CN102883527B - The manufacture method of LED flexible circuit board - Google Patents
The manufacture method of LED flexible circuit board Download PDFInfo
- Publication number
- CN102883527B CN102883527B CN201110198554.3A CN201110198554A CN102883527B CN 102883527 B CN102883527 B CN 102883527B CN 201110198554 A CN201110198554 A CN 201110198554A CN 102883527 B CN102883527 B CN 102883527B
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- base plate
- circuit
- metal base
- wires
- flexible
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Abstract
The invention provides a kind of manufacture method of LED flexible circuit board, shorten the technological process of flexible circuit board, without the need to by plating and etch process, therefore also there is not industrial chemicals consumption, can reduce costs widely and man-hour, and not pollute the environment.LED flexible circuit board includes: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate, described dielectric substrate is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires and the little blade unit of a plurality of circuit, and two wires and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with LED chip die bond region.The manufacture method of this LED flexible circuit board adopts three-step approach shaping, highly shortened technological process, enhances productivity, can be applied in LED light source or the module of continuous seepage flexible circuit board and subsequent technique on streamline.
Description
Technical field
The invention belongs to electronic circuit board and application thereof, particularly relate to a kind of manufacture method of LED flexible circuit board.
Background technology
In prior art.For the common flexible printed circuit board (FPC) of field of LED illumination, adopt printing technology to produce, technological process is long, and production stage is many, time-consuming, therefore price, and plating in production process and etching process procedure also pollute the environment.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of LED flexible circuit board, shorten the technological process of flexible circuit board, without the need to by plating and etch process, therefore also there is not industrial chemicals consumption, can reduce costs widely and man-hour, and not pollute the environment.
The present invention is achieved through the following technical solutions:
LED flexible circuit board, wherein, includes: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate, described dielectric substrate is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires and the little blade unit of a plurality of circuit, and two wires and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with LED chip die bond region.
The width dimensions of described dielectric substrate is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate is more than or equal to the length dimension of flexible metal base plate.
The little blade unit of a plurality of circuit adopts rectangular array mode to arrange.
The manufacture method of above-mentioned LED flexible circuit board, wherein, comprises the steps:
The first step: by a continuous print metal tape through pre-stamping-out, form the flexible metal base plate with two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively there is a little muscle to be connected with one of two wires and adjacent circuit small pieces unit main body;
Second step: flexible metal base plate and width dimensions are more than or equal to metal tape width dimensions, the pressing of continuous print dielectric substrate;
3rd step: stamping-out again, all little muscle local each circuit small pieces unit main body be connected with one of two wires and adjacent circuit small pieces unit main body or all stamping-out fall, and form two wires and the little blade unit of a plurality of circuit that insulate each other.
Beneficial effect of the present invention is as follows:
A kind of LED flexible circuit board of the present invention, owing to including: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate, described dielectric substrate is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires and the little blade unit of a plurality of circuit, and two wires and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with LED chip die bond region; Form two wires insulating each other and a plurality of circuit small pieces, and form the series-parallel circuit of welding LED lamp bead or chip, form a continuous print, can cutting segmentation LED flexible circuit board; Welding LED lamp bead or the series-parallel circuit of chip can be formed in later stage operation, form a continuous print, can the flexible circuit board with LED light source of cutting segmentation.And due to the manufacture method of this LED flexible circuit board, adopt the flexible circuit board that three-step approach is shaping, highly shortened technological process, and there is not common flexible print flexible circuit board and produce necessary plating and etch process, therefore there is not industrial chemicals consumption yet, therefore can reduce costs widely and man-hour, enhance productivity, and do not pollute the environment.Another large benefit of the present invention is, can be applied in LED light source or the module of continuous seepage flexible circuit board and subsequent technique on streamline.
Accompanying drawing explanation
Fig. 1 is the pre-blanking structure schematic diagram of LED flexible circuit board embodiment one of the present invention;
Fig. 2 is the pre-blanking structure schematic diagram of LED flexible circuit board embodiment two of the present invention;
Fig. 3 is blanking structure schematic diagram again after LED flexible circuit board embodiment one of the present invention pressing;
Fig. 4 is blanking structure schematic diagram again after LED flexible circuit board embodiment two of the present invention pressing;
Fig. 5 is stamping-out structure for amplifying schematic diagram again after LED flexible circuit board embodiment one of the present invention pressing.
Description of reference numerals:
1, wire, 2, the little blade unit of circuit, 3, little muscle, 4, location hole, 5, dielectric substrate, 6, lock shape groove, 7, interval trough, 8, LED chip die bond region, 9, isolation channel.
Embodiment
Ask for an interview Fig. 1 to Fig. 5, the invention discloses a kind of LED flexible circuit board, wherein, include: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate 5, described dielectric substrate 5 is pressed together on the bottom of flexible metal base plate; Described flexible metal base plate includes two wires 1 and the little blade unit of a plurality of circuit 2, two wires 1 and the little blade unit 2 of a plurality of circuit and insulate each other; The little blade unit 2 of each circuit is provided with LED chip die bond region.
The width dimensions of described dielectric substrate 5 is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate 5 is more than or equal to the length dimension of flexible metal base plate.
The little blade unit 2 of a plurality of circuit adopts rectangular array mode to arrange.
Described dielectric substrate 5 adopts the material that can bend to make.
Described dielectric substrate 5 adopt can resistance to LED Reflow Soldering time the material of high temperature make.
Embodiment one:
In the present embodiment, as shown in Fig. 1,3,5, include multirow and multiple row circuit little blade unit 2 array, be provided with the interval trough 7 of rectangle between the little blade unit 2 of every column line, the two ends of the little blade unit 2 of every column line are provided with location hole 4; The little blade unit 2 of each circuit has included lock shape groove 6, and LED chip die bond region 8 is positioned at the space that lock shape groove 6 surrounds.
Embodiment two:
In the present embodiment, as shown in Figure 2,4, include a line multiple row circuit little blade unit 2 array, isolated by isolation channel 9 between the little blade unit 2 of adjacent lines; The two ends of the little blade unit of circuit 2 are provided with multiple location hole 4.
The manufacture method of above-mentioned LED flexible circuit board, wherein, comprises the steps:
The first step: by a continuous print metal tape through pre-stamping-out, form the flexible metal base plate with two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively there is a little muscle to be connected with one of two wires and adjacent circuit small pieces unit main body;
Second step: flexible metal base plate and width dimensions are more than or equal to metal tape width dimensions, the pressing of continuous print dielectric substrate;
3rd step: stamping-out again, all little muscle local each circuit small pieces unit main body be connected with one of two wires and adjacent circuit small pieces unit main body or all stamping-out fall, and form two wires and the little blade unit of a plurality of circuit that insulate each other.
In the above-mentioned first step, continuous print metal tape adopts coiled strip form to get the raw materials ready, and the flexible metal base plate after pre-stamping-out reticulates, as accompanying drawing 1.
In above-mentioned second step, continuous print dielectric substrate is material is flexible, and a kind of continuous sheet coiled strip of high temperature during ability LED Reflow Soldering.
After above-mentioned 3rd step, form welding LED lamp bead and maybe can carry out the series-parallel circuit of COF encapsulation, form a continuous print, can the flexible circuit board with LED light source of cutting segmentation.
In embodiment one, for adapting to the needs that COF (Chip On The Flexible) encapsulates, there is the lock shape groove needed for LED, to be combined more firm with packing colloid and flexible circuit board in each circuit small pieces punching.
Above-mentioned listed specific implementation is nonrestrictive, and to one skilled in the art, not departing from the scope of the invention, the various modifications and variations of carrying out, all belong to protection scope of the present invention.
Claims (5)
- The manufacture method of 1.LED flexible circuit board, described LED flexible circuit board includes: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate (5), described dielectric substrate (5) is pressed together on the bottom of flexible metal base plate;Described flexible metal base plate includes two wires (1) and the little blade unit of a plurality of circuit (2), and two wires (1) and the little blade unit of a plurality of circuit (2) insulate each other; The little blade unit of each circuit (2) is provided with LED chip die bond region; It is characterized in that: comprise the steps:The first step: by a continuous print metal tape through pre-stamping-out, form the flexible metal base plate with two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively there is a little muscle to be connected with one of two wires and adjacent circuit small pieces unit main body;Second step: flexible metal base plate and width dimensions are more than or equal to metal tape width dimensions, the pressing of continuous print dielectric substrate;3rd step: stamping-out again, all little muscle local each circuit small pieces unit main body be connected with one of two wires and adjacent circuit small pieces unit main body or all stamping-out fall, and form two wires and the little blade unit of a plurality of circuit that insulate each other.
- The manufacture method of 2.LED flexible circuit board, described LED flexible circuit board includes: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate (5), described dielectric substrate (5) is pressed together on the bottom of flexible metal base plate;Described flexible metal base plate includes two wires (1) and the little blade unit of a plurality of circuit (2), and two wires (1) and the little blade unit of a plurality of circuit (2) insulate each other; The little blade unit of each circuit (2) is provided with LED chip die bond region; The width dimensions of described dielectric substrate (5) is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate (5) is more than or equal to the length dimension of flexible metal base plate; It is characterized in that: comprise the steps:The first step: by a continuous print metal tape through pre-stamping-out, form the flexible metal base plate with two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively there is a little muscle to be connected with one of two wires and adjacent circuit small pieces unit main body;Second step: flexible metal base plate and width dimensions are more than or equal to metal tape width dimensions, the pressing of continuous print dielectric substrate;3rd step: stamping-out again, all little muscle local each circuit small pieces unit main body be connected with one of two wires and adjacent circuit small pieces unit main body or all stamping-out fall, and form two wires and the little blade unit of a plurality of circuit that insulate each other.
- The manufacture method of 3.LED flexible circuit board, described LED flexible circuit board includes: by a continuous print metal tape through the flexible metal base plate of stamping-out and dielectric substrate (5), described dielectric substrate (5) is pressed together on the bottom of flexible metal base plate;Described flexible metal base plate includes two wires (1) and the little blade unit of a plurality of circuit (2), and two wires (1) and the little blade unit of a plurality of circuit (2) insulate each other; The little blade unit of each circuit (2) is provided with LED chip die bond region; The width dimensions of described dielectric substrate (5) is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate (5) is more than or equal to the length dimension of flexible metal base plate; The little blade unit of a plurality of described circuits (2) adopt rectangular array mode to arrange; It is characterized in that: comprise the steps:The first step: by a continuous print metal tape through pre-stamping-out, form the flexible metal base plate with two wires and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body at least respectively there is a little muscle to be connected with one of two wires and adjacent circuit small pieces unit main body;Second step: flexible metal base plate and width dimensions are more than or equal to metal tape width dimensions, the pressing of continuous print dielectric substrate;3rd step: stamping-out again, all little muscle local each circuit small pieces unit main body be connected with one of two wires and adjacent circuit small pieces unit main body or all stamping-out fall, and form two wires and the little blade unit of a plurality of circuit that insulate each other.
- 4. the manufacture method of the LED flexible circuit board as described in claim 1 or 2 or 3, is characterized in that: in the first step, and continuous print metal tape adopts coiled strip form to get the raw materials ready, and the flexible metal base plate after pre-stamping-out reticulates.
- 5. the manufacture method of LED flexible circuit board as claimed in claim 4, it is characterized in that: in second step, continuous print dielectric substrate is material is flexible, and a kind of continuous sheet coiled strip of high temperature during ability LED Reflow Soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198554.3A CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110198554.3A CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883527A CN102883527A (en) | 2013-01-16 |
| CN102883527B true CN102883527B (en) | 2015-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110198554.3A Expired - Fee Related CN102883527B (en) | 2011-07-15 | 2011-07-15 | The manufacture method of LED flexible circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN102883527B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792534A (en) * | 2014-12-23 | 2016-07-20 | 芜湖德豪润达光电科技有限公司 | Manufacturing method of unetched circuit board and unetched circuit board |
| CN104659195B (en) * | 2014-12-24 | 2017-08-29 | 绍兴文理学院 | A kind of reflection white-light LED/light source |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI488329B (en) * | 2008-05-15 | 2015-06-11 | Everlight Electronics Co Ltd | Circuit substrate and light emitting diode chip package |
| CN101621052B (en) * | 2008-07-04 | 2011-01-26 | 一诠精密工业股份有限公司 | LED encapsulating array, structure and method |
| CN201944785U (en) * | 2010-07-20 | 2011-08-24 | 王定锋 | LED lamp circuit board formed by connecting two platy lines in parallel |
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2011
- 2011-07-15 CN CN201110198554.3A patent/CN102883527B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN102883527A (en) | 2013-01-16 |
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Effective date of registration: 20190912 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: 519000 Guangdong city of Zhuhai Province Tang Jia Wan Jin Feng Lu No. 1 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
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Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
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Granted publication date: 20150805 |