CN202695546U - Light emitting diode (LED) support with surface mount device resistors and LED device with same - Google Patents
Light emitting diode (LED) support with surface mount device resistors and LED device with same Download PDFInfo
- Publication number
- CN202695546U CN202695546U CN2012202507267U CN201220250726U CN202695546U CN 202695546 U CN202695546 U CN 202695546U CN 2012202507267 U CN2012202507267 U CN 2012202507267U CN 201220250726 U CN201220250726 U CN 201220250726U CN 202695546 U CN202695546 U CN 202695546U
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- CN
- China
- Prior art keywords
- led
- led support
- chip
- support
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode (LED) support with surface mount device resistors and an LED device with the same, in particular to an LED support with surface mount device resistors. The LED support comprises LED support bodies which are directly formed by metal plates, and the surface mounted resistors, wherein each LED support body comprises two electrode pins, and a disconnection gap for directly mounting the corresponding surface mounted resistor is formed on at least one of the electrode pins; and each surface mounted resistor is mounted and welded at two ends of the disconnection gap of the corresponding LED support body according to a surface mount technology (SMT) in a bridging mode. The utility model also discloses an LED device with the LED support. The LED device can be directly connected to a power supply line for use. Compared with the prior art, the LED device has the advantages that circuit boards are not required, so that the step of welding the LED device and other components with the circuit boards is eliminated, materials are saved, the manufacturing time is shortened, the production efficiency is greatly improved, the production cost is reduced, and a phenomenon that the environment is polluted due to etching in the conventional circuit board manufacturing process is avoided; and therefore, the LED device is very environment-friendly.
Description
Technical field
The utility model relates to the LED application, is specifically related to the led support of Chip-R and with the LED device of Chip-R.
Background technology
In traditional led support and LED element manufacturing and the application, all be to make first led support usually, packaging LED chips is made into LED lamp pearl, again with the LED lamp pearl made and other components and parts and welding circuit board together.This traditional fabrication method not only production process is quite loaded down with trivial details, and Production Time is long, and makes wiring board and also environment is caused severe contamination.
Therefore, in order to overcome above defective and deficiency, need the more simple and reliable LED device of a kind of structure.
Summary of the invention
The utility model relates to the led support of Chip-R and with the LED device of Chip-R, need not use wiring board, can be directly connected on the power line and use, reduced the welding step of LED device and other components and parts and wiring board, also save simultaneously material and shortened Production Time, greatly improved production efficiency; Reduced production cost; Its manufacture craft is cheap simply again, and alternative existing loaded down with trivial details traditional manufacturing technique can overcome defective and the deficiency of above-mentioned traditional handicraft.
Before describing the utility model in detail, it will be appreciated by those skilled in the art that the led chip in the utility model can be the led chip of any type, comprise the chip that long wave led chip of all kinds, indigo plant, green light LED chip, white light LEDs are used, high-power LED chip, etc.Therefore scope of the present utility model is only limited by claims.
The utility model relates to a kind of led support, sees that the electrode pins at led support arranges a disconnection breach, and Chip-R mounts on the two ends that are welded on breach with the mode SMT that builds bridge; Be encapsulated in the led chip on the led support; With the encapsulating structure that is used for packaging LED chips.The LED device that the utility model is made can be directly connected on the power line and use, compare with traditional manufacture craft, need not use wiring board, reduced the welding step of LED device and other components and parts and wiring board, also save simultaneously material and shortened Production Time, greatly improved production efficiency; Reduced production cost; Reduce traditional mode of production and made etching pollution on the environment in the wiring board process, thereby very environmental protection.
According to the utility model, a kind of led support with Chip-R is provided, comprise: by the led support of sheet metal direct forming, described led support comprises two electrode pins, is provided with for the disconnection breach that Chip-R directly is installed in one of them electrode pins; Chip-R, described Chip-R mounts on the two ends of the disconnection breach that is welded on described led support with the mode SMT that builds bridge.
According to an embodiment of the present utility model, on described led support, also be provided with for the bowl structure of settling led chip.
According to an embodiment of the present utility model, be provided with the solder joint for soldering surface mounted resistance at the two ends of described disconnection breach.
According to an embodiment of the present utility model, the welding resistance of described solder joint for soldering surface mounted resistance is the coverlay that welding resistance printing ink or heat pressure adhesive solidify.
According to an embodiment of the present utility model, described solder joint for soldering surface mounted resistance has silver coating.
According to an embodiment of the present utility model, has silver coating on the described bowl structure.
According to an embodiment of the present utility model, described led support is direct plugging-in led support, Cannibalistic fish LED bracket, patch-type led support or high-power LED bracket.
According to the utility model, a kind of LED device with Chip-R also is provided, comprising: according to the led support with Chip-R described in the utility model; Be encapsulated in the led chip on the described led support.
According to an embodiment of the present utility model, LED device of the present utility model also comprises be used to the encapsulating structure that encapsulates single or multiple led chips.
According to an embodiment of the present utility model, described encapsulating structure is encapsulation glue.
According to an embodiment of the present utility model, also comprise the encapsulating structure of the described Chip-R of injection encapsulated.
According to the utility model, a kind of LED device with Chip-R also is provided, comprising: led support; Arrange one on one electrode pins of led support and disconnect breach, Chip-R mounts on the two ends that are welded on breach with the mode SMT that builds bridge; Be encapsulated in the led chip on the led support; With the encapsulating structure that is used for packaging LED chips.
According to an embodiment of the present utility model, arrange one on the electrode pins of led support and disconnect breach, be provided with the solder joint of soldering surface mounted resistance at the two ends of breach.
According to an embodiment of the present utility model, the encapsulation of LED is the encapsulation of single-chip or the encapsulation of multi-chip.
According to an embodiment of the present utility model, Chip-R SMT is welded on the led support, forms one with led support.
According to an embodiment of the present utility model, the Chip-R that is welded on the led support can be enclosed in or seal separately or exposed need not sealing by injection moulding with the led chip wrapper.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the led support schematic diagram of going out with mould according to the utility model one embodiment.
Fig. 2 is at the breach two ends of led support one electrode pins shown in Figure 1 seal welding resistance printing ink, produces the schematic diagram of soldering surface mounted resistance spot weld.
To be Chip-R be welded on schematic diagram on the led support shown in Figure 2 by SMT to Fig. 3.
Fig. 4 is for being welded on led chip die bond nation line (bonding) schematic diagram on the led support according to the utility model one embodiment.
Fig. 5 be according to the utility model one embodiment with the schematic diagram after the led chip sealing shown in Figure 4.
Fig. 6 is the schematic diagram of the led support after supporting according to the pre-connection breaking of cutting away of the utility model one embodiment.
Fig. 7 is the schematic diagram of Chip-R by injection encapsulated on the led support of will being welded on according to the utility model one embodiment.
Embodiment
The below will be described in more detail to the led support with Chip-R of the present utility model and with the implementation of the LED device of Chip-R.
But, it will be appreciated by those skilled in the art that these execution modes have only enumerated the specific embodiment of some these realities inventions, to the utility model and protection range thereof without any restriction.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the utility model basic conception, these all belong in the scope of the present utility model.Scope of the present utility model is only limited by claim.
According to a preferred embodiment, metallic plate with rolling, for example steel plate or copper coin or iron plate, with the metallic plate of copper plate, etc., thickness is preferably 0.2～0.8 millimeter, with the continuous entire volume punching press of mould, cut away unwanted part metals on the sheet material, form the blank structure with at least two electrode pins of led support, as shown in Figure 1.Wherein, shown the blank structure of three led supports among Fig. 1, wherein each support is with two electrode pins, and is reserved with when die-cut between per two led support structures and prejudges connected support structure 2.
Disconnect breach 3 (or long and narrow hole, this long and narrow hole will form and disconnect breach) at least one electrode pins upper punch crush-cutting of each led support of design shown in Figure 1 except forming one in following process, obtain leaving the led support of pre-connection breaking support 2.Then, bear down on one in the led support upper punch with for example mould again and wafer bowl 1 (as shown in Figure 1).
Led support oil removing for example shown in Figure 1 is cleaned, and oven dry, have on the pin that disconnects breach 3 in punching, stamp welding resistance printing ink 4 at the two ends of breach 3, and baking and curing, form the solder joint 10 (as shown in Figure 2) of soldering surface mounted resistance.According to a preferred embodiment, in order to strengthen conductivity and non-oxidizability, wafer bowl 1 and the electrode pads of whole led support or led support can be carried out silver-plated processing.
Preferably mount welding procedure with traditional SMT, by solder joint 10 print solder paste on the steel mesh contraposition led support, Chip-R 5 can be mounted on the led support, cross reflow machine and weld, Chip-R 5 is welded to the form of building bridge on the position at breach 3 two ends of electrode pins of led support (as shown in Figure 3)
Cleaning is welded with the led support of Chip-R 5, then drip bonded adhesives at silver-plated wafer bowl 1, paste afterwards led chip 6 and oven dry in the position of dripping bonded adhesives, and then nation fixed (bonding) welding led chip 6, thereby the positive and negative electrode lead-in wire nation of LED is welded on surely on the solder joint of corresponding led support pin 8 (as shown in Figure 4).
Then; can test → seal up encapsulation and support 2 with the pre-connection breaking of glue 7 (as shown in Figure 5) → curing → excision; form similar direct insertion LED lamp pearl (the as shown in Figure 6) → pin of soldering surface mounted resistance is inserted in the injection mold of injection molding machine; inject raw material; injection encapsulated 9 is sealed protection (as shown in Figure 7) → test → FQC → packing → warehouse-in with Chip-R 5.
Through above-mentioned steps, complete with the LED device of Chip-R, this kind LED device need not used wiring board, can be directly connected on the power line and use, reduced the welding step of LED device and other components and parts and wiring board, also save simultaneously material and shortened Production Time, greatly improved production efficiency; Reduced production cost.
Below will be described in detail the utility model with the led support of Chip-R and with the LED device specific embodiment of Chip-R by reference to the accompanying drawings.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, the scope of scope, the especially claim novel to this usefulness does not have any restriction.Scope of the present utility model is only limited by claim.
Claims (10)
1. the led support with Chip-R is characterized in that, described led support comprises:
By the led support of sheet metal direct forming, described led support comprises two electrode pins, is provided with for the disconnection breach that Chip-R directly is installed in one of them electrode pins:
Chip-R, described Chip-R mounts on the two ends of the disconnection breach that is welded on described led support with the mode SMT that builds bridge.
2. led support according to claim 1 is characterized in that: also be provided with on described led support for the bowl structure of settling led chip.
3. led support according to claim 1 is characterized in that: be provided with the solder joint for soldering surface mounted resistance at the two ends of described disconnection breach.
4. led support according to claim 3 is characterized in that: the welding resistance of described solder joint for soldering surface mounted resistance is the coverlay that welding resistance printing ink or heat pressure adhesive solidify.
5. led support according to claim 2 is characterized in that: have silver coating on the described bowl structure.
6. each described led support according to claim 1-5 is characterized in that: described led support is direct plugging-in led support, Cannibalistic fish LED bracket, patch-type led support or high-power LED bracket.
7. LED device with Chip-R comprises:
Each described led support with Chip-R according to claim 1-6;
Be encapsulated in described with the led chip on the Chip-R led support.
8. LED device according to claim 7 is characterized in that: also comprise be used to the encapsulating structure that encapsulates single or multiple led chips.
9. it is characterized in that according to claim 7 or 8 described LED devices: described encapsulating structure is encapsulation glue.
10. each described LED device is characterized in that: the encapsulating structure that also comprises the described Chip-R of injection encapsulated according to claim 7-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202507267U CN202695546U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) support with surface mount device resistors and LED device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202507267U CN202695546U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) support with surface mount device resistors and LED device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695546U true CN202695546U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202507267U Expired - Lifetime CN202695546U (en) | 2012-05-21 | 2012-05-21 | Light emitting diode (LED) support with surface mount device resistors and LED device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202695546U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769097A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED bracket and LED device both with SMD resistors and manufacturing method thereof |
| WO2019148934A1 (en) * | 2018-01-31 | 2019-08-08 | 吴相勇 | Lighting fixture, in-line led bead, and manufacturing method |
-
2012
- 2012-05-21 CN CN2012202507267U patent/CN202695546U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769097A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED bracket and LED device both with SMD resistors and manufacturing method thereof |
| WO2019148934A1 (en) * | 2018-01-31 | 2019-08-08 | 吴相勇 | Lighting fixture, in-line led bead, and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |
|
| CX01 | Expiry of patent term |