to heat connection, heat dissipation effect is limited, if there is LED driver in the lamp head, the heat conduction path is interrupted. Failure; if the bulb is vacuum sealed, the heat dissipation path also fails; thus it is also difficult to make a practical lamp with sufficient output luminous flux.

The mainstream of the prior art LED bulbs is a power LED with low voltage and high current, a PN junction of one LED chip, the working current is as large as 0.35A or even a few, and the electric power of 1W to several W or more is concentrated in 1 to several. On a square millimeter wafer, the external quantum efficiency is only about 30%, plus the energy difference between the injected electrons and the photons it produces, the energy difference between the photons generated by the PN junction and the last emitted photons, and about 70% of the electric power. It will be transformed into heat, how to dissipate this large amount of heat, and it has been one of its key problems at the same time as the birth of such power LEDs; LEDs are semiconductor devices whose junction temperature of PN junction rises, which will lead to luminescence. The efficiency drops rapidly and even burns out the PN junction; until today, the heat dissipation problem is still one of the key problems of such low-voltage and high-current power LED illumination, including LED bulbs.

In order to solve the heat dissipation problem, the prior art LED bulbs mainly use metal passive heat sinks with heat sink fins, and there are a large number of metal heat sinks for such heat sinks, such as materials and shapes, and how to increase convective heat exchange with air. Research and patents, such as Chinese Patent 200510062323.4 and US Patent 6787999, 7144135, and the like. The metal heat sink is mainly made of alloy aluminum, which is bulky, heavy, and Bengo is one of the key factors in the high cost of prior art LED bulbs.

In addition to the above metal heat sinks, there are also research liquid heat sinks, such as Chinese patents 200810093378.5, 200910100681.8 and 200910101643.4, which are placed in a sealed bulb filled with a light-transmitting heat-conducting liquid, such as water, oil, and ethylene. Alcohol or other inert liquid. The thermal conductivity of liquids is much lower than that of metals. For example, the thermal conductivity of water is about 0.7 W/(m.K), while that of metal is 50-415 W/(mK). The aluminum alloy used for the radiator of LED bulbs is 96- 226W / (m. K), it can be seen that the heat transfer of the liquid is much lower than that of the metal; on the other hand, the viscosity coefficient of the liquid is very large, for example, the viscosity of water is 8937 μP, which is not easy to form convection; therefore, the heat conduction and convection heat dissipation of the liquid The effect is not good; in addition, the use of liquid to dissipate heat and liquid will electrolyze, the liquid will erode the LED, and the liquid may phase change to form a gas phase layer on the surface of the LED, causing heat dissipation failure or even explosion, liquid contamination and heavy weight after rupture of the bulb, and thus Not easy to use and promote.

In addition to using the above metal (solid) and liquid heat dissipation, it has also been studied to dissipate heat with a gas. For example, the LED bulb of the Chinese patent 201010176451.2 is filled with a negative ion nitrogen gas in a sealed bulb; for example, the LED bulb of 200910250434.6 is cooled by a nitrogen-argon mixture sealed in the bulb; these methods have not been practical yet. In addition to these LED bulbs, other types of lamps, such as cold cathode fluorescent lamps, are used to dissipate heat from a high thermal conductivity gas or a hydrogen-hydrogen mixture, such as Chinese patent 200710148853.X, but because of the large size of the cold cathode fluorescent tube, It occupies almost the entire blister, it is difficult to form effective convection, and the conduction heat dissipation effect is limited. So far, there is no practical use. For example, the metal halide lamp also has a gas filled with nitrogen and bismuth in the blister, such as Chinese patent 200580039670.3; the incandescent lamp also has a charge. Nitrogen and other gases; but these are different types of lamps with LED lights.

In addition to the above-mentioned heat dissipation problems, the prior art LED bulbs have a driving problem of how to convert high-voltage mains into low-voltage and high-current. As mentioned above, most of the prior art LED bulbs are DC type low-voltage and high-current power LEDs, operating voltages of several to ten volts, currents of 0.35A to several A; and existing general-purpose incandescent lamps and fireflies Optical energy-saving lamps are directly used with 110-230V AC mains. To replace them directly, a driver including an AC/DC converter is needed to convert high-voltage alternating current into low-voltage and high-current direct current. Such a driver usually includes a switching power supply and a constant current circuit with components such as a triode, a transformer, and an electrolytic capacitor. Since the volume of the LED lamp replacing the incandescent lamp is not too large, the size of the driver should be as small as possible, and the transformer should be as small as possible. The input and output voltage difference is very large, which makes the electrical conversion efficiency low, generally 70-80%, which reduces the luminous efficiency of the whole lamp; at the same time, because of its low efficiency, its own heat is large, plus From the heat generated by the LED, the temperature of the driver is easily increased, which not only further reduces the efficiency of the driver, but also shortens the life of the driver. The driver includes temperature-sensitive components such as transistors, transformers and electrolytic capacitors, and temperature. Elevation will significantly reduce their efficiency, longevity and reliability, which makes the life of the prior art LED bulbs not primarily determined by the LED, but rather by the driver. In addition, the driver circuit of the switching power supply with a transformer and the constant current circuit are complicated, high in component requirements, and high in cost, which is another key factor for the high cost of the prior art LED bulb.

In order to avoid the use of such a driver, a technology called ACLED (AC LED) is being developed, for example, Chinese patents 200510020493.6, 200610099185.1 and US Pat. No. 7515248, 7535028 and AX3221, etc., which serially connect a series of small current LED chips into Similar to the bridge rectifier circuit, mounted on an MPCB, plus a heat sink, it can work directly with AC mains, and its drive circuit is very simple. However, the efficiency of such LEDs is still relatively low, and it needs to be in close thermal connection with a metal heat sink that must be exposed to the air. The ACLED has high voltage alternating current, and the metal heat sink is easy to be charged and unsafe. Prior art HVLEDs (high voltage LEDs), such as Chinese patent 201020159200.9, also have the same safety issues.

In addition, LED is a kind of point light source. The light of about 100 lm is concentrated on the area of about 1mm2, and its brightness is up to several tens of millions of nits. If the human eye looks directly at it, it will produce strong glare and leave a field in the field of vision. Black shadows can seriously affect vision in a short time. Therefore, for household lamps, it is necessary to add anti-glare bulbs or other means for dispersing light; in order to obtain a good light perception, the light diffusing layer of the anti-glare bulb needs to have sufficient thickness, but this also reduces The transmittance of the bulb is usually about 15% of the light lost. This in turn reduces the luminous efficiency of the entire lamp.

In summary, the prior art LED lamps should widely replace incandescent lamps and fluorescent energy-saving lamps for general illumination, and the luminous efficiency needs to be further improved, the cost needs to be greatly reduced, the service life needs to be further improved, and the volume and weight should be close. Incandescent lamp.

It is an object of the present invention to address at least one aspect of the above problems and deficiencies existing in the prior art.

Accordingly, it is an object of the present invention to provide an LED lighting strip capable of efficiently emitting 4π light.

One of the objects of the present invention is to provide a high efficiency LED bulb with high efficiency LED chip 4π light output.

Another object of the present invention is to provide a low-efficiency LED bulb with a high efficiency LED bulb 4π.

It is still another object of the present invention to provide a high efficiency LED bulb that emits light for a long life LED wafer.

It is still another object of the present invention to provide a high efficiency LED bulb that is 4π light-emitting from an LED wafer that is close in size and weight to an incandescent lamp.

According to an aspect of the present invention, an LED light bulb is provided, comprising: an LED bulb case, a stem with an exhaust pipe and a bracket, an LED light bar with at least one LED chip 4π emitting light, a driver, an electrical connector, wherein The LED bulb shell and the stem are vacuum sealed to form a vacuum sealed chamber filled with a low viscosity coefficient high thermal conductivity gas, and the bracket and the LED light strip fixed on the bracket are accommodated in the vacuum The LED light bar is sequentially electrically connected to the driver and the electrical connector, and the electrical connector is used for electrically connecting with an external power source to illuminate the LED light bar.

According to another aspect of the present invention, there is provided an LED lighting strip for LED light emitting from a LED chip, the LED lighting strip comprising a transparent substrate and at least one string on the transparent substrate, LED chips connected in series in the same PN junction direction The LED wafer has a transparent wafer substrate, and the LED wafer electrode is led out by an electrode extraction device of an LED chip disposed at both ends of the transparent substrate, wherein the transparent substrate is made of soft glass, hard glass, quartz glass, transparent ceramic or Made of plastic.

According to another aspect of the present invention, there is provided an LED lighting strip for LED light emitting from a LED chip, the LED lighting strip comprising a transparent substrate and at least one string on the transparent substrate, LED chips connected in series in the same PN junction direction The LED chip has a transparent wafer substrate, and the LED wafer electrode is led out by an electrode take-off device of an LED chip disposed at both ends of the transparent substrate, wherein a part of the LED chip is a blue LED chip and another part thereof is red a light LED chip, the LED chip and a luminescent powder layer disposed around the transparent substrate on which the LED chip is mounted, for converting part of blue light emitted by the blue LED chip into yellow light, another part of blue light and the yellow light And red light mixed into white light, high color rendering index white light or other colors of light.

According to another aspect of the present invention, there is provided an LED lighting strip for LED light emitting from a LED chip, the LED lighting strip comprising a transparent substrate and at least one string on the transparent substrate, LED chips connected in series in the same PN junction direction The LED wafer has a transparent wafer substrate, and the LED wafer electrode is led out by an electrode extraction device of an LED chip disposed at both ends of the transparent substrate, and the outermost surface of the LED wafer and the transparent substrate is a transparent tube or a transparent luminous powder tube. Encapsulation.

According to another aspect of the present invention, there is provided an LED lighting strip for LED light emitting from a LED chip, the LED lighting strip comprising a transparent substrate and at least one string on the transparent substrate, LED chips connected in series in the same PN junction direction The LED chip has a transparent wafer substrate, and the LED wafer electrode is led out by an electrode extracting device of an LED chip disposed at both ends of the transparent substrate, wherein the LED wafer is a transparent high voltage LED chip, and each of the high voltage The LED chip includes at least two LED PN junctions connected in series.

The high-efficiency LED bulb of the LED chip of the present invention includes a light-transmissive bulb, a stem with an exhaust pipe, an electric lead wire and a bracket, at least one LED light strip of the LED chip 4π, a driver, and a driver An electrical connector, a connector of the bulb and the electrical connector; the light-transmissive bulb and the stem are vacuum-sealed to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with a gas having a low viscosity coefficient and a high thermal conductivity; The shell, the LED strip, the driver, the electrical connector and the connecting member are electrically connected to each other to form a whole lamp; the LED strip is fixed on the stem, and the electrode is connected to the driver and the electrical connector via the electric lead of the stem; Connect the external power supply, turn on the external power supply, and light the LED light bar. .

It can be seen from the above that in the embodiment of the present invention, the LED light-transmitting bulb and the stem are vacuum-sealed to receive the corresponding bracket and the LED light-emitting strip fixed thereon, and the driver and the electrical connector are disposed in the vacuum. Seal the outside of the chamber.

The vacuum sealed cavity formed by the light-transmitting bulb and the core column is filled with a gas with a low viscosity coefficient and a high thermal conductivity, such as helium gas, hydrogen gas or a mixed gas of helium gas and hydrogen gas, and the gas pressure is 50- at room temperature. 1520 Torr. It can be seen that any static gas is a good thermal insulator. The heat dissipation of the gas mainly depends on convection, that is, the gas with low viscosity coefficient is selected. The helium gas is the lowest viscosity coefficient in the gas, only 116μP (hydrogen is 173μP, air is 922μP). The water is 8937μP), which is easy to form convection for effective heat dissipation; on the other hand, the LED illuminating strip is small in volume, and it is easier to form effective gas convection; thus, the heat generated by the operation of the LED illuminating strip can be effectively passed through the gas. Convection and heat conduction are then dissipated through the bulb. In addition, the LED light bar is protected by an inert gas such as helium or other low viscosity coefficient gas and vacuum sealed, and is completely unaffected by water vapor or the like in the surrounding environment, so that the LED light bar and the LED chip therein have a longer life.

The LED light strip of the LED chip 4π emits light, and comprises a transparent substrate. The transparent substrate has at least one string of LED chips connected in series in the same direction. The LED chip is a transparent wafer of the wafer substrate, and the LED chip is made of transparent glue. For example, silicone rubber, modified resin or epoxy resin is fixed on a transparent substrate, and the LED wafer 4π emits light, and the luminous efficiency is high; the LED electrodes are led out by the lead wires at both ends of the transparent substrate.

The transparent substrate of the LED light strip is made of glass, hard glass, quartz glass, transparent ceramic or plastic; the electrical lead wires at both ends of the LED light strip are fixed on the transparent substrate by high temperature glue, plastic, silver paste or low melting point glass. Both ends.

The at least one string of LED chips are separately fixed on the transparent substrate, and the wafers can be arranged close to each other or separated by a certain distance. For example, the distance between the wafers is greater than 0.01 mm, and the heat dispersion distribution generated during operation of the LED is easy to dissipate heat. The LED has a small temperature rise and a long service life; the LED has a light-emitting dispersion and reduces the glare of the LED.

The serially mounted wafers mounted on the transparent substrate may be LED chips of the same or different illuminating colors, for example, the same blue light, ultraviolet light or other monochromatic light; or may be red, blue or green three primary colors or multiple primary colors. To obtain white light or mixed light of different colors; use different numbers of LEDs of multiple luminescent colors to obtain white light with high color rendering index.

The transparent substrate of the LED light strip can have a transparent medium layer with high transmittance and high refractive index on the wafer side and the wafer, such as silicone, plastic or epoxy resin, to improve the light emission rate and protect the LED chip and its electricity. Connection line.

When the LED wafer is blue or ultraviolet light and needs to be converted into white light or other color light by the luminescent powder, a uniform luminescent powder layer is required outside the illuminating strip and its wafer.

The luminescent powder may be coated on the outer surface of the transparent substrate and the periphery of the wafer.

The luminescent powder layer may be coated on the luminescent strip transparent substrate and its mounting wafer side and the surrounding outer surface of the transparent dielectric layer on the wafer.

The transparent strip substrate and the wafer may be coated with a transparent dielectric layer and then coated with a uniform layer of luminescent powder.

The illuminating strip transparent substrate and the periphery of the wafer may be coated with a uniform luminescent powder layer and then coated with a transparent dielectric layer.

The luminescent powder layer is made by mixing luminescent powder with a transparent medium; the transparent medium is a high transmittance, high refractive index, high thermal conductivity medium, such as silicone, epoxy resin, plastic, transparent plastic, transparent lacquer and Organic polymer materials, etc.

The luminescent powder is pre-mixed with a transparent medium to form a uniform luminescent film, which is then wrapped around the transparent substrate and the transparent dielectric layer on the wafer.

The luminescent powder layer prepared by mixing the luminescent powder and the transparent medium can also be formed into a transparent medium illuminating powder tube and placed outside the transparent substrate and the wafer; the transparent medium is, for example, silicone, epoxy resin, plastic, glass, etc. .

The luminescent powder may also be coated on the inner or outer wall of a glass tube to form a glass luminescent powder tube, and then a transparent substrate on which at least one string of LED wafers are mounted is placed in the glass luminescent powder tube.

The transparent medium illuminating powder tube and the glass illuminating powder tube and the transparent substrate and the wafer may be filled with a medium having high transmittance, high thermal conductivity and high refractive index, such as silicone rubber, epoxy resin, plastic, etc. The electric lead wires at both ends of the transparent substrate are fixed or sealed.

The luminescent powder may also be coated on the inner wall of the transparent blister.

At least one string of the LED light strips of the LED chip 4π, the LED chips in series may also be high voltage LED chips of the LED chip 4π, the high voltage LED chips comprising at least two serial connections for each high voltage LED chip. LED PN junction, at least one electrical connection line between each PN junction; each high voltage LED wafer has at least one metal electrode for soldering wire at each end; between each high voltage LED chip and high voltage LED chip and high voltage LED There is at least one connecting line between the electrical lead wires. Since each high-voltage LED chip has a plurality of LED PN junctions, the number of wafers required for the light-emitting strips is greatly reduced, which simplifies the solid-crystal bonding process of the light-emitting strips and improves the yield of the light-emitting strips; meanwhile, the plurality of LED PNs The junction does not require a large area of opaque metal welding disc, which improves the light exit rate of the wafer, that is, improves the luminous efficiency.

The LED light strips of the above various LED chips 4π light can be used not only for manufacturing the LED bulb of the present invention, but also as an independent light emitting element.

The at least one string of LED chips connected in series in the same direction has a sufficient number such that the total driving voltage of the at least one LED illuminating strip used in series or series-parallel connection is close to the external AC mains or external DC power supply voltage, for example, the peak value of the alternating current used. Or 20%-100% of the external DC power supply voltage, the driver does not need a transformer, the circuit is simple, high efficiency, and low cost.

The LED light strips of the at least one LED chip 4π can be connected in series or in series and in parallel, and can be connected to work in two-way AC or one-way DC.

The arrangement of the at least one light bar is in the form of a V shape, a W shape, a column shape, a cone shape, a plane shape or the like.

In order to prevent the light emitted by one of the light strips from being shadowed by the light of the other light strip, the light strips of the at least one light strip are arranged to cross each other, that is, any two of the light strips are not in the same plane. on.

The light-emitting strips of the LED light-emitting strips are disposed to intersect each other on a diagonal line of each face of the virtual multi-faceted cylinder or the multi-faceted pillar.

When the bidirectional AC is working, at least one LED light bar may be turned on in the positive direction, and at least one reverse conduction may be turned on. The forward and reverse directions of the alternating current are alternately turned on and the light is turned on; or at least five LED light strips may be formed to form a bridge-like rectifier circuit. Just like the existing ACLED, the forward and reverse directions of the alternating current alternately turn on the light. The light-emitting strip is sealed in a vacuum-sealed light-transmissive bulb, and the high working voltage is isolated in the bulb, and the AC mains can be directly used, or only a current limiting circuit in which a resistor and a capacitor are connected in parallel, or a PTC resistor or the like is required. It is safe and reliable, and overcomes the shortcomings of the existing ACLED and HVLED radiators that are easy to bring high voltage and unsafe.

When the at least one LED light bar is connected to work in one-way DC, it can be operated by an external DC power source or an AC power source; when the external AC power source is used, the driver can be connected by a capacitor and a resistor in parallel with a buck current limiting circuit and rectification filtering. Circuit configuration, rectifier circuit or rectifier circuit can also be used to add PTC resistors in series; driver circuit is simple, low cost, no triode, no transformer, no high frequency radiation, no electrolytic capacitor; can also be used without transformer Non-isolated driver with inductor and constant current source.

The light-transmissive bulb is transparent, or is a milky white, frosted, colored bulb, and may also be a bulb partially having a reflective layer or partially having a series of small prisms and small lenses.

The shape of the light-transmissive bulb may be A-type, G-type, R-type, PAR-type, T-type, candle type, P type, PS type, BR type, ER type or BRL type, and the like. One of the bulbs of a light bulb.

The electrical connector is one of electrical connectors of an existing bulb such as E40, E27, E26, E14, GU, BX, BA, EP, EX, GY, GX, GR, GZ, G, and the like.

Compared with the prior art, the invention has the following advantages:

High luminous efficiency. Using a vacuum-sealed low-viscosity coefficient gas convection heat dissipation, solving the heat dissipation problem of the 4π light-emitting LED chip, the wafer 4π emits light, and the light extraction rate is increased by more than 65%; the high-voltage LED light-emitting strip connected in series by multiple LED chips has high efficiency of the driver circuit More than 95%; the whole lamp efficiency can reach more than 130 lm/W, which is double the existing LED bulb, twice the fluorescent energy-saving lamp and 10 times that of the incandescent lamp. If a high-voltage LED chip that emits light from the LED chip 4π is used, the luminous efficiency can be further improved.

low cost. The heat generated during LED operation, the low viscosity coefficient in the vacuum-sealed bulb, the high convection and conduction of the heat-conducting gas, and the heat dissipation through the bulb, completely eliminate the need for a metal radiator; the high-voltage LED strip does not require high cost. AC/DC converter with transformer; the cost of the whole lamp is reduced by more than 2/3. If the high-voltage LED chip that emits light from the LED chip 4π is used, the cost can be further reduced.

long life. The whole lamp does not have any short-lived components. The LED is vacuum-sealed and filled with inert gas helium in the bubble, completely free from the influence of water vapor in the surrounding environment, plus the wafer is dispersed and installed, working at low current and low temperature. The service life of LED bulbs may reach the long life of 50,000-100,000 hours of LED itself.

Safe and reliable. The high-voltage LED light strip and its high working voltage are sealed in the vacuum-sealed bulb, which is safe and reliable, and solves the safety problems of the prior art ACLED and HVLED.

Light weight and small size. The LED whole lamp does not use a metal radiator and a transformer, and the weight of the lamp is reduced by more than 2/3, and its weight is lighter than that of the fluorescent energy-saving lamp, and is close to the incandescent lamp. Its volume is also close to incandescent lamps.

The glare is light. A plurality of small current LED chips are dispersed and distributed to reduce glare of the LED chip.

With the further improvement of the quantum efficiency in the LED wafer and the continuous decrease of the price of the wafer, the LED bulb of the LED chip of the present invention is expected to become the mainstream of the LED general illumination lamp.

Incandescent and fluorescent energy-saving lamps can be directly replaced for lighting.

The technical solution of the present invention will be further specifically described below by way of examples and in conjunction with the first to the twenty-fifth drawings. In the description, the same or similar reference numerals indicate the same or similar parts. The description of the embodiments of the present invention with reference to the accompanying drawings is intended to illustrate the general inventive concept of the invention, and should not be construed as a limitation of the invention.

The first figure is a schematic structural view of a high efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention. The high-efficiency LED bulb of the LED chip 4π emits light, including a light-transmitting LED bulb shell 1, a stem 5 with an exhaust pipe 2 and a bracket, an LED strip 6 with at least one LED chip 4π, and a driver 7. An electrical connector 8, a connector 9 for the bulb and the electrical connector. The light-transmitting LED bulb shell 1, the stem 5, the LED strip 6, the driver 7, the electrical connector 8, and the connector 9 are integrally connected to each other as the LED bulb 10. The LED light-emitting strip 6 is fixed on the stem 5 by the electric lead wire 3 and the wire 11, and the electrode of the LED light-emitting strip passes through the electric lead wire 3 of the stem 5 and/or the metal wire 11 and the driver 7, ( The electrical connection line 12, the electrical connector 8, and the external power source, which are provided if necessary, are sequentially connected to each other. When the external power source is turned on, the LED light bar 6 can be illuminated. The light-transmitting LED bulb shell 1 and the stem 5 are vacuum-sealed to form a vacuum sealed cavity 13 filled with a low viscosity coefficient high thermal conductivity gas, which can generate heat generated by the LED light strip 6 during operation. The convection and conduction of the gas are then dissipated through the light-transmissive LED bulb housing 1.

It should be understood that the strut 4, the electrical lead wires 3, and the metal wires 11 are used as the brackets 42 for fixing the LED light-emitting strips 6 in the first figure. In an embodiment of the invention, the stem 5 includes an exhaust pipe 2, a flared tube 1a, and a bracket 42 that are integrated into one body (the bracket 42 includes an electrical lead wire 3, a post 4, and a wire 11). As described above, when the stem 5 is vacuum-sealed with the LED bulb case 1, specifically, the flare tube 1a and the LED bulb case 1 are vacuum-sealed at their joint positions. As understood by those skilled in the art, the stems of the present embodiment are substantially identical in arrangement to the components of the prior art stems, and thus will not be described in detail herein.

Specifically, at the joint position of the LED bulb shell 1 and the stem 5, the two are sealed by a high-temperature heat treatment to form a vacuum sealed cavity 13, the process of which is the same as that of the conventional incandescent lamp, and the LED light-emitting strip is used. 6 and the strut 4 of the stem 5, the wire/connection line 11 between one end of the electric lead wire 3 and the light-emitting strip 6 are sealed in the vacuum sealed cavity 13; then the vacuum-tight cavity 13 is sealed via the exhaust pipe 2. After vacuuming, the gas having a low viscosity coefficient and high thermal conductivity is charged, and then the exhaust pipe 2 is sealed at the sealing position 2a, and the low viscosity coefficient high thermal conductivity gas is sealed in the vacuum sealing cavity 13. The low viscosity coefficient high thermal conductivity gas in the vacuum sealed cavity 13 is, for example, helium gas, hydrogen gas, or a mixed gas of helium gas and hydrogen gas, and the gas pressure is between 50-1520 Torr at room temperature. value. Helium is the gas with the smallest viscosity coefficient in gas. It is only 116μP (173μP for hydrogen, 922μP for air, and 8937μP for water). It is easy to form effective convection heat dissipation and take away the heat generated when the LED light bar works. The LED light bar works normally.

It can be seen from the above that the vacuum sealed cavity 13 includes only the LED light-emitting strip 6 and the pillar 4 of the stem 5, one end of the electrical lead wire 3 and the connecting wire/wire 11 between the light-emitting strips 6, and the LED light-emitting The electrodes at both ends of the strip are electrically connected to the driver 7, the electrical connection line 12 and the electrical connector 8 outside the vacuum sealed cavity 13 via the electrical lead-out line 3 on the stem, and the electrical connector 8 is used for connection. A power source illuminates the LED light bar 6.

The LED light-emitting strip 6 is protected by an inert gas such as helium or other low viscosity coefficient gas and is vacuum-sealed, so that it is completely unaffected by water vapor or the like in the surrounding environment, so that the life of the LED is longer.

The LED light-emitting strip 6 has at least one string of LED chips connected in series in the same direction as the PN junction, and the LED chip has a sufficient number to make the total driving of the at least one LED light-emitting strip used in series or in series-parallel connection. The voltage is close to the external AC voltage or the external DC power supply voltage, for example, 20%-100% of the peak value of the AC used or the DC power supply voltage. Therefore, the high-voltage LED light-emitting strip that constitutes the LED chip 4π is thus formed, and the driver does not need a transformer, and the circuit is simple, high in efficiency, and low in cost.

The at least one LED lighting strip 6 can be connected in series or in series and parallel so that bidirectional AC operation or one-way DC operation can be performed. The first figure shows an example where two LED strips are connected in series to operate in a unidirectional DC.

When the at least one LED light bar 6 is connected to work in one-way DC, the external power source may be a DC power source or an AC power source; when the external AC power source is used, the driver 7 may be connected by a capacitor and a resistor in parallel. The flow circuit and the rectification filter circuit are formed, and the rectification filter circuit or the rectification circuit can be used to add the PTC resistor in series, without the triode, the transformerless, or the electroless capacitor; the switching power supply and the constant current device without the transformer can also be used, and the driver cost is low. .

When the at least one LED illuminating strip 6 is connected to work in a bidirectional AC, at least one LED illuminating strip 6 may be forwardly turned on, and at least one other LED illuminating strip 6 may be reversely turned on, and the alternating current is alternately turned on and off in sequence. . Of course, at least five LED illuminating strips 6 may be disposed to form a bridge-like rectifying circuit, that is, four four-arm alternating currents are alternately turned on and off in turn, and one is connected to the four arms diagonally, and the alternating current is connected. Both the forward and reverse directions are illuminated.

When the bidirectional AC is working, it can work directly with AC mains, or the driver 7 is only a current limiting resistor and a PTC resistor connected in series.

The LED light strip of the LED chip 4π can be a high-voltage LED light strip and its working environment of high working voltage is sealed in the vacuum sealed LED bulb shell, thus making it safe and reliable.

The light-transmissive bulb 1 is transparent or is a milky white, frosted, colored bulb. Of course, it is also possible to have a blister having a portion of a reflective layer or a portion of a small prism and a small lens as needed.

The shape of the light-transmitting bulb 1 may be A-type, G-type, R-type, PAR-type, T-type, S-type, candle type, P type, PS type, BR type, ER type, One of the bulbs of the BRL type or other existing bulbs.

The electrical connector 8 is one of electrical connectors of an existing bulb such as E40, E27, E26, E14, GU, B22, BX, BA, EP, EX, GY, GX, GR, GZ, G, etc. For installation on different lamp holders or lamps. The first figure shows an example of an E-type lamp cap.

It is to be noted that the same reference numerals as used in the first embodiment of the present invention, which are the same as those in the first embodiment, denote the same elements or elements having the same functions. For the sake of brevity, they will not be described again in the following embodiments unless they have different structures or functions.

The second figure is a schematic structural view of a high efficiency LED bulb in which an LED chip 4π emits light according to another embodiment of the present invention. In the second figure, in order to prevent the light emitted by one LED light bar from being blocked by the LED light bar, the LED light bulb shell 1 (hereinafter referred to as the bulb 1) or the light fixture is shaded, and the LED light strips are mutually Cross-arranged, that is, any two of the LED strips are not in the same plane. In the present embodiment, the LED light bar 6 has two LED light strips 6a and 6b, and the lower ends of the two light strips 6a and 6b (near the end of the exhaust pipe 2) are in the same level plane in the second figure ( Or set at the same level, their upper ends are installed one after the other.

The third figure is a schematic structural view of a high efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention. The bulb 1 is of the PAR type, and has a light reflecting layer 14 on the inner wall of the bulb 1, and the LED strip 6 is fixed to the wire 11 and the electric lead 3 on the stem 5. In order to increase the light emission rate, the bottom of the bulb 1 is provided with a light reflecting plate 14a for reflecting the light of the LED light emitting strip 6 toward the bottom to improve the light emitting efficiency.

The fourth figure is a schematic structural view of a high efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention. In the case, the bulb 1 is a T-shaped bulb; at least one LED strip 6 is directly fixed on the electric lead wires 3 and 3a of the stem 5, and the electric lead wire 3a connected to the upper end of the LED strip 6 is curved. In order to avoid the light emitted by the LED light strip 6 from being projected through the electrical lead-out line parallel thereto, a projection shadow is generated on the bulb 1. The inner wall of the bulb 1 is provided with a luminescent powder layer 26a, which is an LED illuminating strip without a luminescent powder layer; the electrical connector 8 is directly connected to the blister 1. It should be noted that the electric lead wire 3a can be regarded as a bracket for bending the LED light bar 6.

The fifth figure is a schematic structural view of a high-efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention. In the case, the bulb 1 is an R-type reflective bulb, and the light-reflecting layer 14 on the inner wall of the bulb 1; four LED light-emitting strips 6 connected in series are used for the electric lead wire 3 and the metal on the stem. The wire 11a and the wire 11 on the strut 4 are attached and fixed to the stem 5.

Fig. 6 is a front elevational view showing the LED lighting strip 6 used in the high efficiency LED bulb in which the LED wafer 4π emits light according to an embodiment of the present invention. The LED light bar 6 includes a transparent substrate 15 on which at least one string of LED chips 16 connected in series in the same direction of the PN, electrical connection lines 17 disposed between the LED chips 16, and transparent substrate 15 are disposed on the transparent substrate 15. The two ends are the LED electrode lead wires 18 and their fixing means 19; the one end 20 of the electrode lead wires 18 facing the LED chips 16 is exposed so that the connecting wires 21 are electrically connected to the LED chips 16.

The transparent substrate 15 is made of glass, hard glass, quartz glass, transparent ceramic or plastic. The fixing means 19 of the electric lead wires 18 at both ends of the LED lighting strip 6 are made of high temperature glue, plastic, silver paste or low melting point glass. In view of the LED bulb of the present invention, the vacuum sealed LED bulb shell and the stem are used to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with a low viscosity coefficient high thermal conductivity gas for rapid heat dissipation, so the present invention does not need to be as prior art. In the case of LED light strips, only very expensive transparent substrates such as sapphire, diamond, etc. can be used to withstand the high temperatures generated by the LED strips. Therefore, the transparent substrate of the LED light-emitting strip 6 of the present invention can be made of a relatively inexpensive material such as glass, hard glass, quartz glass, transparent ceramic or plastic, thereby reducing the manufacturing cost of the LED light-emitting strip 6.

The serially connected wafers 16 mounted on the transparent substrate 15 may be LED chips of the same or different luminescent colors, for example, the same blue light, ultraviolet light or other monochromatic light; or different illuminating colors to obtain different Color mixed light or white light; different colors of LEDs with different color colors can be used to obtain white light of different color temperature with high color rendering index.

The seventh figure is a schematic cross-sectional view of the LED light-emitting strip 6 cut along the line A-A shown in the sixth figure. As shown in the seventh figure, the LED wafer 16 is fixed on the transparent substrate 15 with a transparent adhesive 22, and the wafer substrate of the LED wafer 16 is transparent. The light emitted from the PN junction 24 of the LED chip 16 may be directly emitted from a portion of the light in the direction of the electrical connection line 17, and the light in the direction of the total reflection of the light toward the transparent substrate 15 and the light in the direction toward the transparent substrate 15 may be directly emitted. The transparent substrate 15 passing through the wafer substrate and the light-emitting strip is emitted. As shown in the seventh figure, it can be seen from the outgoing light 23 that the LED chip 16 can emit light 4π, thereby greatly reducing the reflection, multiple reflection, and absorption of light emitted by the PN junction in the LED wafer 16. The light loss, in turn, greatly increases the light extraction rate of the LED wafer and improves the external quantum efficiency. That is, the luminous efficiency of the LED wafer is improved. The transparent adhesive 22 is, for example, an epoxy resin, a modified resin, silicone or the like.

The eighth figure is a schematic cross-sectional view showing still another embodiment of the LED light-emitting strip 6 cut along the line A-A shown in the sixth figure. Wherein, the LED chip 16 and the transparent substrate 15 on which the LED chip 16 is mounted have a high refractive index, high light transmittance, high thermal conductivity transparent dielectric layer 25 on one surface thereof to improve the light emission rate of the LED wafer 16 in the direction of the connection line and The wafer 16 and its electrical connection lines 17 are protected. The transparent medium is, for example, silicone, epoxy, plastic, or the like.

When the LED chip is blue or ultraviolet light and needs to be converted into white light or other luminescent color by the luminescent powder, the luminescent powder layer is required in addition to the LED illuminating strip 6 shown in the sixth, seventh or eighth. The luminescent powder layer may be closely attached to the surface of the LED illuminating strip 6, or coated on the inner or outer wall of the transparent medium tube outside the LED illuminating strip 6, or the luminescent powder may be mixed in the transparent medium tube wall (for example, made into illuminating The powder tube) may also be coated on the inner wall of the bulb 1, such as the phosphor layer 26a of the fourth figure.

The ninth drawing is a schematic cross-sectional view of an embodiment of an LED illuminating strip having a luminescent powder layer. Therein, an outer surface of the periphery of the LED wafer 16 and the transparent substrate 15 is coated with a uniform luminescent powder layer 26. That is, a uniform layer of luminescent powder 26 is coated on the outer surface of the LED illuminating strip shown in FIG.

The luminescent powder layer 26 is made of a mixture of luminescent powder and a transparent medium; for example, silicone, epoxy, plastic, transparent plastic, transparent lacquer, high molecular polymer, and the like.

The tenth is a schematic cross-sectional structural view of still another embodiment of an LED illuminating strip having a luminescent powder layer. In the tenth figure, one side of the LED wafer 16 and the transparent substrate 15 on which the wafer is mounted is first coated with a transparent dielectric layer 25 (as shown in FIG. 8), and then a uniform layer of luminescent powder 26 is wrapped.

Figure 11 is a schematic cross-sectional view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer. In the eleventh figure, the transparent substrate 15 and the transparent dielectric layer 25 on one side of which the LED chip 16 is mounted are coated with a transparent dielectric layer 25a, and then a uniform layer of the luminescent powder 26 is coated.

Figure 12 is a schematic cross-sectional view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer. In the twelfth figure, a layer of transparent dielectric 25 is wrapped around the wafer 16 and the transparent substrate 15, and then a uniform luminescent layer 26 is wrapped.

Figure 13 is a schematic cross-sectional view showing still another embodiment of an LED illuminating strip having a luminescent powder layer. In the thirteenth figure, a uniform layer of luminescent powder 26 is wrapped around the LED wafer 16 and the transparent substrate 15, and then a layer of transparent dielectric 25 is wrapped.

In addition, a transparent tube may be added outside the LED light bar 6 shown in FIG. 6 for protecting the LED chip. Of course, the LED light bar can also add a luminescent powder layer. Fig. 14 is a front elevational view showing an embodiment of an LED light-emitting strip provided with an outer transparent tube. As shown in FIG. 14, the LED lighting strip 27 includes an outer transparent tube 28, and the transparent substrate 15 on which the LED wafer 16 is mounted is sealed in the transparent tube 28, and the electrodes of the LED wafer 16 are covered by the transparent tube 28 The electrical lead wire 29 is led out, and the electrical lead wire 29 is sealed from the transparent tube 28 at the sealing position 30. In the fourteenth figure, the LED chip 16 is an LED chip of two different illuminating colors. For example, the LED chip 16 is blue-emitting, and the LED chip 16a is red-emitting. The different color LED chips 16a Can be used to change the illuminating color temperature and color rendering index.

The fifteenth diagram is a schematic view showing the structure of the LED light-emitting strip 27 which is led out along the line B-B cut in the fourteenth figure. In the fifteenth figure, the LED chip 16 and its transparent substrate 15 are provided with a transparent tube 28 made of glass, plastic or silicone. When the luminescent strip 27 requires a luminescent powder layer, the luminescent powder may be coated on the inner or outer wall of the transparent tube 28. The fifteenth diagram shows an example in which the luminescent powder layer 32 is coated on the inner wall of the transparent tube 28.

As shown in the fifteenth figure, the luminescent powder may also be mixed in the transparent medium of the transparent tube 28, that is, the luminescent powder is mixed with the transparent medium glass, plastic, silicone or the like to form a transparent illuminating powder tube, so that the transparent tube 28 It is not necessary to apply the luminescent powder layer 32 on the inner or outer wall.

As shown in the fifteenth figure, the transparent tube 28 and the LED wafer and the transparent substrate 15 thereof may be filled with a material 31 having a high thermal conductivity, a high refractive index, and a high transmittance, such as a transparent silicone, an epoxy resin, and a plastic. . The light emitted by the LED chip emits light, and since the refractive index of the glass substrate, the transparent glue and the glass tube are similar, the light loss of the LED light emitted from each medium interface is small, so that the light output of the LED chip is high, that is, the light emission efficient.

Fig. 16 is a front elevational view showing the structure of still another embodiment of the LED light-emitting strip of the LED chip 4π emitted by the present invention. As shown in Fig. 16, the wafer substrate of the LED chip of the LED light-emitting strip 33 of the LED chip 4π is transparent. The LED chips are high voltage LED chips, and each high voltage LED chip 34 includes at least two LED PN junctions 35 connected in series, and at least one electrical connection line 36 is connected between each PN junction; each high voltage LED wafer There are at least one metal electrode 37 for soldering wires at each end; at least one electrical connection line 38 is disposed between each of the high voltage LED chips and between the high voltage LED chip and the high voltage LED light bar output lead line 18.

The at least one high voltage LED chip 34 of the LED light bar 33 shown in Fig. 16 may be of the same or different illuminating colors, and it is the same as the LED light bar described in the sixth and the fourteenth drawings, and the wafer side is also There may be a transparent dielectric layer, and a luminescent powder layer may be disposed around the illuminating strip 33.

It can be understood that the LED light strips 6, 27 and 33 which emit light of the LED chips 4π described above can be used for manufacturing the LED bulbs as shown in the first, second, third, fourth and fifth figures, or can be used alone as a light emitting element.

When used for manufacturing an LED light bulb, the position of the at least one LED light strip can be arranged as needed, for example, arranged in a column shape, a V shape, a W shape, a cone shape, a plane, etc., such as the first, second, third, and fourth figures. And the arrangement shown in FIG. 5 can also be arranged as shown in the seventeenth, eighteenth, nineteenth and twentieth diagrams, in order to avoid the light emitted by one LED strip from passing through the other LED strip. When blocking the shadow on the bulb, the LED strips of the at least one LED strip are arranged to cross each other. As shown in FIG. 18, the plurality of LED strips are arranged in a virtual multi-faced cylinder or The diagonal of each face of the multifaceted cylinder. Or a plurality of LED light-emitting strips are integrally arranged in a solid form of a multi-faceted cylinder or a multi-faceted cylinder, and the LED light strips are not on the same plane. In the eighteenth figure, four LED light-emitting strips are arranged in a square cylinder form, and are respectively on the diagonal lines of the four faces shown by the broken line 41 of the eighteenth figure.

The illuminating strips 6, 27 and 33 used may be of the same or different illuminating colors to obtain lamps of different illuminating colors, different color temperatures and different color rendering indices. For example, as shown in FIG. 17, the light-emitting strips 6, 27 or 33 of the four LED chips which emit blue light and which are coated with a luminescent powder layer which can be excited by blue to generate yellow light are arranged around the tapered axis 39 therebetween. Conical, there is also a LED light bar 40 emitting other colors, such as red light, changing the relative luminous flux of the two, can obtain different color temperature and color rendering index of the white LED bulb.

While some embodiments of the present general inventive concept have been shown and described, it will be understood by those of ordinary skill in the art The scope is defined by the claims and their equivalents.

The reference numerals used in the drawings are briefly described below:

1. . . Light-transmitting LED bulb shell

1a. . . Ferrule tube

2. . . exhaust pipe

2a. . . Sealing position of the exhaust pipe

3. . . Electrical lead

3a. . . Curved electrical lead

4. . . pillar

42. . . support

5. . . Core column

6, 6a, 6b. . . LED light strip

7. . . driver

8. . . Electrical connector

9. . . Connector

10. . . LED bulb

11, 11a. . . Wire on the stem

12. . . Electrical cable

13. . . Vacuum sealed cavity

14. . . Light reflection layer

14a. . . Light reflector

15. . . Transparent substrate

16, 16a. . . LED chip

17. . . Electrical connection between wafers

18. . . Electrode lead

19. . . Electric lead wire fixing device

20. . . Welding end of electric lead wire

twenty one. . . Electrical cable

twenty two. . . Transparent glue

twenty three. . . Exit light

twenty four. . . PN junction

25, 25a. . . Transparent dielectric layer

26, 26a. . . Luminous powder layer

27. . . Light strip with transparent tube or luminescent powder tube

28. . . Transparent tube or luminescent powder tube

29. . . Electrical lead

30. . . Sealing position

31. . . Transparent medium

32. . . Luminous powder layer

33. . . Light strip for high voltage LED chip

34. . . High voltage LED chip

35. . . LED PN junction

36. . . Electrical connection between PN junctions

37. . . Wire reel at both ends of high voltage LED chip

38. . . Electrical connection between high voltage LED chips and between electrical leads

39. . . Cone shaft

40. . . LED light strips with different illuminating colors

41. . . Virtual polyhedron

These and/or other aspects and advantages of the present invention will become apparent and readily understood from

The first figure is a schematic structural view of a high efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention.

The second figure is a schematic structural view of a high efficiency LED bulb in which an LED chip 4π emits light according to another embodiment of the present invention.

The third figure is a schematic structural view of a high-efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention.

The fourth figure is a schematic structural view of a high efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention.

The fifth figure is a schematic structural view of a high-efficiency LED bulb in which the LED chip 4π emits light according to still another embodiment of the present invention.

Fig. 6 is a front elevational view showing the structure of an LED light-emitting strip of a high-efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention.

The seventh figure is a schematic structural view of an embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

The eighth figure is a schematic structural view of still another embodiment of the LED light strip cut along the line A-A in the sixth figure.

The ninth drawing is a schematic structural view of still another embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

The tenth figure is a schematic structural view of still another embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

Fig. 11 is a schematic structural view showing still another embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

Fig. 12 is a structural schematic view showing still another embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

Fig. 13 is a schematic structural view showing still another embodiment of the LED light-emitting strip cut along the line A-A in the sixth figure.

Fig. 14 is a front elevational view showing the structure of an LED light-emitting strip of a high-efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention.

Fig. fifteen is a schematic view showing the structure of an embodiment of the LED light-emitting strip cut along the line B-B in the fourteenth figure.

Fig. 16 is a front elevational view showing the structure of an LED light-emitting strip of a high-voltage LED wafer in which an LED chip 4π emits light according to an embodiment of the present invention.

Fig. 17 is a view showing still another arrangement of LED light-emitting strips of a high-efficiency LED bulb in which the LED wafer 4π emits light according to an embodiment of the present invention.

Fig. 18 is a view showing still another arrangement of LED light-emitting strips of a high-efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention.

Fig. 19 is a view showing still another arrangement of LED light-emitting strips of a high-efficiency LED bulb in which an LED chip 4π emits light according to an embodiment of the present invention.

Fig. 20 is a schematic view showing still another arrangement of LED light-emitting strips of a high-efficiency LED bulb in which the LED wafer 4π emits light according to an embodiment of the present invention.

1. . . Light-transmitting LED bulb shell

1a. . . Ferrule tube

2. . . exhaust pipe

2a. . . Sealing position of the exhaust pipe

3. . . Electrical lead

4. . . pillar

42. . . support

5. . . Core column

6. . . LED light strip

7. . . driver

8. . . Electrical connector

9. . . Connector

10. . . LED bulb

11. . . Wire on the stem

12. . . Electrical cable

13. . . Vacuum sealed cavity

Claims (40)

  1. An LED light bulb comprising: an LED bulb shell, a stem with an exhaust pipe and a bracket, an LED light strip with at least one LED chip 4π emitting light, a driver, an electrical connector, wherein the LED bulb shell and the stem are vacuum sealed Forming a vacuum sealed cavity, the vacuum sealed cavity is filled with a low viscosity coefficient high thermal conductivity gas, and the bracket and the LED light bar fixed on the bracket are housed in the vacuum sealed cavity, and the LED light bar is The driver and the electrical connector are electrically connected in sequence, and the electrical connector is used for electrically connecting with an external power source to illuminate the LED light bar.
  2. The LED light bulb of claim 1, wherein the LED light bulb housing is light transmissive and is connected to the electrical connector directly or through a connector.
  3. The LED light bulb of claim 1, wherein the support of the stem comprises an electric lead wire, a post and a wire for fixing the LED light bar, and the electrodes of the two ends of the LED light bar are The electric lead wire is electrically connected to the driver and the electrical connector outside the vacuum sealed cavity in sequence.
  4. The LED light bulb according to claim 1, wherein the low viscosity coefficient high thermal conductivity gas comprises helium gas, hydrogen gas or a mixed gas of helium gas and hydrogen gas, and the low viscosity coefficient is at room temperature. The gas pressure of the high thermal conductivity gas is 50-1520 Torr.
  5. The LED light bulb of claim 1, wherein each of the at least one LED light bar has at least one string of LED chips connected in series in the same direction as the PN junction, the LED chip having sufficient The number of LED light bars is connected in series or in series and parallel, and the total driving voltage is close to the external driving voltage.
  6. The LED light bulb of claim 5, wherein the total driving voltage is 20%-100% of an alternating current peak or a DC power source voltage.
  7. The LED light bulb of claim 1, wherein the LED light bar is at least two LED light strips and is connected to operate in a bidirectional AC, wherein at least one of the LED light strips is positively conductive and at least one additional The LED light strips are reversely conductive, and the forward and reverse directions of the alternating current sequentially cause the LED light strips to alternately conduct light.
  8. The LED light bulb of claim 1, wherein the at least one LED light bar is connected to operate in a one-way DC.
  9. The LED light bulb of claim 1, wherein the LED light strips are connected in series or in series and in parallel; the light strips are arranged in a V-shaped, W-shaped, cylindrical, tapered or planar form.
  10. The LED light bulb of claim 1, wherein each of the LED light-emitting strips of the LED light-emitting strip are arranged in a cross arrangement such that any two of the LED light-emitting strips are not on the same plane to avoid the one. The light emitted by the LED strips is blocked by the LED strips on the LED bulb shell.
  11. The LED light bulb of claim 1 or 10, wherein each of the LED light-emitting strips of the LED light-emitting strips are disposed to intersect each other at a diagonal of each face of the virtual multi-faced cylinder or the multi-faceted cylinder on-line.
  12. The LED light bulb according to claim 1, wherein the LED light bulb shell is a transparent, milky white, frosted or colored bulb, or is partially partially reflective or partially has a series of small prisms and lenslets. The shape of the LED bulb shell is A-type, G-type, R-type, PAR-type, T-type, candle type, P type, PS type, BR type, ER type or BRL type.
  13. The LED light bulb of claim 1, wherein an end of the LED light bulb housing adjacent to the electrical connector is further provided with a light reflecting plate.
  14. The LED light bulb according to claim 1, wherein the electrical connector is an E40, E27, E26, E14, GU, BX, BA, EP, EX, GY, GX, GR, GZ, G type bulb One of the electrical connectors.
  15. The LED light bulb of claim 1, wherein the LED light strip of the LED chip 4π emits light comprises a transparent substrate and at least one string mounted on the transparent substrate, connected in series in the same PN junction direction. An LED wafer having a transparent wafer substrate.
  16. The LED light-emitting strip of claim 15 further comprising an electrode lead-out device for the LED chip disposed at both ends of the transparent substrate.
  17. The LED light-emitting strip according to claim 15, wherein the LED chips are fixedly separated from each other on the transparent substrate by a transparent adhesive, and the transparent substrate of the LED light-emitting strip is made of soft glass, hard glass, quartz. Made of glass, transparent ceramic or plastic.
  18. The LED light-emitting strip of claim 16, further comprising a fixing device for fixing the electrode take-up device to both ends of the transparent substrate, the fixing device being made of high-temperature glue, plastic, silver paste or low-melting glass. .
  19. The LED lighting strip of claim 15, wherein the LED chips are LED chips of the same or different luminescent colors.
  20. The LED lighting strip of claim 15, wherein the LED chip is a blue or ultraviolet LED chip, a red, blue and green trichromatic LED chip or a multi-primary LED chip.
  21. The LED lighting strip of claim 15 wherein a portion of the LED wafer is a blue LED wafer and another portion of the LED wafer is a red LED wafer.
  22. The LED lighting strip of claim 20 or 21, further comprising: a luminescent powder layer disposed around the LED wafer and the transparent substrate on which the LED wafer is mounted.
  23. The LED lighting strip of claim 20 or 21, further comprising: a first transparent dielectric layer disposed on a surface of the transparent substrate on which the LED wafer is mounted and the LED wafer.
  24. The LED lighting strip according to claim 23, further comprising: a luminescent powder layer disposed around the transparent medium layer and the transparent substrate on which the LED wafer is mounted.
  25. The LED light-emitting strip of claim 23, further comprising: another transparent dielectric layer and a luminescent powder layer disposed in sequence around the first transparent dielectric layer and the transparent substrate on which the LED wafer is mounted.
  26. The LED light-emitting strip according to claim 20 or 21, further comprising: a transparent dielectric layer and a luminescent powder layer disposed in sequence around the LED wafer and the transparent substrate on which the LED wafer is mounted.
  27. The LED lighting strip according to claim 20 or 21, further comprising: a luminescent powder layer and a transparent dielectric layer disposed in sequence around the LED wafer and the transparent substrate on which the LED wafer is mounted.
  28. The LED light-emitting strip of claim 22, wherein the luminescent powder layer is made of a mixture of luminescent powder and a transparent medium, the transparent medium package Any one or a combination of silicone, epoxy, plastic, transparent glue, clear lacquer, and polymer.
  29. The LED lighting strip of claim 15, wherein the outermost surface of the LED wafer and the transparent substrate are encapsulated by a transparent tube.
  30. The LED light-emitting strip according to claim 29, wherein the inner wall or the outer wall of the transparent tube is provided with a luminescent powder layer.
  31. The LED lighting strip of claim 29, wherein the transparent tube is glass, plastic or silicone.
  32. The LED lighting strip of claim 15, wherein the outermost surface of the LED wafer and the transparent substrate are encapsulated by a transparent luminous powder tube.
  33. The LED light-emitting strip of claim 29, wherein the transparent tube and the LED wafer and the transparent substrate further comprise a high transmittance, a high thermal conductivity, and a high refractive index medium. Light rate, high thermal conductivity, high refractive index media include transparent silicone, epoxy or plastic.
  34. The LED lighting strip of claim 22, wherein the LED wafers are high voltage LED wafers, each high voltage LED wafer comprising at least two LED PN junctions connected in series.
  35. An LED light strip for illuminating an LED chip 4, the LED light strip comprising a transparent substrate and at least one string of LED chips connected in series in the same PN junction direction on the transparent substrate, the LED wafer having a transparent wafer The substrate, the LED wafer electrode is led out by an electrode take-up device of an LED chip disposed at both ends of the transparent substrate, wherein the transparent substrate is made of soft glass, hard glass, quartz glass, transparent ceramic or plastic.
  36. An LED light strip for illuminating an LED chip 4, the LED light strip, the LED light strip comprising a transparent substrate and at least one string of LED chips connected in series in the same PN junction direction on the transparent substrate, The LED wafer has a transparent wafer substrate which is led out by an electrode extraction device of an LED wafer disposed at both ends of the transparent substrate, wherein a part of the LED wafer is a blue LED wafer and another portion thereof is a red LED wafer The LED chip and the transparent substrate on which the LED chip is mounted are provided with a luminescent powder layer for converting part of the blue light emitted by the LED chip into yellow light, and another part of the blue light and the yellow light and red light mixing. White light, high color rendering index white light or other colors of light.
  37. An LED light strip for emitting light from an LED chip, wherein the LED light strip comprises a transparent substrate and at least one string of LED chips connected in series in the same PN junction direction on the transparent substrate, the LED wafer having a transparent wafer substrate The LED wafer electrode is led out by an electrode extraction device of an LED chip disposed at both ends of the transparent substrate, and the outermost surface of the LED wafer and the transparent substrate is encapsulated by a transparent tube or a transparent luminous powder tube.
  38. The LED light-emitting strip of the LED chip 4π according to the invention of claim 37, wherein the inner wall or the outer wall of the transparent tube is provided with a luminescent powder layer.
  39. An LED light strip for emitting light from an LED chip, wherein the LED light strip comprises a transparent substrate and at least one string of LED chips connected in series in the same PN junction direction on the transparent substrate, the LED wafer having a transparent wafer substrate The LED wafer electrode is led out by an electrode take-off device of an LED chip disposed at both ends of the transparent substrate, wherein the LED wafer is a wafer substrate that is a transparent high-voltage LED chip, and each of the high-voltage LED chips includes at least two LEDs connected in series PN junction.
  40. According to the LED light strip of the LED chip 4π according to claim 39, wherein there is at least one electrical connection line between each LED PN junction, and at least one of each end of each high voltage LED wafer is used for soldering and wire bonding. The metal electrode; at least one electrical connection line between each high voltage LED chip and between the high voltage LED chip and the electrical lead line of the high voltage LED light strip.
TW100135326A 2010-11-22 2011-09-29 LED bulbs and can be 4π out of the LED light bar TWI470164B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN2010206174061U CN201944638U (en) 2010-11-22 2010-11-22 LED lamp bulb for a sense lamp capable of directly replacing an incandescent lamp
CN2010206852040U CN201944605U (en) 2010-12-29 2010-12-29 LED (light-emitting diode) bulb formed by P-N junction 4 pai light extraction high-voltage LED
CN2010106100927A CN102109115B (en) 2010-12-29 2010-12-29 P-N junction 4pi light emitting high-voltage light emitting diode (LED) and LED lamp bulb
CN2011201481956U CN202281057U (en) 2011-05-11 2011-05-11 High-efficiency LED light emitting tube with LED chip 4pi light outlet
CN201120148206U CN202132734U (en) 2011-05-11 2011-05-11 LED (Light-Emitting Diode) lamp bulb with high colour rendering index and high efficiency
CN2011203196519U CN202281062U (en) 2011-08-29 2011-08-29 LED chip 4-Pi light-emitting LED bulb with high color rendering index

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Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
TWI560397B (en) * 2013-10-22 2016-12-01 Epistar Corp Illumination device
TWI564509B (en) * 2013-03-27 2017-01-01 英特明光能股份有限公司 Light emitting diode lamp
US9310031B2 (en) 2013-06-06 2016-04-12 Interlight Optotech Corporation Light emitting diode bulb
TWI481795B (en) * 2013-12-27 2015-04-21 Harvatek Corp A light emitting diode lamp
US20160043292A1 (en) * 2014-08-07 2016-02-11 Formosa Epitaxy Incorporation Light emitting device, light emitting module, and illuminating apparatus
TWI645582B (en) * 2015-07-21 2018-12-21 晶元光電股份有限公司 Light emitting device and light emitting module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201007995Y (en) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360 degree light-emitting LED lamp
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN201555054U (en) * 2009-12-09 2010-08-18 东莞市贺喜光电有限公司 LED bulb

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201007995Y (en) * 2006-09-29 2008-01-16 厦门市三安光电股份有限公司 360 degree light-emitting LED lamp
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN201555054U (en) * 2009-12-09 2010-08-18 东莞市贺喜光电有限公司 LED bulb

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