CN104037302B - LED (light-emitting diode) package assembly - Google Patents
LED (light-emitting diode) package assembly Download PDFInfo
- Publication number
- CN104037302B CN104037302B CN201410223672.9A CN201410223672A CN104037302B CN 104037302 B CN104037302 B CN 104037302B CN 201410223672 A CN201410223672 A CN 201410223672A CN 104037302 B CN104037302 B CN 104037302B
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- Prior art keywords
- led
- layer
- led package
- chip
- package assemblings
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- Expired - Fee Related
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- 239000010410 layer Substances 0.000 claims abstract description 49
- 239000011241 protective layer Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 241001025261 Neoraja caerulea Species 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000009738 saturating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 239000004033 plastic Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED (light-emitting diode) package assembly which comprises a flexible substrate, a reflection layer, an LED chip and a protective layer, wherein the flexible substrate is formed with a circuit layer, the reflection layer is arranged on a first side of the flexible substrate, the LED chip is arranged on the flexible substrate, an electrode of the LED chip passes through the reflection layer to be electrically connected with the circuit layer, and the protective layer is arranged on a second side of the flexible substrate. The LED package assembly according to the invention is provided with the flexible substrate, the application range of the LED package assembly is expanded, moreover, the substrate of the LED package assembly has a simple structure, so that formed heat resistance is low, and the LED package assembly is simple to fabricate and is low in production cost.
Description
Technical field
The present invention relates to light emitting diode (LED), and in particular to a kind of LED package assemblings, especially a kind of white light LEDs are sealed
Arrangement.
Background technology
LED can expeditiously convert electrical energy into luminous energy, and with low-power consumption and longer service life etc.
Feature.Therefore, LED may be applied not only in display device, in being also applied to lighting.In recent years, LED is as a kind of
New light source and be widely applied in various lighting fields.
At present, for traditional LED packagings, usually LED chip is cooperatively used with mounting bracket,
Then they are fixed on together on aluminum base plate.Afterwards, aluminum base plate again with it is heat sink carry out it is thermally coupled.However, this preparation
Method can produce the higher shortcoming of thermal resistance.In order to reduce thermal resistance, the encapsulating structure of another main flow be by LED chip directly and
Substrate is coordinated, afterwards again with it is heat sink carry out it is thermally coupled.In this case, LED chip can be placed into located at substrate surface
Groove in, be then attached by solder, such as tin cream etc..Tin cream can be formed as concordant with substrate surface, it is also possible to
Be formed as protruding from the arc surface of substrate surface.
Patent document CN202487662U discloses a kind of LED encapsulation structure, and it includes base plate for packaging, located at the encapsulation base
LED chip on plate, and the packaging plastic being covered on base plate for packaging and LED chip.Wherein, LED chip and packaging plastic it
Between be additionally provided with a hemispheric lens.Here, base plate for packaging is usually hard substrate, for example with metal or ceramic substrate.
Patent document CN202474038U discloses a kind of LED support type encapsulating structure, and it includes lead frame and LED core
Piece.Encapsulating housing and lower encapsulating housing are respectively arranged with the upper and lower both sides of lead frame.LED chip is arranged at encapsulating shell
In vivo, and the pin of LED chip is connected on lead frame.Be additionally provided with upper encapsulating housing be covered in it is upper in LED chip
Packaging plastic, and lower packaging plastic is provided with lower encapsulating housing.For this LED component, it needs in use
It is welded on substrate and uses.Therefore, the complex process of the method, product percent of pass is relatively low.
From the aforegoing it can be seen that existing LED encapsulation is usually that LED chip or LED component are coordinated into aluminium base, ceramic substrate
It is used together Deng hard substrate, the encapsulating structure of gained is complex.In addition, from LED chip to having sandwich construction heat sink,
Cause the presence of larger thermal resistance.In addition, being adapted to coordinate gluing process scheme, its work using blue chip traditional encapsulating structure more
Skill is loaded down with trivial details, and product percent of pass is relatively low.
Therefore, want in the art be solved for LED encapsulation structure, especially White-light LED package structure
State problem.
The content of the invention
For above-mentioned technical problem, the present invention is intended to provide a kind of LED package assemblings, it can be effectively reduced and produce into
This.In addition, the present invention would also be desirable to provide a kind of LED package assemblings, wherein the substrate in the LED package assemblings is flexible, and
And the simple structure of substrate so that the thermal resistance for being formed is relatively low.
According to the present invention, there is provided a kind of LED package assemblings, including：Flexible base board, is formed with line layer；Arrange
Reflector layer on the first side of the flexible base board；LED chip on the flexible base board, the LED core
The electrode of piece is electrically connected through the reflector layer with the line layer；The protection being arranged on the second side of the flexible base board
Layer.
LED package assemblings of the invention can especially send the LED package assemblings of white light.However, this area
Technical staff is appreciated that after well known necessary modification has been carried out LED package assemblings of the invention can also send
The light of other colors.
In one embodiment, the LED chip is White-light LED chip.In this case, the protective layer can be
Polymer material layer, the in particular polymer composite layer containing titanium oxide.Especially, the LED chip is white light LEDs upside-down mounting
Chip, and its top surface and side surrounded by hemispherical lens.
In another embodiment, the LED chip is blue-ray LED flip-chip.Now, in the week of the LED chip
Enclosing can be provided with phosphor powder layer or by hemispherical lens made by the material for being mixed with fluorescent material.
Preferably, the fluorescent material is one or more in yellow fluorescent powder, red fluorescence powder and green emitting phosphor
Mixture.
In another embodiment, the LED chip is the positive cartridge chip of blue-ray LED, and it passes through wire bonding with the line
Road floor electrical connection.
According to the present invention, the protective layer is metal level, is preferably made up of copper, aluminium, gold, silver.Especially, the protective layer
Thickness be equal to or more than the line layer thickness.
In one embodiment, insulating barrier is additionally provided between the flexible base board and protective layer, the insulating barrier is preferred
Made with PI, PET or epoxy resin.
In one embodiment, the LED package assemblings also include be arranged on the protective layer away from the flexible base
The adhesive layer of the side of plate, it is used to be attached with heat sink.
LED package assemblings of the invention have flexible substrate, expand its range of application.In addition, the LED encapsulation
The substrate of component has simple structure so that the thermal resistance for being formed is relatively low.Additionally, the preparation of the LED package assemblings is simple, it is raw
Produce low cost.
Description of the drawings
Below with reference to accompanying drawing, the present invention will be described.Easy to understand, accompanying drawing is merely for more fully understand this
Bright and provide, it is not construed as limitation of the present invention.
Fig. 1 shows the LED package assemblings of first embodiment of the invention.
Fig. 2 shows the LED package assemblings of first embodiment of the invention.
Fig. 3 shows the LED package assemblings of first embodiment of the invention.
In the accompanying drawings, identical reference shows same or similar part.Accompanying drawing is not drawn to scale.
Specific embodiment
Below by taking the LED package assemblings that can send white light as an example and the present invention will be described in conjunction with the accompanying.
Fig. 1 shows the white-light LED encapsulation component of first embodiment of the invention.As shown in figure 1, the white light LEDs
Package assembling 10 includes flexible base board 11, formed therein which line layer 14.Flexible base board 11 and line layer therein 14 can
Made with common used material known in the art and conventional process.
Reflector layer 15 is coated with the first side of flexible base board 11, first side is shown as in FIG upside.At one
In embodiment, reflector layer 15 can be white oil layer.LED chip 16 is also equipped with the first side of flexible base board 11.In the reality
In applying example, LED chip 16 is white light LEDs flip-chip.Preferably, the white light LEDs flip-chip is by the institute of lens 18 of dome-type
Surround.It will be understood, however, that the embodiment equally includes the situation without lens 18, this completely by those skilled in the art according to
The needs of concrete application are determining.LED chip 16 (only show for clarity one including an appropriate number of electrode portion 17 in figure
It is individual), it passes through the through hole being opened in reflector layer 15 and is connected with the line layer 14 in flexible base board 11.Hereby it is achieved that LED
Electrical connection between chip 16 and flexible base board 11/signal connection.
Insulating barrier 12 is provided with the second relative side of flexible base board 11, second side is shown as in FIG downside.
The insulating barrier 12 for example can be made up of polyimides (PI), PET (PET) or epoxy resin.In insulation
Matcoveredn 13 is set on the side (i.e. downside in Fig. 1) away from flexible base board 11 of layer 12.In this embodiment, protective layer
13 are made up of macromolecular material.Preferably, protective layer 13 is made up of the polymer composite containing titanium oxide.
According to the present invention, protective layer 13 is connected by tack coat (not shown) with heat sink (not shown).Tack coat is for example
Can be made up of heat-conducting silicone grease or heat-conducting glue.Therefore, from LED chip 16 to only simple several layer materials heat sink so that institute
The thermal resistance of formation is relatively small.This is because for identical material, the thermal resistance of substrate is directly proportional to the number of plies of material.Cause
This in LED chip 16 to small number of material layer is provided only between heat sink, causes formed thermal resistance phase according to the present invention
To less.Further, since flexible base board 11 has been used in the white-light LED encapsulation component 10, therefore its encapsulating structure is relatively simple,
Reduce production cost, it is also possible to adapt to various different purposes.Further, since directly used White-light LED chip, can in order to avoid
Go the series of LED such as bonding wire, dispensing, baking to encapsulate flow process, shorten the LED technological process of productions, further improving product yields.
Further, since White-light LED chip has been sorted, so the step of can removing sorting from subsequent operation.It is above-mentioned to lead
The simplification of manufacturing process is caused.
The LED package assemblings 10 can be prepared by following methods.First, flexible base board 11 is prepared, line is formed with
Road floor 14, and insulating barrier 12, protective layer 13 and reflector layer 15 are set on flexible base board 11.Then, by White-light LED chip 16
It is placed on flexible base board 11 so that the electrode portion 17 of White-light LED chip 16 is connected with line layer 14.If desired, may be used
To arrange lens 18 around LED chip 16.Curing schedule is carried out afterwards so that White-light LED chip 16 and flexible base board 11
It is fixedly connected.After this, photochromic detection is carried out to whole LED/light source.Finally, protective layer 13 free side (away from insulation
The side of layer 12) coating tack coat, it is connected with heat sink by the tack coat.
Can see from above, LED package assemblings of the invention can be prepared with simple processing step, and its is very big
Reduce production cost.
Although in this embodiment LED chip 16 selects to be white light LEDs flip-chip, it being understood, however, that LED chip 16
It can also be blue-ray LED flip-chip.Now, in order to export white light, lens 18 should be by the transparent material for being mixed with fluorescent material
Make.In certain embodiments, fluorescent material can be the one kind or many in yellow fluorescent powder, red fluorescence powder and green emitting phosphor
The mixture planted.Thus, under the collective effect of blue-ray LED flip-chip and the lens of the fluorescent material containing particular color, should
LED package assemblings 10 can send white light.
Fig. 2 shows white-light LED encapsulation component according to the second embodiment of the present invention.As shown in Fig. 2 the white light LEDs
Package assembling 20 is roughly the same with the white-light LED encapsulation component 10 shown in Fig. 1.Therefore, it is that difference is, LED therein
Chip is blue-ray LED flip-chip 26, and phosphor powder layer 28 is provided with its top surface and side.Similarly, phosphor powder layer 28
Can be formed by the mixture of one or more in yellow fluorescent powder, red fluorescence powder and green emitting phosphor.Thus, in blue light
Under the collective effect of the lens of the phosphor powder layer 28 of LED flip chip and particular color, the LED package assemblings 20 can send white
Light.
Additionally, in this embodiment, protective layer 23 is made up of metal material.Preferably, protective layer 23 is by aluminium, copper, gold, silver
Make Deng material.Preferably, protective layer 23 is configured with and has with flexible base board 11, line layer especially formed therein
Identical thickness.However, protective layer 23 can also be configured with than flexible base board 11, line layer especially formed therein
Bigger thickness.Therefore, protective layer 23 can be designed with different thickness according to different purposes, mechanical strong to meet
The requirement of degree and heat dispersion.In addition, the material of protective layer 23 can be designed according to radiating requirements and welding demand, carry
Very high design freedom is supplied.
In addition, in this embodiment, insulating barrier 22 is not necessary, but can also be omitted.
It is easy to understand, in this embodiment, phosphor powder layer 28 can also by such as first embodiment in it is glimmering by being mixed with
Lens made by the transparent material of light powder are substituted.
In a unshowned example, the LED chip in second embodiment can also be White-light LED chip.Now, may be used
To dispense phosphor powder layer 28.
The LED package assemblings 20 can be prepared by following methods.First, flexible base board 21 is prepared, line is formed with
Road floor, and insulating barrier 22, protective layer 23 and reflector layer are set on flexible base board 21.Then, blue-light LED chip 26 is placed
On flexible base board 21 so that the electrode portion of blue-light LED chip 26 is connected with line layer.Curing schedule is carried out afterwards so that white
Light LED chip 26 is fixedly connected with flexible base board 21.It is then possible to phosphor powder layer 28 be coated around LED chip 26 or is set
Put lens 28.As a example by arrange lens 28, solidified again after this, the parameter that its temperature is solidified by silica gel is arranging.
Afterwards, photochromic detection is carried out to whole LED/light source.Finally, the free side (away from side of insulating barrier 22) in protective layer 23 is applied
Tack coat is covered, is connected with heat sink by the tack coat.
Fig. 3 shows white-light LED encapsulation component according to the third embodiment of the invention.As shown in figure 3, the white light LEDs
Package assembling 30 is roughly the same with the white-light LED encapsulation component 10 shown in Fig. 1.Difference is that LED chip therein is indigo plant
The positive cartridge chips 36 of light LED.The positive cartridge chip 36 of the blue-ray LED is wrapped by lens made by the transparent material for being mixed with fluorescent material 38
Enclose.Additionally, the positive cartridge chip 36 of the blue-ray LED is connected by wire bonding with the line layer of flexible base board.Wire bonding is this
Known to the technical staff in field, therefore its detailed description is omitted here.
The preparation method of above-mentioned white-light LED encapsulation component 30 is approximately similar to the white-light LED encapsulation group in first embodiment
The preparation method of part 10.Difference is after the positive cartridge chip 36 of blue-ray LED is installed on flexible base board, also to enter
The operation of line lead bonding.
In a unshowned example, the LED chip in 3rd embodiment can also be White-light LED chip.Now may be used
To dispense lens 38, or lens 38 are made not include phosphor material powder.
Although being described in detail to the present invention above in association with white-light LED encapsulation component, however, it is readily understood that this
Invention can be applied equally to send the LED package assemblings of the light of other colors.Now only need to by those skilled in the art
Some conversion known to member, you can send the light of other colors, the gold-tinted of such as colour temperature 3000k.
The present invention has been described in detail above in association with accompanying drawing and by specific embodiment.However, it is readily understood that
These explanations can not be considered as limiting the scope of the present invention.Protection scope of the present invention is limited by appended claims
Fixed, any change on the basis of the claims in the present invention is belonged in protection scope of the present invention.
Claims (10)
1. a kind of LED package assemblings, including：
Flexible base board, is formed with line layer；
Reflector layer on the first side of the flexible base board is set；
LED chip on the flexible base board, the electrode of the LED chip through the reflector layer with the circuit
Layer electrical connection；And
The protective layer being arranged on the second side of the flexible base board.
2. LED package assemblings according to claim 1, it is characterised in that the protective layer is polymer material layer, described
Polymer material layer is the polymer composite layer containing titanium oxide.
3. LED package assemblings according to claim 1 and 2, it is characterised in that the LED chip is flip-chip, and
Its top surface and side are surrounded by hemispherical lens.
4. LED package assemblings according to claim 1, it is characterised in that the LED chip is blue-ray LED flip-chip,
And phosphor powder layer or saturating by hemispherical made by the material for being mixed with fluorescent material is provided with around the LED chip
Mirror.
5. LED package assemblings according to claim 4, it is characterised in that the fluorescent material is yellow fluorescent powder, red glimmering
The mixture of one or more in light powder and green emitting phosphor.
6. LED package assemblings according to claim 1, it is characterised in that the LED chip is the positive cartridge chip of blue-ray LED,
It passes through wire bonding and electrically connects with the line layer, and the LED package assemblings are white-light LED encapsulation component.
7. LED package assemblings according to any one of claim 1,4 to 6, it is characterised in that the protective layer is metal
Layer, the metal level is copper, aluminium, gold or silver.
8. LED package assemblings according to claim 7, it is characterised in that the thickness of the protective layer is equal to or more than institute
State the thickness of line layer.
9. LED package assemblings according to claim 1, it is characterised in that between the flexible base board and protective layer also
Insulating barrier is provided with, the insulating barrier is made with PI, PET or epoxy resin.
10. LED package assemblings according to claim 1, it is characterised in that the LED package assemblings also include being arranged on
The adhesive layer of the side away from the flexible base board of the protective layer, it is used to be attached with heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223672.9A CN104037302B (en) | 2014-05-23 | 2014-05-23 | LED (light-emitting diode) package assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410223672.9A CN104037302B (en) | 2014-05-23 | 2014-05-23 | LED (light-emitting diode) package assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104037302A CN104037302A (en) | 2014-09-10 |
| CN104037302B true CN104037302B (en) | 2017-04-26 |
Family
ID=51467999
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410223672.9A Expired - Fee Related CN104037302B (en) | 2014-05-23 | 2014-05-23 | LED (light-emitting diode) package assembly |
Country Status (1)
| Country | Link |
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| CN (1) | CN104037302B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017163058A (en) * | 2016-03-10 | 2017-09-14 | パナソニックＩｐマネジメント株式会社 | LED module |
| JP6817599B2 (en) * | 2016-03-10 | 2021-01-20 | パナソニックＩｐマネジメント株式会社 | LED module |
| CN109087986A (en) * | 2018-08-30 | 2018-12-25 | 佛山市国星半导体技术有限公司 | A kind of flexible LED device and preparation method thereof, LED filament |
| CN111029452B (en) * | 2019-12-10 | 2022-04-19 | 宁波安芯美半导体有限公司 | Ultraviolet light emitting diode packaging structure and packaging method thereof, and ultraviolet lamp |
| CN112201739B (en) | 2020-10-30 | 2022-02-15 | 上海中航光电子有限公司 | Light-emitting structure, backlight module, display module and display device |
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| CN202647291U (en) * | 2012-05-21 | 2013-01-02 | 王定锋 | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line |
| CN103151444A (en) * | 2013-02-27 | 2013-06-12 | 上舜照明（中国）有限公司 | Base plate group for flexible LED (Light Emitting Diode) light source and manufacturing method thereof |
| CN103236489A (en) * | 2013-04-18 | 2013-08-07 | 浙江深度照明有限公司 | LED (light emitting diode) packaging structure |
| CN203367362U (en) * | 2013-06-03 | 2013-12-25 | 福建泉州世光照明科技有限公司 | LED light source module with high luminous efficiency and based on gold thread binding |
| CN103700758A (en) * | 2013-12-16 | 2014-04-02 | 常州市武进区半导体照明应用技术研究院 | LED (Light-emitting Diode) package unit, package methods thereof, and array area light source |
| CN103715340A (en) * | 2013-12-16 | 2014-04-09 | 常州市武进区半导体照明应用技术研究院 | LED packaging unit and LED packaging method and array surface light source |
| CN203941950U (en) * | 2014-05-23 | 2014-11-12 | 常州市武进区半导体照明应用技术研究院 | A kind of LED package assembling |
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