CN201944785U - LED lamp circuit board formed by connecting two platy lines in parallel - Google Patents

LED lamp circuit board formed by connecting two platy lines in parallel Download PDF

Info

Publication number
CN201944785U
CN201944785U CN2010202653457U CN201020265345U CN201944785U CN 201944785 U CN201944785 U CN 201944785U CN 2010202653457 U CN2010202653457 U CN 2010202653457U CN 201020265345 U CN201020265345 U CN 201020265345U CN 201944785 U CN201944785 U CN 201944785U
Authority
CN
China
Prior art keywords
lamp plate
led circuit
led
flat conductor
platy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010202653457U
Other languages
Chinese (zh)
Inventor
王定锋
徐文红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2010202653457U priority Critical patent/CN201944785U/en
Application granted granted Critical
Publication of CN201944785U publication Critical patent/CN201944785U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model relates to an LED lamp circuit board formed by connecting two platy lines in parallel. The LED lamp circuit board is designed to adopt two platy lines and sets a distance according to a distance dimension between elements pins to arrange the lines in parallel, one side of the platy line is adhered and fixed with the platy lines by an insulating base material 1 with glue, while the other side of the platy line is welded with resistance by a film previously opened with a window or a solder mask, all LEDs and elements are welded in parallel on the two platy lines which are at the position previously opened with the window; and the welding employs SMT (surface mount technology) reflow soldering or plug-in wave soldering. The circuit board manufactured by the utility model does not need etching and has the advantages of simple structure, low manufacturing cost and high efficiency. The LED lamp circuit board is a new technology which is environmentally friendly and saves energy and materials.

Description

With two flat conductors LED circuit for lamp plate of making in parallel
Technical field
The utility model belongs to circuit-board industry, relates to led circuit plate field, the LED circuit for lamp plate that is specifically related to have the LED circuit for lamp plate of rigid circuit board and has flexible PCB.
Background technology
Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
The utility model is directly to take juxtaposed flat conductor to make according to the characteristics of the big circuit board of the simple consumption of some circuits to produce circuit board, can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient height, and very environmental protection.
Summary of the invention
The utility model adopts two flat conductors, spacing dimension according to component pins is provided with spacing and puts arrangement, in the one side of flat conductor with the insulating substrate of the band glue flat conductor that is adhesively fixed, hold the film of window in advance successfully or do welding resistance in the another side usefulness of flat conductor with welding resistance printing ink, all LED and element be all in parallel to be welded on solder mask and to have on two flat conductors at window place, and welding is adopted SMT Reflow Soldering welding or adopted the welding of plug-in unit wave-soldering.
The circuit board that the utility model is made need not etching, and simple in structure, and cost of manufacture is low, efficient is high, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
According to the utility model, a kind of LED circuit for lamp plate is provided, comprising: two and put the flat conductor of arrangement, described flat conductor forms the line layer (2) of described LED circuit for lamp plate; The insulating substrate (1) of applying and the band glue of hot pressing on the one side of these two flat conductors, fit and hot pressing at the end face coverlay that has the solder joint window on the opposite another side of these two flat conductors or be applied to welding resistance printing ink on this opposite another side, described end face coverlay or described welding resistance printing ink form the solder mask (3) of described LED circuit for lamp plate; Electronic devices and components are arranged in parallel on juxtaposed two flat conductors.
According to an embodiment of the present utility model, the place provides solder joint (7) at described solder joint window.
According to an embodiment of the present utility model, described LED circuit for lamp plate is flexible circuit board or rigid circuit board.
Described electronic devices and components can comprise LED.
According to an embodiment of the present utility model, described and put that to arrange be parallel arrangement.
According to an embodiment of the present utility model, described insulating substrate is epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base and ceramic base material wherein a kind of.
According to an embodiment of the present utility model, described lead is a flat conductor.
According to an embodiment of the present utility model, described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
According to an embodiment of the present utility model, in the boring of welding window place or punching and the pin holes that is formed for welding pin LED lamp and pin element.
According to an embodiment of the present utility model, described welding resistance printing ink is the welding resistance printing ink that PCB uses, and described end face coverlay is the coverlay that flexible circuit board is used.
According to an embodiment of the present utility model, the length of described LED circuit for lamp plate is less than or equal to 100 meters, perhaps more than 100 meters.
According to an embodiment of the present utility model, make LED circuit for lamp plate with two parallel flat conductors.
According to an embodiment of the present utility model, article two, parallel lines and put arrangement, spacing is provided with according to the component pins spacing dimension, substrate bonding flat conductor with band glue is fixed, the coverlay of solder side printing welding resistance printing ink or hot pressing windowing, all element parallel connections are welded on flat conductor windowing solder joint.
According to an embodiment of the present utility model, described element comprises LED lamp and other elements of any amount, and the spacing between the element can be set arbitrarily as required.
According to the utility model, a kind of LED circuit for lamp plate also is provided, comprising: two and put the flat conductor of arrangement, form the flat conductor layer of led circuit plate; Be welded on LED and other element on these two flat conductors with parallel connection.
According to an embodiment of the present utility model, the structure of above-mentioned LED circuit for lamp plate comprises successively: ground floor is the insulation bearing bed that is combined on the one side of described flat conductor layer; The second layer is described flat conductor layer; The 3rd layer is the solder mask on being combined in the opposite another side of described flat conductor layer, and it is provided with and holds the solder joint position of soldered elements with window in advance successfully; The 4th layer is to comprise the LED of described welding in parallel and the element layer of other element.
According to an embodiment of the present utility model, described solder joint position is SMT paster solder joint position, is used for other surface mount elements of the soldering surface mounted LED of SMT.
According to an embodiment of the present utility model,, and be formed for the pin holes of pin LED lamp and pin element in solder joint position boring or punching.
According to an embodiment of the present utility model, solder mask is the welding resistance printing ink that PCB uses, or the coverlay used of FPC.
In following description, will set forth one or more embodiments of the detail of the present utility model to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the structural representation of led circuit panel products.
Fig. 2 for and put the schematic diagram of groove mould.
The cross sectional representation that Fig. 3 is and puts groove mould.
Fig. 4 is for flat conductor and put the schematic diagram of wiring.
Fig. 5 is for for flat conductor and put and vacuumize air-breathing fixing schematic diagram when arranging.
Fig. 6 is fixed on schematic diagram on the coverlay of bottom surface for flat conductor.
Fig. 7 is for pasting the schematic diagram of end face coverlay.
Fig. 8 is for forming the schematic diagram in element legs hole by the form that gets out or go out for the bond pad locations of plug-in type circuit board.
Fig. 9 is the decomposing schematic representation of board structure of circuit shown in Figure 7.
The parts label
1 base material; 2 flat conductors; 3 solder masks; 4,5LED and other element; 6, power supply pad; 7 solderings (solder joint); 8 parallel grooves; 9 vaccum suction tubes
The specific embodiment
Being made as embodiment with flexible LED circuit board and LED lamp decoration below with reference to accompanying drawings is described in detail the utility model.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the embodiment that is equal to equally also can be used for implementing the utility model.
The making of flexible LED circuit board and LED lamp decoration
According to designing and producing the wiring mould
Etch or the mould (as shown in Figure 2) of the parallel slot 8 that machining is consistent with flat conductor 2 width with for example mirror face stainless steel, the degree of depth of the parallel slot 8 of mould is determined according to the thickness of flat conductor 2, than the gauge slightly more shallow (as shown in Figure 3) of flat conductor 2.
Wiring
2 while of one group of flat conductor cloth in the groove 8 of mould (as shown in Figure 3-4), is vacuumized (shown in the arrow of Fig. 5) by means of vacuum-pumping tube 9, and flat conductor 2 is fixed in the groove 8, as shown in Figure 5.
Paste the bottom surface coverlay
Coverlay 1 contraposition in bottom surface is attached on the flat conductor 2 of mould, clung in 10 seconds 180 ℃ of following hot pressing.From mould, take out, realize that like this circuit (being flat conductor 2) is fixed (as shown in Figure 6).Wherein, flat conductor 2 becomes the line layer blank of circuit board, and bottom surface coverlay 1 will become the insulation bearing bed (base material) 1 of circuit board, as shown in Figure 9.
Paste the end face coverlay
The circuit that has been fixed by bottom surface coverlay 1, another side conversely, the coverlay 3 that snaps a window and fixing 180 ℃ of following hot pressing 10 seconds is sticked in contraposition.
Continuation with the pressure hot pressing of 150kg 120 seconds, makes two sides coverlay (being bottom surface coverlay and end face coverlay) and flat conductor 2 strong bonded under 180 ℃.Next, the flat conductor that is combined with the two sides coverlay 150 ℃ of following baking-curings 60 minutes, is obtained structure as shown in Figure 7.Fig. 9 has shown the decomposing schematic representation of structure shown in Figure 7, and wherein, flat conductor 2 becomes the line layer 2 of circuit board, and bottom surface coverlay 1 becomes the insulating substrate 1 of circuit board, and end face coverlay 3 becomes the solder mask 3 of circuit board.
Printing word
Next printing word, the printing word technology of the method for printing word and traditional circuit-board is identical, repeats no more.
Weld the pin element if desired, then for example use die punching in solder joint 7 positions, obtain structure as shown in Figure 8, the aperture in the hole of being gone out and the diameter of component pins coupling, but the aperture in this hole is preferably less than the window size of end face coverlay, make the limit, hole expose the metal weld-ring, can use the scolding tin soldered elements then.
OSP handles solder joint 7, can be identical with traditional circuit-board technology, repeat no more.
Soldered elements
For the circuit board of SMT type, can promptly finish the element welding with reflow machine welding behind the Yamaha automatic chip mounting.For the pin type circuit board, can promptly finish the element welding with crossing the crest welder welding behind the artificial plug-in unit.Here, element is meant the required any electronic devices and components of circuit board that comprise LED.
Like this, just can obtain structure for example shown in Figure 1, wherein, the element of welding is connected in parallel on two flat conductors 2 and conducting, as shown in Figure 1.
Cut itemize
For example, can on punch press, cut, form wall scroll LED lamp decoration product (as shown in Figure 1) with cutting die.
Below in conjunction with the accompanying drawings the utility model is described in detail.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.

Claims (10)

1. a LED circuit for lamp plate is characterized in that, described LED circuit for lamp plate comprises:
Article two, and put the flat conductor of arrangement, form the flat conductor layer of led circuit plate; With
Parallel connection is welded on LED and other element on these two flat conductors.
2. LED circuit for lamp plate according to claim 1 is characterized in that, the structure of described LED circuit for lamp plate comprises successively:
Ground floor is the insulation bearing bed that is combined on the one side of described flat conductor layer;
The second layer is described flat conductor layer;
The 3rd layer is the solder mask on being combined in the opposite another side of described flat conductor layer, and it is provided with and holds the solder joint position of soldered elements with window in advance successfully; With
The 4th layer is to comprise the LED of described welding in parallel and the element layer of other element.
3. each described LED circuit for lamp plate in requiring according to aforesaid right is characterized in that described LED lamp driver plate is the soft wiring board or the wiring board of rigidity.
4. each described LED circuit for lamp plate in requiring according to aforesaid right is characterized in that, and is described and put that to arrange be to be arranged in parallel.
5. LED circuit for lamp plate according to claim 2 is characterized in that, described solder joint position is SMT paster solder joint position, is used for the soldering surface mounted LED of SMT and other surface mount elements and uses.
6. LED circuit for lamp plate according to claim 2 is characterized in that, in solder joint position boring or punching, and is formed for the pin holes of pin LED lamp and pin element.
7. LED circuit for lamp plate according to claim 2 is characterized in that, the material of described insulation bearing bed is epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base, or ceramic base material.
8. LED circuit for lamp plate according to claim 2 is characterized in that, described solder mask is the welding resistance printing ink that PCB uses, or the coverlay used of FPC.
9. each described LED circuit for lamp plate in requiring according to aforesaid right is characterized in that described flat conductor is selected from copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
10. each described LED circuit for lamp plate in requiring according to aforesaid right is characterized in that the length of described LED circuit for lamp plate is less than or equal to 100 meters, perhaps more than 100 meters.
CN2010202653457U 2010-07-20 2010-07-20 LED lamp circuit board formed by connecting two platy lines in parallel Expired - Lifetime CN201944785U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202653457U CN201944785U (en) 2010-07-20 2010-07-20 LED lamp circuit board formed by connecting two platy lines in parallel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202653457U CN201944785U (en) 2010-07-20 2010-07-20 LED lamp circuit board formed by connecting two platy lines in parallel

Publications (1)

Publication Number Publication Date
CN201944785U true CN201944785U (en) 2011-08-24

Family

ID=44472127

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202653457U Expired - Lifetime CN201944785U (en) 2010-07-20 2010-07-20 LED lamp circuit board formed by connecting two platy lines in parallel

Country Status (1)

Country Link
CN (1) CN201944785U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102510662A (en) * 2011-12-31 2012-06-20 珠海市耀宏电子科技有限公司 Novel LED sinkless copper plated lamp tape circuit board and manufacturing process thereof
CN102883527A (en) * 2011-07-15 2013-01-16 广东德豪润达电气股份有限公司 Flexible circuit board for LED and manufacturing method of flexible circuit board
CN103137253A (en) * 2011-11-23 2013-06-05 达昌电子科技(苏州)有限公司 Flat cable unit provided with light-emitting assembly
CN103167744A (en) * 2011-12-08 2013-06-19 王定锋 Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof
CN105280106A (en) * 2015-11-17 2016-01-27 东莞嘉鑫创光电有限公司 LED display panel
CN105792534A (en) * 2014-12-23 2016-07-20 芜湖德豪润达光电科技有限公司 Manufacturing method of unetched circuit board and unetched circuit board
CN106376179A (en) * 2015-07-20 2017-02-01 陈锡然 Manufacturing technique for circuit board
CN106413249A (en) * 2016-08-09 2017-02-15 王定锋 LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method
CN107632475A (en) * 2017-10-31 2018-01-26 武汉天马微电子有限公司 Display panel and display device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102883527A (en) * 2011-07-15 2013-01-16 广东德豪润达电气股份有限公司 Flexible circuit board for LED and manufacturing method of flexible circuit board
CN103137253A (en) * 2011-11-23 2013-06-05 达昌电子科技(苏州)有限公司 Flat cable unit provided with light-emitting assembly
CN103167744A (en) * 2011-12-08 2013-06-19 王定锋 Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof
CN103167744B (en) * 2011-12-08 2016-03-02 王定锋 LED wiring board with element and preparation method thereof
CN102510662A (en) * 2011-12-31 2012-06-20 珠海市耀宏电子科技有限公司 Novel LED sinkless copper plated lamp tape circuit board and manufacturing process thereof
CN105792534A (en) * 2014-12-23 2016-07-20 芜湖德豪润达光电科技有限公司 Manufacturing method of unetched circuit board and unetched circuit board
CN106376179A (en) * 2015-07-20 2017-02-01 陈锡然 Manufacturing technique for circuit board
CN105280106A (en) * 2015-11-17 2016-01-27 东莞嘉鑫创光电有限公司 LED display panel
CN106413249A (en) * 2016-08-09 2017-02-15 王定锋 LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method
CN107632475A (en) * 2017-10-31 2018-01-26 武汉天马微电子有限公司 Display panel and display device
CN107632475B (en) * 2017-10-31 2020-11-03 武汉天马微电子有限公司 Display panel and display device

Similar Documents

Publication Publication Date Title
CN201944785U (en) LED lamp circuit board formed by connecting two platy lines in parallel
CN202048540U (en) LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires
CN201910973U (en) Full-series LED (Light-Emitting Diode) circuit board made of flat leads
CN102065645B (en) Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof
CN102340928B (en) Single-sided circuit board made by arranging flat wires side by side and making method thereof
CN201860505U (en) Combined two-sided PCB
CN201813610U (en) Double-sided circuit board and led lamp belt
CN102340931B (en) Method for making single-sided circuit board with flat wires arranged side by side
CN206181548U (en) LED stripe shape lamp double layers of circuit boards module
CN201928518U (en) Double-sided circuit board manufactured by indirectly adhering or attracting juxtaposed flat leads
CN102065648B (en) Double-sided circuit board and interconnection conduction method thereof
WO2012009841A1 (en) Single-sided circuit board made by bonding juxtaposition flat wiring with thermosetting glue film
CN201928521U (en) Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires
CN201491372U (en) Module for directly manufacturing circuit board and electronic component on radiator
CN202206656U (en) LED (light-emitting diode) circuit board
CN201928519U (en) Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film
CN102883524A (en) Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method
CN201797655U (en) Double-side circuit board made of parallel flat leads
WO2012009842A1 (en) Method of manufacturing single sided circuit board by using carrier glue film and juxtaposition flat wiring
CN202364467U (en) LED (light emitting diode) circuit board manufactured all by leads
CN102340929B (en) Single-sided circuit board made by respectively hot-pressing insulating layers on two sides of flat wires
CN201616952U (en) Double-faced circuit board
CN102724810A (en) LED circuit board with circuits flexible to be detached and LED module
CN207750797U (en) A kind of wire circuit plate LED light strip
CN202310269U (en) Multi-layer circuit board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20110824

CX01 Expiry of patent term