CN202697022U - Light-emitting diode (LED) module with double-faced mixing circuit - Google Patents
Light-emitting diode (LED) module with double-faced mixing circuit Download PDFInfo
- Publication number
- CN202697022U CN202697022U CN2012202505492U CN201220250549U CN202697022U CN 202697022 U CN202697022 U CN 202697022U CN 2012202505492 U CN2012202505492 U CN 2012202505492U CN 201220250549 U CN201220250549 U CN 201220250549U CN 202697022 U CN202697022 U CN 202697022U
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- back side
- insulating carrier
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Abstract
The utility model relates to a light-emitting diode (LED) module with a double-faced mixing circuit. The LED module comprises an insulation carrier, metal wires, a via hole, adhesiveness conducting media and LEDs, wherein the metal wires are arranged on the back face of the insulation carrier and forms a back-face conducting circuit of the double-faced mixing circuit; the via hole which penetrates through the insulation carrier is arranged at the position corresponding to the back-face conducting circuit; the adhesiveness conducting media are arranged on the front face of the insulation carrier and forms a front-face conducting circuit, and some of the adhesiveness conducting media are filled in the via holes to be connected with the back-face conducting circuit in a conducting mode; and the LEDs are adhered to the adhesiveness conducting media and connected with the adhesiveness conducting media in a conducting mode. According to the LED module with the double-faced mixing circuit, chemical etching is not required during circuit board manufacturing, the LEDs are not required to be mounted in a welding mode through a surface mount technology (SMT), the whole manufacturing process flow is shortened, materials are saved, manufacturing time is shortened, production efficiencies are greatly improved, environmental pollution caused during traditional circuit board manufacturing processes is reduced, and production costs are greatly reduced so that the LED module is environment-friendly.
Description
Technical field
The utility model belongs to circuit-board industry and LED application, is specifically related to have the LED module of two-sided hybrid circuit.
Background technology
Traditional double-sided PCB all is to etch circuit with copper-clad plate usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former cost is high and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities, and after finishing the making of wiring board, also will weld LED in the circuit board by the surface-pasted mode of SMT.This traditional fabrication method not only production process is quite loaded down with trivial details, and Production Time is long, but also environment is caused severe contamination.
Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable technique.The utility model is with the simplification that mounts of the manufacturing of wiring board and LED and components and parts, and its manufacture craft is cheap simply again, alternative existing loaded down with trivial details traditional manufacturing technique.Can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient are high, and very environmental protection.
Summary of the invention
Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition, term " wiring board " and " circuit board " can use interchangeably in the application, and term " circuit " and " circuit " also can use interchangeably in the application.
According to a preferred implementation of the present utility model, in the LED module with two-sided hybrid circuit of the present utility model, the back side can be set to juxtaposed metallic line, the front is set to the conducting resinl printed wire, back side circuit connects conducting with the conducting resinl of front circuit in being poured in via, and LED and other components and parts can be bonded in the corresponding position of conducting resinl circuit, front.More specifically, needs according to line design, can on insulating carrier, need the corresponding position of conducting to convince in advance through hole by patient analysis in front circuit and back side circuit, plain conductor contraposition layout is bonded on the one side of insulating carrier, form conducting wire, the back side, then contraposition printing conductive glue on the another side of insulating carrier, simultaneously conducting resinl is poured in the via, form positive conducting wire, positive conducting resinl link tester is crossed the conducting resinl that is poured in the via and is communicated with the plain conductor at the back side is bonding, again LED and components and parts are positioned over the corresponding position of conducting resinl circuit, front, Curing conductive adhesive, make conducting resinl with LED and components and parts strong bonded and conducting, make conducting resinl and plain conductor strong bonded and conducting, make conducting resinl and insulating carrier strong bonded, conducting resinl works to do the conducting wire simultaneously, works again to do bonding LED and components and parts thereof.This LED module with two-sided hybrid circuit does not need chemical etching when making wiring board, LED also mounts welding without SMT, and whole manufacturing process flow shortens, and has saved material and has shortened Production Time, has greatly improved production efficiency; Reduced pollution on the environment in the traditional fabrication wiring board process; Greatly reduce production cost, thereby very environmental protection.
Particularly, according to the utility model, provide a kind of LED module with two-sided hybrid circuit, described LED module comprises: insulating carrier; Be arranged in the plain conductor on the back side of described insulating carrier, described plain conductor forms the back side conducting channel of described two-sided hybrid circuit; At the via that runs through described insulating carrier corresponding to the position of described back side conducting channel; Be arranged in the viscosity conducting medium on the front of described insulating carrier, described viscosity conducting medium forms the positive conducting channel of described two-sided hybrid circuit, and in the described viscosity conducting medium some are filled described via and form conductive communication with described back side conducting channel; Be bonded on the described viscosity conducting medium and form the LED of conductive communication with described viscosity conducting medium.
According to an embodiment of the present utility model, described via also runs through the plain conductor of described back side conducting channel.
According to another embodiment of the present utility model, described plain conductor comprises the plain conductor on the back side of many described insulating carriers that are arranged side by side and are fixed on.
According to another embodiment of the present utility model, described insulating carrier is rigidity or soft insulating carrier.
According to another embodiment of the present utility model, described viscosity conducting medium is made by conducting resinl, conductive paste or conductive paste, and described conducting medium resisting medium is arranged on the front of described insulating carrier by the mode of printing.
According to another embodiment of the present utility model, described LED is connected conducting by means of the viscosity conducting medium that passes described via with described back side conducting channel.
According to another embodiment of the present utility model, one of them viscosity conducting medium partly partly is connected conducting by described LED with another viscosity conducting medium.
According to another embodiment of the present utility model, described viscosity conducting medium is made by conducting resinl, and described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.
According to another embodiment of the present utility model, described plain conductor is the circle line; Or stranded conductor; Or the flat conductor that adopts circle line or stranded conductor calendering to make; Or divide the flat conductor that cuts into metal forming, metallic plate, metal tape.
According to another embodiment of the present utility model, described LED module is used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Panel light, LED sign module or LED Christmas lamp.
According to another embodiment of the present utility model, need the corresponding position of conducting to be provided with via at the front of insulating carrier circuit and back side circuit.
According to another embodiment of the present utility model, described plain conductor is that many contraposition juxtapositions are bonded in the plain conductor that forms conducting wire, the back side on the one side of insulating carrier.
According to another embodiment of the present utility model, the conducting resinl contraposition is imprinted on the another side of insulating carrier, simultaneously conducting resinl is poured in the via, forms positive conducting wire, positive conducting resinl link tester is crossed the conducting resinl that is poured in the via and is communicated with the plain conductor at the back side is bonding.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram according to the flat conductor of the utility model one embodiment.
Fig. 2 is the schematic diagram according to the juxtaposition groove mould of the utility model one embodiment.
Fig. 3 is the sectional view according to the juxtaposition groove mould of the utility model one embodiment.
Fig. 4 is the juxtaposition wiring schematic diagram according to the flat conductor of the utility model one embodiment.
Fig. 5 is the floor map according to the insulating carrier of the utility model one embodiment.
Fig. 6 for according to the utility model one embodiment on insulating carrier, make the corresponding position of front circuit and back side line conduction convince the schematic diagram of through hole by patient analysis at needs.
Fig. 7 is according to the plain conductor of the conducting wire, the back side of the utility model one embodiment and the decomposing schematic representation of the insulating carrier contraposition preparation bonding of holding via successfully.
Fig. 8 is that plain conductor shown in Figure 7 is bonded together with the insulating carrier contraposition of holding via successfully, forms the schematic diagram of conducting wire, the back side, and wherein via only runs through insulating carrier but do not run through plain conductor.
Fig. 9 for according to another embodiment of the utility model, with plain conductor with do not have the insulating carrier contraposition of perforate to be bonded together the schematic diagram that forms conducting wire, the back side.
Figure 10 is for to convince through hole by patient analysis at plain conductor shown in Figure 9 and insulating carrier, thereby formation runs through the schematic diagram of the via of plain conductor and insulating carrier.
Figure 11 is the upper contraposition printing conductive glue of the another side (namely arranging the side of positive conducting wire) at the insulating carrier of Fig. 8 or structure shown in Figure 10 according to the utility model one embodiment, simultaneously conducting resinl is poured in the via and forms the schematic diagram of positive conducting wire.
Figure 12 is the cutting plane structural representation of contraposition printing conductive glue in the via of structure shown in Figure 8, wherein the conducting resinl of positive conducting wire will run through insulating carrier and with the plain conductor conducting of conducting wire, the back side.
Figure 13 is the cutting plane structural representation of contraposition printing conductive glue in the via of structure shown in Figure 10, and wherein the conducting resinl of positive conducting wire will run through insulating carrier and be connected plain conductor and be connected conducting with conducting wire, the back side with conducting wire, the back side.
Figure 14 is on structure shown in Figure 11, LED (with other components and parts) is positioned over the relevant position on the conducting resinl of front, Curing conductive adhesive, make the schematic diagram of LED (with other components and parts) and conducting resinl strong bonded and conducting, wherein conducting resinl has passed plain conductor strong bonded and the conducting at via and the back side, and conducting resinl and insulating carrier strong bonded.
Embodiment
The below will be described in more detail the embodiment of the LED module that the utlity model has two-sided hybrid circuit.
But, it will be appreciated by those skilled in the art that these execution modes have only enumerated some preferred embodiments of the present utility model, to the utility model and protection range thereof without any restriction.For example, the layout of the flat conductor of conducting wire, the back side is not limited to shown in the accompanying drawing described with specific embodiment, and the position of the layout of the conducting resinl of positive conducting wire and mode also are not limited to shown in the accompanying drawing described with specific embodiment, etc.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.
1, the making of wire:
According to a preferred embodiment, take the cutting of Copper Foil itemize to make, or roll copper cash with calender, obtain the flat conductor 3 (as shown in Figure 1) of required width and thickness.According to the needs of application scenario, this flat conductor 3 can be single wire, can be Alignment also, be preferably many wires that are arranged in parallel.
2. the juxtaposition groove mould is made:
According to a preferred embodiment, adopt the method for etching or machining with minute surface stainless steel plate, process the juxtaposition groove 8 consistent with line width, and be provided with vacuum-pumping tube 7 (as shown in Figure 2), the degree of depth of groove 8 is preferably than flat conductor thickness more shallow (as shown in Figure 3).
3. plain conductor is bonded on the insulating carrier
According to a preferred embodiment, with one side with the insulating carrier 1 of epoxy adhesive (as shown in Figure 5, for example be the polyimides coverlay of insulation), need the corresponding position of conducting to convince through hole 2 (as shown in Figure 6) by patient analysis at front circuit and back side circuit, then will have the sticky surface of the insulating carrier 1 of via 2, with the side (as shown in Figure 4) that is furnished with flat conductor 3 on the wiring mould, carry out contraposition (as shown in Figure 7) overlapping, hot pressing 5-10 second, make juxtaposed flat conductor 3 bonding being transferred on the insulating carrier 1, separate and take mould away, this moment, flat conductor 3 was bonded together with insulating carrier 1, formed conducting wire, the back side 3 (as shown in Figure 8).Wherein, Fig. 7 is for preparing the decomposing schematic representation of bonding according to the plain conductor 3 of the conducting wire, the back side of this embodiment and insulating carrier 1 contraposition of holding via 2 successfully.Fig. 8 is that plain conductor 3 shown in Figure 7 is bonded together with insulating carrier 1 contraposition of holding via 2 successfully, forms the schematic diagram of conducting wire, the back side 3, and wherein via 2 only runs through insulating carrier 1 but do not run through plain conductor 3.
According to another preferred embodiment, with the insulating carrier 1 (as shown in Figure 5) of one side with epoxy adhesive, overlapping with the side (as shown in Figure 4) contraposition that is furnished with flat conductor 3 on the wiring mould, hot pressing 5-10 second, make juxtaposition flat conductor 3 bonding being transferred on the insulating carrier 1, separate and take mould away, this moment, flat conductor 3 was bonded together with insulating carrier 1, as shown in Figure 9, Fig. 9 for according to this embodiment of the utility model, plain conductor 3 and insulating carrier 1 contraposition of not convincing through hole by patient analysis are bonded together the schematic diagram that forms conducting wire, the back side 3.Then, need the corresponding position of conducting to convince through hole 2 by patient analysis at front circuit and back side circuit, via 2 passes plain conductor 3 and insulating carrier 1, form the via 2 that connects, as shown in figure 10, Figure 10 is for to convince through hole 2 by patient analysis at plain conductor 3 shown in Figure 9 and insulating carrier 1, runs through simultaneously the two the schematic diagram of via 2 of plain conductor 3 and insulating carrier 2 thereby form.
4, printing conductive glue
On the another side of insulating carrier according to the design circuit contraposition printing conductive glue 4, this conducting resinl 4 forms positive conducting wire (as shown in figure 11), in addition, conducting resinl 4 fillings is poured in the via 2, thereby with 3 bonding connections of plain conductor at the back side, shown in Figure 12,13.Wherein, Figure 12 is the cutting plane structural representation of contraposition printing conductive glue 4 in the via 2 of structure shown in Figure 8, wherein the conducting resinl 4 of positive conducting wire will run through insulating carrier 1 and with plain conductor 3 conductings of conducting wire, the back side.Figure 13 is the cutting plane structural representation of contraposition printing conductive glue 4 in the via 2 of structure shown in Figure 10, and wherein the conducting resinl 4 of positive conducting wire will run through insulating carrier 1 and be connected plain conductor 3 and be connected conducting with conducting wire, the back side 3 with conducting wire, the back side.
5, bonding LED and other components and parts
LED 5 (and other components and parts 6) is positioned over the corresponding position of conducting resinl circuit, front (as shown in figure 14), solidify and process conducting resinl 4, thereby make conducting resinl 4 with LED 5 (and other components and parts 6) strong bonded and conducting, make conducting resinl 4 and plain conductor 3 strong bonded and conducting, make conducting resinl 4 and insulating carrier 1 strong bonded, therefore conducting resinl 4 works to do the conducting wire simultaneously, works again to do bonding LED and other components and parts.
Next, can carry out product test and packing to the LED module with two-sided hybrid circuit of finishing through above-mentioned operation, qualified through detecting, the listing of can dispatching from the factory.
The LED module specific embodiment that below will have by reference to the accompanying drawings two-sided hybrid circuit is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. the LED module with two-sided hybrid circuit is characterized in that, described LED module comprises:
Insulating carrier;
Be arranged in the plain conductor on the back side of described insulating carrier, described plain conductor forms the back side conducting channel of described two-sided hybrid circuit;
At the via that runs through described insulating carrier corresponding to the position of described back side conducting channel;
Be arranged in the viscosity conducting medium on the front of described insulating carrier, described viscosity conducting medium forms the positive conducting channel of described two-sided hybrid circuit, and in the described viscosity conducting medium some are filled described via and form conductive communication with described back side conducting channel;
Be bonded on the described viscosity conducting medium and form the LED of conductive communication with described viscosity conducting medium.
2. LED module according to claim 1, it is characterized in that: described via also runs through the plain conductor of described back side conducting channel.
3. LED module according to claim 1 and 2 is characterized in that: described plain conductor comprises the plain conductor on the back side of many described insulating carriers that are arranged side by side and are fixed on.
4. LED module according to claim 3, it is characterized in that: described insulating carrier is rigidity or soft insulating carrier.
5. LED module according to claim 1 and 2, it is characterized in that: described viscosity conducting medium is made by conducting resinl, conductive paste or conductive paste, and the mode of described conducting medium resisting medium by printing is arranged on the front of described insulating carrier.
6. LED module according to claim 1 and 2, it is characterized in that: described LED is connected conducting by means of the viscosity conducting medium that passes described via with described back side conducting channel.
7. LED module according to claim 1 and 2, it is characterized in that: one of them viscosity conducting medium partly partly is connected conducting by described LED with another viscosity conducting medium.
8. LED module according to claim 5, it is characterized in that: described viscosity conducting medium is made by conducting resinl, and described conducting resinl is cold curing conducting resinl, intermediate temperature setting conducting resinl, hot setting conducting resinl or UV-Curing Electric Conductive Adhesives.
9. LED module according to claim 1 and 2 is characterized in that: described plain conductor is the circle line; Or stranded conductor; Or the flat conductor that adopts circle line or stranded conductor calendering to make; Or divide the flat conductor that cuts into metal forming, metallic plate, metal tape.
10. LED module according to claim 1 and 2 is characterized in that: described LED module is used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Panel light, LED sign module or LED Christmas lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202505492U CN202697022U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with double-faced mixing circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202505492U CN202697022U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with double-faced mixing circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697022U true CN202697022U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202505492U Expired - Lifetime CN202697022U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) module with double-faced mixing circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202697022U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711369A (en) * | 2012-05-21 | 2012-10-03 | 王定锋 | Light-emitting diode (LED) module with double-sided mixing circuit and manufacturing method thereof |
| CN108266693A (en) * | 2018-01-23 | 2018-07-10 | 苏州晶品新材料股份有限公司 | A kind of enhanced LED light source of misty rain light transmission |
-
2012
- 2012-05-21 CN CN2012202505492U patent/CN202697022U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711369A (en) * | 2012-05-21 | 2012-10-03 | 王定锋 | Light-emitting diode (LED) module with double-sided mixing circuit and manufacturing method thereof |
| CN108266693A (en) * | 2018-01-23 | 2018-07-10 | 苏州晶品新材料股份有限公司 | A kind of enhanced LED light source of misty rain light transmission |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |