CN202695547U - Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board - Google Patents
Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board Download PDFInfo
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- CN202695547U CN202695547U CN 201220250755 CN201220250755U CN202695547U CN 202695547 U CN202695547 U CN 202695547U CN 201220250755 CN201220250755 CN 201220250755 CN 201220250755 U CN201220250755 U CN 201220250755U CN 202695547 U CN202695547 U CN 202695547U
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- led
- wire
- line plate
- led chip
- wire line
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Abstract
The utility model relates to a light-emitting diode (LED) circuit component with an LED chip directly encapsulated on a wire circuit board. The LED circuit component comprises the wire circuit board, the LED chip and an encapsulation structure, at least two wires are arranged in an concatenate mode to form the wire circuit board, the wires are fixed on an insulating layer, the LED chip is directly encapsulated on the wire circuit board by a chip on board (COB) technology, the LED chip is connected with corresponding wires, and the encapsulation structure is used for encapsulating the LED chip. According to the light-emitting diode (LED) circuit component with the LED chip directly encapsulated on the wire circuit board, the LED chip is directly encapsulated on the wire circuit board by the COB technology without other welding processes, simultaneously materials are saved, the manufacturing time is shortened, the production efficiency is greatly improved, the production cost is lowered, the pollution of etching to the environment in the traditionally manufacturing process of circuit boards is reduced, and thereby the LED circuit component is extremely environment-friendly.
Description
Technical field
The utility model relates to led circuit and LED application, is specifically related on the wire line plate direct packaging LED chips and the led circuit assembly that integrates with the wire line plate.
Background technology
COB (Chip On Board) technology is the technology that just occurs in recent years, is about to the electronic devices and components chip and directly is contained on the circuit board.But, in led circuit assembly and LED application product field, not yet occur to adopt the COB mode that led chip directly is encapsulated in led circuit subassembly product on the wire line plate juxtaposition wire.
Although industry is existing led chip is encapsulated in product on the electric wire, the utility model is that wire producing is become the wiring board encapsulation, therefore with prior art very big-difference is arranged.Led chip is encapsulated in two products on the electric wire arranged side by side at present, and packaging efficiency is very low, and the encapsulation consistency is poor, causes LED luminosity and aberration large.
Summary of the invention
The utility model is that wire is made wiring board, then packaging LED chips is the COB encapsulation of mature technology fully on the wire line plate, the led circuit assembly that directly encapsulates, to be encapsulated on whole the wire line plate a plurality of led chips are disposable, the structural integrity of encapsulation is high, each point is luminous all more consistent, and packaging efficiency improves decades of times than the existing product that led chip is encapsulated on the electric wire.
Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition term " wiring board " and " circuit board " can use interchangeably in the application, and term " circuit " and " circuit " can use interchangeably also in the application.
In the utility model, term " wire line plate " is to be different from traditional wiring board.Particularly, " wire line plate " refers to those directly modes by non-etching, non-printing, and for example, the modes such as juxtaposition wiring form the wire line plate of circuit.For example, this class wire can be the juxtaposed flat conductor of directly cutting formation with sheet metal, can be the circle line, etc.According to the difference of substrate, " wire line plate " can be soft board, also can be hardboard.And, since " wire line plate " in the utility model do not relate to chemical etching, printing etc. may be to the technique of environment, be environment amenable environment-protective process therefore, also be that country supports the industry direction of development energetically at present.
It will be appreciated by those skilled in the art that the led chip in the utility model can be the led chip of any type, comprise the chip that long wave led chip of all kinds, indigo plant, green light LED chip, white light LEDs are used, high-power LED chip, etc.Therefore scope of the present utility model is only limited by claims.
The utility model relates to a kind of directly led circuit assembly of packaging LED chips on the wire line plate, particularly, can adopt the hot pressing of flat conductor Alignment to be fixed on the insulating barrier with glueability, form a kind of LED wire line plate, then with the COB technology led chip directly is encapsulated on adjacent two wires, forms a kind of directly led circuit assembly of packaging LED chips on the wire line plate.
Perhaps, can adopt the hot pressing of flat conductor Alignment to be fixed on the insulating barrier with glueability, needs according to line design, the position that the excision wire need to disconnect, obtain the conducting wire, form LED wire line plate, then led chip directly be encapsulated on the two ends at incision site place of LED wire line plate excision with the COB technology, form a kind of direct on the wire line plate led circuit assembly of packaging LED chips.
The advantage of the circuit board structure of this kind led chip and the integrated making of wire line plate comprises, after led chip need not encapsulate again SMT dress paste the step that is welded to the wire line plate, therefore a part of material in the encapsulation, the cost such as artificial have been saved, also save simultaneously processing step and shortened Production Time, greatly improved production efficiency; Reduced production cost; Reduce traditional mode of production and made etching pollution on the environment in the wiring board process, thereby very environmental protection.
According to the utility model, a kind of directly led circuit assembly of packaging LED chips on the wire line plate is provided, comprising: have the LED wire line plate of the formed circuit of wire of at least two Alignments, described wire is fixed on the insulating barrier; Employing COB technology directly is encapsulated in the led chip on adjacent two wires of described wire line plate; With the encapsulating structure that is used for encapsulating described led chip.
According to the utility model, a kind of directly led circuit assembly of packaging LED chips on the wire line plate also is provided, comprise: the wire line plate, described wire line plate has the formed circuit of one or more wire, and described one or more wire is fixed on the insulating barrier; Wire at described wire line plate arranges otch, forms the wire line plate; Adopt the COB technology directly to be encapsulated in led chip on two end points of wire otch of described wire line plate; With the encapsulating structure that is used for encapsulating described led chip.
According to an embodiment of the present utility model, described wire line plate is flexible wire line plate or the wire line plate of rigidity, and described wire be Alignment be fixed on wire on the described insulating barrier with glueability by hot pressing.
According to another embodiment of the present utility model, described encapsulating structure is the COB encapsulating structure.
According to another embodiment of the present utility model, described led chip is encapsulated between two described wires adjacent one another are of described wire line plate.
According to another embodiment of the present utility model, the wherein positive wire of a described led chip of wire bond adjacent one another are, the negative wire of the described led chip of wherein another wire bond adjacent one another are.
According to another embodiment of the present utility model, described wire is the circle line, or adopts the circle line pressure to prolong the flat conductor of making, or divides the flat conductor that cuts into metal forming, metallic plate or metal tape.
According to another embodiment of the present utility model, described led chip adopts the COB technology directly to be encapsulated on the two-end-point of juxtaposition wire otch of corresponding described wire line plate.
According to another embodiment of the present utility model, the positive wire nation of described led chip fixes on the wire of corresponding described otch one end, and the negative wire nation of described led chip fixes on the wire of the corresponding described otch other end.
According to another embodiment of the present utility model, described wire is fixed on the wire on the described insulating barrier with glueability by hot pressing.
According to the utility model, a kind of directly led circuit assembly of packaging LED chips on the wire line plate also is provided, comprising: LED wire line plate; Employing COB technology directly is encapsulated in the led chip on the described LED wire line plate; With the encapsulating structure that is used for encapsulating described led chip.
According to another embodiment of the present utility model, described wire is conducting metal or alloy silver jacketed wire, conducting metal or Alloy Plating nickel wire, conducting metal or alloy nickel plating gold thread.
According to the utility model, the hot pressing of available flat conductor Alignment is fixed on the insulating barrier with glueability, form a kind of LED wire line plate, then with the COB technology led chip directly is encapsulated on adjacent two wires, forms a kind of directly led circuit assembly of packaging LED chips on the wire line plate.According to another embodiment of the present utility model, described encapsulation is the encapsulation that led chip is used the COB technology.
According to another embodiment of the present utility model, described led circuit assembly is used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Panel light, LED sign module or LED Christmas lamp.
In this usefulness is novel, led chip directly is encapsulated on the LED wire line plate, allow led chip and LED wire line plate directly encapsulate and form as one.The structure that this employing COB technology directly is integrated led chip and LED wire line plate, without after the LED encapsulation again the SMT dress paste the step that is welded to the wire line plate, make simultaneously the wire line plate and do not need etching, its manufacture method has been saved material and has been shortened Production Time, has greatly improved production efficiency; Reduce traditional mode of production and made etching pollution on the environment in the wiring board process; Also reduced greatly production cost.Responded the call of country for energy-saving and emission-reduction.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram of flat conductor.
Fig. 2 is the schematic diagram of juxtaposition groove mould.
Fig. 3 is the cross-sectional view of juxtaposition groove mould.
Fig. 4 is flat conductor juxtaposition wiring diagram.
Fig. 5 is the schematic diagram that the juxtaposition flat conductor is adhesively fixed.
Fig. 6 is that led chip nation fixes on the schematic diagram on adjacent two wires of wire guide plate.
Fig. 7 is the schematic diagram after nation between adjacent two lines of LED wire line plate decides chip, sealing curing.
Fig. 8 is after led chip is encapsulated between adjacent two wires of wire guide plate, cuts into the schematic diagram of wall scroll product.
Fig. 9 is the schematic diagram of wiring board after the die-cut disconnection in the position that wire need disconnect of wire.
Figure 10 is that led chip nation fixes on the schematic diagram on the two ends, incision site place of LED wire line plate excision.
Figure 11 is the schematic diagram of LED wire line plate after place, the incision site two ends nation of excision decides LED core, sealing.
Figure 12 is after led chip is encapsulated in the place, incision site two ends of LED wire line plate, cuts into the schematic diagram of wall scroll product.
Figure 13 is the generalized section that led chip is encapsulated in the incision site place of LED wire line plate.
Embodiment
The below will to this usefulness novel directly on the wire line plate implementation of the led circuit assembly of packaging LED chips be described in more detail.
But, it will be appreciated by those skilled in the art that these execution modes have only enumerated some specific embodiment of the utility model, to the utility model and protection range thereof without any restriction.For example, the structure of wire line plate is not limited to the structure shown in the following specific embodiment, and the fixed position of led chip nation and mode also to be not limited to specific embodiment described.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the novel basic conception of this usefulness, these all belong in the novel scope of this usefulness.The novel scope of this usefulness is only limited by claim.
Embodiment one is packaging LED chips between adjacent two wires of wire line plate
One, the making of wire line plate
1, the making of wire:
Can take Copper Foil itemize cutting making or roll copper cash with calender, form the flat conductor 1 of one fixed width and thickness, i.e. the wire 1 (as shown in Figure 1) of wire line plate.
2. the juxtaposition groove mould is made:
Adopt the method for etching or machining with minute surface stainless steel plate, process the juxtaposition groove 2 corresponding with circuit 1 width, and being provided with vacuum-pumping tube 3 (as shown in Figure 2), the degree of depth of groove 2 is preferably than the thickness of flat conductor 1 more shallow (as shown in Figure 3).
3. paste and close insulating substrate
To aim at overlapping with the one side (as shown in Figure 4) that is furnished with flat conductor 1 on the polyimides coverlay 4 of epoxy adhesive and the wiring mould, hot pressing 5-10 second, make juxtaposition flat conductor 1 bonding being transferred on the coverlay 4, separate and take the wiring mould away, flat conductor circuit 1 has shifted and has been fixed on the coverlay 4 at this moment, then that face in the exposure of circuit 1 arranges release film, continuation was 150 ℃ to 180 ℃ lower hot pressing 90 seconds to 180 seconds, take out after fixedly securing flat conductor circuit 1, in baking box, 120 ℃ to 160 ℃ lower curing 45 minutes to 90 minutes, be made into LED wire line plate as shown in Figure 5.
4. utilize the basic conception of COB technology, led chip is encapsulated on the wire line plate
Clean as shown in Figure 5 LED wire line plate → for example adjacent two wires 1 of this LED wire line plate wherein one drip bonded adhesives → paste in the position of dripping bonded adhesives led chip 6 and oven dry, and then fixed (bonding) led chip 6 of nation, for example, according to a preferred embodiment, the positive wire nation of led chip 6 can be fixed on wherein wire of adjacent two wires, the negative wire nation of led chip 6 is fixed on (as shown in Figure 6) on another wire → test → seal up encapsulation with the product (as shown in Figure 8) of glue 7 (as shown in Figure 7) → solidify → test → cut into wall scroll → FQC → pack → put in storage.
Here, those of ordinary skill in the art is familiar with fixed (bonding) technology of traditional nation and the encapsulation technology of led chip very much, therefore repeats no more.
Encapsulation can be traditional epoxide-resin glue with glue 7, and still, the needs according to using for example, when the packaged high-power LED chip, also can adopt silica gel or other packaging plastic, etc.
Embodiment two is at the two ends of the incision site of the wire of wire line plate packaging LED chips
1, the making of the wire of LED wire line plate (circuit):
According to a preferred embodiment, can take the cutting of Copper Foil itemize to be made or rolled copper cash with calender, form the flat conductor 1 of one fixed width and thickness, i.e. the wire 1 (as shown in Figure 1) of wire line plate.
2. the juxtaposition groove mould is made:
Adopt the method for etching or machining with minute surface stainless steel plate, process the juxtaposition groove 2 corresponding with circuit 1 width, and being provided with vacuum-pumping tube 3 (as shown in Figure 2), the degree of depth of groove 2 is preferably than the thickness of flat conductor 1 more shallow (as shown in Figure 3).
3. paste and close insulating substrate
To aim at overlapping with the one side (as shown in Figure 4) that is furnished with flat conductor 1 on the polyimides coverlay 4 of epoxy adhesive and the wiring mould, hot pressing 5-10 second, make juxtaposition flat conductor 1 bonding being transferred on the coverlay 4, separate and take the wiring mould away, flat conductor circuit 1 has shifted and has been fixed on the coverlay 4 at this moment, then that face in the exposure of circuit 1 arranges release film, continuation was 150 ℃ to 180 ℃ lower hot pressing 90 seconds to 180 seconds, take out after fixedly securing flat conductor circuit 1, in baking box, 120 ℃ to 160 ℃ lower curing 45 minutes to 90 minutes, be made into the wire line plate blank that does not form otch as shown in Figure 5.
4. according to the needs of line design, for example use the position of the need disconnection of die punching flat conductor 1, stay otch 5 (as shown in Figure 9), be made into like this wire line plate as shown in Figure 9.
5. utilize the basic conception of COB technology, led chip is encapsulated on the LED wire line plate
An end that cleans as shown in Figure 9 LED wire line plate → at the die cuts place of wire guide plate drips bonded adhesives → paste in the position of dripping bonded adhesives led chip 6 and oven dry, and then nation decides led chip 6, for example, but the positive wire nation of led chip 6 fixes on the circuit 1 of otch 5 one ends, but the negative wire nation of led chip 6 fixes on the product (as shown in figure 12) of (as shown in figure 10) → test → sealing 7 (shown in Figure 11,13) on the circuit 1 of otch 5 other ends → solidify → test → cut into wall scroll → FQC → packing → warehouse-in.
Certainly, those skilled in the art obviously understand easily, according to the needs of application scenario and LED wire line plate layout, can also adopt the COB technology to install, encapsulate other required electronic devices and components at the wire line plate, etc.
Below by reference to the accompanying drawings will be directly on LED wire line plate the wiring board specific embodiment of packaging LED chips the utility model is described in detail.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, the scope of scope, the especially claim novel to this usefulness does not have any restriction.
Claims (10)
1. direct led circuit assembly of packaging LED chips on the wire line plate comprises:
Wire line plate with formed circuit of wire of at least two Alignments, wherein, described wire is fixed on the insulating barrier;
Employing COB technology directly is encapsulated in the led chip on adjacent two wires of described wire line plate; With
Be used for encapsulating the encapsulating structure of described led chip.
2. direct led circuit assembly of packaging LED chips on the wire line plate comprises:
The wire line plate, described wire line plate has the formed circuit of one or more wire, and described one or more wire is fixed on the insulating barrier;
Wire at described wire line plate arranges otch, forms the wire line plate;
Adopt the COB technology directly to be encapsulated in led chip on two end points of wire otch of described wire line plate; With
Be used for encapsulating the encapsulating structure of described led chip.
3. led circuit assembly according to claim 1 and 2, it is characterized in that: described wire line plate is flexible wire line plate or the wire line plate of rigidity, and described wire be Alignment be fixed on wire on the described insulating barrier with glueability by hot pressing.
4. led circuit assembly according to claim 1 and 2, it is characterized in that: described encapsulating structure is the COB encapsulating structure.
5. led circuit assembly according to claim 1, it is characterized in that: described led chip is encapsulated between two described wires adjacent one another are of described wire line plate.
6. led circuit assembly according to claim 1 or 5 is characterized in that: the wherein positive wire of a described led chip of wire bond adjacent one another are, the negative wire of the described led chip of wherein another wire bond adjacent one another are.
7. led circuit assembly according to claim 1 and 2 is characterized in that: described wire is the circle line, or adopts the circle line pressure to prolong the flat conductor of making, or divides the flat conductor that cuts into metal forming, metallic plate or metal tape.
8. led circuit assembly according to claim 2 is characterized in that: described led chip adopts the COB technology directly to be encapsulated on the two-end-point of juxtaposition wire otch of corresponding described wire line plate.
9. led circuit assembly according to claim 8, it is characterized in that: the positive wire nation of described led chip fixes on the wire of corresponding described otch one end, and the negative wire nation of described led chip fixes on the wire of the corresponding described otch other end.
10. led circuit assembly according to claim 1 and 2, it is characterized in that: described led circuit assembly is used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Panel light, LED sign module or LED Christmas lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220250755 CN202695547U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220250755 CN202695547U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN202695547U true CN202695547U (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220250755 Expired - Lifetime CN202695547U (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036171A (en) * | 2018-07-10 | 2018-12-18 | 中航华东光电有限公司 | Liquid crystal display signal converting band encapsulating method |
-
2012
- 2012-05-21 CN CN 201220250755 patent/CN202695547U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036171A (en) * | 2018-07-10 | 2018-12-18 | 中航华东光电有限公司 | Liquid crystal display signal converting band encapsulating method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |
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| CX01 | Expiry of patent term |