CN103715340A - LED packaging unit and LED packaging method and array surface light source - Google Patents
LED packaging unit and LED packaging method and array surface light source Download PDFInfo
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- CN103715340A CN103715340A CN201310694128.8A CN201310694128A CN103715340A CN 103715340 A CN103715340 A CN 103715340A CN 201310694128 A CN201310694128 A CN 201310694128A CN 103715340 A CN103715340 A CN 103715340A
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Abstract
The invention brings forward an LED packaging unit comprising an LED light-emitting body which is inversely installed and welded on a substrate, an optical thin film which is covered on the LED light-emitting body and the substrate, and a scattering component which is used for evenly scattering light emitted by the LED light-emitting body. The LED light-emitting body is inversely installed and welded on the substrate, the optical thin film is utilized to reflect and refract light emitted by the LED light-emitting body, and light emitted by the LED light-emitting body is controlled to be evenly surface-scattered by utilizing the scattering component so that point light sources formed by the LED light-emitting body are converted into a surface light source. Compared with a laterally-incident type light guide module group, components like a light guide plate, a diffusion plate, etc. are saved so that cost in utilizing the LED light-emitting body to manufacture the surface light source is effectively reduced. The invention also brings forward an array surface light source so that cost in utilizing the LED light-emitting body to manufacture the surface light source is effectively reduced. The invention further brings forward three LED packaging methods to manufacture the LED packaging unit so that cost in utilizing the LED light-emitting body to manufacture the surface light source is effectively reduced.
Description
Technical field
The present invention relates to technical field of semiconductor illumination, relate in particular to a kind of LED encapsulation unit and method for packing thereof and array surface light source.
Background technology
LED luminous element has the advantages such as life-span length, power saving, is therefore applied to more and more lighting field.
As everyone knows, LED luminous element point-source of light normally.At present LED being converted into the mode that area source mainly takes by point-source of light is to utilize light guide plate scattering principle, and light is distributed to large-area exiting surface from a plurality of small size light source luminescent faces, thereby LED luminous element forms area source.Its concrete structure comprises: adopt metal material to make framework, the LED lamp bar that is provided as incident light source along the inner side of frame side wall (wherein can all arrange LED lamp bar in the inner side of four sidewalls of framework, the inner side of two sidewalls that also can be relative on framework arranges LED lamp bar), and in framework inner side, light-emitting area this three part substantially vertical with this incident light source is set.Wherein light-emitting area is by order to reflect the light tiles of the light that LED lamp bar sends and to form in order to change and to pass to the light guide plate of the light that LED lamp bar sends and diffuser plate etc.Form the light that LED lamp bar is sent and change into the brightness side entering type leaded light module of area source comparatively uniformly.
But above-mentioned side entering type leaded light module needs the members such as light guide plate, diffuser plate, reflector are set during fabrication, and it has increased the manufacturing cost of LED luminous element being made to area source greatly.
Summary of the invention
For above-mentioned deficiency of the prior art, the object of the present invention is to provide a kind of LED encapsulation unit, it has reduced the cost that utilizes LED luminous element to manufacture area source effectively.
The object of the present invention is to provide a kind of LED method for packing, utilize the LED encapsulation unit that the method produces can effectively reduce the cost that utilizes LED luminous element to manufacture area source.
The object of the present invention is to provide a kind of array surface light source, it has reduced the cost that utilizes LED luminous element to manufacture area source effectively.
A kind of LED encapsulation unit provided by the invention, comprising:
Be arranged on the LED luminous element on substrate,
Be covered in the optical thin film on described LED luminous element and described substrate,
And for the scattering member of the even scattering of light that described LED luminous element is sent.
Optionally, between described LED luminous element and described optical thin film, be also provided with for covering the phosphor powder layer of described LED luminous element.
Optionally, described scattering member is a plurality of scattering particless that are uniformly distributed in described optical thin film, or be arranged at a plurality of blind holes at the upper surface place of described optical thin film, or be formed on described substrate for placing one or more combinations of the reflective groove of cup-shaped of described LED luminous element.
Optionally, described blind hole is shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
Optionally, the reflective groove of described cup-shaped is bent to form by described substrate.
Optionally, described LED luminous element comprises:
LED chip,
Be arranged on the lower surface of described LED chip for connecing electrical bonding pads with positive pole and the negative pole of described substrate welding,
And the reflecting piece that is arranged on the upper surface place of described LED chip.
Optionally, described substrate is a kind of in soft base plate or metal substrate or ceramic substrate;
Described soft base plate is followed successively by circuit layer, dielectric layer and the metal level being welded to connect with described LED luminous element from top to bottom.
A kind of array surface light source provided by the invention, comprises a plurality of above-mentioned LED encapsulation units, and a plurality of described LED encapsulation units become array to distribute and form a face array.
A kind of LED method for packing provided by the invention, comprising:
Manufacture substrate;
LED luminous element is arranged on described substrate;
The optical thin film that contains scattering particles is covered on described LED luminous element and described substrate and solidified.
Optionally, described, by after LED luminous element face-down bonding is on described substrate, also comprise,
The gluing that is mixed with fluorescent material is covered on described LED luminous element, and solidify to form phosphor powder layer.
Optionally, described LED luminous element face-down bonding is comprised on described substrate:
A plurality of described LED luminous elements are arranged on described substrate.
A kind of LED method for packing provided by the invention, comprising:
Manufacture substrate;
LED luminous element is arranged on described substrate;
Optical thin film is covered on described LED luminous element and described substrate, and described optical thin film solidifies and at described optical thin film, deviates from the end face of described substrate and forms blind hole.
Optionally, described, optical thin film is covered on described LED luminous element and described substrate, before described optical thin film solidifies and deviates from described optical thin film and form blind hole on the end face of described substrate, also comprises,
The gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element, and solidify to form phosphor powder layer.
Optionally, described optical thin film is covered on described LED luminous element and described substrate, described optical thin film solidifies and is deviating from described optical thin film and on the end face of described substrate, forms blind hole and be specially:
Described optical thin film is covered on described LED luminous element and described substrate;
Before described optical thin film solidifies, by mould, at described optical thin film, deviating from the end face of described substrate and forming blind hole.
Optionally, described optical thin film is covered on described LED luminous element and described substrate, described optical thin film solidifies and is deviating from described optical thin film and on the end face of described substrate, forms blind hole and be specially:
Described optical thin film is covered on described LED luminous element and described substrate;
After described optical thin film solidifies, by laser or chemical reagent, at described optical thin film, deviating from the end face of described substrate and forming blind hole.
Optionally, described LED luminous element face-down bonding is comprised on described substrate:
A plurality of described LED luminous elements are arranged on described substrate.
A kind of LED method for packing provided by the invention, comprising:
Manufacture has the substrate of the reflective groove of cup-shaped;
LED luminous element is arranged in the reflective groove of described cup-shaped;
Optical thin film is covered on described LED luminous element and described substrate and solidified.
Optionally, described, optical thin film is covered on described LED luminous element and described substrate and before solidifying, also comprises,
The gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element, and solidify to form phosphor powder layer.
Optionally, the substrate that described manufacture has the reflective groove of cup-shaped comprises:
Manufacture substrate, on described substrate, form the reflective groove of a plurality of cup-shapeds, and the reflective groove of a plurality of described cup-shapeds is arranged in array.
Compared with prior art, LED encapsulation unit provided by the invention, it is by being arranged on LED luminous element on substrate, the light that utilizes optical thin film and substrate that LED luminous element is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element is uniform surface scattering, and then the point-source of light that LED luminous element is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element to manufacture area source.
In further technical scheme, between optical thin film and LED luminous element, form phosphor powder layer, utilize phosphor powder layer that LED luminous element is covered, wrapped up, thereby the light that LED luminous element is sent convert white light output to.
In further technical scheme, scattering member is a plurality of scattering particless that are distributed in optical thin film, and the bright dipping of controlling LED luminous element by scattering particles is uniform surface scattering, thereby the point-source of light that LED luminous element is formed converts area source to.
In further technical scheme, scattering member is a plurality of blind holes that are arranged at the upper surface place of optical thin film, and the bright dipping of controlling LED luminous element by blind hole is uniform surface scattering, thereby the point-source of light that LED luminous element is formed converts area source to.
In further technical scheme, scattering member is the reflective groove of cup-shaped being formed on substrate, and LED luminous element is placed in the reflective groove of cup-shaped, the bright dipping of controlling LED luminous element by the reflective groove of cup-shaped is uniform surface scattering, thus the point-source of light that LED luminous element is formed converts area source to.Meanwhile, the light reflection that the reflective groove of cup-shaped can send LED luminous element side, to exiting surface direction, adds the efficiency that high light extracts.
In further technical scheme, the reflective groove of cup-shaped is bent to form by substrate, and it is convenient to processing and manufacturing.
Compared with prior art, a kind of array surface light source provided by the invention, it is by being arranged on LED luminous element on substrate, the light that utilizes optical thin film and substrate that LED luminous element is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element is uniform surface scattering, and then the point-source of light that LED luminous element is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element to manufacture area source.
Compared with prior art, a kind of LED method for packing provided by the invention, the LED encapsulation unit that utilizes the method to make, it passes through LED luminous element face-down bonding on substrate, the light that utilizes optical thin film and substrate that LED luminous element is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of control LED luminous element is uniform surface scattering, and then the point-source of light that LED luminous element is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
In further technical scheme, a plurality of encapsulation units can whole making, and a plurality of encapsulation units form an array surface light source, from LED encapsulation unit, directly send planar light, make Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Compared with prior art, another kind of LED method for packing provided by the invention, the LED encapsulation unit that utilizes the method to make, it passes through LED luminous element face-down bonding on substrate, the light that utilizes optical thin film and substrate that LED luminous element is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of control LED luminous element is uniform surface scattering, and then the point-source of light that LED luminous element is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
In further technical scheme, a plurality of encapsulation units can whole making, and a plurality of encapsulation units form an array surface light source, from LED encapsulation unit, directly send planar light, make Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Compared with prior art, another LED method for packing provided by the invention, the LED encapsulation unit that utilizes the method to make, it passes through LED luminous element face-down bonding on substrate, the light that utilizes optical thin film and substrate that LED luminous element is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of control LED luminous element is uniform surface scattering, and then the point-source of light that LED luminous element is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
In further technical scheme, a plurality of encapsulation units can whole making, and a plurality of encapsulation units form an array surface light source, from LED encapsulation unit, directly send planar light, make Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Above-mentioned technical characterictic can various applicable modes combine or be substituted by equivalent technical characterictic, as long as can reach object of the present invention.
Accompanying drawing explanation
Hereinafter by based on only for the embodiment of indefiniteness and with reference to accompanying drawing, the present invention being described in more detail.Wherein:
The structural representation of the LED encapsulation unit that Fig. 1 provides for the embodiment of the present invention one;
The structural representation of the array surface light source that Fig. 2 provides for the embodiment of the present invention two;
The structural representation of the LED encapsulation unit that Fig. 3 provides for the embodiment of the present invention five;
The structural representation of the array surface light source that Fig. 4 provides for the embodiment of the present invention six;
The structural representation of the LED encapsulation unit that Fig. 5 provides for the embodiment of the present invention nine;
The structural representation of the array surface light source that Fig. 6 provides for the embodiment of the present invention ten.
Accompanying drawing explanation:
1-substrate, the reflective groove of 11-cup-shaped, 12-circuit layer, 13-dielectric layer, 14-metal level;
2-LED luminous element, 21-LED chip, 22-positive pole and negative pole connect electrical bonding pads, 23-reflecting piece;
3-optical thin film, 31-scattering particles, 32-blind hole;
4-phosphor powder layer.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer; to technical scheme of the present invention be carried out to clear, complete description below; embodiment based in the present invention; those of ordinary skills are resulting all other execution modes under the prerequisite of not making creative work, all belong to the scope that the present invention protects.
Before describing embodiment, first the directivity noun occurring in the present invention is done to following restriction:
In LED encapsulation unit, as shown in Figure 1, along substrate 1, be its light direction with the vertical direction of optical thin film 3; Along light direction, towards one end of optical thin film 3, being top, is below towards one end of substrate 1.
Embodiment mono-:
As shown in Figure 1, the LED encapsulation unit providing in the present embodiment, comprising: be arranged on the LED luminous element 2 on substrate 1, be covered in the optical thin film 3 on LED luminous element 2 and substrate 1, and for the scattering member of the even scattering of light that LED luminous element 2 is sent.
It is by being arranged on LED luminous element 2 on substrate 1, the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Wherein, preferred LED luminous element 2 face-down bondings, on substrate 1, and adopt reflow soldering apparatus to weld, and further, the scolder that its welding adopts is any one or more combination in the alloys such as SAC, tin bismuth, tin copper and Xi Yin; Optical thin film 3 can adopt any one or more combination in the light transmissive materials such as silica gel, silicones, epoxy resin, modified epoxy to make.
In the present embodiment, (such as blue, green, red etc.) only with certain color of self sending due to LED luminous element 2, and LED luminous element 2 application at present more be white light.For this reason, can between LED luminous element 2 and optical thin film 3, also be provided with for covering the phosphor powder layer 4 of LED luminous element 2.Colored light LED luminous element 2 being sent by phosphor powder layer 4 sends after converting white light to again.
It should be noted that, phosphor powder layer 4 covers on LED luminous element 2, should guarantee LED luminous element 2 to cover completely, guarantees that the light that LED luminous element 2 sends all outwards sends after phosphor powder layer 4 again.Concrete, phosphor powder layer 4 should cover the whole outer surface of LED luminous element 2 (being LED luminous element 2 and the substrate 1 rear exposed surface of welding), also the substrate 1 in LED luminous element 2 certain limit around can be covered, to guarantee that phosphor powder layer 4 covers LED luminous element 2 completely simultaneously.
Wherein, phosphor powder layer 4 is to be mixed in proportion by fluorescent material, fluorescent glue, organic solvent etc.; Further, fluorescent material is that any one or more mixing in yellow fluorescent powder, red fluorescence powder, green emitting phosphor forms, specifically the LED luminous element 2 depending on choosing.
Scattering member is a plurality of scattering particless 31 that are uniformly distributed in optical thin film 3, or is arranged at a plurality of blind holes 32 at the upper surface place of optical thin film 3, or be formed on substrate 1 for placing one or more combinations of the reflective groove 11 of cup-shaped of LED luminous element 2.
Concrete, in the present embodiment, scattering member is a plurality of scattering particless 31 that are distributed in optical thin film 3.Its bright dipping of controlling LED luminous element 2 by scattering particles 31 is uniform surface scattering, thereby the point-source of light that LED luminous element 2 is formed converts area source to.
Wherein, scattering particles 31 can adopt any one or more combination in the transparent light transmissive materials such as silicon, modified silicon, titanium dioxide to make.
In the present embodiment, LED luminous element 2 comprises: LED chip 21, be arranged on the lower surface of LED chip 21 for connecing electrical bonding pads 22 with positive pole and the negative pole of substrate 1 welding, and the reflecting piece 23 that is arranged on the upper surface place of LED chip 21.
Wherein, reflecting piece 23 should adopt two sides all reflective material make, reflecting piece 23 two sides all can be realized reflective.
In the present embodiment, substrate 1 is a kind of in soft base plate, metal substrate or ceramic substrate.
Wherein, preferably adopt soft base plate, and soft base plate is followed successively by the circuit layer 12 being welded to connect with LED luminous element 2 from top to bottom, dielectric layer 13 and metal level 14.Further, on circuit layer 12, by designing requirement, etch required circuit, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.
Embodiment bis-:
As shown in Figure 2, the array surface light source providing in the present embodiment, comprises the LED encapsulation unit in a plurality of above-described embodiments one, and a plurality of LED encapsulation units become array to distribute and form a face array.
Embodiment tri-:
The LED method for packing providing in the present embodiment, comprising:
Step 101, manufacture substrate 1;
Step 102, LED luminous element 2 is arranged on described substrate 1;
Step 103, the optical thin film that contains scattering particles 31 3 is covered on described LED luminous element 2 and described substrate 1 and solidify.
The LED method for packing that the present embodiment provides, the LED encapsulation unit that utilizes the method to make, it is (preferred by LED luminous element 2 being arranged on substrate 1, LED luminous element face-down bonding is on substrate 1), the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of control LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Embodiment tetra-:
The LED method for packing providing in the present embodiment, comprising:
Step 201, manufacture substrate 1;
Step 202, LED luminous element 2 is arranged on described substrate 1;
Step 203, the gluing that is mixed with fluorescent material is covered on described LED luminous element 2, and solidify to form phosphor powder layer 4;
Step 204, scattering particles 31 is added in described optical thin film 3 and stirred;
Step 205, the optical thin film that contains scattering particles 31 3 is covered on described LED luminous element 2 and described substrate 1 and solidify.
Wherein, manufacturing substrate 1 comprises
Wherein, manufacture substrate 1 and comprise: substrate 1, by being divided into circuit layer 12, dielectric layer 13 and metal level 14 under upper, etches required circuit by designing requirement on circuit layer 12, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.
Solidifying in step 203 and step 205 can adopt temperature-curable or photocuring etc.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 201 also can be: a plurality of LED luminous elements 2 are installed on substrate 1.Concrete structure is with reference to shown in figure 2.
A plurality of encapsulation units can whole making, and a plurality of encapsulation units are formed to an array surface light source, from LED encapsulation unit, directly sends planar light, makes Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Embodiment five:
As shown in Figure 3, the LED encapsulation unit providing in the present embodiment, comprising: be arranged on the LED luminous element 2 on substrate 1, be covered in the optical thin film 3 on LED luminous element 2 and substrate 1, and for the scattering member of the even scattering of light that LED luminous element 2 is sent.
It is by being arranged on LED luminous element 2 on substrate 1, the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Wherein, preferred LED luminous element 2 face-down bondings, on substrate 1, and adopt reflow soldering apparatus to weld, and further, the scolder that its welding adopts is any one or more combination in the alloys such as SAC, tin bismuth, tin copper and Xi Yin; Optical thin film 3 can adopt any one or more combination in the light transmissive materials such as silica gel, silicones, epoxy resin, modified epoxy to make.
In the present embodiment, (such as blue, green, red etc.) only with certain color of self sending due to LED luminous element 2, and LED luminous element 2 application at present more be white light.For this reason, can between LED luminous element 2 and optical thin film 3, also be provided with for covering the phosphor powder layer 4 of LED luminous element 2.Colored light LED luminous element 2 being sent by phosphor powder layer 4 sends after converting white light to again.
It should be noted that, phosphor powder layer 4 covers on LED luminous element 2, should guarantee LED luminous element 2 to cover completely, guarantees that the light that LED luminous element 2 sends all outwards sends after phosphor powder layer 4 again.Concrete, phosphor powder layer 4 should cover the whole outer surface of LED luminous element 2 (being LED luminous element 2 and the substrate 1 rear exposed surface of welding), also the substrate 1 in LED luminous element 2 certain limit around can be covered, to guarantee that phosphor powder layer 4 covers LED luminous element 2 completely simultaneously.
Wherein, phosphor powder layer 4 is to be mixed in proportion by fluorescent material, fluorescent glue, organic solvent etc.; Further, fluorescent material is that any one or more mixing in yellow fluorescent powder, red fluorescence powder, green emitting phosphor forms, specifically the LED luminous element 2 depending on choosing.
Scattering member is a plurality of scattering particless 31 that are uniformly distributed in optical thin film 3, or is arranged at a plurality of blind holes 32 at the upper surface place of optical thin film 3, or be formed on substrate 1 for placing one or more combinations of the reflective groove 11 of cup-shaped of LED luminous element 2.
Concrete, in the present embodiment, scattering member is a plurality of blind holes 32 at the upper surface place (end face that deviates from substrate 1) that is arranged at optical thin film 3.Its bright dipping of controlling LED luminous element 2 by blind hole 32 is uniform surface scattering, thereby the point-source of light that LED luminous element 2 is formed converts area source to.Further, blind hole 32 is shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
In the present embodiment, LED luminous element 2 comprises: LED chip 21, be arranged on the lower surface of LED chip 21 for connecing electrical bonding pads 22 with positive pole and the negative pole of substrate 1 welding, and the reflecting piece 23 that is arranged on the upper surface place of LED chip 21.
Wherein, reflecting piece 23 should adopt two sides all reflective material make, reflecting piece 23 two sides all can be realized reflective.
In the present embodiment, substrate 1 is a kind of in soft base plate, metal substrate or ceramic substrate.
Wherein, preferably adopt soft base plate, and soft base plate is followed successively by the circuit layer 12 being welded to connect with LED luminous element 2 from top to bottom, dielectric layer 13 and metal level 14.Further, on circuit layer 12, by designing requirement, etch required circuit, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.
Embodiment six:
As shown in Figure 4, the array surface light source providing in the present embodiment, comprises the LED encapsulation unit in a plurality of above-described embodiments five, and a plurality of LED encapsulation units become array to distribute and form a face array.
Embodiment seven:
The LED method for packing providing in the present embodiment, comprising:
Step 301, manufacture substrate 1;
Step 302, LED luminous element 2 is arranged on described substrate 1;
Step 303, optical thin film 3 is covered on described LED luminous element 2 and described substrate 1, described optical thin film 3 solidifies and at described optical thin film 3, deviates from the end face of described substrate 1 and forms blind hole 32.
The LED method for packing that the present embodiment provides, the LED encapsulation unit that utilizes the method to make, it is by being arranged on LED luminous element 2 on substrate 1, the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Embodiment eight:
Step 401, manufacture substrate 1;
Step 402, LED luminous element 2 is arranged on described substrate 1;
Step 403, the gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element 2, and solidify to form phosphor powder layer 4;
Step 404, described optical thin film 3 is covered on described LED luminous element 2 and described substrate 1;
Step 405, before described optical thin film 3 solidifies, by mould, at described optical thin film 3, deviating from the end face of described substrate 1 and forming blind hole 32.
Wherein, step 404 and step 405 are also replaceable is:
Step 504, described optical thin film 3 is covered on described LED luminous element 2 and described substrate 1;
Step 505, after described optical thin film 3 solidifies, by laser or chemical reagent, at described optical thin film 3, deviating from the end face of described substrate 1 and forming blind hole 32.
Wherein, manufacture substrate 1 and comprise: substrate 1, by being divided into circuit layer 12, dielectric layer 13 and metal level 14 under upper, etches required circuit by designing requirement on circuit layer 12, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.
Solidifying in step 403, step 405 and step 505 can adopt temperature-curable or photocuring etc.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 401 also can be: a plurality of LED luminous elements 2 are installed on substrate 1.Concrete structure is with reference to shown in figure 4.
A plurality of encapsulation units can whole making, and a plurality of encapsulation units are formed to an array surface light source, from LED encapsulation unit, directly sends planar light, makes Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Embodiment nine:
As shown in Figure 5, the LED encapsulation unit providing in the present embodiment, comprising: be arranged on the LED luminous element 2 on substrate 1, be covered in the optical thin film 3 on LED luminous element 2 and substrate 1, and for the scattering member of the even scattering of light that LED luminous element 2 is sent.
It is by being arranged on LED luminous element 2 on substrate 1, the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Wherein, preferred LED luminous element 2 face-down bondings, on substrate 1, and adopt reflow soldering apparatus to weld, and further, the scolder that its welding adopts is any one or more combination in the alloys such as SAC, tin bismuth, tin copper and Xi Yin; Optical thin film 3 can adopt any one or more combination in the light transmissive materials such as silica gel, silicones, epoxy resin, modified epoxy to make.
In the present embodiment, (such as blue, green, red etc.) only with certain color of self sending due to LED luminous element 2, and LED luminous element 2 application at present more be white light.For this reason, can between LED luminous element 2 and optical thin film 3, also be provided with for covering the phosphor powder layer 4 of LED luminous element 2.Colored light LED luminous element 2 being sent by phosphor powder layer 4 sends after converting white light to again.
It should be noted that, phosphor powder layer 4 covers on LED luminous element 2, should guarantee LED luminous element 2 to cover completely, guarantees that the light that LED luminous element 2 sends all outwards sends after phosphor powder layer 4 again.Concrete, phosphor powder layer 4 should cover the whole outer surface of LED luminous element 2 (being LED luminous element 2 and the substrate 1 rear exposed surface of welding), also the substrate 1 in LED luminous element 2 certain limit around can be covered, to guarantee that phosphor powder layer 4 covers LED luminous element 2 completely simultaneously.
Wherein, phosphor powder layer 4 is to be mixed in proportion by fluorescent material, fluorescent glue, organic solvent etc.; Further, fluorescent material is that any one or more mixing in yellow fluorescent powder, red fluorescence powder, green emitting phosphor forms, specifically the LED luminous element 2 depending on choosing.
Scattering member is a plurality of scattering particless 31 that are uniformly distributed in optical thin film 3, or is arranged at a plurality of blind holes 32 at the upper surface place of optical thin film 3, or be formed on substrate 1 for placing one or more combinations of the reflective groove 11 of cup-shaped of LED luminous element 2.
Concrete, in the present embodiment, scattering member is the reflective groove 11 of cup-shaped being formed on substrate 1, and LED luminous element 2 is placed in the reflective groove 11 of cup-shaped.Its bright dipping of controlling LED luminous element 2 by the reflective groove 11 of cup-shaped is uniform surface scattering, thereby the point-source of light that LED luminous element 2 is formed converts area source to.Further preferred, for the ease of manufacturing, the reflective groove 11 of cup-shaped is bent to form by substrate 1.
In the present embodiment, LED luminous element 2 comprises: LED chip 21, be arranged on the lower surface of LED chip 21 for connecing electrical bonding pads 22 with positive pole and the negative pole of substrate 1 welding, and the reflecting piece 23 that is arranged on the upper surface place of LED chip 21.
Wherein, reflecting piece 23 should adopt two sides all reflective material make, reflecting piece 23 two sides all can be realized reflective.
In the present embodiment, substrate 1 is a kind of in soft base plate, metal substrate or ceramic substrate.
Wherein, preferably adopt soft base plate, and soft base plate is followed successively by the circuit layer 12 being welded to connect with LED luminous element 2 from top to bottom, dielectric layer 13 and metal level 14.Further, on circuit layer 12, by designing requirement, etch required circuit, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.
Embodiment ten:
As shown in Figure 5, the array surface light source providing in the present embodiment, comprises the LED encapsulation unit in a plurality of above-described embodiments nine, and a plurality of LED encapsulation units become array to distribute and form a face array.
Embodiment eight:
The LED method for packing providing in the present embodiment, comprising:
Step 601, manufacture have the substrate 1 of the reflective groove 11 of cup-shaped;
Step 602, LED luminous element 2 is arranged in the reflective groove 11 of described cup-shaped;
Step 603, optical thin film 3 is covered on described LED luminous element 2 and described substrate 1 and solidify.
The LED method for packing that the present embodiment provides, the LED encapsulation unit that utilizes the method to make, it passes through LED luminous element 2 face-down bondings on substrate 1, the light that utilizes optical thin film 3 and substrate 1 that LED luminous element 2 is sent reflects, the light that simultaneously utilizes scattering member to send LED luminous element reflects, thereby the bright dipping of controlling LED luminous element 2 is uniform surface scattering, and then the point-source of light that LED luminous element 2 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED luminous element 2 to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Embodiment nine:
Step 701, manufacture have the substrate 1 of the reflective groove 11 of cup-shaped;
Step 702, LED luminous element 2 is arranged in the reflective groove 11 of described cup-shaped;
Step 703, the gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element 2, and solidify to form phosphor powder layer 4;
Step 704, optical thin film 3 is covered on described LED luminous element 2 and described substrate 1 and solidify.
Wherein, manufacture substrate 1 and comprise: substrate 1, by being divided into circuit layer 12, dielectric layer 13 and metal level 14 under upper, etches required circuit by designing requirement on circuit layer 12, but any one or two kinds of combinations in its circuit connecting mode serial or parallel connection.Then on substrate 1, bending or punching press form the reflective groove 11 of cup-shaped.
Solidifying in step 703 and step 704 can adopt temperature-curable or photocuring etc.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 701 also can be: manufacture substrate 1, and on substrate 1, form the reflective groove 11 of a plurality of cup-shapeds.
A plurality of encapsulation units can whole making, and a plurality of encapsulation units are formed to an array surface light source, from LED encapsulation unit, directly sends planar light, makes Design of Luminaires liberalization, the variation of LED light source outside; And be convenient to batch production, further reduced manufacturing cost.
Need to further illustrate, by LED luminous element 2 face-down bondings, when the reflective groove 11 of cup-shaped is interior, LED luminous element 2 is identical and corresponding one by one with the quantity of the reflective groove 11 of cup-shaped, and the corresponding reflective groove 11 of cup-shaped of each LED luminous element 2 arranges.Concrete structure is with reference to shown in figure 6.
Finally it should be noted that: above execution mode and embodiment only, in order to technical scheme of the present invention to be described, are not intended to limit; Although the present invention is had been described in detail with reference to aforementioned embodiments and embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned embodiments or embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence disengaging embodiment of the present invention of appropriate technical solution or the spirit and scope of embodiment technical scheme.
Claims (19)
1. a LED encapsulation unit, comprising:
Be arranged on the LED luminous element on substrate,
Be covered in the optical thin film on described LED luminous element and described substrate,
And for the scattering member of the even scattering of light that described LED luminous element is sent.
2. LED encapsulation unit according to claim 1, is characterized in that, between described LED luminous element and described optical thin film, is also provided with for covering the phosphor powder layer of described LED luminous element.
3. LED encapsulation unit according to claim 1 and 2, it is characterized in that, described scattering member is a plurality of scattering particless that are uniformly distributed in described optical thin film, or be arranged at a plurality of blind holes at the upper surface place of described optical thin film, or be formed on described substrate for placing one or more combinations of the reflective groove of cup-shaped of described LED luminous element.
4. LED encapsulation unit according to claim 3, is characterized in that, described blind hole be shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
5. LED encapsulation unit according to claim 3, is characterized in that, the reflective groove of described cup-shaped is bent to form by described substrate.
6. according to the LED encapsulation unit described in any one in claim 1 to 5, it is characterized in that, described LED luminous element comprises:
LED chip,
Be arranged on the lower surface of described LED chip for connecing electrical bonding pads with positive pole and the negative pole of described substrate welding,
And the reflecting piece that is arranged on the upper surface place of described LED chip.
7. according to the LED encapsulation unit described in any one in claim 1 to 6, it is characterized in that, described substrate is a kind of in soft base plate or metal substrate or ceramic substrate;
Described soft base plate is followed successively by circuit layer, dielectric layer and the metal level being welded to connect with described LED luminous element from top to bottom.
8. an array surface light source, comprises the LED encapsulation unit described in any one in a plurality of the claims 1 to 7, and a plurality of described LED encapsulation units become array to distribute and form a face array.
9. a LED method for packing, comprising:
Manufacture substrate;
LED luminous element is arranged on described substrate;
The optical thin film that contains scattering particles is covered on described LED luminous element and described substrate and solidified.
10. LED method for packing according to claim 9, is characterized in that, described LED luminous element is arranged on described substrate after, also comprise,
The gluing that is mixed with fluorescent material is covered on described LED luminous element, and solidify to form phosphor powder layer.
11. according to the LED method for packing described in claim 9 or 10, it is characterized in that, described LED luminous element is arranged on described substrate and is comprised:
A plurality of described LED luminous elements are arranged on described substrate.
12. 1 kinds of LED method for packing, comprising:
Manufacture substrate;
LED luminous element is arranged on described substrate;
Optical thin film is covered on described LED luminous element and described substrate, and described optical thin film solidifies and at described optical thin film, deviates from the end face of described substrate and forms blind hole.
13. LED method for packing according to claim 12, it is characterized in that, described, optical thin film is covered on described LED luminous element and described substrate, before described optical thin film solidifies and deviates from described optical thin film and form blind hole on the end face of described substrate, also comprise
The gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element, and solidify to form phosphor powder layer.
14. LED method for packing according to claim 12, it is characterized in that, described optical thin film is covered on described LED luminous element and described substrate, described optical thin film solidifies and is deviating from described optical thin film and on the end face of described substrate, forms blind hole and be specially:
Described optical thin film is covered on described LED luminous element and described substrate;
Before described optical thin film solidifies, by mould, at described optical thin film, deviating from the end face of described substrate and forming blind hole.
15. LED method for packing according to claim 12, it is characterized in that, described optical thin film is covered on described LED luminous element and described substrate, described optical thin film solidifies and is deviating from described optical thin film and on the end face of described substrate, forms blind hole and be specially:
Described optical thin film is covered on described LED luminous element and described substrate;
After described optical thin film solidifies, by laser or chemical reagent, at described optical thin film, deviating from the end face of described substrate and forming blind hole.
16. according to the LED method for packing described in any one in claim 12 to 15, it is characterized in that, described LED luminous element face-down bonding is comprised on described substrate:
A plurality of described LED luminous elements are arranged on described substrate.
17. 1 kinds of LED method for packing, comprising:
Manufacture has the substrate of the reflective groove of cup-shaped;
LED luminous element is arranged in the reflective groove of described cup-shaped;
Optical thin film is covered on described LED luminous element and described substrate and solidified.
18. LED method for packing according to claim 17, is characterized in that, described, optical thin film are covered on described LED luminous element and described substrate and before solidifying, also comprise,
The gluing that is mixed with fluorescent material is coated with and is covered on described LED luminous element, and solidify to form phosphor powder layer.
19. according to the LED method for packing described in claim 17 or 18, it is characterized in that, the substrate that described manufacture has the reflective groove of cup-shaped comprises:
Manufacture substrate, on described substrate, form the reflective groove of a plurality of cup-shapeds, and the reflective groove of a plurality of described cup-shapeds is arranged in array.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410022A (en) * | 2015-07-31 | 2017-02-15 | 佛山市国星光电股份有限公司 | Manufacturing method of LED packaging device and the LED packaging device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101943376A (en) * | 2009-07-03 | 2011-01-12 | 福建中科万邦光电股份有限公司 | LED packaging structure for eliminating glare |
| TW201242107A (en) * | 2011-04-06 | 2012-10-16 | Lustrous Green Technology Of Lighting | LED package structure for increasing light uniforming effect |
| CN103296188A (en) * | 2013-05-27 | 2013-09-11 | 北京半导体照明科技促进中心 | LED package structure and production method thereof |
| CN103367565A (en) * | 2012-04-06 | 2013-10-23 | 展晶科技(深圳)有限公司 | Light-Emitting Diode (LED) packaging method |
-
2013
- 2013-12-16 CN CN201310694128.8A patent/CN103715340A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101943376A (en) * | 2009-07-03 | 2011-01-12 | 福建中科万邦光电股份有限公司 | LED packaging structure for eliminating glare |
| TW201242107A (en) * | 2011-04-06 | 2012-10-16 | Lustrous Green Technology Of Lighting | LED package structure for increasing light uniforming effect |
| CN103367565A (en) * | 2012-04-06 | 2013-10-23 | 展晶科技(深圳)有限公司 | Light-Emitting Diode (LED) packaging method |
| CN103296188A (en) * | 2013-05-27 | 2013-09-11 | 北京半导体照明科技促进中心 | LED package structure and production method thereof |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN106410022B (en) * | 2015-07-31 | 2019-01-01 | 佛山市国星光电股份有限公司 | A kind of manufacturing method and LED packaging of LED packaging |
| CN106410022A (en) * | 2015-07-31 | 2017-02-15 | 佛山市国星光电股份有限公司 | Manufacturing method of LED packaging device and the LED packaging device |
| CN109155346B (en) * | 2016-03-11 | 2020-06-16 | 罗茵尼公司 | Method for applying phosphor to light emitting diode and apparatus therefor |
| CN109155346A (en) * | 2016-03-11 | 2019-01-04 | 罗茵尼公司 | For phosphor to be applied to the method and its equipment of light emitting diode |
| CN107564422A (en) * | 2016-06-30 | 2018-01-09 | 群创光电股份有限公司 | Light emitting display device |
| CN107564422B (en) * | 2016-06-30 | 2020-02-07 | 群创光电股份有限公司 | Light emitting diode display device |
| CN106449942A (en) * | 2016-11-28 | 2017-02-22 | 贵州万泰弘发科技股份有限公司 | LED flip wafer ceramic substrate module and preparation method thereof |
| CN109904301A (en) * | 2017-12-11 | 2019-06-18 | 深圳市聚飞光电股份有限公司 | Wafer-level package multifaceted light-emitting LED and its packaging method, backlight module |
| CN109950379A (en) * | 2017-12-20 | 2019-06-28 | 深圳市聚飞光电股份有限公司 | Wafer-level package LED of multifaceted light-emitting and preparation method thereof, backlight module |
| CN109950379B (en) * | 2017-12-20 | 2021-04-06 | 芜湖聚飞光电科技有限公司 | Multi-surface light-emitting chip-scale packaged LED, manufacturing method thereof and backlight module |
| CN110085731A (en) * | 2018-01-25 | 2019-08-02 | 致伸科技股份有限公司 | Light source module |
| WO2019144545A1 (en) * | 2018-01-29 | 2019-08-01 | 深圳市绎立锐光科技开发有限公司 | Wavelength conversion device, light-emitting assembly, and illumination device |
| WO2020025055A1 (en) * | 2018-08-03 | 2020-02-06 | 海迪科（南通）光电科技有限公司 | Led light source, surface light source display module, and preparation method for led light source |
| US11605764B2 (en) | 2018-08-03 | 2023-03-14 | Dura-Chip (Nantong) Limited | LED light source, surface light source display module, and preparation method for LED light source |
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