CN101800270A - Light emitting diode device and packaging method therefore - Google Patents

Light emitting diode device and packaging method therefore Download PDF

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Publication number
CN101800270A
CN101800270A CN200910004212A CN200910004212A CN101800270A CN 101800270 A CN101800270 A CN 101800270A CN 200910004212 A CN200910004212 A CN 200910004212A CN 200910004212 A CN200910004212 A CN 200910004212A CN 101800270 A CN101800270 A CN 101800270A
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CN
China
Prior art keywords
light
emitting diode
transparency carrier
backlight unit
diode chip
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Application number
CN200910004212A
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Chinese (zh)
Inventor
刘宇桓
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亿光电子工业股份有限公司
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Publication date
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Priority to CN200910004212A priority Critical patent/CN101800270A/en
Publication of CN101800270A publication Critical patent/CN101800270A/en

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Abstract

The invention provides a light emitting diode device which comprises a transparent base plate, a plurality of light emitting diode chips, a circuit and a transparent colloid, wherein the light emitting diode chips are fixedly connected to the transparent base plate; the circuit is formed on the transparent base plate and is electrically connected to the light emitting diode chips; and the transparent colloid is used for packaging the light emitting diode chips. The light emitting diode chips are used for generating light rays with at least one type of wavelength, and the light generated by the light emitting diode chips is respectively emitted to two opposite surfaces of the transparent base plate. The blue light chips are welded on the circuit of the transparent base plate, the fluorescence material is matched and coated, and the advantages of the base plate are utilized, therefore the double-surface white light emitting device packaged by the chips is manufactured.

Description

Light-emitting diode assembly and method for packing thereof

Technical field

The invention relates to that (light emitting diode, LED) device and its method for packing refer to a kind of light-emitting diode assembly and its method for packing that can be used as two-sided white light emitting device to a kind of light-emitting diode especially.

Background technology

Compared to conventional light source such as cold-cathode tubes, because the LED package assembling has that volume is little, power consumption is low, high brightness, height color representation, reaction speed fast (but high-frequency operation), environmental protection (shatter-proof, shock-resistant be difficult for broken, recyclable) become compact advantages such as product, so make led light source occupy certain market advantage with easy exploiting.Generally speaking, traditional LED package assembling comprises encapsulation cup and led chip basically and is installed on and encapsulates on the cup.The encapsulation cup of tradition has two internal links and two external links, but the internal link seam that wherein encapsulates cup to the positive and negative electrode of led chip to form electrical path, the external link of encapsulation cup then in order to light tight printed circuit board (PCB) (printed circuit board, PCB) electrical connection.In addition, equally also has external link on the printed circuit board (PCB), the external link of printed circuit board (PCB) is in order to be electrically connected with the external control device, and the lead that makes the external control device can see through on the printed circuit board (PCB) be electrically connected on the led chip with encapsulating the lead on the cup.

From the above, the light-emitting diode assembly method for packing of tradition system is packaged in led chip on the encapsulation cup earlier and forms after the LED package assembling, more a plurality of LED package assemblings is engaged on the printed circuit board (PCB), to form a kind of LED light-emitting device.Except the volume potential of LED light-emitting device must increase, the making complexity of LED light-emitting device also increased thereupon but thus.This not only can increase the processing procedure cost, also can limit the range of application of LED light-emitting device simultaneously.In view of this, provide that a kind of LED light-emitting device with good optical benefit and frivolous structure is real to be important topic one of in the LED technical development.

Summary of the invention

One of purpose of the present invention is to provide a kind of LED matrix and its method for packing, and with simplification canned program, minimizing device volume, and the LED matrix that is provided can be used as a pair of colourless light light-emitting device.

The preferred embodiment one of according to the present invention, the present invention has disclosed a kind of LED matrix, it includes first transparency carrier, a plurality ofly is fixed in led chip on first transparency carrier, is formed at the circuit on first transparency carrier, and the transparent colloid of packaging LED chips.Wherein, aforementioned circuit can be electrically connected to led chip.Light-emitting diode chip for backlight unit is in order to the light of first wavelength that produces at least a wavelength, and circuit and light-emitting diode chip for backlight unit electrically connect, and wherein the light that produces of light-emitting diode chip for backlight unit sends to the two sides of first transparency carrier respectively.

Another preferred embodiment according to the present invention, the present invention provides a kind of method of packaged LED device in addition.At first, provide first transparency carrier.Afterwards, go up the formation circuit in one of first transparency carrier surface.Then, with a plurality of led chips.Led chip is fixed on first transparency carrier, and is electrically connected to aforementioned circuit., transparent colloid be arranged on first transparency carrier on thereafter, and on the packaging LED chips.

Because the present invention system is arranged at led chip on first transparency carrier, therefore the LED matrix that is formed can be used as a kind of double-side device.In addition, because led chip system directly is fixed on first transparency carrier, and directly is electrically connected on the circuit of first transparency carrier, so the present invention can simplify the processing procedure of LED matrix, and the frivolous LED matrix of chip-scale is provided.

For the present invention's above-mentioned purpose, feature and advantage can be become apparent, better embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.Yet following better embodiment and graphic only for reference and explanation usefulness are not to be used for to the present invention's limitr in addition.

Description of drawings

Fig. 1 is the structural representation of the present invention's the first preferred embodiment LED matrix;

Fig. 2 is the schematic top plan view of first transparency carrier shown in Figure 1;

Fig. 3 is the perspective exploded view of the led chip 128 and first transparency carrier 124 shown in Figure 1;

Fig. 4 is the perspective exploded view of the present invention's the second preferred embodiment LED matrix;

Fig. 5 is the perspective view of LED matrix shown in Figure 4;

Fig. 6 is the generalized section of the present invention's the 3rd preferred embodiment LED matrix;

Fig. 7 is the generalized section of the present invention's the 4th preferred embodiment LED matrix;

Fig. 8 is the schematic flow sheet of the present invention's the 5th preferred embodiment packaged LED device.

The primary clustering symbol description

100LED device 124 first transparency carriers

128LED chip 130 transparent colloids

146 first fluorescent materials, 148 second fluorescent materials

150 circuits, 155 grafting materials

151 first leads, 152 second leads

154 external link 156 pads

158 ball-type sept 200LED devices

230 transparent colloid 300LED devices

400LED device D diameter

The H height

Embodiment

Please refer to Fig. 1 to Fig. 3.Fig. 1 is the structural representation of the present invention's the first preferred embodiment LED matrix 100, and Fig. 2 is the schematic top plan view of first transparency carrier 124 shown in Figure 1, and Fig. 3 is the perspective exploded view of the led chip 128 and first transparency carrier 124 shown in Figure 1.As shown in Figure 1, LED matrix 100 can include first transparency carrier 124, a plurality of led chip 128 that is fixed on first transparency carrier 124, and is covered in the transparent colloid 130 on the led chip 128.Wherein, first transparency carrier 124 can comprise the material of any light-permeable, for example is glass substrate or plastic base.Led chip 128 can be various types of led chips, under preferable situation, but the upper and lower surface of each led chip 128 that is used is uniformly light-emitting all, and for example the wave-length coverage of the light wave that is sent can be between 380 nanometers (nm) between 680 nanometers, but are not limited thereto.Because the present invention system is arranged at led chip on the transparency carrier, but and the upper and lower surface of led chip 128 be preferably all uniformly light-emittings, therefore the LED matrix that is formed can be used as a kind of double-side device.Be noted that though Fig. 1 system illustrates 9 led chips 128 as an illustration, yet the quantity of the present invention's led chip 128 is not limit by this.

Transparent colloid 130 can comprise any geometry, and in the present embodiment, transparent colloid for example is the spherical sealing of semicircle, and half and half spherical shape sealing can be coated on the led chip 128 accordingly.Transparent colloid 130 itself can comprise the insulation light transmissive material of any curable and anti-aqueous vapor, for example epoxy resin or silica gel.In addition, led chip 128 may be the luminous led chip of short-wave band, that is led chip 128 may not be directly to send predetermined photochromic or pure white light.In order to make LED matrix 100 can send predetermined light tone, has at least a first fluorescent material 146 in the transparent colloid 130.Fluorescent material 146 is subjected to the exciting of light of a part of first wavelength and produces the light of second wavelength, and the light of remaining (rema ining) first wavelength mixes with the light of aforementioned second wavelength and obtains a predetermined mixed-color light.For instance, when the light that is sent when led chip 128 is blue light, fluorescent material 146 for example is a kind of gold-tinted fluorescent material, the be stimulated blue light that gold-tinted and led chip 128 produced that produced and become required white light of gold-tinted fluorescent material makes LED matrix 100 become a kind of two-sided white light emitting device.Perhaps, first fluorescent material 146 for example is to comprise a kind of red light flourescent material and a kind of green glow fluorescent material, red light flourescent material be stimulated the ruddiness, the green glow fluorescent material that are produced be stimulated the green glow that produced and led chip 128 blue light and become white light.

In first embodiment, first transparency carrier 124 optionally includes a kind of second fluorescent material 148 and is mixed in wherein, the light tone that is presented towards first transparency carrier, 124 directions from led chip 128 with further adjustment, and second fluorescent material is identical with first fluorescent material.In other embodiment of the present invention, first transparency carrier 124 also can not comprise fluorescent material.

As shown in Figure 2, LED matrix 100 can include the circuit 150 that is arranged at first transparency carrier, 124 surfaces.But led chip 128 mat dot matrix ways (dot matrix) are arranged on the surface of first transparency carrier 124, but its particular location need not be subjected to the restriction of Fig. 2, wherein see, so the led chip 128 of Fig. 2 is the structure that illustrates to having an X-rayed for clear demonstrating outside first transparency carrier 124.Circuit 150 can include a plurality of first leads 151 and a plurality of second leads 152, and each bar first lead 151 all has an external link 154 separately with each bar second lead 152, in order to led chip 128 is electrically connected to external control device (figure does not illustrate).Control device can electrically connect with first lead 151 and second lead 152 respectively, in order to the luminous situation of control led chip 128.The led chip 128 that is positioned at delegation can be electrically connected on aforementioned first lead 151 in parallel, and the led chip 128 that is positioned at same row can be electrically connected on aforementioned second lead 152 in parallel.

As shown in Figure 3, each led chip 128 can have one first electrode 132 and one second electrode 134.First lead 151 and second lead 152 are first electrode 132 and second electrode 134 that is electrically connected to led chip 128 respectively, and then control the light source of indivedual led chips 128.Wherein, for promoting the joint reliability of led chip 128, led chip 128 can utilize grafting material 155 to be fixed on first transparency carrier 124, and wherein the led chip 128 of Fig. 3 and grafting material 155 all illustrate the structure for having an X-rayed.Under preferable situation, grafting material 155 can be elargol or eutectic metal.Elargol or eutectic metal can directly be fixed in led chip 128 on first transparency carrier 124, and led chip 128 is electrically connected to circuit 150 on first transparency carrier 124.

Previous embodiment system utilizes the spherical transparent colloid of semicircle 130 protection other led chips 128; therefore shape, the size of transparent colloid 130 or the fluorescent material that is comprised all can be adjusted according to the product demand or the type of led chip 128; and previous embodiment can use less transparent colloid 130 materials to encapsulate, yet the invention is not restricted to this.In other embodiment, the present invention also can adopt other packaged type to form the LED matrix of different structure.

Please refer to Fig. 4 and Fig. 5.Fig. 4 is the perspective exploded view of the present invention's the second preferred embodiment LED matrix 200, and Fig. 5 is the perspective view of LED matrix 200 shown in Figure 3.As Fig. 4 and shown in Figure 5, LED matrix 200 can include first transparency carrier 124, second transparency carrier 126, a plurality of dot matrix way that is is fixed in led chip 128 on first transparency carrier 124, is arranged at the transparent colloid 230 between first transparency carrier 124 and second transparency carrier 126, with be arranged on first transparency carrier 124 and be electrically connected to the circuit (figure do not show that its configuration can be similar to circuit 150) of led chip 128.Wherein, second transparency carrier 126 also can comprise the material of any light-permeable, for example is glass substrate or plastic base.Led chip 128 also optionally utilizes grafting material to be fixed on first transparency carrier 124, yet is not limited thereto.

Transparent colloid 230 is to utilize the mode of coating to be covered on first transparency carrier 124, and is arranged on all led chips 128.Transparent colloid 230 is one deck adhesive layer, itself comprises the insulation light transmissive material of any curable and anti-aqueous vapor, for example epoxy resin or silica gel.Can send suitable light tone in order to make LED matrix 200, also can have at least a first fluorescent material 146 in the transparent colloid 230, and first fluorescent material 146 can comprise a kind of gold-tinted fluorescent material, perhaps comprise a kind of red light flourescent material and a kind of green glow fluorescent material, but be not limited thereto.

Thus; present embodiment not only can further be simplified the manufacturing process of transparent colloid 230; and can utilize second transparency carrier 126 and first transparency carrier 124 to protect the upper and lower both sides of led chip 128 respectively, make LED matrix 200 be more suitable for being applied as the double-side device.

Overhang the next ccontaining led chip 128 in a space in order to prop up between first transparency carrier 124 and second transparency carrier 126, the present invention can include clearance support (spacer) in addition.Please refer to Fig. 6 and Fig. 7.Fig. 6 and Fig. 7 are respectively the generalized section of the present invention's the 3rd and the 4th preferred embodiment LED matrix 300,400.As shown in Figure 6, be with the main difference part of LED matrix 200, LED matrix 300 comprises clearance support in addition, it for example is pad 156, be arranged at led chip 128 around, for example be surrounded on the periphery of all led chips 128, use between first transparency carrier 124 and second transparency carrier 126, to prop up overhanging the next ccontaining led chip 128 in a space for the rectangular ring pad.The height H of pad 156 can be greater than the thickness of led chip 128, and pad 156 is preferably and can be transparent material.Perhaps as shown in Figure 7, be with the main difference part of LED matrix 200, the transparent colloid 230 of LED matrix 400 includes a plurality of clearance supports in addition, for example the ball-type sept 158, ball-type sept 158 can directly be mixed in the material of transparent colloid 230, uses to prop up between first transparency carrier 124 and second transparency carrier 126 to overhang the next ccontaining led chip 128 in a space.The diameter D of ball-type sept 158 can be greater than the thickness of led chip 128, and ball-type sept 158 is preferably and can be transparent material.

A kind of method of packaged LED device then further is provided, and how the present invention utilizes transparency carrier to carry out the encapsulation of LED matrix with explanation.Please refer to Fig. 8, what it illustrated is the schematic flow sheet of the present invention's the 5th preferred embodiment packaged LED device.Wherein, flow process shown in Figure 8 can the corresponding structure that forms aforementioned each embodiment.Therefore, more clear and definite for making this process step, herein can be in the lump as an illustration referring to figs. 1 to structure shown in Figure 5.

As shown in Figure 8, at first provide transparency carrier, for example first transparency carrier 124.Afterwards, carry out at least metal evaporation processing procedure and at least exposure imaging processing procedure, form circuit 150 to go up in one of first transparency carrier 124 surface.Subsequently, on first transparency carrier 124, clearance support is set, in order to support second transparency carrier 126 of first transparency carrier 124 and follow-up setting.

Then, provide a plurality of led chips 128, utilize elargol or eutectic mode directly led chip 128 to be fixed on first transparency carrier 124, and led chip 128 is electrically connected to circuit 150 on first transparency carrier 124 by elargol or eutectic metal.Then, provide second transparency carrier 126 again, cover on the led chip 128.

Thereafter, utilize transparent colloid 130 or transparent colloid 230 to coat and packaging LED chips 128, wherein transparent colloid 130,230 can include at least a fluorescent material, can utilize the mode of coating to be arranged on first transparency carrier 214, also can utilize the mode of encapsulating to be filled between first transparency carrier 124 and second transparency carrier 126.Afterwards, can be cured processing procedure, to form the light-emitting diode assembly of encapsulation to transparent colloid 130,230.

Compared to the LED matrix of tradition, the present invention can comprise following advantage.At first, because the present invention system is arranged at led chip on the transparency carrier, therefore the LED matrix that is formed can be used as a kind of double-side device.Because the present invention can utilize interior fluorescent material of transparent colloid or the interior fluorescent material of transparency carrier to change the light tone of LED matrix, therefore can produce two-sided white light emitting device again.In addition, because led chip system directly is fixed on the transparency carrier, and directly is electrically connected on the circuit of transparency carrier, so the present invention can simplify the processing procedure of LED matrix, and the frivolous LED matrix of chip-scale is provided.Moreover, because the present invention's led chip system is arranged on the transparency carrier with dot matrix way, and the circuit that can utilize the array mode to distribute is controlled the open and close of each led chip, therefore can effectively utilize LED matrix as the lighting device in a kind of display unit of double-sided display type, a kind of adjustable light sources brightness and distribution of light zone or as a kind of light source module.Be noted that the arrangement mode of led chip of the present invention need not be subjected to the limitation of previous embodiment, also can be single file arrangement, (random) arrangement at random, even LED matrix can only have single led chip.

The above only is the present invention's preferred embodiment, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to the present invention's covering scope.

Claims (17)

1. light-emitting diode assembly includes:
First transparency carrier;
A plurality of light-emitting diode chip for backlight unit, in order to the light of first wavelength that produces at least a wavelength, these light-emitting diode chip for backlight unit are fixed on this first transparency carrier;
Transparent colloid encapsulates these light-emitting diode chip for backlight unit; And
Circuit is formed on this first transparency carrier, and electrically connects with these light-emitting diode chip for backlight unit, and wherein the light of these light-emitting diode chip for backlight unit generations sends to the two sides of this first transparency carrier respectively.
2. light-emitting diode assembly as claimed in claim 1, it is characterized in that, this transparent colloid includes at least a fluorescent material, this fluorescent material is subjected to the exciting of light of this first wavelength of a part and produces the light of second wavelength, and the light of remaining first wavelength mixes with the light of this second wavelength and obtains predetermined mixed-color light.
3. light-emitting diode assembly as claimed in claim 2, it is characterized in that, the light that these light-emitting diode chip for backlight unit sent is blue light, this fluorescent material comprises a kind of gold-tinted fluorescent material or a kind of red light flourescent material and a kind of green glow fluorescent material, and the be stimulated blue light that light and these light-emitting diode chip for backlight unit produced that produced and become white light of this fluorescent material.
4. light-emitting diode assembly as claimed in claim 3 is characterized in that, this first wave-length coverage is between 380 nanometer to 680 nanometers.
5. light-emitting diode assembly as claimed in claim 1 is characterized in that, also includes grafting material, and these light-emitting diode chip for backlight unit systems utilize grafting material to be fixed on this first transparency carrier, and this grafting material is eutectic metal or elargol.
6. light-emitting diode assembly as claimed in claim 1 is characterized in that, this transparent colloid includes the spherical sealing of a plurality of semicircles, and respectively the spherical sealing of this semicircle coats respectively this light-emitting diode chip for backlight unit respectively.
7. light-emitting diode assembly as claimed in claim 1 is characterized in that this transparent colloid comprises one deck adhesive layer, and this adhesive layer is covered on this first transparency carrier.
8. light-emitting diode assembly as claimed in claim 7 is characterized in that other comprises second transparency carrier, and wherein this transparent colloid is arranged between this first transparency carrier and this second transparency carrier.
9. light-emitting diode assembly as claimed in claim 8 is characterized in that other comprises clearance support, is arranged between this first transparency carrier and this second transparency carrier.
10. light-emitting diode assembly as claimed in claim 1, it is characterized in that, wherein this circuit includes a plurality of first leads and a plurality of second leads, respectively this light-emitting diode chip for backlight unit has one first electrode and one second electrode, respectively this first lead system is electrically connected to respectively this first electrode, and respectively this second lead system is electrically connected to respectively this second electrode.
11. light-emitting diode assembly as claimed in claim 10 is characterized in that other comprises control device, this control device electrically connects with these first leads and second lead respectively, in order to control the luminous of these light-emitting diode chip for backlight unit.
12. light-emitting diode assembly as claimed in claim 10, it is characterized in that, these light-emitting diode chip for backlight unit systems are arranged on one of this first transparency carrier surface with dot matrix way, these light-emitting diode chip for backlight unit that are positioned at delegation are electrically connected on these first leads in parallel, and these light-emitting diode chip for backlight unit that are positioned at same row are electrically connected on these second leads in parallel.
13. the method for packing of a light-emitting diode assembly is characterized in that, includes:
First transparency carrier is provided;
On this first transparency carrier, form circuit;
A plurality of light-emitting diode chip for backlight unit are fixed on this transparency carrier, and are electrically connected to this circuit; And
Transparent colloid is arranged on this first transparency carrier, and encapsulates these light-emitting diode chip for backlight unit.
14. the method for packing of light-emitting diode assembly as claimed in claim 13 is characterized in that, the step that forms this circuit comprises carries out at least metal evaporation processing procedure and at least exposure imaging processing procedure, to form this circuit on this transparency carrier.
15. the method for packing of light-emitting diode assembly as claimed in claim 13 is characterized in that, further comprising provides second transparency carrier, this colloid to be arranged between this first transparency carrier and this second transparency carrier, and coats these led chips.
16. the method for packing of light-emitting diode assembly as claimed in claim 15 is characterized in that, further is included on this first transparency carrier clearance support is set, in order to support this first transparency carrier and this second transparency carrier.
17. the method for packing of light-emitting diode assembly as claimed in claim 13 is characterized in that, further comprises solidifying this transparent colloid.
CN200910004212A 2009-02-11 2009-02-11 Light emitting diode device and packaging method therefore CN101800270A (en)

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WO2012031533A1 (en) * 2010-09-08 2012-03-15 浙江锐迪生光电有限公司 Led lamp bulb and led lighting bar capable of emitting light over 4π
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CN104456472B (en) * 2013-09-22 2018-07-31 雷盟光电股份有限公司 Light-emitting device and its light source module
CN104456472A (en) * 2013-09-22 2015-03-25 雷盟光电股份有限公司 Light emitting device and light source module thereof
CN105047655B (en) * 2015-08-11 2018-09-11 杭州恒星高虹光电科技股份有限公司 A kind of AC power supply full angle LED illuminator and its manufacturing method
CN105047655A (en) * 2015-08-11 2015-11-11 杭州恒星高虹光电科技股份有限公司 AC power supplied full-angle light emitting diode (LED) luminous body and fabrication method thereof
CN106159062A (en) * 2016-08-08 2016-11-23 深圳市泓亚智慧科技股份有限公司 LED filament light source, LED filament bulb lamp and preparation method thereof
CN106098679A (en) * 2016-08-08 2016-11-09 深圳市泓亚智慧科技股份有限公司 A kind of LED filament light source and preparation method thereof
CN106449944A (en) * 2016-12-02 2017-02-22 上海俪德照明科技股份有限公司 LED surface light source, LED lamp slice and LED lamp
CN106764560A (en) * 2016-12-24 2017-05-31 惠州市圣士照明有限公司 A kind of manufacture method of LED
CN106764560B (en) * 2016-12-24 2020-06-09 惠州市圣士照明有限公司 Manufacturing method of LED lamp
CN106997888A (en) * 2017-04-06 2017-08-01 圆融光电科技股份有限公司 Light emitting display device
CN106997888B (en) * 2017-04-06 2020-03-13 圆融光电科技股份有限公司 Light emitting diode display device

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Application publication date: 20100811