CN208317096U - Radio frequency circuit board, radio frequency unit and communication equipment - Google Patents
Radio frequency circuit board, radio frequency unit and communication equipment Download PDFInfo
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- CN208317096U CN208317096U CN201820328393.2U CN201820328393U CN208317096U CN 208317096 U CN208317096 U CN 208317096U CN 201820328393 U CN201820328393 U CN 201820328393U CN 208317096 U CN208317096 U CN 208317096U
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Abstract
A kind of radio frequency circuit board, radio frequency unit and communication equipment.Radio frequency circuit board includes: rf board main body and the antenna element being electrically connected with rf board main body, the first conductive component for being electrically connected rf board main body and RF IC and the second conductive component for being electrically connected antenna element and RF IC；Wherein, rf board main body includes opposite first surface and second surface on thickness direction, and antenna element is embedded at rf board main body and is located at this side of first surface.After the utility model embodiment, signal transmission path can be shortened, reduce signal transmission attenuation, promotion signal quality and consistency.
Description
Technical field
The utility model relates to the communications field more particularly to a kind of radio frequency circuit boards, radio frequency unit and communication equipment.
Background technique
With the development of communication technology, the communication technology is started from current 4G to 5G development communication technologies, due to frequency
Not reusability, the low frequency band that 4G has been occupied cannot continue to be multiplexed in 5G, therefore 5G communication frequency is inevitable to high band hair
Exhibition.Since the frequency range of 5G is high, corresponding carrier wavelength becomes smaller, and also has led to the size of antenna gradually by rice before
And decimetre rank is reduced to a millimeter rank, antenna is integrated on radio frequency veneer just being possibly realized property.
As the newest communication technology, one of scene demand requires increase coverage domain as far as possible and is promoted to hold 5G
Amount, therefore system engineer in hoisting power by every means and reduces link load, and use traditional radio frequency, antenna equal part
Necessarily cause link load excessive from scheme, especially under high frequency scene.Currently, mainly independently being set using radio frequency and antenna part
It sets, i.e., portion radio frequency device and antenna is independently set to module, then pass through surface installation technique (Surface Mount
Technology, SMT) by module welding assembly on radio frequency veneer.
Since 5G high frequency is using multichannel input and output (Multi-Input Multi-Out, MIMO) mode, cause
The size of module is larger.And the high frequency stage is easier to occur leaking and radiation problem, link is too long necessarily to be caused to leak and radiate
Excessively, final signal area coverage is caused to reduce.Therefore in the high frequency stage, face that signal transmission path is long, and the loss of signal is big
The problem of.
Utility model content
The utility model embodiment provides a kind of radio frequency circuit board, can shorten signal transmission path, reduces signal and passes
Defeated loss, promotion signal quality and consistency, at the same be also able to solve antenna element size greatly can not packing problem, antenna element
Area and size are unrestricted.It is connected and fixed to form an overall structure between antenna element and rf board main body, integrated level is high, drop
Low assembling cost.The two connection is reliable, is not susceptible to separate, stable connection.
The utility model embodiment additionally provides a kind of radio frequency unit, can shorten signal transmission path, reduces signal and passes
Defeated loss, promotion signal quality and consistency.
In a first aspect, the utility model embodiment provides a kind of radio frequency circuit board, comprising:
Rf board main body and with rf board main body be electrically connected antenna element, for making rf board main body and radio frequency collection
It is led at the first conductive component of circuit electric connection and second for being electrically connected antenna element and RF IC
Electrical components；
Wherein, rf board main body includes opposite first surface and second surface on thickness direction, antenna element
It is embedded at rf board main body and is located at this side of first surface.
Currently, antenna element and rf board main body are separated from each other setting.Antenna element is set to the top of rf board main body,
It is electrically connected between the two by soldered ball, signal needs to first pass through entire rf board main body, is just finally transmitted to using soldered ball
Antenna element, therefore signal transmission path is long, while self structure may be residual after having deformation and welding after ball bond
Melt substance is stayed, the consistency of signal is influenced.In foregoing circuit plate, antenna element included by radio frequency circuit board, which is embedded at, to be penetrated
In frequency plate main body, to be interconnected and fixed to form an overall structure, so that radio frequency circuit board is integrally easily assembled to, group is reduced
This is dressed up, also reduces radio frequency circuit board overall dimensions, structure is more compact.In addition, since radio frequency circuit board overall structure is tight
It gathers, while rf board main body can be electrically connected by the first conductive component and external RF IC, and antenna element
It can be electrically connected by the second conductive component and external RF IC.In this way, the first conductive component and the second conduction
Component and rf board main body form an overall structure, so that signal is by portion radio frequency plate main body without passing through rf board master
The whole thickness of body can be transmitted to antenna element, so that being transmitted to the transmission road of the signal of antenna element from rf board main body
Diameter is short, to reduce signals transmission loss, promotion signal quality and consistency.
In a kind of possible design, the first conductive component and the second conductive component are by second surface the first table of direction
The columnar structures that face extends.
In foregoing circuit plate, the first conductive component and the second conductive component are easy to fabricate.
In a kind of possible design, the first conductive component and the second conductive component are all set in rf board main body and day
The corresponding region of line component.
In foregoing circuit plate, area thickness corresponding with antenna element is less than the thickness in other regions in rf board main body
Degree, the first conductive component of setting and the second conductive component thickness are small, can effectively shorten signal transmitting distance.
In a kind of possible design, the first conductive component and the second conductive component are cross-section columnar structures or change
Section columnar structures.Cross-section columnar structures, such as cylindrical body or regular prism etc.；Variable cross-section columnar structures, such as
The frustum of a cone or the frustum of a pyramid etc..
In a kind of possible design, the first conductive component extends into rf board master towards first surface by second surface
Body, the second conductive component extend through rf board main body towards first surface by second surface and extend into antenna element.
In foregoing circuit plate, the first conductive component and the second conductive component, can be with other than with conducting function
Improve the bonding strength of rf board main body and antenna element.
In a kind of possible design, the first conductive component is solid cylinder or hollow cylinder, the second conductive part
Part is solid cylinder or hollow cylinder.
In foregoing circuit plate, the first conductive component and the second conductive component of solid cylinder or hollow cylinder
It is lower to fabricate difficulty, reduces processing and manufacturing cost.
In a kind of possible design, radio frequency circuit board further includes third conductive component, and third conductive component includes setting
In second connecting portion rf board master intracorporal first connecting portion and be set in antenna element, antenna element or rf board master
Body and third conductive component are electrically connected.
In foregoing circuit plate, third conductive component can also improve antenna other than having the function of transmitting signal
The bonding strength of component and rf board main body guarantees that the two connection status is stablized.
In a kind of possible design, third conductive component is the column structure extended from second surface towards first surface
The axial direction distribution of body, first connecting portion and second connecting portion along third conductive component.Wherein, it hangs down with first surface or second surface
Straight direction can regard the axial direction of third conductive component as.
In foregoing circuit plate, third conductive component is to extend from the second surface of rf board main body towards first surface
Columnar structures, it is easy to manufacture, reduce processing and manufacturing difficulty and processing and manufacturing cost.
In a kind of possible design, radio frequency circuit board further includes conductive adhesive layer, conductive adhesive layer be set to antenna element with
Between rf board main body, antenna element is electrically connected by conductive adhesive layer and rf board main body.
In alternatively possible design, antenna element and rf board main body can also pass through respectively included copper each other
Matter structural member directly contacts, to realize electric connection between the two.
In foregoing circuit plate, it is connected to each other between antenna element, conductive adhesive layer and rf board main body in stable condition reliable,
It avoids using welding manner bring welding stress problem.
In a kind of possible design, the top surface of antenna element flushes with the first surface or lower than first table
Face, in other words, antenna element are completely embedded into rf board main body.So that the structure of radio frequency circuit board is more compact, drop
Low antenna element and external other structures part a possibility that there are location conflicts, while making antenna element that there is good heat dissipation
Performance.
Second aspect, the utility model embodiment provide a kind of radio frequency unit, comprising:
Such as the radio frequency circuit board of above-described embodiment；
RF IC, setting corresponding with the second surface of rf board main body, rf board main body are conductive by first
Component and RF IC are electrically connected, and antenna element is electrically connected by the second conductive component and RF IC.
In a kind of possible design, RF IC is embedded in rf board main body and is located at rf board main body
This side of second surface.
In above-mentioned radio frequency unit, the radio frequency unit of rf board main body, antenna element and RF IC composition is whole
It is compact-sized, so that radio frequency unit is integrally easily assembled to, assembling cost is reduced, also reduces the overall dimensions of radio frequency unit,
Structure is more compact.
The third aspect, the utility model embodiment provide a kind of communication equipment, including power connector and radio frequency circuit board,
Radio frequency circuit board is the radio frequency circuit board that aforementioned first aspect provides.
In above-mentioned communication equipment, the transmission loss of signal of communication equipment is low.Since radio frequency circuit board overall dimensions are small, make
Obtain communication equipment compact overall structure.
Fourth aspect, the utility model embodiment provide a kind of communication equipment, including power connector and radio frequency unit, penetrate
Frequency electric unit is the radio frequency unit that aforementioned second aspect provides.
In above-mentioned communication equipment, the transmission loss of signal of communication equipment is low.Since radio frequency unit overall dimensions are small, so that
Communication equipment compact overall structure.Communication equipment can be the electronic equipment with communication function, such as wireless terminal, can also be with
It is the signal transmitting/receiving module etc. in base station.
Detailed description of the invention
It may be better understood from the description with reference to the accompanying drawing to specific embodiment of the present utility model practical
It is novel wherein, the same or similar appended drawing reference indicates the same or similar feature.
Fig. 1 is the schematic cross-sectional view of the radio frequency circuit board of an embodiment of the present invention；
Fig. 2 is that the radio frequency circuit board of an embodiment of the present invention and the structure section view of RF IC electric connection are shown
It is intended to；
Fig. 3 is the schematic cross-sectional view of the radio frequency circuit board of an embodiment of the present invention；
Fig. 4 is the schematic cross-sectional view of the radio frequency circuit board of an embodiment of the present invention；
Fig. 5 is that the radio frequency circuit board of an embodiment of the present invention and the structure section view of RF IC electric connection are shown
It is intended to；
Fig. 6 is that the radio frequency circuit board of an embodiment of the present invention and the structure section view of RF IC electric connection are shown
It is intended to；
Fig. 7 is that the radio frequency circuit board of an embodiment of the present invention and the structure section view of RF IC electric connection are shown
It is intended to.
In the accompanying drawings, the attached drawing is not drawn according to the actual ratio.
Description of symbols:
1, rf board main body；11, first surface；12, second surface；13, receiving portion；14, recessed portion；
2, antenna element；21, antenna core plate；22, Anneta module；
3, the first conductive component；
4, the second conductive component；
5, RF IC；
6, welding assembly；
7, conductive adhesive layer；
8, third conductive component；
X, thickness direction.
Specific embodiment
The utility model in order to better understand, below with reference to Fig. 1 to Fig. 5 to the radio circuit of the utility model embodiment
Plate is described in detail.
Fig. 1 schematically shows the sectional structure of the radio frequency circuit board of an embodiment of the present invention.Fig. 2 is schematically
Show the radio frequency circuit board of an embodiment of the present invention and the sectional structure that RF IC is electrically connected.Fig. 3 signal
Show to property the sectional structure of the radio frequency circuit board of an embodiment of the present invention.Fig. 4 schematically shows that this is practical new
The sectional structure of the radio frequency circuit board of one embodiment of type.Fig. 5 schematically shows the radio frequency electrical of an embodiment of the present invention
The sectional structure that road plate and RF IC are electrically connected.Fig. 6 schematically shows penetrating for an embodiment of the present invention
The schematic structural cross-sectional view that frequency circuit plate and RF IC are electrically connected.Fig. 7 schematically shows the utility model one
The schematic structural cross-sectional view that the radio frequency circuit board and RF IC of embodiment are electrically connected.
Different pattern Regional Representative different structure of the Fig. 1 into Fig. 7, only product structure and the area that makes for ease of understanding
Point, do not limit the material representated by it.In addition, Fig. 1, into Fig. 7, what the part that hatching is filled with oblique line indicated is conductive
Medium.
Fig. 1 schematically shows the sectional structure of the radio frequency circuit board of an embodiment of the present invention.The utility model
The radio frequency circuit board of embodiment includes rf board main body 1 and the antenna element 2 with the electric connection of rf board main body 1.This implementation
It can be realized signal interconnection between the rf board main body 1 and antenna element 2 of example, so that corresponding signal can pass therebetween
It is defeated.
The rf board main body 1 of the present embodiment has scheduled thickness, width and length.The rf board main body 1 of the present embodiment
Including first surface 11 and second surface 12 opposite on the X of thickness direction.The antenna element 2 of the present embodiment, which is embedded at, to be penetrated
In frequency plate main body 1, and antenna element 2 is located at this side of first surface 11, and specifically, the top of antenna element 2 is exposed to
One this side of surface 11.The antenna element 2 of the present embodiment includes antenna core plate 21 and the antenna being set on antenna core plate 21
Module 22.In one example, the rf board main body 1 of the present embodiment includes the appearance being recessed from first surface 11 to second surface 12
Receive portion 13.The mode that the antenna element 2 of the present embodiment is embedded at rf board main body 1 is: at least part setting of antenna element 2
In in receiving portion 13, and included antenna core plate 21 and rf board main body 1 are electrically connected.In one example, in thickness side
To on X, itself integral thickness of antenna element 2 can be greater than the depth of receiving portion 13, project slightly from the first of rf board main body 1
Surface 11.2 integral thickness of antenna element might be less that the depth equal to receiving portion 13, so that the top surface of antenna element 2 is lower than
The first surface 11 of rf board main body 1 is flush with the first surface 11 of rf board main body 1, so that radio frequency circuit board
Structure it is more compact, a possibility that reducing antenna element 2 and external other structures part there are location conflicts, while making antenna
Component 2 has good heat dissipation performance.
Fig. 2 schematically shows that the radio frequency circuit board of an embodiment of the present invention and RF IC are electrically connected
Sectional structure.The radio frequency circuit board of the utility model embodiment further includes for making rf board main body 1 and external radio frequency collection
At circuit 5 (Radio Frequency Integration Circuit, RFIC) be electrically connected first conductive component 3 and
The second conductive component 4 for being electrically connected antenna element 2 and external RF IC 5.In the present embodiment, first is led
Electrical components 3 and the second conductive component 4 are all set in part corresponding with antenna element 2 in rf board main body 1, so that first leads
Electrical components 3 and the second conductive component 4 include being exposed to second surface 12, the company for being electrically connected with RF IC 5
Connect region, thus RF IC 5 can be set to this side of the second surface 12 of rf board main body 1 and with first conduction
The join domain that component 3 and the second conductive component 4 are exposed to second surface 12 is electrically connected.
Currently, antenna element 2 and rf board main body 1 are separated from each other setting.Antenna element 2 is set to rf board main body 1
Top is electrically connected by soldered ball between the two, and signal needs to first pass through entire rf board main body 1, just final using soldered ball
Be transmitted to antenna element 2, therefore signal transmission path is long, at the same after ball bond self structure can exist deformation and weld after
Melt substance may be remained, the consistency of signal is influenced.In the radio frequency circuit board of the present embodiment and the integrated electricity of external radio frequency
After road 5 is electrically connected, the included metal conducting layer for transmitting signal to antenna element 2 is transmitted from rf board main body 1
Signal can be transmitted to RF IC 5 by rf board main body 1 and the first conductive component 3, then using radio frequency collection
Antenna element 2, transmission path arrow shown in Figure 2 are transmitted at circuit 5 and the second conductive component 4.In this way, first is conductive
Component 3 and the second conductive component 4 and one overall structure of formation of rf board main body 1, so that signal passes through portion radio frequency plate main body 1
Without antenna element 2 can be transmitted to by the whole thickness of rf board main body 1, so that being transmitted from rf board main body 1
Transmission path to the corresponding signal of antenna element 2 is short, to reduce signals transmission loss, improves signal quality
And consistency.
The antenna element 2 as included by the radio frequency circuit board of the utility model embodiment is embedded in rf board main body 1,
To be interconnected and fixed to form an overall structure, so that radio frequency circuit board is integrally easily assembled to, assembling cost is reduced, is also contracted
Small radio frequency circuit board overall dimensions, structure are more compact.In addition, due to radio frequency circuit board compact overall structure, while radio frequency
Plate main body 1 can be electrically connected by the first conductive component 3 with external RF IC 5, and antenna element 2 can pass through
Second conductive component 4 is electrically connected with external RF IC 5, so that being transmitted to antenna part from rf board main body 1
The transmission path of the signal of part 2 is short, to reduce signals transmission loss, promotion signal quality and consistency.This is practical new
The size for the receiving portion 13 being arranged in the rf board main body 1 of type can be manufactured according to the dimensioned of antenna element 2, so that antenna
The size and area of component 2 are no longer restricted.Directly electrically connect between the antenna element 2 and rf board main body 1 of the utility model
It connects, so that the plate selection of antenna element 2 is not limited by the plate of rf board main body 1.Furthermore it is arranged in rf board main body 1
When mutiple antennas component 2, since each antenna element 2 can be protected with the surface for forming 13 bottom of receiving portion in rf board main body 1
Good flatness is held, so that can guarantee that coplane degree error within 0.7%, is less than between mutiple antennas component 2
The tolerance specification requirement of 0.2mm.
First conductive component 3 and the second conductive component 4 of the utility model embodiment are for by the second of rf board main body 1
The columnar structures that surface 12 extends towards first surface 11, so that the first conductive component 3 and the second conductive component 4 are easy to
Processing and manufacturing.
It is shown in Figure 1 in the utility model an optional embodiment, antenna element 2 directly with rf board main body 1
Pressing.It is connected and fixed between antenna element 2 and rf board main body 1 by pressing mode, enables to be connected to each other in stable condition
Reliably, and the two is avoided using welding manner bring welding stress problem.
In the present embodiment, optionally, columnar first conductive component 3 and the second conductive component 4 are all set in rf board master
Region corresponding with antenna element 2 on body 1.Specifically, corresponding region can be on thickness direction X, antenna element
The 2 orthographic projection region on rf board mainboard 1；In other words, corresponding region can be on rf board mainboard 1 by antenna
The region that component 2 covers.Area thickness corresponding with antenna element 2 is less than the thickness in other regions in rf board main body 1, makes
The first conductive component 3 and 4 thickness of the second conductive component that must be arranged are small, so as to be effectively reduced signal transmission damage
Consumption, promotion signal quality and consistency.First conductive component 3 includes along itself two axially opposing end.First conductive part
One end of part 3 is through rf board main body 1 and is exposed to second surface 12, and the other end is embedded in and penetrates not through rf board main body 1
In frequency plate main body 1, so that rf board main body 1 and the first conductive component 3 are electrically connected, and can be by the first conductive component 3
The join domain and external RF IC 5 for being exposed to second surface 12 are electrically connected.Columnar second conductive component 4 wraps
It includes along itself two axially opposing end.One end of second conductive component 4 is through rf board main body 1 and is exposed to second surface
12, the other end forms the surface of the bottom of receiving portion 13 in rf board main body 1 and is exposed to receiving portion 13, to be set to
The bottom of antenna element 2 in receiving portion 13 can be electrically connected with the second conductive component 4, and by the second conductive component 4
The join domain and external RF IC 5 for being exposed to second surface 12 are electrically connected.
In the present embodiment, the quantity of the first conductive component 3 and the second conductive component 4 is not construed as limiting, can be according to practical production
Product require to carry out flexible choice.
In the present embodiment, optionally, the first conductive component 3 and the second conductive component 4 can be cross-section column structure
Body, such as cylindrical body or regular prism etc..First conductive component 3 and the second conductive component 4 can also be variable cross-section column knot
Structure body, such as the frustum of a cone or the frustum of a pyramid etc..
It is shown in Figure 2 in the present embodiment, when radio frequency circuit board needs to be electrically connected with external RF IC 5,
The join domain for the second surface 12 that first conductive component 3 and the second conductive component 4 are respectively exposed to rf board main body 1 can lead to
It crosses welding assembly 6 and RF IC 5 is electrically connected.Welding assembly 6 can be soldered ball or welding block.The radio frequency electrical of the present embodiment
After road plate and RF IC 5 are electrically connected, as shown by the arrows in Figure 2, corresponding signal can be transmitted to from rf board main body 1
First conductive component 3 in left side, is transmitted to RF IC 5 using welding assembly 6, using another welding assembly in figure
6 are transmitted to the second conductive component 4, are finally transmitted to antenna element 2, thus 6 quantity of welding assembly that signals transmission passes through
Few, transmission path is short, effectively reduces the loss in signals transmission, improves signal quality and consistency.It is readily appreciated that
Ground, signal can also be transmitted to first conductive component 3 on right side in Fig. 2 from rf board main body 1, transmit using welding assembly 6
To RF IC 5, it is transmitted to the second conductive component 4 using another welding assembly 6, is finally transmitted to antenna element 2.
The process of the radio frequency circuit board of above-described embodiment includes the following steps:
Firstly, by antenna element 2, individually processing and manufacturing forms independent component；
Then, receiving portion 13 is fabricated out in rf board main body 1,2 entirety of antenna element is pressed on rf board main body 1
Receiving portion 13 in, then from this side of second surface 12 to rf board main body 1 carry out laser boring operation, in rf board main body
The hole extended by second surface 12 towards first surface 11 is formed on 1；The hole processed in rf board main body 1 includes being subsequently used for
The blind hole of first conductive component 3 is set and is subsequently used for the through-hole of the second conductive component 4 of setting, the through-hole and 13 phase of receiving portion
Connection；
Secondly, plating filler operation is carried out to radio frequency circuit board, so that conductive material is filled into respectively in blind hole or through-hole,
And correspondingly form columnar first conductive component 3 and the second conductive component 4；
Finally, being exposed to the company of the second surface 12 of rf board main body 1 to the first conductive component 3 and the second conductive component 4
It connects region to be surface-treated, and makes outer-layer circuit.
In above-mentioned steps, antenna element 2 can not be fabricated individually in advance, but gradually in rf board main body 1
Processing and manufacturing is formed.Antenna core plate 21 included by antenna element 2 has multiple layers of structure.Antenna core plate 21 is pressed by different level
Together in the receiving portion 13 of rf board main body 1, Anneta module 22 is then set to antenna core plate 21 again and is located at first surface 11
On the surface of this side, to ultimately form antenna element 2.
It is shown in Figure 3 in another optional embodiment of the utility model, antenna element 2 and rf board main body 1 that
This is connected and fixed and is electrically connected with each other, to realize signal transmission between the two.First conductive component 3 is by 12 court of second surface
Rf board main body 1 is extended into first surface 11, the second conductive component is passed through by second surface 12 towards the extension of first surface 11
It wears rf board main body 1 and extends into antenna element 2.First conductive component and the second conductive component in addition to conducting function it
Outside, the bonding strength of rf board main body and antenna element can also be improved.
Columnar first conductive component 3 includes along itself two axially opposing end.One end of first conductive component 3 is passed through
It wears rf board main body 1 and is exposed to second surface 12, the other end can run through or not through antenna element 2, thus rf board
Main body 1 and the first conductive component 3 are electrically connected.The other end of first conductive component 3 can also be not through rf board main body 1.It penetrates
Frequency plate main body 1 can be integrated electric by the join domain and external radio frequency that are exposed to second surface 12 on the first conductive component 3
Road 5 is electrically connected.Rf board main body 1 and the first conductive component 3 constitute a conductive path, included from rf board main body 1
The signal that transmits of the metal conducting layer for transmitting signal to antenna element 2 can be conductive by rf board main body 1 and first
Component 3 is transmitted to RF IC 5, transmission path arrow shown in Figure 5.Columnar second conductive component 4 includes edge
Itself two axially opposing end.One end of second conductive component 4 is through rf board main body 1 and is exposed to second surface 12,
The other end can run through or not through antenna element 2, so that the antenna element 2 being set in receiving portion 13 can be led with second
Electrical components 4 are electrically connected.Antenna element 2 passes through the join domain that second surface 12 is exposed on the second conductive component 4 and outside
RF IC 5 be electrically connected.Second conductive component 4 and antenna element 2 constitute another conductive path, integrated from radio frequency
The signal transmitted in circuit 5 is transmitted to antenna element 2, transmission path arrow shown in Figure 5 by the second conductive component 4.
Preferably, the first conductive component 3 and the second conductive component 4 respectively run through rf board main body along the thickness direction X of rf board main body 1
1 and antenna element 2.
In the present embodiment, the quantity of the first conductive component 3 and the second conductive component 4 is not construed as limiting, can be according to practical production
Product require to carry out flexible choice.
In the present embodiment, the first conductive component 3 can be solid cylinder, or hollow cylinder.Second is conductive
Component 4 can be solid cylinder, or hollow cylinder.First conduction of solid cylinder or hollow cylinder
The processing and manufacturing difficulty of component and the second conductive component is lower, reduces processing and manufacturing cost.
It is shown in Figure 4 in the present embodiment, when radio frequency circuit board needs to be electrically connected with external RF IC 5,
First conductive component 3 and the second conductive component 4 are respectively exposed to the join domain and radio frequency of the second surface 12 of rf board main body 1
It can be electrically connected by welding assembly 6 between integrated circuit 5.Welding assembly 6 can be soldered ball or welding block.The present embodiment is penetrated
After frequency circuit plate and RF IC 5 are electrically connected, as shown by the arrows in Figure 4, signal can be transmitted to the from rf board main body 1
One conductive component 3 is transmitted to RF IC 5 using welding assembly 6, is transmitted to second using another welding assembly 6
Conductive component 4 is finally transmitted to antenna element 2, so that 6 quantity of welding assembly that signals transmission passes through is few, transmission path
It is short, the loss in signals transmission is effectively reduced, signal quality and consistency are improved.
In one example, shown in Figure 4, radio frequency circuit board further includes conductive adhesive layer 7.Conductive adhesive layer 7 is set to day
Between line component 2 and rf board main body 1.Antenna element 2 is electrically connected by conductive adhesive layer 7 and rf board main body 1.Antenna element
2, it is connected and fixed between conductive adhesive layer 7 and rf board main body 1 by pressing mode, is connected to each other in stable condition reliable, avoids adopting
With welding manner bring welding stress problem.Optionally, conductive adhesive layer 7 includes the Insulating frame (Mi Xiexianqu in referring to fig. 4
Domain) and it is filled in conducting resinl (black region in referring to fig. 4) on frame.In another example, antenna element 2 with penetrate
Frequency plate main body 1 can also directly be contacted each other by respectively included copper structural member, to realize that electrical property between the two connects
It connects.
The process of the radio frequency circuit board of above-described embodiment includes the following steps:
Firstly, by antenna element 2, individually processing and manufacturing forms independent component；
Then, fabricate out receiving portion 13 in rf board main body 1, antenna element 2 be set in receiving portion 13 and with penetrate
Frequency plate main body 1 is electrically connected；In this step, antenna element 2 can directly be connect with rf board main body 1, it can also be preparatory
It is formed in rf board main body 1 on the surface of the bottom of receiving portion 13 and conductive adhesive layer 7 is set, then 2 entirety of antenna element is pressed
Above conductive adhesive layer 7；
Secondly, laser boring operation is carried out to rf board main body 1 and antenna element 2, in rf board main body 1 and antenna part
Part 2 is respectively formed on the hole extended by second surface 12 towards first surface 11；
Furthermore plating filler operation is carried out to radio frequency circuit board, so that conductive material is filled into respectively in the hole processed,
And correspondingly form columnar first conductive component 3 and the second conductive component 4；
Finally, being exposed to the company of the second surface 12 of rf board main body 1 to the first conductive component 3 and the second conductive component 4
It connects region to be surface-treated, and makes outer-layer circuit.
In above-mentioned steps, antenna element 2 can not be fabricated individually in advance, but be formed in rf board main body 1
Gradually processing and manufacturing is formed on the surface of the bottom of receiving portion 13 or on the basis of conductive adhesive layer 7.Included by antenna element 2
Antenna core plate 21 have multiple layers of structure.Antenna core plate 21 is pressed on by different level in rf board main body 1 and forms receiving portion
On the surface of 13 bottom or 7 top of conductive adhesive layer, is then set to antenna core plate 21 positioned at first for Anneta module 22 again
On the surface of 11 this side of surface, to ultimately form antenna element 2.
Referring to shown in Fig. 1, Fig. 3 or Fig. 4, the radio frequency circuit board of the utility model embodiment further includes third conductive component 8.
Third conductive component 8 includes that the first connecting portion being set in rf board main body 1 and second be set in antenna element 2 connect
Socket part.Antenna element 2 or rf board main body 1 can be electrically connected with third conductive component 8, to can respectively be led by third
Electrical components 8 and external component are electrically connected, to transmit the signals such as ground signalling or power supply signal.In addition, third conductive component 8
The bonding strength of antenna element 2 and rf board main body 1 can be further increased, guarantees that the two connection status is stablized.
In one embodiment, third conductive component 8 is from the second surface 12 of rf board main body 1 towards first surface 11
The columnar structures of extension, it is easy to manufacture, reduce processing and manufacturing difficulty and processing and manufacturing cost.First connecting portion and second
Axial direction distribution of the interconnecting piece along third conductive component 8.Optionally, columnar third conductive component 8 runs through rf board main body 1 and day
Line component 2.
In one example, the first connecting portion of antenna element 2 and third conductive component 8 is electrically connected.At this point, rf board
Main body 1 and the second connecting portion of third conductive component 8 are in mechanical connection state, and the two does not transmit signal mutually.Antenna element 2 is logical
It crosses first connecting portion and interacts the signals such as ground signalling or power supply signal with external circuit.
In one example, rf board main body 1 and the second connecting portion of third conductive component 8 are electrically connected.At this point, antenna
The first connecting portion of component 2 and third conductive component 8 is in mechanical connection state, and the two does not transmit signal mutually.Rf board main body 1
The signals such as ground signalling or power supply signal are interacted with external circuit by second connecting portion.
In the present embodiment, after antenna element 2 is embedded at rf board main body 1, penetrated by the way of laser boring
Pre-manufactured hole is processed on frequency plate main body 1 and antenna element 2, is then filled in pre-manufactured hole by the way of filler is electroplated again conductive
Material is finally exposed to the second surface of rf board main body 1 to form columnar third conductive component 8 to third conductive component 8
12 region and the region at top for being exposed to antenna element 2 are surface-treated, and make outer-layer circuit.
Referring to fig. 2 or shown in Fig. 5, the utility model embodiment also provides a kind of radio frequency unit, including above-described embodiment
Radio frequency circuit board and the RF IC 5 being electrically connected with radio frequency circuit board.The RF IC 5 of the present embodiment with penetrate
The second surface 12 of frequency plate main body 1 is correspondingly arranged.Rf board main body 1 passes through the first conductive component 3 and RF IC 5
It is electrically connected.Antenna element 2 is electrically connected by the second conductive component 4 with RF IC 5.
In one embodiment, the first conductive component 3 and the second conductive component 4 are respectively exposed to the of rf board main body 1
The join domain on two surfaces 12 can be electrically connected by welding assembly 6 and RF IC 5.Welding assembly 6 can be weldering
Ball or welding block.
After radio frequency circuit board included by the radio frequency unit of the present embodiment and RF IC 5 are electrically connected, such as Fig. 2 or
In Fig. 4 shown in arrow, signal can be transmitted to the first conductive component 3 from rf board main body 1, be transmitted to and penetrate using welding assembly 6
Frequency integrated circuit 5 is transmitted to the second conductive component 4 using another welding assembly 6, antenna element 2 is finally transmitted to, to believe
6 quantity of welding assembly that number transmission process is passed through is few, and transmission path is short, effectively reduces the loss in signals transmission, mentions
Signal quality and consistency are risen.
In the utility model an optional embodiment, penetrated referring to shown in Fig. 6 or Fig. 7, RF IC 5 is embedded at
Frequency plate main body 1.The letter that the included metal conducting layer for transmitting signal to antenna element 2 transmits from rf board main body 1
Number, it can be transmitted to RF IC 5 by rf board main body 1 and the first conductive component 3, then using the integrated electricity of radio frequency
Road 5 and the second conductive component 4 are transmitted to antenna element 2, and transmission path is referring to Fig. 6 or arrow shown in Fig. 7.In an example
In, the second surface 12 of rf board main body 1 is provided with the recessed portion 14 being recessed by second surface 12 towards first surface 11.This reality
The RF IC 5 for applying example, which is embedded at the mode of rf board main body 1, is: at least part of RF IC 5 is set to
In recessed portion 14, and rf board main body 1 and antenna element 2 are electrically connected with rf board main body 1 respectively.In one example, exist
On thickness direction X, the sum of integral thickness of 5 integral thickness of RF IC and welding assembly 6 can be greater than recessed portion 14
Depth projects slightly from the second surface 12 of rf board main body 1.The entirety of RF IC 5 integral thickness and welding assembly 6
The sum of thickness might be less that the depth equal to recessed portion 14, so that the top surface of RF IC 5 is lower than rf board main body 1
Second surface 12 is flush with the second surface 12 of rf board main body 1, so that the overall structure of radio frequency unit is more
It is compact, a possibility that reducing RF IC 5 and external other structures part there are location conflicts, while making the integrated electricity of radio frequency
Road 5 has good heat dissipation performance.The radio frequency unit that rf board main body 1, antenna element 2 and RF IC 5 form is whole
It is compact-sized, so that radio frequency unit is integrally easily assembled to, assembling cost is reduced, also reduces the overall dimensions of radio frequency unit,
Structure is more compact.
The utility model embodiment also provides a kind of communication equipment, and radio frequency circuit board and power supply including above-described embodiment connect
Connect device.Due to the present embodiment radio frequency circuit board self transmission signal when loss of signal it is low, signal quality and consistency are good, because
The communication equipment own signal transmission performance of this present embodiment is good.In addition, the radio frequency circuit board self structure of the present embodiment is tight
It gathers, so that itself overall structure of the communication equipment of the present embodiment is also more compact.
The utility model embodiment also provides a kind of communication equipment, and the radio frequency unit including above-described embodiment is connected with power supply
Device.Due to the present embodiment radio frequency unit self transmission signal when loss of signal it is low, signal quality and consistency are good, thus this
The communication equipment own signal transmission performance of embodiment is good.In addition, the radio frequency unit self structure of the present embodiment is compact, so that
Itself overall structure of the communication equipment of the present embodiment is also more compact.
In one example, communication equipment can be the electronic equipment with communication function, such as wireless terminal, can also be with
It is the signal transmitting/receiving module etc. in base station.Specifically, wireless terminal can be the hand-held with wireless connecting function and set
Other processing equipments standby or that be connected to radio modem are led to through wireless access network and one or more core nets
The mobile terminal of letter.For example, wireless terminal can be mobile phone, plate battery plate or personal digital assistant (personal
Digital assistant, PDA), mobile internet device (mobile Internet device, MID), wearable device
With E-book reader (e-book reader) etc..For another example, wireless terminal is also possible to portable, pocket, hand-held, meter
Built in calculation machine or vehicle-mounted mobile device.
Although the present utility model has been described by reference to the preferred embodiments, but in the model for not departing from the utility model
In the case where enclosing, various improvement can be carried out to it and can replace component therein with equivalent.Especially, as long as not depositing
In structural conflict, items technical characteristic mentioned in the various embodiments be can be combined in any way.The utility model
It is not limited to specific embodiment disclosed herein, but is included all technical solutions falling within the scope of the claims.
Claims (14)
1. a kind of radio frequency circuit board characterized by comprising
Rf board main body, with the rf board main body be electrically connected antenna element, for making the rf board main body and radio frequency
Integrated circuit be electrically connected the first conductive component and for connecting the antenna element electrically with the RF IC
The second conductive component connect；
Wherein, the rf board main body includes opposite first surface and second surface on thickness direction, the antenna
Component is embedded at the rf board main body and is located at this side of the first surface.
2. radio frequency circuit board according to claim 1, which is characterized in that first conductive component and second conduction
Component is the columnar structures extended by the second surface towards the first surface.
3. radio frequency circuit board according to claim 1 or 2, which is characterized in that first conductive component and described second
Conductive component is all set in region corresponding with the antenna element in the rf board main body.
4. radio frequency circuit board according to claim 1 or 2, which is characterized in that first conductive component and described second
Conductive component is cross-section columnar structures or variable cross-section columnar structures.
5. radio frequency circuit board according to claim 1 or 2, which is characterized in that first conductive component is by described second
Surface extends into the rf board main body towards the first surface, and second conductive component is by the second surface direction
The first surface extends through the rf board main body and extends into the antenna element.
6. radio frequency circuit board according to claim 5, which is characterized in that first conductive component be solid cylinder or
Person's hollow cylinder, second conductive component are solid cylinder or hollow cylinder.
7. radio frequency circuit board according to claim 1 or 2, which is characterized in that the radio frequency circuit board further includes that third is led
Electrical components, the third conductive component include being set to the intracorporal first connecting portion of the rf board master and being set to the day
Second connecting portion in line component, the antenna element or the rf board main body and the third conductive component are electrically connected.
8. radio frequency circuit board according to claim 7, which is characterized in that the third conductive component is from second table
The columnar structures extended facing towards the first surface, the first connecting portion and the second connecting portion are led along the third
The axial distribution of electrical components.
9. radio frequency circuit board according to claim 1 or 2, which is characterized in that the radio frequency circuit board further includes conducting resinl
Layer, the conductive adhesive layer are set between the antenna element and the rf board main body, and the antenna element is led by described
Electric glue-line and the rf board main body are electrically connected.
10. radio frequency circuit board according to claim 1 or 2, which is characterized in that the top surface of the antenna element and described the
One surface flushes or lower than the first surface.
11. a kind of radio frequency unit characterized by comprising
Radio frequency circuit board as described in any one of claim 1 to 10；
RF IC, setting corresponding with the second surface of the rf board main body, the rf board main body pass through
First conductive component and the RF IC are electrically connected, the antenna element by second conductive component with
The RF IC is electrically connected.
12. radio frequency unit according to claim 11, which is characterized in that the RF IC is embedded at the radio frequency
In plate main body and it is located at this side of the second surface of the rf board main body.
13. a kind of communication equipment, which is characterized in that the communication equipment includes power connector and radio frequency circuit board, described to penetrate
Frequency circuit plate is radio frequency circuit board as described in any one of claim 1 to 10.
14. a kind of communication equipment, which is characterized in that the communication equipment includes power connector and radio frequency unit, the radio frequency
Unit is radio frequency unit described in claim 11 or 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820328393.2U CN208317096U (en) | 2018-03-09 | 2018-03-09 | Radio frequency circuit board, radio frequency unit and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820328393.2U CN208317096U (en) | 2018-03-09 | 2018-03-09 | Radio frequency circuit board, radio frequency unit and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208317096U true CN208317096U (en) | 2019-01-01 |
Family
ID=64721666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820328393.2U Active CN208317096U (en) | 2018-03-09 | 2018-03-09 | Radio frequency circuit board, radio frequency unit and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208317096U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110635291A (en) * | 2019-03-29 | 2019-12-31 | 中航光电科技股份有限公司 | Radio frequency backboard and backboard assembly |
| CN113067587A (en) * | 2021-03-30 | 2021-07-02 | Oppo广东移动通信有限公司 | Radio frequency assembly and communication device |
-
2018
- 2018-03-09 CN CN201820328393.2U patent/CN208317096U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110635291A (en) * | 2019-03-29 | 2019-12-31 | 中航光电科技股份有限公司 | Radio frequency backboard and backboard assembly |
| CN113067587A (en) * | 2021-03-30 | 2021-07-02 | Oppo广东移动通信有限公司 | Radio frequency assembly and communication device |
| CN113067587B (en) * | 2021-03-30 | 2022-12-02 | Oppo广东移动通信有限公司 | Radio frequency assembly and communication equipment |
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