CN202647291U - LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line - Google Patents
LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line Download PDFInfo
- Publication number
- CN202647291U CN202647291U CN 201220250512 CN201220250512U CN202647291U CN 202647291 U CN202647291 U CN 202647291U CN 201220250512 CN201220250512 CN 201220250512 CN 201220250512 U CN201220250512 U CN 201220250512U CN 202647291 U CN202647291 U CN 202647291U
- Authority
- CN
- China
- Prior art keywords
- led module
- led
- conducting resinl
- insulating carrier
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims description 40
- 238000004891 communication Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 238000003490 calendering Methods 0.000 claims description 2
- 239000006210 lotion Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to an LED (Light-Emitting Diode) module for directly and reversely arranging a reversely-arranged LED chip on a mixed line, comprising an insulating carrier, a metal lead wire, conductive glue and the reversely-arranged LED chip, wherein the metal lead wire is arranged on the insulating carrier and the metal lead wire forms one part of a conductive circuit in the mixed line; the conductive glue which is separated from each other is combined on the insulating carrier and a conductive glue circuit in the mixed line is formed by the conductive glue; and the reversely-arranged LED chip is directly reversely arranged and packaged on the mixed line and is selectively conducted and communicated with the mixed line. The LED module disclosed by the utility model is not etched and the LED chip is mounted by utilizing a chip reverse arranging method; light of a light-emitting layer is not shielded by an electrode and an electrode lead wire when being emitted so that the light-emitting efficiency of the LED module is improved; the LED is not adhered and welded by using an SMT (Surface Mounting Technology) so that the flow of a manufacturing process is shortened, materials are saved, the manufacturing time is shortened and the production efficiency is greatly improved; and the production cost is reduced, the pollution to the environment, which is caused by etching in a traditional manufacturing process, is reduced, so that the LED module is very environment-friendly.
Description
Technical field
The utility model belongs to the LED application, is specifically related to the LED module of the direct upside-down mounting of flip chip type led chip on joint line.
Background technology
Traditional circuit board all is to etch circuit with copper-clad plate usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former cost is high and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities, and after finishing the making of wiring board, also will weld LED and components and parts thereof in the circuit board by the surface-pasted mode of SMT.This traditional fabrication method not only production process is quite loaded down with trivial details, and Production Time is long, but also environment is caused severe contamination.
Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable LED module.
Summary of the invention
In view of the above, the utility model provides that a kind of its manufacture craft is cheap simply again directly with the LED module of flip-chip on joint line, alternative existing loaded down with trivial details traditional manufacturing technique.Can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient are high, and very environmental protection.
Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition, term " circuit " and " circuit " can use interchangeably in the application.
The utility model relates to directly the LED module of led chip upside-down mounting on joint line, particularly, according to a preferred embodiment, plain conductor can be arranged in parallel and be bonded on the insulating carrier, form the part of conducting wire, then but printing conductive glue forms another part conducting wire at insulating carrier, needs according to line design, make conducting resinl need the position of conducting to be communicated with plain conductor is bonding at it, then the led chip dress of flip chip structure can be pasted and be connected on the conducting resinl circuit of joint line, sealing is solidified, and the led chip electrode is engaged with the conducting resinl circuit be communicated with, and makes directly the LED module of flip-chip on joint line.
This kind directly compared the LED module of flip-chip on joint line with traditional manufacture craft, just can make circuit without etching, adopt simultaneously the flip-chip installation method that led chip is installed, the light of luminescent layer can not be subject to covering of electrode and lead-in wire when penetrating the outside, improved the luminous efficiency of LED, increased the current density of chip, LED and other components and parts also mount welding without SMT, whole manufacturing process flow shortens, save material and shortened Production Time, greatly improved production efficiency; Reduced production cost, also reduced traditional mode of production and made etching pollution on the environment in the circuit process, thereby very environmental protection.
More specifically, according to the utility model, provide a kind of directly with the LED module of flip chip type led chip upside-down mounting on joint line, having comprised: insulating carrier; Be arranged in the plain conductor on the described insulating carrier, described plain conductor forms a part of conducting channel in the described joint line; Be combined in the conducting resinl that is spaced apart from each other on the described insulating carrier, described conducting resinl forms the conducting resinl circuit in the described joint line; Directly flip-chip packaged on described joint line and with the described joint line flip chip type led chip of conductive communication optionally.
According to an embodiment of the present utility model, described plain conductor is the one or more of plain conductors that are arranged side by side, and it is upper and form conductive communication that some in the described conducting resinl optionally directly are bonded in described many strip metals wire one or some.
According to an embodiment of the present utility model, described insulating carrier is the insulating carrier of being made by non-metal insulating material; Or the insulating carrier that is integrated by metal base and insulating barrier, wherein, the described joint line of described LED module is supported on the described insulating barrier.
According to an embodiment of the present utility model, described insulating carrier is rigidity or soft insulating carrier.
According to an embodiment of the present utility model, described conducting resinl is to have electric conductivity and the conductive rubber that can solidify, conduction lotion or conduction slurry.
According to an embodiment of the present utility model, described flip chip type led chip is connected conducting with described conducting resinl with described plain conductor.
According to an embodiment of the present utility model, wherein a conducting resinl link tester is crossed described flip chip type led chip and another conducting resinl connection conducting.
According to an embodiment of the present utility model, described flip chip type led chip directly flip-chip packaged on the described conducting resinl circuit that described conducting resinl forms and with described conducting resinl circuit conductive communication optionally.
According to an embodiment of the present utility model, described plain conductor is the circle line; Or stranded conductor; Or the flat conductor that adopts circle line or stranded conductor calendering to make; Or divide the flat conductor that cuts into metal forming, metallic plate, metal tape.
According to an embodiment of the present utility model, described LED module also comprises the reflective membrane that is arranged in described insulating carrier one side.
According to an embodiment of the present utility model, described flip chip type led chip is the high-power LED chip of flip chip type.
According to an embodiment of the present utility model, conducting resinl is cold curing conducting resinl intermediate temperature setting conducting resinl, hot setting conducting resinl, UV-Curing Electric Conductive Adhesives.
According to an embodiment of the present utility model, described upside-down mounting is the encapsulation of the led chip of flip chip structure.
According to an embodiment of the present utility model, described wire line plate is soft wiring board or the wiring board of rigidity.
According to an embodiment of the present utility model, described LED module can be used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED panel light, LED sign module or LED Christmas lamp.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram according to the flat conductor of the utility model one embodiment.
Fig. 2 is the schematic diagram according to the juxtaposition groove mould of the utility model one embodiment.
Fig. 3 is the schematic cross-section of juxtaposition groove mould shown in Figure 2.
Fig. 4 is the juxtaposition wiring schematic diagram according to the flat conductor of the utility model one embodiment.
Fig. 5 is the floor map according to the insulating carrier of the utility model one embodiment.
Fig. 6 is plain conductor shown in Figure 3 is arranged in parallel and is bonded in the floor map that forms a part of conducting channel of LED module on the insulating carrier shown in Figure 5 according to the utility model one embodiment.
Fig. 7 is according to an embodiment of the present utility model, and on structure shown in Figure 6, printing conductive glue forms the floor map of another part conducting channel at insulating carrier shown in Figure 6.
Fig. 8 is for being connected to according to an embodiment of the present utility model led chip of flip chip structure dress is pasted on the conducting resinl circuit shown in Figure 7 and other components and parts also being arranged in schematic diagram on the conducting resinl circuit.
Fig. 9 is to the schematic diagram after the structure sealing shown in Figure 8.
Figure 10 is the schematic diagram after pasting one deck reflective membrane at the conducting resinl circuit of the LED module of making shown in Figure 9.
Figure 11 is the generalized section of the LED module of making shown in Figure 10.
The specific embodiment
The below will be described in more detail direct specific embodiment with the LED module of flip-chip on joint line of the present utility model.
But, it will be appreciated by those skilled in the art that these embodiments have only enumerated some preferred embodiments of the present utility model, to the utility model and protection domain thereof without any restriction.For example, as the layout of the flat conductor of a conducting wire part be not limited to shown in the accompanying drawing and specific embodiment described, as the conducting wire in addition the layout of the conducting resinl of a part the position and mode also is not limited to shown in the accompanying drawing and specific embodiment is described, etc.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.
1, the making of wire:
Take Copper Foil itemize cutting to make, or roll copper cash with calender, obtain the flat conductor 2 (as shown in Figure 1) of required width and thickness, this flat conductor 2 will be as the part of the joint line of LED module.According to the needs of application scenario, this flat conductor 2 can be single wire 2, can be Alignment also, be preferably the many wires 2 that are arranged in parallel.
2. the making of juxtaposition groove mould:
Adopt the method for etching or machining with minute surface stainless steel plate, process the juxtaposition groove 6 consistent with line width, and being provided with vacuum-pumping tube 7 (as shown in Figure 2), the degree of depth of groove 6 is preferably than the thickness of flat conductor 2 more shallow (as shown in Figure 3).
3. plain conductor 2 is arranged in parallel and is bonded on the insulating carrier
Will be with the polyimides coverlay of the insulation of epoxy adhesive (namely, a kind of preferred insulating carrier) is furnished with (many on 1 (as shown in Figure 5) and the wiring mould, for example two) one side (as shown in Figure 4) of flat conductor 2 aims at overlapping hot pressing 5-10 second, make this juxtaposition flat conductor 2 bonding being transferred on the insulation coverlay 1, separate and take mould away, flat conductor circuit 2 has shifted and has been fixed on the insulation coverlay 1 at this moment, thereby forms the part (as shown in Figure 6) of the hybrid conductive circuit of LED module.
Certainly, although above-mentioned insulating carrier is the polyimides coverlay, persons of ordinary skill in the art may appreciate that being applicable to insulating carrier of the present utility model also can be the insulating carrier of being made by other non-metal insulating material; Or the insulating carrier that is integrated by rigid metal base material and insulating barrier, wherein, the hybrid conductive circuit of LED module will be supported on the insulation carrier layer one side of such insulating carrier.
4, printing conductive glue
According to the needs of line design, conducting resinl 3 is printed on the insulating carrier 1, conducting resinl needs the position of conducting to be communicated with plain conductor is bonding at it, forms another part conducting wire (as shown in Figure 7) of the hybrid conductive circuit of LED module.Certainly, those of ordinary skill in the art obviously is appreciated that, be not that all conducting resinls 3 all need directly and plain conductor 2 conductive communication, for example, needs according to circuit design and application, some conducting resinl 3 can pass through electronic devices and components (for example led chip, resistance etc.) and indirectly with plain conductor 2 conductive communication, as hereinafter describing in detail.
5, led chip and other components and parts that bond are installed in upside-down mounting
As shown in Figure 8, adopt the flip-chip installation methods that led chips 4 are installed and make electrode and 3 combinations of conducting resinl circuit of led chip 4 at conducting resinl circuit 3, and/or the corresponding position that other electronic devices and components 5 are positioned over conducting resinl circuit 3 and metallic conduction circuit 2 (as shown in Figure 8.Then oven dry (as shown in Figure 8) → test → sealing 8 (as shown in Figure 9) → curing → test is made into directly the LED module of flip-chip on joint line.The installation method of flip-chip is known for the those of ordinary skill in electronic devices and components field, therefore repeats no more.
Such as Fig. 8 and shown in Figure 9, according to preferred embodiment of the present utility model, according to the needs of line design and application scenario, for example, can make between the circuit of one section conducting resinl 3 and another section conducting resinl 3 via led chip 4 and/or 5 conductings of other electronic devices and components; Can make between the circuit of one section conducting resinl 3 and plain conductor 2 via led chip 4 and/or 5 conductings of other electronic devices and components; Also can make conducting resinl 3 and plain conductor 2 direct bonding and conductive communication.Therefore, it will be understood by those skilled in the art that conducting resinl 3 can serve as bonding medium on the one hand and is combined securely with insulating carrier 1, can serve as conducting channel on the other hand and with led chip 4, other electronic devices and components 5 and/or plain conductor 2 conductive communication.Therefore, conducting resinl 3 plays the effect of serving as the conducting wire simultaneously, and led chip and other electronic devices and components play a part again to be adhesively fixed.This is one of them basic conception of the present utility model and starting point.
6, according to a preferred embodiment of the present utility model; can also be behind complete Fig. 8 and LED module shown in Figure 9; according to the position of flip LED chips 4 and sealing 8 and the position of components and parts 5; reflective membrane 9 is left window in advance then be pasted on (such as Figure 10, shown in Figure 11) on the conducting resinl circuit 3; reflective membrane 9 plays the effect of protection circuit and the effect of reflective increase front face brightness, then can test → pack → put in storage.
Below by reference to the accompanying drawings and directly the specific embodiment of the LED module of flip-chip on joint line is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. one kind with the LED module of the direct upside-down mounting of flip chip type led chip on joint line, it is characterized in that, described LED module comprises:
Insulating carrier;
Be arranged in the plain conductor on the described insulating carrier, described plain conductor forms a part of conducting channel in the described joint line;
Be combined in the conducting resinl that is spaced apart from each other on the described insulating carrier, described conducting resinl forms the conducting resinl circuit in the described joint line; With
Directly flip-chip packaged on described joint line and with the described joint line flip chip type led chip of conductive communication optionally.
2. LED module according to claim 1, it is characterized in that: described plain conductor is the one or more of plain conductors that are arranged side by side, and it is upper and form conductive communication that some in the described conducting resinl optionally directly are bonded in described many strip metals wire one or some.
3. LED module according to claim 1 and 2, it is characterized in that: described insulating carrier is the insulating carrier of being made by non-metal insulating material; Or the insulating carrier that is integrated by metal base and insulating barrier, wherein, the described joint line of described LED module is supported on the described insulating barrier.
4. LED module according to claim 3, it is characterized in that: described insulating carrier is rigidity or soft insulating carrier.
5. LED module according to claim 1 and 2 is characterized in that: described conducting resinl is to have electric conductivity and the conductive rubber that can solidify, conduction lotion or conduction slurry.
6. LED module according to claim 1 and 2, it is characterized in that: described flip chip type led chip is connected conducting with described conducting resinl with described plain conductor.
7. LED module according to claim 1 and 2, it is characterized in that: wherein a conducting resinl link tester is crossed described flip chip type led chip and another conducting resinl connection conducting.
8. LED module according to claim 1 and 2 is characterized in that: described flip chip type led chip directly flip-chip packaged on the described conducting resinl circuit that described conducting resinl forms and with described conducting resinl circuit conductive communication optionally.
9. LED module according to claim 1 and 2 is characterized in that: described plain conductor is the circle line; Or stranded conductor; Or the flat conductor that adopts circle line or stranded conductor calendering to make; Or divide the flat conductor that cuts into metal forming, metallic plate, metal tape.
10. LED module according to claim 1 and 2, it is characterized in that: described LED module also comprises the reflective membrane that is arranged in described insulating carrier one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220250512 CN202647291U (en) | 2012-05-21 | 2012-05-21 | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220250512 CN202647291U (en) | 2012-05-21 | 2012-05-21 | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202647291U true CN202647291U (en) | 2013-01-02 |
Family
ID=47416395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220250512 Expired - Lifetime CN202647291U (en) | 2012-05-21 | 2012-05-21 | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202647291U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN109519742A (en) * | 2018-12-09 | 2019-03-26 | 江门朗天照明有限公司 | A kind of strip light with flip LED chips |
-
2012
- 2012-05-21 CN CN 201220250512 patent/CN202647291U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037302B (en) * | 2014-05-23 | 2017-04-26 | 常州市武进区半导体照明应用技术研究院 | LED (light-emitting diode) package assembly |
| CN109519742A (en) * | 2018-12-09 | 2019-03-26 | 江门朗天照明有限公司 | A kind of strip light with flip LED chips |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102340928B (en) | Single-sided circuit board made by arranging flat wires side by side and making method thereof | |
| CN102340931B (en) | Method for making single-sided circuit board with flat wires arranged side by side | |
| CN102065648B (en) | Double-sided circuit board and interconnection conduction method thereof | |
| CN201928521U (en) | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires | |
| CN201928518U (en) | Double-sided circuit board manufactured by indirectly adhering or attracting juxtaposed flat leads | |
| RU2010121963A (en) | ELECTRONIC INTERFACE DEVICE, SYSTEM AND METHOD FOR ITS MANUFACTURE | |
| CN109757039B (en) | Circuit board of composite metal circuit and manufacturing method thereof | |
| CN102340930B (en) | Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film | |
| TW200612440A (en) | Polymer-matrix conductive film and method for fabricating the same | |
| CN102340932B (en) | Method of using reproduced glue film and parallel arranged flat wire to make single-sided circuit board | |
| CN201928519U (en) | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film | |
| CN201797655U (en) | Double-side circuit board made of parallel flat leads | |
| CN202647291U (en) | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line | |
| CN202697023U (en) | LED module with single-side hybrid circuit | |
| CN202695439U (en) | LED die set with LED chip directly encapsulated on rigid-flexible circuit board | |
| CN201928520U (en) | Double-face circuit board made by bonding insulation layer and solder mask and juxtaposing flat guide lines | |
| CN102709444B (en) | Light-emitting diode (LED) strip module with LED brackets directly formed on wires and manufacturing method for LED strip module | |
| CN202206656U (en) | LED (light-emitting diode) circuit board | |
| CN202927508U (en) | Light-emitting diode (LED) lamp module with circuit directly manufactured on three-dimensional heat dissipating support lamp carrier | |
| CN102340929B (en) | Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires | |
| CN102748605A (en) | Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method | |
| CN202697022U (en) | Light-emitting diode (LED) module with double-faced mixing circuit | |
| CN102711368A (en) | Light-emitting diode (LED) module with single-sided hybrid circuit and manufacturing method for LED module | |
| CN210519001U (en) | Ultra-long flexible circuit board for LED lamp strip | |
| CN203407083U (en) | A LED wire circuit board with one insulation bearing layer and a LED lamp belt |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130102 |