CN101126485A - Light source module possessing LED and its forming method - Google Patents
Light source module possessing LED and its forming method Download PDFInfo
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- CN101126485A CN101126485A CNA2006101155467A CN200610115546A CN101126485A CN 101126485 A CN101126485 A CN 101126485A CN A2006101155467 A CNA2006101155467 A CN A2006101155467A CN 200610115546 A CN200610115546 A CN 200610115546A CN 101126485 A CN101126485 A CN 101126485A
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- metal substrate
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Abstract
The invention discloses a light source module with an LED (light-emitting diode) and the formation method, wherein the LED core is directly arranged on a metal substrate to form the light source unit. A plurality of light-emitting diodes are arranged in each sealed light source unit and an optical lens is arranged on each LED. Then, the light source units are assembled into a light source module which can effectively radiate the heat.
Description
Technical field
The present invention relates to a kind of light source module, particularly, have light emitting diode (LightEmitting Diode, the encapsulation of light source module LED) and an assembling about a kind of.
Background technology
The packaged type of traditional LED light-source module is to be made into light-emitting diode 100 earlier, as shown in Figure 1.Subsequently, be assembled to again on the circuit board 292,, make the striation (Light Bar) 200 of strip, as shown in Figure 2 as printed circuit board (PCB) (Printed CircuitBoard).With reference to the vertical view of the backlight module 300 of figure 3, these striations 292 can be arranged slivering row shape, and form backlight module 300.
According to different product demand dimensionally, must prepare the different striation of all lengths.Therefore be assembled into the mode of different length striation after the encapsulation again, cost is higher, and does not often utilize optical lens to control light ray energy effectively, so that the light emitting diode quantity of using increases thereupon, and then influences product competitiveness.
Therefore, be different from the production method of traditional LED optical strip, be necessary to provide a kind of method and structure that directly LED core is packaged on the metal substrate, wherein each light source cell encapsulates several light emitting diodes, and on each light emitting diode, assemble again and go up optical lens, and these light source cells are assembled into the light source module that can dispel the heat effectively, as application such as backlight module or light fixtures.
Summary of the invention
An aspect of of the present present invention is to provide a kind of light source module of tool light emitting diode, and it comprises: a plurality of light source cells, and wherein each light source cell has at least one optical lens; And module substrate, the lower surface of this module substrate has the circuit conducting shell, and this module substrate has a plurality of openings (opening), and each opening is for the optical lens that holds this light source cell; Wherein each light source cell is electrically connected to the circuit conducting shell, and wherein each light source cell also comprises: metal substrate; A plurality of light emitting diodes directly are packaged in the upper surface of metal substrate; Insulating barrier is positioned on the metal substrate and does not contact with a plurality of light emitting diodes; A plurality of conductive layers lay respectively on the insulating barrier, for the anode and the negative terminal that connect each light emitting diode; And bearing bed, be positioned on a plurality of conductive layers, for carrier module substrate and optical lens.
The present invention is to provide a kind of formation to have the method for the light source module of light emitting diode on the other hand, comprises following steps: (a) form a plurality of light source cells, wherein the formation of each light source cell comprises following steps: metal substrate (i) is provided; (ii) form insulating barrier on metal substrate, this insulating barrier has the zone of a plurality of these metal substrates of exposure; (iii) on insulating barrier, form bearing bed; (iv) on the metal substrate zone that exposes, encapsulate a plurality of light emitting diodes; (v) on each light emitting diode, be coated with phosphor powder; (a plurality of optical lenses vi) are provided, and each optical lens is assembled and be positioned on the bearing bed; And (b) provide module substrate, have a plurality of openings, for each optical lens of each light source cell that exposes a plurality of light source cells.
Another aspect of the invention is to provide a kind of method that forms the light source module of light emitting diode, comprises following steps: (a) form a plurality of light source cells, wherein the formation of each light source cell comprises following steps: metal substrate (i) is provided; (ii) form insulating barrier on metal substrate, this insulating barrier has the zone of a plurality of these metal substrates of exposure; (iii) on insulating barrier, form bearing bed; (iv) on the metal substrate zone that exposes, encapsulate a plurality of light emitting diodes; (a plurality of optical lenses v) are provided, and each optical lens is assembled on the bearing bed; And (b) provide a module substrate, have a plurality of openings, for each optical lens of each light source cell that exposes a plurality of light source cells.
Description of drawings
Fig. 1 is the profile of a light emitting diode;
Fig. 2 is the profile of the striation assembled by light emitting diode;
Fig. 3 for by striation assemble by the vertical view of optical module;
Fig. 4 is the profile of the light source module with light emitting diode of a foundation specific embodiment of the present invention;
Fig. 5 is the vertical view according to the light source cell of a specific embodiment of the present invention;
Fig. 6 is the profile according to the light source cell of a specific embodiment of the present invention;
Fig. 7-1 is another assembling mode according to the light source module of a specific embodiment of the present invention;
Fig. 7-2 is the profile according to the light source cell of a specific embodiment of the present invention;
Fig. 8 is the arrangement mode according to the of the present invention one concrete light source cell of implementing;
Fig. 9 is the arrangement mode according to the light source cell of a specific embodiment of the present invention;
Figure 10-1 is the molding mode according to the optical lens of a specific embodiment of the present invention;
Figure 10-2 is the molding mode according to the optical lens of a specific embodiment of the present invention;
Figure 11 is the molding mode according to the optical lens of a specific embodiment of the present invention;
Figure 12 is the molding mode according to the optical lens of a specific embodiment of the present invention;
Figure 13 is the storing mode according to the optical lens of a specific embodiment of the present invention;
Figure 14 is the storing mode according to the optical lens of a specific embodiment of the present invention;
Figure 15 is the storing mode according to the optical lens of a specific embodiment of the present invention;
Figure 16 is the storing mode according to the optical lens of a specific embodiment of the present invention;
Figure 17 is the outward appearance according to the optical lens that exemplifies of a specific embodiment of the present invention.
Description of reference numerals
100 light emitting diodes
200 striations
292 circuit boards
300 backlight modules
400,700 light source modules
402,404,406,702,704,706 light source cells
402a, 402b, 402c light emitting diode
403,405,407 openings
408,708 module substrates
418,419,718,719 conductive layers
420 separation layers
422,722 bearing beds
424,425,426,724 optical lenses
460,760 circuit conducting shells
470,770 reflection layers
480 heat conduction layers
802a, 802d, 902a, 902d green light LED
802b, the 902b red light-emitting diode
802c, the 902c blue light-emitting diode
1000,1100,1200 light source cells
1002b, 1102b, 1202b light emitting diode
1023 juts
1052,1152 macromolecule glue materials
1124,1224 optical lenses
1300,1400,1500,1600 light source cells
1322,1422,1522,1622 bearing beds
1324,1424,1524,1624 optical lenses
1518,1519,1618,1619 conductive layers
1520,1620 insulating barriers
1550,1650 metal substrates
1690 inlets
1692 outlets
1400,1500 light source cells
1724,1725 optical lenses
1730,1731,1732,1733 shading materials
The specific embodiment
The present invention discloses light source module of a kind of tool light emitting diode and forming method thereof.In order to make narration of the present invention more detailed and complete, can be with reference to the accompanying drawing of following description and cooperation Fig. 4 to Figure 17.
With reference to the profile of figure 4, in one embodiment, the invention provides a kind of light source module 400 with light emitting diode.As shown in the figure, light source module 400 comprises three light source cells 402,404 and 406, and module substrate 408, has a plurality of openings 403,405 and 407 on the module substrate 408, takes in light source cell 402,404 and 406 respectively.The specific embodiment of light source cell 402,404 and 406 structure is shown in Fig. 5 and Fig. 6.With light source cell 402 is example, and Fig. 5 is the vertical view of light source cell 402.Light source cell 402 comprises a plurality of light emitting diodes, then be illustrated as three light emitting diode 402a, 402b and 402c in this, wherein light emitting diode 402a, 402b and 402c directly are encapsulated on the metal substrate 450 in the mode of flip-chip (Flip Chip on Board) on chip on board (Chip on Board) or the plate, and metal substrate 450 can be copper base, aluminium base or other metal substrate.And light emitting diode 402a, 402b and 402c anode and negative terminal difference routing are to conductive layer 418 and 419.Has insulating barrier 420 between metal substrate 450 and conductive layer 418 and 419, conductive layer 418 and 419 is electrically separated with metal substrate 450, and also contain bearing bed 422 on conductive layer 418 and 419, for carrier module substrate and/or optical lens, but the focus passed on of fuzzy graph 5 for the sake of simplicity and not, Fig. 5 does not draw module substrate and optical lens.In addition, Fig. 6 is the profile of the described light source cell 402 of Fig. 5 along aa ' line, can be about the narration of each component symbol of Fig. 6 with reference to the narration of figure 5, similarly, and the focus of fuzzy graph 6 for the sake of simplicity and not, Fig. 6 does not draw module substrate and optical lens.
Get back to Fig. 4, light source cell 404 and 406 can have identical configuration with above-mentioned light source cell 402, and for having the light source cell of light emitting diode, and the opening 403 on the module substrate 408 can hold at least one optical lens 424 of light source cell 402.In the same manner, opening 405 and 407 can hold at least one optical lens 425 and 426 of light source cell 404 and 406 respectively.Be that example further explains with light source cell 402 now, light source cell 402 comprises: a plurality of light emitting diodes, and still the profile in this is representative with light emitting diode 402b; Conductive layer 418 and 419; Insulating barrier 420; Metal substrate 450; And bearing bed 422.The anode of light emitting diode 402b and negative terminal are electrically connected to the circuit conducting shell 460 of the lower surface that is positioned at module substrate 408 via conductive layer 418 and 419.In specific embodiment, conductive layer 418 and 419 passes through bearing bed 422 and is connected with circuit conducting shell 460.Connected mode can be pin (pin) binding, connector (connector) binding, scolding tin (solder) links or BGA (ball grid array, BGA) binding.In this embodiment, the upper surface of module substrate 408 also can comprise reflection layer 470, and it can be metallic film or optical coating, for the usefulness of mixed light or concentrated light.And light source module 400 also can comprise heat conduction layer 480, with loss light source cell 402,404 more effectively and 406 heat that produce.In addition, light source cell 404 and 406 and the binding of module substrate 408 and can utilize above-mentioned and light source cell 402 same way as, light source cell 404 and 406 internal structures also can not repeat them here with above-mentioned identical with light source cell 402.
Except the mode of the described assembling light source module of Fig. 4, the another kind of mode that light source cell is assembled into light source module 700 of Fig. 7-1 explanation.Light source module 700 comprises three light source cells 702,704 and 706, and module substrate 708.Similarly, be example with light source cell 702, light source cell 702 comprises optical lens 724, bearing bed 722, conductive layer 718 and 719, and metal substrate 750.Conductive layer 718 and 719 passes through metal substrate 750 and is connected with module substrate 708, promptly is connected with circuit conducting shell (on the figure show) on the module substrate 708, and connected mode can be above-mentioned can be pin, connector, scolding tin or BGA binding.It should be noted that, for simplicity, Fig. 7 does not depict circuit conducting shell and separation layer, but those skilled in the art all can understand, the circuit conducting shell is positioned at the upper surface of module substrate 708, and separation layer is positioned at outside conductive layer 718 and 719, and conductive layer 718 and 719 is electrically separated with metal substrate 750.In addition, optionally also comprise reflection layer 770 on the bearing bed 722 of Fig. 7, it can be metallic film or optical coating, for the usefulness of mixed light or concentrated light.Note that at this according to the difference of design requirement, reflection layer 770 also can be formed on the appropriate location of module substrate 708, to improve optical application.
Though the conductive layer 418 and 419 of Fig. 4 passes through bearing bed 422 and is connected to circuit conducting shell 460, and passing through metal substrate 750, the conductive layer 718 and 719 of Fig. 7-1 is connected to circuit conducting shell on the module substrate 708, but in the embodiment that Fig. 7-2 is painted, conductive layer 718 in the light source cell 702 of Fig. 7-1 and 719 can be designed to walk around light source cell 702 sides, makes this structure also can be applicable to the configuration of the described light source module 400 of Fig. 4.In like manner, the light source cell of Fig. 4, the light source cell 402 of Fig. 6 for example, conductive layer 418 and 419 also can be designed to walk around light source cell 402 sides, makes this structure also can be applicable to the configuration of the described light source module 700 of Fig. 7.
Light source cell 702 can be packaged into the arrangement as Fig. 5 packaged light source unit 402 among Fig. 7-1, and it presents straight line.Yet in other specific embodiments, the described light source cell 402 of Fig. 4 and Fig. 7 and 702 also can encapsulate four light emitting diodes, as the arrangement of four light emitting diode 802a, 802b, 802c and 802d that Fig. 8 painted.And with reference to figure 9, in specific embodiment, four light emitting diode 902a, 902b, 902c and 902d of encapsulation more can be arranged in situation as shown in Figure 9.The light emitting diode of wherein above-mentioned Fig. 8 and Fig. 9 can be various different wave lengths, the scope light emitting diode from 420nm to 680nm, for example light emitting diode 802a, 802d and 902a, 902d can be green glow (G) light emitting diode, 802b and 902b can be ruddiness (R) light emitting diode, 802c and 902c can be blue light (B) light emitting diode, red, green, blue (RGB) but mixed light becomes white light.Except RGB, those skilled in the art the present invention as can be known also can utilize Huang, purplish red, ultramarine (YMC) mixed light to become white light.Though it should be noted that the light emitting diode of Fig. 8 and Fig. 9 is green red bluish-green arrangement, putting in order that other are possible all may be implemented among the present invention.And in other specific embodiment, the present invention also can encapsulate the light emitting diode of two, three, five, seven or its multiple in light source cell.
After the solid brilliant routing of light emitting diode, in one embodiment, shown in Figure 10-1, light source cell 1000 can directly pour into 1052 moulding of macromolecule glue material, and can select to decline the lens of giving out light on light source cell 1000.In this embodiment, shown in Figure 10-2, before perfusion macromolecule glue material 1052, also can on the bearing bed 1022 of light source cell 1000, form jut 1023 earlier, so help the perfusion of macromolecule glue material 1052 around light emitting diode 1002b; In one embodiment, as shown in figure 11, light source cell 1100 can pour into macromolecule glue material 1152 earlier, puts optical lens 1124 again; In other a specific embodiment, as shown in figure 12, can on light source cell 1200, directly put optical lens 1224.In addition, light source cell 1000,1100 that Figure 10 to Figure 12 painted and 1200 thin portion structure, promptly conductive layer, bearing bed, metal substrate, insulating barrier etc. have been described in detail at Fig. 4 to Fig. 6, repeat no more in this.
The storing mode of optical lens can be with reference to figures 13 to the description of drawings of Figure 16 among Figure 11 and Figure 12.Light source cell 1300,1400,1500 and 1600 has bearing bed 1322,1422,1522 and 1622 respectively among Figure 13 to Figure 16, for bearing optical lens 1324,1424,1524 and 1624.Except Figure 15 and Figure 16 also indicate represent insulating barrier 1520 and 1620, represent conductive layer 1518 and 1519 and 1618 and 1619, represent metal substrate 1550 and 1650, omit the extra sign of Figure 13 to Figure 16, to simplify explanation.Wherein, Figure 13 is according to a specific embodiment of the present invention, utilizes the mode of directly adhesion that optical lens 1324 is fixed on the bearing bed 1322 of light source cell 1300.Figure 14 is according to a specific embodiment of the present invention, optical lens 1424 is sticked on the bearing bed 1422 of light source cell 1400.Figure 15 is according to a specific embodiment of the present invention, the bearing bed 1522, conductive layer 1518 and 1589, insulating barrier 1520 and the metal substrate 1550 that optical lens 1524 are run through light source cell 1500, and engage with the lower surface of metal substrate 1550, to be fixed on the bearing bed 1522.Figure 16 explanation is according to a specific embodiment of the present invention, utilize the described mode of Figure 13 to Figure 15 or other methods known to those skilled in the art hollow optical lens 1624 to be fixed on the bearing bed 1622 of light source cell 1600 earlier, see through again and run through the inlet 1690 of bearing bed 1622, conductive layer 1618 and 1619, insulating barrier 1620 and metal substrate 1650 and export 1692, colloidal materials 1690 is poured into from entering the mouth.Along with pouring into of colloidal materials, the gas in the optical lens 1624 will be taken advantage of a situation and be discharged by outlet 1692, and hollow optical lens 1624 is filled.Above-mentioned mode just is placed in optical lens some examples that exemplify of light source cell, and those skilled in the art the invention is not restricted to only can use these modes as can be known.
Further with reference to Figure 17, above-mentioned optical lens can be the optical lens of different profiles, for example 1724 or 1725, and on optical lens 1724 or 1725 suitable positions, more can come shield lights in the mode of stickup, coating or plated film one material 1730,1731,1732 and 1733, wherein this material can absorb or reflection ray, in order to control light type or veiling glare effectively.Wherein omitting extra sign once more makes accompanying drawing more clear.
In addition, after solid brilliant routing and before putting optical lens, also can on light emitting diode, be coated with phosphor powder.In this specific embodiment, all light emitting diode in the light source cell can be the blue light-emitting diode of wavelength 420nm to 470nm, and the light that blue light-emitting diode penetrates can be transformed into white light through phosphor powder.
The present invention is to provide a kind of formation to have the method for the light source module of light emitting diode on the other hand, comprise following steps: (a) form a plurality of light source cells, wherein the formation of each light source cell comprises following steps: metal substrate (i) is provided, and this metal substrate can be the metal substrate of copper base, aluminium base or other high thermal conductivity coefficients; (ii) form insulating barrier on metal substrate, this insulating barrier has a plurality of zones, to expose this metal substrate; (iii) on insulating barrier, form bearing bed; The (iv) light emitting diode of two, three, five, seven of encapsulation or its multiple on the metal substrate zone that exposes, packaged type can be flip-chip mode on chip on board or the plate; (v) on each light emitting diode, be coated with phosphor powder; (a plurality of optical lenses vi) are provided, and each optical lens is assembled and be positioned on the bearing bed, and assembling mode is described with lens shape Figure 10 to Figure 13 and Figure 16 as above; And (b) provide module substrate, have a plurality of openings, for each optical lens of each light source cell that exposes a plurality of light source cells.And wherein packed light emitting diode is a blue light-emitting diode.In step (b) afterwards, also can comprise provides heat conduction layer, and the lower surface contact of metal substrate is with more effectively heat radiation.
Another aspect of the invention is to provide a kind of method that forms the light source module of light emitting diode, comprise following steps: (a) form a plurality of light source cells, wherein the formation of each light source cell comprises following steps: metal substrate (i) is provided, and this metal substrate can be the metal substrate of copper base, aluminium base or other high thermal conductivity coefficients; (ii) form insulating barrier on metal substrate, this insulating barrier has the zone of a plurality of these metal substrates of exposure; (iii) on insulating barrier, form bearing bed; The (iv) light emitting diode of two, three, five, seven of encapsulation or its multiple on the metal substrate zone that exposes, packaged type can be flip-chip mode on chip on board or the plate; (a plurality of optical lenses v) are provided, and each optical lens is assembled on the bearing bed, and assembling mode is described with lens shape Figure 10 to Figure 13 and Figure 16 as above; And (b) provide module substrate, have a plurality of openings, for each optical lens of each light source cell that exposes a plurality of light source cells.And wherein packed light emitting diode is the different light emitting diode of wavelength, can be the combination of above-mentioned RGB or YMC.In step (b) afterwards, also can comprise provides heat conduction layer, and the lower surface contact of metal substrate is with more effectively heat radiation.
To sum up state, light source cell of the present invention can be according to area size, shape and the brightness of required light source module, and present different arrangements, is applicable in the various application, on for example light-emitting devices such as backlight module, traffic signal light or light fixture are used.
The above is the preferred embodiments of the present invention only, is not in order to limit scope of the present invention; All other do not break away from being equal to of being finished under the disclosed spirit of the present invention and changes or modify, and all should be included in the scope of following claim.
Claims (23)
1. light source module with light emitting diode comprises:
A plurality of light source cells, wherein each light source cell has at least one optical lens; And
Module substrate, the lower surface of this module substrate has the circuit conducting shell, and this module substrate has a plurality of openings, and each opening is for the optical lens that holds this light source cell;
Wherein this each light source cell is electrically connected to this circuit conducting shell, and wherein this each light source cell also comprises:
Metal substrate;
A plurality of light emitting diodes directly are packaged in the upper surface of this metal substrate;
Insulating barrier is positioned on this metal substrate and does not contact with these a plurality of light emitting diodes;
A plurality of conductive layers lay respectively on this insulating barrier, for the anode and the negative terminal that connect each light emitting diode; And
Bearing bed is positioned on these a plurality of conductive layers, for this module substrate of carrying and this optical lens.
2. light source module as claimed in claim 1, wherein this metal substrate is aluminium base or copper base, and wherein with flip-chip mode on chip on board or the plate will these a plurality of LED package in the upper surface of this metal substrate.
3. light source module as claimed in claim 1, wherein each light emitting diode is a blue light-emitting diode, and applied phosphor powder on this each light emitting diode wherein.
4. light source module as claimed in claim 1, wherein these a plurality of light emitting diodes are the different red, green, blue of wavelength, or yellow, purplish red, ultramarine light emitting diode, or above-mentioned combination.
5. light source module as claimed in claim 4, wherein the upper surface of this module substrate has reflection layer, is used to mix the emitted light of the different light emitting diode of this wavelength.
6. light source module as claimed in claim 1 also comprises:
Heat conduction layer contacts with the lower surface of the metal substrate of this each light emitting diode.
7. light source module as claimed in claim 1, wherein this each optical lens is gone up in position, more comes shield lights in the mode of stickup, coating or plated film one material, and this material can absorb or reflection ray.
8. light source module as claimed in claim 1, wherein this conductive layer of this light source cell passes through this bearing bed, or passes through this metal substrate and along the side of this light source cell, to be connected to this circuit conducting shell.
9. light source module as claimed in claim 1, wherein this light source module is used in the application of backlight module or light fixture, and these a plurality of openings present different arrangements according to required area size, shape and brightness.
10. light source module as claimed in claim 1, wherein this optical lens utilizes following one mode wherein to be fixed on this bearing bed:
(a) directly adhesion;
(b) be sticked on this bearing bed; Or
(c) this optical lens is partly run through this bearing bed, this insulating barrier and this metal substrate, and engage with the lower surface of this metal substrate.
11. light source module as claimed in claim 10, wherein this optical lens is hollow optical lens, and this light source module also comprises an inlet and an outlet that runs through this bearing bed, this insulating barrier and this metal substrate, for pouring into colloidal materials this hollow optical lens is filled up.
12. a formation has the method for the light source module of light emitting diode, comprises following steps:
(a) form a plurality of light source cells, wherein the formation of each light source cell comprises following steps:
(i) provide metal substrate;
(ii) form insulating barrier on this metal substrate, this insulating barrier has the zone of a plurality of these metal substrates of exposure;
(iii) on this insulating barrier, form bearing bed;
(iv) on the metal substrate zone of this exposure, encapsulate a plurality of light emitting diodes;
(a plurality of optical lenses v) are provided, and each optical lens is assembled and be positioned on this bearing bed; And
(b) provide module substrate, have a plurality of openings, for each optical lens of each light source cell that exposes these a plurality of light source cells.
13. method as claimed in claim 12, wherein this metal substrate is aluminium base or copper base, and wherein this step (iv) utilizes the mode of flip-chip on the mode of chip on board or the plate to encapsulate the light emitting diode of two, three, five, seven or its multiple on this metal substrate.
14. method as claimed in claim 12, wherein (step utilization v):
Direct Nian Zhe mode;
Be sticked in the mode of this bearing bed; Or
Make this optical lens of part run through this bearing bed, this insulating barrier and this metal substrate, and the mode that engages with the lower surface of this metal substrate;
This optical lens is fixed on this bearing bed.
15. method as claimed in claim 14, wherein this optical lens is a hollow optical lens, and utilizes inlet and the outlet that runs through this bearing bed, this insulating barrier and this metal substrate, pours into colloidal materials, makes this hollow optical lens be filled.
16. method as claimed in claim 12, wherein in (after the step v), also comprise:
(vi) on the suitable position of this each optical lens, utilize the mode of stickup, coating or plated film to come shield lights, this material can absorb or reflection ray;
17. method as claimed in claim 12 wherein after (b) step, also comprises:
(c) provide a heat conduction layer, contact with the lower surface of the metal substrate of these a plurality of light emitting diodes.
18. method as claimed in claim 12, wherein each light emitting diode is a blue light-emitting diode, and applied phosphor powder on this each light emitting diode wherein.
19. method as claimed in claim 12, wherein these a plurality of light emitting diodes are the different red, green, blue of wavelength, or yellow, purplish red, ultramarine light emitting diode, or above-mentioned combination.
20. method as claimed in claim 19, wherein the upper surface of this module substrate has reflection layer, is used to mix the emitted light of the different light emitting diode of this wavelength.
21. the light source module of a tool light emitting diode comprises:
A plurality of light source cells, wherein each light source cell has at least one optical lens; And
Module substrate, the upper surface of this module substrate has the circuit conducting shell;
Wherein this each light source cell is electrically connected to this circuit conducting shell, and wherein this each light source cell also comprises:
Metal substrate;
A plurality of light emitting diodes directly are packaged in the upper surface of this metal substrate;
Insulating barrier is positioned on this metal substrate and does not contact with these a plurality of light emitting diodes;
A plurality of conductive layers lay respectively on this insulating barrier, for the anode and the negative terminal that connect each light emitting diode; And
Bearing bed is positioned on these a plurality of conductive layers, for this module substrate of carrying and this optical lens.
22. light source module as claimed in claim 21, wherein this optical lens utilizes following one mode wherein to be fixed on this bearing bed:
(a) directly adhesion;
(b) be sticked on this bearing bed; Or
(c) this optical lens is partly run through this bearing bed, this insulating barrier and this metal substrate, and engage with the lower surface of this metal substrate.
23. light source module as claimed in claim 22, wherein this optical lens is hollow optical lens, and this light source module also comprises inlet and the outlet that runs through this bearing bed, this insulating barrier and this metal substrate, for pouring into colloidal materials this hollow optical lens is filled up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101155467A CN101126485A (en) | 2006-08-18 | 2006-08-18 | Light source module possessing LED and its forming method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101155467A CN101126485A (en) | 2006-08-18 | 2006-08-18 | Light source module possessing LED and its forming method |
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| CN101126485A true CN101126485A (en) | 2008-02-20 |
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| CN102494259A (en) * | 2011-12-01 | 2012-06-13 | 深圳市华星光电技术有限公司 | Light-emitting diode (LED) lamp strip and backlight module for liquid crystal display device |
| CN103574317A (en) * | 2012-07-20 | 2014-02-12 | 欧司朗股份有限公司 | Light-emitting module and lighting device with same |
| CN103574317B (en) * | 2012-07-20 | 2017-06-30 | 欧司朗股份有限公司 | Light emitting module and the lighting device including the light emitting module |
| CN103775963A (en) * | 2014-02-10 | 2014-05-07 | 上海向隆电子科技有限公司 | Reflective type lamp cup structure and back light module |
| WO2017054245A1 (en) * | 2015-10-02 | 2017-04-06 | 魏晓敏 | Led light emitting module and led light emitting device |
| CN107390428A (en) * | 2017-07-24 | 2017-11-24 | 武汉华星光电技术有限公司 | Down straight aphototropism mode set and liquid crystal display |
| US10514574B2 (en) | 2017-07-24 | 2019-12-24 | Wuhan China Star Optoelectronics Technology Co., Ltd | Direct type backlight module and liquid crystal display |
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