CN102883527A - Flexible circuit board for LED and manufacturing method of flexible circuit board - Google Patents
Flexible circuit board for LED and manufacturing method of flexible circuit board Download PDFInfo
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- CN102883527A CN102883527A CN2011101985543A CN201110198554A CN102883527A CN 102883527 A CN102883527 A CN 102883527A CN 2011101985543 A CN2011101985543 A CN 2011101985543A CN 201110198554 A CN201110198554 A CN 201110198554A CN 102883527 A CN102883527 A CN 102883527A
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- led
- circuit board
- flexible
- flexible circuit
- metal base
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Abstract
The invention provides a flexible circuit board for an LED (light-emitting diode), and a manufacturing method of the flexible circuit board. The technological process of the flexible circuit board is shortened, and electroplating and etching technologies are not required, so that no chemical raw material is consumed, the cost is lowered greatly, the working hours are shortened greatly, and no pollution is caused to the environment. The flexible circuit board for the LED comprises a flexible metal base board and an insulating substrate formed by a continuous metal strap through blanking, wherein the insulating substrate is laminated at the lower part of the flexible metal base board; the flexible metal base board comprises two wires and a plurality of line die units insulated against the two wires; and each line die unit is provided with an LED chip die bonding area. The manufacturing method of the flexible circuit board for the LED comprises three steps for forming, so that the technological process is greatly shortened, the production efficiency is improved, and the manufacturing method can be applied to a flow line to produce the flexible circuit board and an LED light source or a module of subsequent technologies continuously.
Description
Technical field
The invention belongs to electronic circuit board and application thereof, relate in particular to a kind of LED flexible circuit board and manufacture method thereof.
Background technology
In the prior art.The common flexible printed circuit board (FPC) that is used for the LED lighting field adopts printing technology production, and technological process is long, and production stage is many, and is time-consuming, so price, and the plating in the production process and etching process procedure also pollute the environment.
Summary of the invention
The object of the present invention is to provide a kind of LED flexible circuit board and manufacture method thereof, shortened the technological process of flexible circuit board, need not therefore also not have industrial chemicals consumption by electroplating and etch process, can reduce widely cost and man-hour, and not pollute the environment.
The present invention is achieved through the following technical solutions:
The LED flexible circuit board wherein, includes: by flexible metal base plate and dielectric substrate that a continuous metal tape forms through stamping-out, described dielectric substrate is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires and the little blade unit of a plurality of circuit, and two wires and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with led chip die bond zone.
The width dimensions of described dielectric substrate is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate is more than or equal to the length dimension of flexible metal base plate.
A plurality of circuit small pieces unit adopts the rectangular array mode to arrange.
Above-mentioned LED wherein, comprises the steps: with the manufacture method of flexible circuit board
The first step: with a continuous pre-stamping-out of metal tape warp, formation has the flexible metal base plate of two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively has a little muscle to link to each other with one of two wires and adjacent circuit small pieces unit main body;
Second step: with flexible metal base plate and a width dimensions more than or equal to the metal tape width dimensions, continuous dielectric substrate pressing;
The 3rd step: stamping-out again, all little muscle that each circuit small pieces unit main body and one of two wires and adjacent circuit small pieces unit main body are linked to each other local or all stamping-outs fall, form two wires and the little blade unit of a plurality of circuit that insulate each other.
Beneficial effect of the present invention is as follows:
A kind of LED flexible circuit board of the present invention, owing to including: by flexible metal base plate and dielectric substrate that a continuous metal tape forms through stamping-out, described dielectric substrate is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires and the little blade unit of a plurality of circuit, and two wires and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with led chip die bond zone; Form two wires and a plurality of circuit small pieces of each other insulation, and form the series-parallel circuit of welding LED lamp pearl or chip, but consist of a continuous cutting segmentation LED flexible circuit board; Can form the series-parallel circuit of welding LED lamp pearl or chip in the later stage operation, but consist of the flexible circuit board with led light source of a continuous cutting segmentation.And because this LED manufacture method of flexible circuit board, adopt the flexible circuit board of three-step approach moulding, greatly shortened technological process, and do not exist common flexible print flexible circuit board to produce necessary plating and etch process, therefore there is not industrial chemicals consumption yet, therefore can reduce widely cost and man-hour, enhance productivity, and do not pollute the environment.Another large benefit of the present invention is, can be applied on the streamline continuously led light source or the module of production flexible circuit board and subsequent technique.
Description of drawings
Fig. 1 is LED of the present invention flexible circuit board embodiment one pre-blanking structure schematic diagram;
Fig. 2 is LED of the present invention flexible circuit board embodiment two pre-blanking structure schematic diagrames;
Fig. 3 be LED of the present invention with flexible circuit board embodiment one pressing after blanking structure schematic diagram again;
Fig. 4 be LED of the present invention with flexible circuit board embodiment two pressings after blanking structure schematic diagram again;
Fig. 5 be LED of the present invention with flexible circuit board embodiment one pressing after stamping-out structure for amplifying schematic diagram again.
Description of reference numerals:
1, wire, 2, the little blade unit of circuit, 3, little muscle, 4, location hole, 5, dielectric substrate, 6, lock shape groove, 7, interval trough, 8, led chip die bond zone, 9, isolation channel.
Embodiment
Ask for an interview Fig. 1 to Fig. 5, the invention discloses a kind of LED flexible circuit board, wherein, include: by flexible metal base plate and dielectric substrate 5 that a continuous metal tape forms through stamping-out, described dielectric substrate 5 is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires 1 and 2, two wires 1 in a plurality of circuit small pieces unit and a plurality of circuit small pieces unit 2 and insulate each other; Each circuit small pieces unit 2 is provided with led chip die bond zone.
The width dimensions of described dielectric substrate 5 is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate 5 is more than or equal to the length dimension of flexible metal base plate.
A plurality of circuit small pieces unit 2 adopts the rectangular array mode to arrange.
Described dielectric substrate 5 adopts and can crooked material make.
Described dielectric substrate 5 adopts the material of the high temperature can anti-LED Reflow Soldering the time to make.
Embodiment one:
In the present embodiment, shown in Fig. 1,3,5, include multirow and multiple row circuit small pieces unit 2 arrays, be provided with the interval trough 7 of rectangle between every column line small pieces unit 2, the two ends of every column line small pieces unit 2 are provided with location hole 4; Each circuit small pieces unit 2 has included lock shape groove 6, and led chip die bond zone 8 is positioned at the space that lock shape groove 6 surrounds.
Embodiment two:
In the present embodiment, shown in Fig. 2,4, include delegation's multiple row circuit small pieces unit 2 arrays, isolate by isolation channel 9 between the adjacent lines small pieces unit 2; The two ends of circuit small pieces unit 2 are provided with a plurality of location holes 4.
Above-mentioned LED wherein, comprises the steps: with the manufacture method of flexible circuit board
The first step: with a continuous pre-stamping-out of metal tape warp, formation has the flexible metal base plate of two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively has a little muscle to link to each other with one of two wires and adjacent circuit small pieces unit main body;
Second step: with flexible metal base plate and a width dimensions more than or equal to the metal tape width dimensions, continuous dielectric substrate pressing;
The 3rd step: stamping-out again, all little muscle that each circuit small pieces unit main body and one of two wires and adjacent circuit small pieces unit main body are linked to each other local or all stamping-outs fall, form two wires and the little blade unit of a plurality of circuit that insulate each other.
In the above-mentioned first step, continuous metal tape adopts the coiled strip form to get the raw materials ready, and the flexible metal base plate behind the pre-stamping-out reticulates, such as accompanying drawing 1.
In the above-mentioned second step, continuous dielectric substrate is that material is flexible, and a kind of continuous sheet coiled strip of the high temperature during ability LED Reflow Soldering.
After above-mentioned the 3rd step, form the series-parallel circuit that welding LED lamp pearl maybe can carry out the COF encapsulation, but consist of the flexible circuit board with led light source of a continuous cutting segmentation.
Among the embodiment one, for adapting to the needs of COF (Chip On The Flexible) encapsulation, in each circuit small pieces punching the required lock shape groove of LED encapsulation is arranged, in order to be combined more firm with packing colloid and flexible circuit board.
Above-mentioned listed specific implementation is nonrestrictive, to one skilled in the art, is not departing from the scope of the invention, and the various modifications and variations of carrying out all belong to protection scope of the present invention.
Claims (10)
1.LED use flexible circuit board, it is characterized in that: include: by flexible metal base plate and dielectric substrate (5) that a continuous metal tape forms through stamping-out, described dielectric substrate (5) is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires (1) and the little blade unit of a plurality of circuit (2), and two wires (1) and the little blade unit of a plurality of circuit (2) insulate each other; The little blade unit of each circuit (2) is provided with led chip die bond zone.
2. LED flexible circuit board as claimed in claim 1, it is characterized in that: the width dimensions of described dielectric substrate (5) is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate (5) is more than or equal to the length dimension of flexible metal base plate.
3. LED flexible circuit board as claimed in claim 2 is characterized in that: the little blade units of a plurality of described circuits (2) adopt the rectangular array mode to arrange.
4. such as claim 1 or 2 or 3 described LED flexible circuit board, it is characterized in that: described dielectric substrate (5) adopts and can crooked material make.
5. LED flexible circuit board as claimed in claim 4 is characterized in that: described dielectric substrate (5) adopts the material of the high temperature can anti-LED Reflow Soldering the time to make.
6. LED flexible circuit board as claimed in claim 5, it is characterized in that: include multirow and the little blade unit of multiple row circuit (2) array, be provided with the interval trough (7) of rectangle between the little blade unit of every column line (2), the two ends of the little blade unit of every column line (2) are provided with location hole (4); The little blade unit of each circuit (2) has included lock shape groove (6), and led chip die bond zone (8) is positioned at the space that lock shape groove (6) surrounds.
7. LED flexible circuit board as claimed in claim 5 is characterized in that: include the little blade unit of delegation's multiple row circuit (2) array, isolate by isolation channel (9) between the little blade unit of adjacent lines (2); The two ends of the little blade unit of circuit (2) are provided with a plurality of location holes (4).
8. such as the manufacture method of claim 1 or 2 or 3 described LED usefulness flexible circuit board, it is characterized in that: comprise the steps:
The first step: with a continuous pre-stamping-out of metal tape warp, formation has the flexible metal base plate of two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively has a little muscle to link to each other with one of two wires and adjacent circuit small pieces unit main body;
Second step: with flexible metal base plate and a width dimensions more than or equal to the metal tape width dimensions, continuous dielectric substrate pressing;
The 3rd step: stamping-out again, all little muscle that each circuit small pieces unit main body and one of two wires and adjacent circuit small pieces unit main body are linked to each other local or all stamping-outs fall, form two wires and the little blade unit of a plurality of circuit that insulate each other.
9. LED as claimed in claim 8 is with the manufacture method of flexible circuit board, and it is characterized in that: in the first step, continuous metal tape adopts the coiled strip form to get the raw materials ready, and the flexible metal base plate behind the pre-stamping-out reticulates.
10. LED as claimed in claim 9 is with the manufacture method of flexible circuit board, and it is characterized in that: in the second step, continuous dielectric substrate is that material is flexible, and a kind of continuous sheet coiled strip of the high temperature during ability LED Reflow Soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198554.3A CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198554.3A CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883527A true CN102883527A (en) | 2013-01-16 |
| CN102883527B CN102883527B (en) | 2015-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110198554.3A Expired - Fee Related CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659195A (en) * | 2014-12-24 | 2015-05-27 | 绍兴文理学院 | Reflection type white light LED light source |
| CN105792534A (en) * | 2014-12-23 | 2016-07-20 | 芜湖德豪润达光电科技有限公司 | Manufacturing method of unetched circuit board and unetched circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2120518A2 (en) * | 2008-05-15 | 2009-11-18 | Everlight Electronics Co., Ltd. | Circuit substrate and light emitting diode package |
| CN101621052A (en) * | 2008-07-04 | 2010-01-06 | 一诠精密工业股份有限公司 | LED encapsulating array, structure and method |
| CN201944785U (en) * | 2010-07-20 | 2011-08-24 | 王定锋 | LED lamp circuit board formed by connecting two platy lines in parallel |
-
2011
- 2011-07-15 CN CN201110198554.3A patent/CN102883527B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2120518A2 (en) * | 2008-05-15 | 2009-11-18 | Everlight Electronics Co., Ltd. | Circuit substrate and light emitting diode package |
| CN101621052A (en) * | 2008-07-04 | 2010-01-06 | 一诠精密工业股份有限公司 | LED encapsulating array, structure and method |
| CN201944785U (en) * | 2010-07-20 | 2011-08-24 | 王定锋 | LED lamp circuit board formed by connecting two platy lines in parallel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792534A (en) * | 2014-12-23 | 2016-07-20 | 芜湖德豪润达光电科技有限公司 | Manufacturing method of unetched circuit board and unetched circuit board |
| CN104659195A (en) * | 2014-12-24 | 2015-05-27 | 绍兴文理学院 | Reflection type white light LED light source |
| CN104659195B (en) * | 2014-12-24 | 2017-08-29 | 绍兴文理学院 | A kind of reflection white-light LED/light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102883527B (en) | 2015-08-05 |
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Effective date of registration: 20190912 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: 519000 Guangdong city of Zhuhai Province Tang Jia Wan Jin Feng Lu No. 1 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
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Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 |
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| CF01 | Termination of patent right due to non-payment of annual fee |