CN102339404B - A kind of Novel intelligent card module and production technology thereof - Google Patents
A kind of Novel intelligent card module and production technology thereof Download PDFInfo
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- CN102339404B CN102339404B CN201010231647.7A CN201010231647A CN102339404B CN 102339404 B CN102339404 B CN 102339404B CN 201010231647 A CN201010231647 A CN 201010231647A CN 102339404 B CN102339404 B CN 102339404B
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Abstract
The invention discloses a kind of Novel intelligent card module and production technology, this module is formed by CFN module is bonding with carrier band, and its production technology includes step (1) paster; (2) carrier band is cut into; (3) punching; (4) test; (5) fabrication is completed. The present invention adopts CFN module to be combined with PET wiring board, and production efficiency is greatly improved, reduce smart card module produce material with manufacture cost.
Description
Technical field:
The present invention relates to microelectronic package technology, be specifically related to the production technology of a kind of novel intelligent object and this module.
Background technology:
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter. In field of intelligent cards, owing to safety and multi-functional requirement display gradually, it is desirable to increase reliability when cost reduces or be constant.
But the encapsulation of the intelligent object of routine is typically all the substrate layer using FR4 or G10 as carrier band, one side or double-side copper-applying circuit are set, then intelligent card chip paster, routing are connected, treat complete directly molding or UV encapsulation afterwards, realize the high reliability of smart card module. This method for packing, it is desirable to corresponding carrier band can directly beat gold thread, and this carrier band is all produced without competition by external producer at present, and die cost is high, and unit price is expensive. This makes intelligent object encapsulate costly, greatly reduces the market competitiveness of corresponding intelligent object.
The patent of invention of the applicant's application, application number: 200810036653.X, it discloses a kind of miniature radio frequency module and method for packing thereof, and the technical scheme of this patent is to be attached on carrier band by semiconductor chip, line lead of going forward side by side is bonded, and is finally packaged into intelligent object ultra-thin, subminiature.
How utilizing above-mentioned intelligent object ultra-thin, subminiature to be packaged into smart card module cheap, that performance is more superior is the application problem to be solved.
Summary of the invention:
The present invention is directed to above-mentioned existing intelligent object encapsulation technology to need to rely on expensive carrier band, thus the problem reducing the finished product market competitiveness, and a kind of Novel intelligent card module and corresponding production technology are provided, this module has very low packaging cost, corresponding production technology has higher production efficiency simultaneously, and the finished product formed can effectively meet the smart card industry reliability requirement to smart card module.
In order to achieve the above object, the present invention adopts the following technical scheme that:
A kind of Novel intelligent card module, described smart card module includes CFN (quad flat non-pin package) module and the carrier by carrier band cutting, and described CFN module is bonding on the carrier.
Described carrier includes the substrate layer of PET material, surface through the copper foil circuit layer of electroplating technology and anti-oxidation process, and the tow sides of described substrate layer lay described copper foil circuit layer respectively.
The thickness of described CFN module is 0.33-0.50mm.
Described CFN module is installed on the carrier by the low-temperature conductive binding agent of environment-friendly materials, and welds mutually with the connection line on described carrier.
The quantity that described CFN module is installed is one or more.
Described carrier also can be installed one or more SMD components.
Described carrier band is formed by connecting by some described carriers, and described carrier connects some double carrier strip of formation, and described double carrier strip is in turn connected into described carrier band.
Described some double carrier strip can cut into standard intelligent card band wide for 35mm.
The production technology of a kind of Novel intelligent card module, described production technology comprises the steps:
(1) using SMT automatic chip mounting equipment, be attached on the carrier of PET material by CFN module and other components and parts by conductive adhesive, the reflow ovens then through 100 DEG C-180 DEG C solidifies;
(2) carrier that paster completes is put in automatic cutting equipment, cuts into the standard intelligent card band that every width is 35mm;
(3) the standard intelligent card band cut is carried out short circuit hole die-cut so that it is each contact has independent electrical performance;
(4) die-cut good band is positioned in needle-bar test equipment carries out electric performance test;
(5) band tested is carried out last manufacturing card so that it is become standard intelligent card.
Novel intelligent card module provided by the invention adopts on the direct bonding carrier of CFN module of quad flat non-pin package, avoid the technique that carrier band needs to beat gold thread, thus realizing without adopting expensive special carrier band, reducing product cost greatly, greatly improving the competitiveness of product in market.
Novel intelligent card module provided by the invention can be widely applied among the processing of all kinds of smart card simultaneously, such as bank card, consumption card, Mobile phone card etc.; It is conducive to the general of production equipment simultaneously, the raising of product reliability, and facilitates the installation of later process.
Production technology provided by the invention, owing to employing multiple rows of supported form in flakes, can save the production time makes production efficiency significantly improve; And generally applicable existing equipment, the present invention greatly reduces production cost, particularly material cost, is that external producer produces without competition and is reduced to domestic manufacturer and can be directly produced from original carrier band.
Accompanying drawing illustrates:
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is the front schematic view of the present invention;
Fig. 2 is the schematic rear view of the present invention;
Fig. 3 is the sectional view of the present invention;
Fig. 4 is the reverse side schematic diagram of carrier band in the present invention;
Fig. 5 is the front schematic view in the present invention after carrier band paster;
Fig. 6 is the process chart of the present invention.
Detailed description of the invention:
For the technological means making the present invention realize, creation characteristic, reach purpose and effect and be easy to understand, below in conjunction with being specifically illustrating, the present invention is expanded on further.
When encapsulating due to conventional intelligent object, it is desirable to corresponding carrier band can directly beat gold thread, furthermore this carrier band is all produced without competition by external producer at present, and die cost is high, and unit price is expensive. So that intelligent object encapsulates costly, greatly reduce the market competitiveness of corresponding intelligent object.
For above-mentioned situation, the present invention avoids adopting the encapsulating structure of normal procedure intelligent module, and provides a kind of novel smart card module.
Referring to Fig. 1, smart card module provided by the invention includes CFN module 1 and carrier 2 two parts.
Wherein, CFN module 1 is quad flat non-pin package, and its thickness is 0.33-0.50mm, semiconductor chip be attached on carrier band, and line lead of going forward side by side is bonded, and is finally packaged into intelligent object ultra-thin, subminiature, in order to the follow-up SMT that carries out processes use.
The pin of CFN module 1 and circuit 4 are electrically connected, and again through through hole 5, smart card module positive and negative are carried out electric performance conducting.
Referring to Fig. 2, smart card module front contact 6 is standard intelligent card contact size, by slotted eye 7, its eight contacts is individually isolated.
Referring to Fig. 3, carrier 2 includes substrate layer 2-1 and copper foil circuit layer 2-2. The material of substrate layer 2-1 is PET material, and its color is transparent or white or other colors; The tow sides of substrate layer 2-1 all lay copper foil circuit layer 2-2, and this copper foil circuit layer 2-2 is copper foil circuit wiring board, and its surface carries out electroplating technology, and adds anti-oxidation process.
For forming smart card module, CFN module 1 is directly bondd by the low-temperature conductive binding agent 3 of environment-friendly materials and is arranged on the corresponding site of carrier 2 by the present invention, and welds mutually with the connection line on carrier 2. Such structure avoid conventional modules encapsulation required beat gold thread technique, thus the special carrier band of use can be avoided, thus greatly reducing production cost, also do not affect performance and the practical ranges of product simultaneously.
Further, CFN module 1 can according to the functional requirement of actual application of IC cards in the present invention, and the selectable number of installation is from one to multiple.
It addition, carrier 2 can be installed one or more other kinds of SMD components as required, such as resistance, electric capacity etc.
The smart card module obtained by such scheme its be of a size of standard intelligent card size: 12.6mm × 11.4mm, its thickness is 0.53mm-0.56mm.
In order to increase production efficiency, Novel intelligent card module production process adopts web-like pan feeding and web-like discharge method. Namely entire volume carrier band is automatically fed into patch device by track, and automatically carries out the attachment of CFN module and components and parts, mount complete after automatically entire volume carrier band is sent again through equipment rail.
Carrier 2 in the present invention is cut into by carrier band 200 and forms.
Referring to Fig. 4, whole carrier band 200 is strip, two double carrier strip 201 connect to form. In order to improve SMT production capacity, the width of every double carrier strip 201 is 35mm, and it is formed by connecting according to two modes arranging permutation by single carrier 202.
It is provided with dowel 203, in order to when making carrier band for electric plating of whole board technique between two double carrier strip 201.
Referring to Fig. 5, it is the front schematic view of the carrier band 200 setting CFN module 204 on carrier 202, is provided with dowel 208, in order to when making carrier band for electric plating of whole board technique.
Article two, it is provided with through hole 205 between double carrier strip, cutting para-position when it separates for double carrier band.
Equidistant in the both sides of two double carrier strip it is provided with registration holes 206, in order to use registration holes 206 to carry out product aligning when automatically attaching components and parts.
Deposited copper 207 it is provided with, for showing the model of this product intelligent card module in the centre of two double carrier strip.
After the carrier band 200 obtained by technique scheme installs components and parts (as shown in Figure 5) cut into the standard intelligent card band of double 35mm width, to facilitate rear road to add the general of equipment in man-hour.
Meanwhile, then carrier band is cut into the standard intelligent card band of double 35mm width, then be punched out, test, fabrication.
The concrete production technology of above-mentioned Novel intelligent card module following (referring to Fig. 6):
First, using SMT automatic chip mounting equipment, by secondary on the carrier of PET material by conductive adhesive patch to CFN module and other components and parts, the reflow ovens then through 100 DEG C-180 DEG C solidifies.
Then, the carrier completed by paster is put in automatic cutting equipment, cuts into the standard intelligent card band that every width is 35mm.
Then, the standard intelligent card band cut is carried out short circuit hole die-cut so that it is each contact has independent electrical performance.
Followed by, die-cut good band is positioned in needle-bar test equipment and carries out electric performance test.
Finally, the band tested is carried out last manufacturing card so that it is become standard intelligent card.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described. Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; described in above-described embodiment and description is that principles of the invention is described; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within the claimed scope of the invention. Claimed scope is defined by appending claims and equivalent thereof.
Claims (7)
1. a Novel intelligent card module, it is characterized in that, described smart card module front is provided with eight contacts, by slotted eye, its eight contacts is individually isolated, and this smart card module includes CFN module and the carrier by carrier band cutting, described carrier includes substrate layer and copper foil circuit layer, the material of substrate layer is PET material, and the tow sides of substrate layer all lay copper foil circuit layer, and this copper foil circuit layer is copper foil circuit wiring board, its surface carries out electroplating technology, and adds anti-oxidation process; Described CFN module is attached on the carrier of PET material by conductive adhesive, and the reflow ovens then through 100 DEG C-180 DEG C solidifies, and the pin of CFN module is electrically connected with the circuit on carrier, it is not necessary to carrier beats gold thread; And it is die-cut to carry out short circuit hole so that it is each contact has independent electrical performance; Again through through hole, smart card module positive and negative is carried out electric performance conducting.
2. a kind of Novel intelligent card module according to claim 1, it is characterised in that the thickness of described CFN module is 0.33-0.50mm.
3. a kind of Novel intelligent card module according to claim 1, it is characterised in that described CFN module is installed on the carrier by the low-temperature conductive binding agent of environment-friendly materials, and welds mutually with the connection line on described carrier.
4. a kind of Novel intelligent card module according to claim 1 and 2, it is characterised in that the quantity that described CFN module is installed is one or more.
5. a kind of Novel intelligent card module according to claim 1, it is characterised in that also can install one or more SMD components on described carrier.
6. a kind of Novel intelligent card module according to claim 1, it is characterised in that described carrier band is formed by connecting by some described carriers, and described carrier connects some double carrier strip of formation, and described double carrier strip is in turn connected into described carrier band.
7. a kind of Novel intelligent card module according to claim 6, it is characterised in that described some double carrier strip can cut into standard intelligent card band wide for 35mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010231647.7A CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010231647.7A CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
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| Publication Number | Publication Date |
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| CN102339404A CN102339404A (en) | 2012-02-01 |
| CN102339404B true CN102339404B (en) | 2016-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010231647.7A Active CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
| CN102610912B (en) * | 2012-04-16 | 2015-08-05 | 韦业明 | Based on antenna electric sublayer and the processing technology thereof of hard contact |
| CN106624387B (en) * | 2016-12-07 | 2018-08-10 | 诺得卡（上海）微电子有限公司 | A kind of hole punched device for smart card module manufacture |
| CN110411400A (en) * | 2019-07-19 | 2019-11-05 | 闽南理工学院 | A punching control system and method for smart card module manufacturing |
| CN115939074B (en) * | 2023-03-13 | 2023-08-22 | 新恒汇电子股份有限公司 | Novel double-sided flexible lead frame structure and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091137A (en) * | 1996-05-31 | 2000-07-18 | Kabushiki Kaisha Toshiba | Semiconductor device substrate and method of manufacturing the same |
| CN1337741A (en) * | 2000-08-09 | 2002-02-27 | 株式会社Kostat半导体 | Semiconductor with injectable conductive area and mfg. method thereof |
| JP2004165531A (en) * | 2002-11-15 | 2004-06-10 | Dainippon Printing Co Ltd | Double-sided wiring antenna circuit member for noncontact data carrier |
| CN1901183A (en) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | Substrate, smart card modules and methods for fabricating the same |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
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2010
- 2010-07-20 CN CN201010231647.7A patent/CN102339404B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091137A (en) * | 1996-05-31 | 2000-07-18 | Kabushiki Kaisha Toshiba | Semiconductor device substrate and method of manufacturing the same |
| CN1337741A (en) * | 2000-08-09 | 2002-02-27 | 株式会社Kostat半导体 | Semiconductor with injectable conductive area and mfg. method thereof |
| JP2004165531A (en) * | 2002-11-15 | 2004-06-10 | Dainippon Printing Co Ltd | Double-sided wiring antenna circuit member for noncontact data carrier |
| CN1901183A (en) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | Substrate, smart card modules and methods for fabricating the same |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
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| CN102339404A (en) | 2012-02-01 |
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Address after: 201206 Shanghai City, Pudong New Area Chinese (Shanghai) Free Trade Zone gold Yulu No. 818 Applicant after: SHANGHAI INESA INTELLIGENT ELECTRONICS CO., LTD. Address before: 201206 Shanghai City, Pudong New Area Yulu No. 818 gold Applicant before: Shanghai Changfeng Intelligent Card Co., Ltd. |
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