CN113067587A

CN113067587A - Radio frequency assembly and communication device

Info

Publication number: CN113067587A
Application number: CN202110338136.3A
Authority: CN
Inventors: 李宏源
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2021-07-02
Anticipated expiration: 2041-03-30
Also published as: CN115765762A; CN113067587B; CN115765762B

Abstract

The embodiment of the application relates to a radio frequency assembly and communication equipment; the radio frequency assembly comprises a radio frequency board, wherein M first radio frequency connection points are arranged on the radio frequency board; the radio frequency circuit is arranged on the radio frequency board and used for supporting the receiving and transmitting processing of the radio frequency signals; the antenna board is provided with M second radio frequency connection points, and each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner; the antenna group is arranged on the antenna plate and comprises N antennas; the switching circuit is arranged on the antenna board, a plurality of first ends of the switching circuit are respectively connected with the M second radio frequency connection points in a one-to-one correspondence mode, and a plurality of second ends of the switching circuit are respectively connected with the N antennas in a one-to-one correspondence mode; the switch circuit is used for selectively switching on the radio frequency paths between any M antennas and the M second radio frequency connection points in a one-to-one correspondence mode, so that the occupied area of the radio frequency board can be saved, the insertion loss caused by radio frequency wiring on the radio frequency board is effectively reduced, and the communication performance of the radio frequency assembly is improved.

Description

Radio frequency assembly and communication device

Technical Field

The embodiment of the application relates to the technical field of radio frequency antennas, in particular to a radio frequency assembly and communication equipment.

Background

The technical development of the current wireless communication network is changing day by day, the communication system is rapidly upgraded to 3G/4G/5G with higher bandwidth through 2G, and along with the improvement of the bandwidth, the service content brought to people is more and more abundant. At present, a New air interface (New Radio, NR) system of a 5G mobile communication system puts forward a Radio frequency system architecture requirement for supporting four antenna groups, that is, a Radio frequency system architecture requirement for selecting four antennas from a plurality of antennas to perform communication.

Generally, each device of a radio frequency system with four antenna groups is arranged on a radio frequency single board to realize 5G communication, but the radio frequency system arranged on the radio frequency single board has large insertion loss and low communication performance.

Disclosure of Invention

The embodiment of the application provides a radio frequency assembly and communication equipment, which can effectively reduce insertion loss caused by radio frequency wiring on a radio frequency board so as to improve the communication performance of the radio frequency assembly.

A radio frequency assembly, comprising:

a radio frequency board provided with M first radio frequency connection points,

the radio frequency circuit is arranged on the radio frequency board, is correspondingly connected with each first radio frequency connection point respectively, and is used for supporting the receiving and transmitting processing of radio frequency signals;

the antenna board is provided with M second radio frequency connection points, and each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner;

the antenna group is arranged on the antenna plate and comprises N antennas;

the switching circuit is arranged on the antenna board, a plurality of first ends of the switching circuit are respectively connected with the M second radio frequency connection points in a one-to-one correspondence mode, and a plurality of second ends of the switching circuit are respectively connected with the N antennas in a one-to-one correspondence mode; the switch circuit is used for selectively conducting the radio frequency paths between any M antennas and the M second radio frequency connection points in a one-to-one correspondence mode; wherein M is more than or equal to 2 and less than N, and N, M are positive integers.

A communication device, comprising: such as the radio frequency assembly described above.

The above radio frequency assembly and communication device include: the radio frequency board is provided with M first radio frequency connection points; the radio frequency circuit is arranged on the radio frequency board, is correspondingly connected with each first radio frequency connection point respectively, and is used for supporting the receiving and transmitting processing of radio frequency signals; the antenna board is provided with M second radio frequency connection points, and each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner; the antenna group is arranged on the antenna plate and comprises N antennas; the switching circuit is arranged on the antenna board, a plurality of first ends of the switching circuit are respectively connected with the M second radio frequency connection points in a one-to-one correspondence mode, and a plurality of second ends of the switching circuit are respectively connected with the N antennas in a one-to-one correspondence mode; the switch circuit is used for selectively conducting the radio frequency paths between any M antennas and the M second radio frequency connection points in a one-to-one correspondence mode; can avoid the radio frequency subassembly to only adopt a radio frequency board to bear radio frequency circuit, switch circuit and N antennas, in order to avoid setting up the first radio frequency tie point that equals with the antenna total number on radio frequency board 10, only need set up M first radio frequency tie point J on radio frequency board 10, reach the area occupied who saves the radio frequency board, and simultaneously, can also reduce the length of the line is walked to the radio frequency on the radio frequency board, can effectively reduce the radio frequency on the radio frequency board and walk the insertion loss of bringing of line, and then can improve the sensitivity and the communication performance of radio frequency subassembly. In addition, the switching circuit and the antenna group are arranged on the antenna board, so that the layout flexibility of the antenna group on the antenna board can be improved, the logic control of selecting M antennas from N antennas for communication can be realized, the assembly complexity of the radio frequency assembly is reduced, and the realizability is high.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of an embodiment of a radio frequency device;

fig. 2 is a second schematic structural diagram of an rf device according to an embodiment;

fig. 3 is a schematic structural diagram of an rf front-end module according to an embodiment;

fig. 4 is a schematic structural diagram of an rf board and an antenna board in an rf component according to an embodiment;

FIG. 5 is a third block diagram illustrating an exemplary RF device;

FIG. 6 is a fourth schematic structural diagram of an RF device according to an embodiment;

FIG. 7 is a fifth exemplary schematic structural diagram of an RF device according to an embodiment;

fig. 8 is a block diagram of a communication device according to an embodiment.

Detailed Description

To facilitate an understanding of the embodiments of the present application, the embodiments of the present application will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. The embodiments of the present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, the first radio frequency connection point may be referred to as the second radio frequency connection point, and similarly, the second radio frequency connection point may be referred to as the first radio frequency connection point, without departing from the scope of the present application. The first radio frequency connection point and the second radio frequency connection point are both radio frequency connection points, but are not the same radio frequency connection point.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present application, "a number" means at least one, such as one, two, etc., unless specifically limited otherwise.

In a radio frequency component of a MIMO (Multiple-In Multiple-Out) architecture In the related art, a radio frequency transceiver supporting MIMO, a radio frequency front end module, a radio frequency switch, and Multiple antennas are generally disposed on a radio frequency single board. The radio frequency single board is generally configured with a radio frequency connector and a fastening seat adjacent to the radio frequency connecting seat for each antenna. For example, if the rf module includes eight antennas, eight rf connectors and eight wire holders are required. The radio frequency connector occupies more area of the radio frequency single board. However, in consideration of the problem of the yield of welding of the rf single board, the area of the rf single board cannot be infinitely enlarged, and currently, the size of the rf single board is generally controlled to be 60mm × 60mm, so that the number of devices (e.g., rf connectors, wire holders, antennas) disposed on the rf single board has a certain limitation, and it is difficult to select 4 antenna sets from more multiple antennas (e.g., 10 antennas) to perform 5G communication.

Based on the above research, the present embodiment provides a radio frequency antenna board 100 to improve the above problems, and can implement switching between multiple antennas, and at the same time, can also save the occupied area of the radio frequency board, and effectively reduce the insertion loss caused by the radio frequency wiring on the radio frequency board, so as to improve the sensitivity and the communication performance of the radio frequency assembly.

As shown in fig. 1, an embodiment of the present application provides a radio frequency assembly. In one embodiment, the radio frequency components include a radio frequency board 10, an antenna board 20, radio frequency circuitry 110, switching circuitry 210, and an antenna stack 220.

The rf board 10 may also be referred to as an rf board. The radio frequency board 10 may be a multi-layer PCB board. The PCB can select Rogers RO5880 with a smaller dielectric constant as a dielectric substrate so as to reduce interference of the dielectric substrate on the antenna. Furthermore, glass fiber and other substances can be doped in the Rogers RO5880, and the hardness of the dielectric substrate is increased on the basis of not changing the original electrical property. The radio frequency board 10 is provided with M first radio frequency connection points J. The first rf connection point J may be an electrical connection point, for example, a solder joint, or a mounting point of a patch connector. Each first rf connection point J may be connected to the rf circuit 110 disposed on the rf board 10 through an rf trace or a microstrip trace. Specifically, the first rf connection point J may be connected to the rf trace by welding or by an rf connection socket. In the embodiment of the present application, the specific form of the first rf connection point J is not limited to the above-mentioned illustration.

As shown in FIG. 2, RF circuitry 110 may include satellite positioning RF circuitry for receiving satellite positioning signals at 1575MHz, WiFi and Bluetooth transceiver RF circuitry for handling the 2.4GHz and 5GHz bands of IEEE802.11 communications, and cellular telephone transceiver RF circuitry for handling wireless communications in cellular telephone bands, such as the 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, and Sub-6G bands. The Sub-6G frequency band may specifically include a 2.496GHz-6GHz frequency band and a 3.3GHz-6GHz frequency band.

Specifically, the rf circuit 110 may include an rf transceiver 111 and a plurality of rf front-end modules 113 connected to the rf transceiver 111. As shown in fig. 3, in particular, the rf front-end modules 113 may include at least one transceiver module 1131 and a plurality of receiving modules 1132, so as to support the amplification filtering process for receiving and transmitting the rf signals. In the embodiment of the present application, the plurality of rf front-end modules 113 includes at least one transceiver module 1131. Illustratively, the transceiver module 1131 may include a power amplifier, a low noise amplifier, a filter, a duplexer, a radio frequency switch, and other radio frequency devices. For example, the transceiver module 1131 may receive the radio frequency signal sent by the radio frequency transceiver 111, perform power amplification, filtering and other processing on the radio frequency signal, and transmit the radio frequency signal to the antenna to implement the transmission processing on the radio frequency signal, and correspondingly, the transceiver module 1131 may further receive the radio frequency signal received by each antenna, perform filtering and low-noise amplification processing on the radio frequency signal, and transmit the radio frequency signal to the radio frequency transceiver 111 to implement the reception processing on the radio frequency signal. The receiving module 1132 may include a low noise amplifier, a filter, a duplexer, a radio frequency switch, and other radio frequency devices. For example, the receiving module 1132 may receive the radio frequency signal received by each antenna, perform filtering and low-noise amplification on the radio frequency signal, and transmit the radio frequency signal to the radio frequency transceiver 111, so as to implement receiving processing on the radio frequency signal.

The antenna board 20 may also be a multilayer PCB board, and the material of the multilayer PCB board may be the same as that of the rf board 10 or different from that of the rf board 10. The number of the antenna boards 20 may be one or more. When the number of the antenna board 20 is plural, the number of the devices provided on the antenna board 20 can be adjusted adaptively. The antenna board 20 is provided with M second rf connection points K, where the second rf connection points K may be understood as electrical connection points, for example, a welding point, or a mounting point of a patch connector. Each of the second rf connection points K is connected to one of the first rf connection points J in a one-to-one correspondence manner, that is, the M second rf connection points K are electrically connected to the M first rf connection points J in a one-to-one correspondence manner, so as to electrically connect the rf board 10 and the antenna board 20.

Specifically, the first rf connection point J may be connected to the second rf connection point K through an rf trace. Optionally, the first rf connection point J may also be connected to the second rf connection point K through a patch panel.

In the embodiment of the present application, the material of the radio frequency board 10 and the antenna board 20 is not limited to the above examples, and may be other materials.

The antenna set 220, disposed on the antenna board 20, includes N antennas a, and each antenna a is configured to receive and transmit radio frequency signals. Wherein M is more than or equal to 2 and less than N, and N, M are positive integers. Specifically, each antenna a of antenna group 220 may be a directional antenna or a non-directional antenna. Illustratively, each antenna may be formed using any suitable type of antenna. For example, each antenna may include an antenna having a resonating element formed from the following antenna structure: at least one of an array antenna structure, a loop antenna structure, a patch antenna structure, a slot antenna structure, a helical antenna structure, a strip antenna, a monopole antenna, a dipole antenna, and the like. For example, the N antennas may be a 5G antenna, a 4G antenna, a WiFi antenna, a bluetooth antenna, and the like, and are used for correspondingly transceiving antenna signals of corresponding frequency bands. The number N of the antennas a may be 3, 4, 6, 8, 10, etc. to meet the communication requirement of the customer premises equipment.

The switching circuit 210 is disposed on the antenna board 20. Specifically, a plurality of first ends of the switch circuit 210 are respectively connected to the M second rf connection points K in a one-to-one correspondence, and a plurality of second ends of the switch circuit 210 are respectively connected to the N antennas a in a one-to-one correspondence. The switch circuit 210 may be configured to selectively turn on any of the M antennas a to correspond to the rf paths between the M second rf connection points K one to one. Each second rf connection point K may be connected to a switch circuit 210 disposed on the antenna board 20 through an rf trace and/or a microstrip trace, and the switch circuit 210 may be connected to an antenna group 220 disposed on the antenna board 20 through an rf trace and/or a microstrip trace.

It should be noted that the number of M may be set according to a Multiple Input Multiple Output (MIMO) technology that needs to be supported by the radio frequency component. For example, if the client front-end device needs to support 2 × 2MIMO, 2 antennas need to be selected from N antennas as a target transmit-receive antenna group to implement transmission and reception of radio frequency signals; if the client front-end device needs to support 4 × 4MIMO, four antennas from the N antennas need to be selected as a target transmit-receive antenna group to implement transmission and reception of radio frequency signals.

In this embodiment, by setting the radio frequency board 10 and the antenna board 20, and setting the radio frequency circuit 110 on the radio frequency board 10, and setting the switch circuit 210 and the antenna group 220 on the antenna board 20, it can be avoided that the radio frequency component only uses one radio frequency board 10 to carry the radio frequency circuit 110, the switch circuit 210 and N antennas a, so as to avoid setting the first radio frequency connection points equal to the total number of antennas on the radio frequency board 10, and only needs to set M first radio frequency connection points J on the radio frequency board 10, which can achieve the purpose of saving the occupied area of the radio frequency board 10, and at the same time, can also reduce the length of the radio frequency wiring on the radio frequency board 10, and can effectively reduce the insertion loss caused by the radio frequency wiring on the radio frequency board 10, and further can improve the sensitivity and the communication performance of the radio frequency. In addition, the switch circuit 210 and the antenna group 220 are disposed on the antenna board 20, so that the layout flexibility of the antenna group 220 on the antenna board 20 can be improved, and the logic control of selecting M antennas a from the N antennas a for communication can be realized, thereby reducing the assembly complexity of the radio frequency module and having strong realizability.

Further, by fixedly arranging the first rf connection point J on the rf board 10, in the using process, the antenna board 20 can be defined according to the communication requirement (e.g., communication environment, product requirement) of the rf system, and there is no need to repeatedly provide the rf board 10 with different first rf connection points J, which can reduce the cost and technical difficulty of formulating the rf board 10. In one embodiment, N third rf connection points Q are further disposed on the antenna board 20. The M first ends of the switch circuit 210 are connected to the M second rf connection points K in a one-to-one correspondence, the N second ends of the switch circuit 210 are connected to the N third rf connection points Q in a one-to-one correspondence, and the N third rf connection points Q are further connected to the N antennas a in a one-to-one correspondence. The third rf connection point Q may be an electrical connection point, for example, a solder joint, or a mounting point of a patch connector or a wire fastening base. Each third rf connection point Q is connected to a second end of the switch circuit 210 and the antenna a in a one-to-one correspondence. That is, the N antennas a may be connected to the second end of the switch circuit 210 through the third rf connection point Q, so as to electrically connect the switch circuit 210 and the antenna set 220.

Specifically, the connection mode of the third rf connection point Q and the antenna a includes one of a buckle connection and a soldering connection. Illustratively, the third rf connection point Q may be a solder joint, which may be implemented for solder connection with the antenna a. The third radio frequency connection point Q may also be a fastening head connection point, and may be electrically connected to the antenna a through a fastening head base. When the third radio frequency connection point Q is connected with the antenna A in a buckle head mode, the connection flexibility can be improved, and meanwhile, the assembly difficulty in the production process can be effectively reduced.

In one embodiment, the switch circuit 210 includes a plurality of switch units 211, a first end of each switch unit 211 is connected to a second rf connection point K, and a plurality of second ends of each switch unit 211 are respectively connected to the N third rf connection points Q in a one-to-one correspondence manner. Illustratively, the switch unit 211 may be at least one of a single-pole double-throw switch, a double-pole double-throw switch, and a multi-pole multi-throw switch. The types of the switch units 211 are different, the number of the switch units 211 included in the switch circuit 210, the connection relationship between the switch units 211 and each of the antennas a and the second rf connection point K, and the switching and conducting logic between the switch units 211 are also different, and adaptive adjustment can be performed according to actual requirements, so that the rf module can conduct the rf paths of the M antennas a at the same time, and define the M antennas a conducted at the same time as a transceiver antenna group.

In the embodiments of the present application, for convenience of description, M is 4 and N is 8. That is, the antenna group 220 includes 8 antennas a, four first rf connection points J are disposed on the rf board 10, and four second rf connection points K are disposed on the antenna board 20. Specifically, the rf circuit 110 disposed on the rf board 10 may include an rf transceiver 111 and four rf front-end modules 113, and the switch circuit 210 disposed on the antenna board 20 includes four single-pole double-throw switches. The first end of each single-pole double-throw switch is connected with a second radio frequency connection point K, and the two second ends of each single-pole double-throw switch are respectively connected with the two antennas A in a one-to-one correspondence mode.

Specifically, the rf transceiver 111 may obtain network information of each transceiver antenna group, and analyze the network to determine a target transceiver antenna group. The network information may include, among other things, raw and processed information associated with wireless performance metrics of the received radio frequency signal, such as received power, reference signal received quality, received signal strength indication, signal-to-noise ratio, and so on. For example, the network information is taken as the received power for explanation. The radio frequency transceiver 111 may rank the magnitudes of the signal-to-noise ratios Si of the radio frequency signals received by each transceiver antenna group, where i identifies the identification information of the transceiver antenna group, for example, the signal-to-noise ratio of the first transceiver antenna group is S1, and the transceiver antenna group with the largest signal-to-noise ratio is taken as the target transceiver antenna group.

Specifically, after the rf transceiver 111 determines the target antenna group, the four antennas a (e.g., a1, a2, a4, and a6) in the target antenna group may be controlled to be in an operating state, so as to implement the transceiving control of the rf signal. In addition, in order to improve the throughput of the radio frequency system, the radio frequency system may further control each switch of the switch circuit 210, so that the radio frequency system can support a 1T4R (1 transmitting 4 receiving) function in which one path of transmission signal is transmitted alternately between four antennas a in the target transceiver antenna group, that is, only one path of transmission signal may perform SRS (Sounding Reference signal) Switching in 4 paths of reception channels (four antennas a).

In the embodiment of the present application, the switch circuit 210 is disposed on the antenna board 20, that is, the selection logic control of the antenna a is received on the antenna board 20, and the antenna board 20 can support the selection of each antenna a and the extension of the third rf connection point Q (which can also be understood as an antenna interface), so that the length of the whole rf trace in the rf component can be reduced by (N-M) × pitch L, for example, by (8-4) × pitch L. The distance L is the distance between the first radio frequency connection point J and the second radio frequency connection point K, so that insertion loss of the corresponding length can be reduced, and the communication performance of the radio frequency assembly can be improved.

As shown in fig. 4, in one embodiment, the rf board 10 and the antenna board 20 are stacked in a first direction, which may also be understood as a thickness direction of the rf board 10, that is, the first direction is perpendicular to a plane where the rf circuit 110 is disposed. Specifically, the rf board 10 and the antenna group 220 may at least partially overlap in the first direction. When the rf board 10 and the antenna board 20 are stacked in the first direction, the area of the rf component on the plane where the rf board 10 is disposed can be further reduced, and the occupied area of the rf component in the communication device can be further reduced. For example, the antenna board 20 may completely overlap with the radio frequency board 10, so that the occupied area of the antenna board 20 and the radio frequency board 10 can be minimized.

Alternatively, when the rf board 10 and the antenna board 20 are stacked in the first direction, they may be stacked in contact with each other or stacked at intervals. Wherein, the interval of interval stack can also be filled with buffer material to realize the effect of shock attenuation. The buffer material has no electric field interference and no magnetic field interference to the radio frequency signal.

With continued reference to fig. 4, in one embodiment, the rf board 10 includes a first surface 101 and a second surface 102 disposed opposite to each other, wherein the first surface 101 and the second surface 102 can also be understood as two surfaces of the rf board 10 in the thickness direction, which can be used for disposing the rf circuit 110.

The antenna board 20 includes a third surface 201 and a fourth surface 202 disposed opposite to each other, wherein the third surface 201 and the fourth surface 202 can also be understood as two surfaces of the antenna board 20 in the thickness direction, which can be used for disposing the antenna group 220. It should be noted that, in the embodiment of the present application, the layered structure of the antenna board 20 may be defined according to the type of the antenna a, and the radiator of the antenna a may be correspondingly disposed in the corresponding layered structure of the antenna board 20.

In one embodiment, the rf circuit 110 is disposed on the first surface 101. Antenna group 220 is disposed on fourth surface 202. The second surface 102 is disposed close to the third surface 201, that is, the rf circuit 110 may be disposed on a bottom surface of the rf module, and the antenna module 220 may be disposed on a top surface of the rf module, which may be beneficial to radiation of the antenna a to the rf signal and improve radiation performance of the antenna a.

In one embodiment, a groove for accommodating the rf circuit 110 may be further formed on the rf board 10, and the rf circuit 110 is disposed in the groove, that is, the highest surface of the rf circuit 110 may be flush with the first surface 101. This reduces the footprint of the rf circuit 110 in the first direction. It should be noted that the highest surface of the rf circuit 110 may be understood as the upper surface of the device having the highest height in the rf circuit 110.

In one embodiment, the rf board 10 includes a first side edge 103, and each first rf connection point J is disposed along the first side edge 103. In particular, the first side edge 103 may be understood as a side edge of the first surface 101 of the rf board 10. The antenna plate 20 comprises second side edges 104, each second radio frequency connection point K being arranged along the second side edges 104, wherein the second side edges 104 may also be understood as one side edge of the fourth surface 202 of the antenna plate 20. In the embodiment of the present application, the first side edge 103 and the second side edge 104 may be disposed adjacent to each other at a parallel interval, so that the distance between the first rf connection point J and the second rf connection point K is the same, the length of the rf trace therebetween is also the same, and further, the insertion loss caused by the rf trace is also the same, that is, the insertion loss on the receiving link of the M antennas a is the same, and the communication performance can also be maintained stable.

Specifically, when the rf board 10 and the antenna board 20 are stacked in the first direction, the first side edge 103 and the second side edge 104 may be aligned in the first direction, so that the long path of each rf trace for connecting the first rf connection point J and the second rf connection point K may be consistent, and further, the insertion loss of the rf trace on the rf receiving path and/or the rf transmitting path where each antenna a is located may be consistent, and in addition, when the first side edge 103 and the second side edge 104 are aligned in the first direction, the length of the rf trace for connecting the first rf connection point and the second rf connection point K may be further shortened, so as to further reduce the insertion loss on the rf receiving path and/or the rf transmitting path, and further improve the sensitivity and the communication performance of the rf component.

Referring to fig. 2, in one embodiment, when the radio frequency board 10 and the antenna board 20 are not stacked in the first direction, for example, the first surface 101 of the radio frequency board 10 and the third surface 201 of the antenna board 20 are disposed coplanar, the first side edge 103 and the second side edge 104 are disposed adjacent to each other in parallel, that is, the distance between the first side edge 103 and the second side edge 104 is smaller than the distance between the first side edge 103 and any side edge of the antenna board 20. When the distance between the first side edge 103 and the second side edge 104 is shortest, the distance for connecting the rf traces between the first rf connection point J and the second rf connection point K can be correspondingly shortened, and then the insertion loss can be reduced to improve the performance of the rf component.

As shown in fig. 5, in one embodiment, when the rf board 10 and the antenna board 20 are not stacked in the first direction, for example, the first surface 101 of the rf board 10 is perpendicular to the third surface 201 of the antenna board 20, the first side edge 103 is disposed adjacent to and parallel to the second side edge 104, which may further shorten the length of the rf trace connecting between the first rf connection point and the second rf connection point K, so as to further reduce insertion loss on the rf receiving path and/or the rf transmitting path, thereby improving the sensitivity and the communication performance of the rf module.

As shown in fig. 5, in one embodiment, the antenna board 20 includes a plurality of antenna sub-boards 20 a. The size and shape of each antenna plate, the number of the switches and the antennas A arranged on each antenna daughter board can be the same or different. Specifically, a plurality of antenna sub-boards 20a may be disposed around the radio frequency board 10. Optionally, the antenna sub-boards 20a may also be distributed on two sides of the rf board 10, or may be distributed on the same side of the rf board 10.

The size, shape and relative position of the antenna daughter boards 20a to the radio frequency board 10 are not further limited, and may be set according to actual requirements.

In this embodiment, the switches and the antennas a are distributed on different antenna sub-boards 20a, so that the area of each antenna sub-board 20a is small, and each antenna sub-board 20a can be flexibly disposed in a relatively small space of the communication device, thereby improving the design flexibility of disposing each antenna sub-board 20a in the communication device.

In one embodiment, if the third rf connection point Q is connected to the antenna a by a buckle connection, the antenna board 20 may include an antenna single board 20c and a substrate 20b, as shown in fig. 6. The substrate 20b may be a PCB, wherein the substrate 20b may be a Router board, the substrate 20b may be a large board for soldering the rf board 10, and the substrate may also be used to expand the rf interface and the non-cellular function of the rf board 10. Specifically, the third rf connection point Q and the antenna group 220 are respectively disposed on the antenna single board 20c, and the second rf connection point K, the switch circuit 210 and the rf board 10 are respectively disposed on the substrate 20 b.

In the embodiment of the present application, both the rf board 10 and the switch circuit 210 may be disposed on the substrate 20b, that is, the switch circuit 210 may be multiplexed with the substrate 20b, so as to reduce the area of the antenna single board 20c, thereby reducing the occupied space of the rf component.

In one embodiment, when the antenna board 20 includes the antenna single board 20c and the substrate 20b, the antenna single board 20c may be divided into a plurality of antenna sub-boards 20a according to the description of the previous embodiment, wherein each antenna sub-board 20a may have at least one antenna a, and for example, each antenna sub-board 20a may have two antennas a correspondingly. The plurality of antenna sub-boards 20a in the embodiment of the present application can improve the design flexibility in which each antenna sub-board 20a is provided in the communication device.

As shown in fig. 7, in one embodiment, the radio frequency board 10 is further provided with M buckling seats P, where the M buckling seats P are adjacent to the M first radio frequency connection points J in a one-to-one correspondence manner, and are used to fix a radio frequency trace used for connecting between the first radio frequency connection point J and the second radio frequency connection point K.

In this embodiment, the radio frequency board 10 may use a conventional radio frequency board without additional development, and when the number of the first radio frequency connection points J used on the radio frequency board is reduced, the unused first radio frequency connection points J may be used to support other functions, for example, support WiFi communication, so as to implement multiplexing with other functions.

As shown in fig. 8, an embodiment of the present application further provides a communication device. In one embodiment, a communication device includes: the radio frequency assembly of any of the preceding embodiments. The radio frequency component according to the embodiment of the present application may be applied to a communication device having a wireless communication function, where the communication device may be a handheld device, a vehicle-mounted device, a wearable device, a computing device, a Customer Premise Equipment (CPE) or other processing device connected to a wireless modem, and various User Equipments (UEs), such as a Mobile phone, a Mobile Station (MS), and the like. For convenience of description, the above-mentioned devices are collectively referred to as a communication device.

Above-mentioned communication equipment is through setting up radio frequency board 10, antenna panel 20, and set up radio frequency circuit 110 on radio frequency board 10, set up switch circuit 210 and antenna stack 220 on antenna panel 20, can avoid the radio frequency subassembly to only adopt a radio frequency board 10 to bear radio frequency circuit 110, switch circuit 210 and N branch antenna A, and then can reduce the quantity that is used for connecting the radio frequency connecting seat of N branch antenna A on the radio frequency board 10, reach the area occupied who saves radio frequency board 10, and simultaneously, can also reduce the length of the line of radio frequency on radio frequency board 10, can effectively reduce the insertion loss of the radio frequency line of radio frequency on radio frequency board 10 brought, and then can improve the sensitivity and the communication performance of radio frequency subassembly. In addition, the switch circuit 210 and the antenna group 220 are disposed on the antenna board 20, so that the layout flexibility of the antenna group 220 on the antenna board 20 can be improved, and the logic control of selecting M antennas from N antennas for communication can be realized, thereby reducing the assembly complexity of the radio frequency module and having strong realizability.

Further, the communication device is taken as a client front-end device for example. In particular, the at least one client front-end device may further include a client front-end device including a housing 11, a memory 21 (which optionally includes one or more computer-readable storage media), a processor 22, a peripheral interface 23, a Radio Frequency (RF) component 24, and an input/output (I/O) subsystem 26. These components optionally communicate via one or more communication buses or signal lines 29. Those skilled in the art will appreciate that the client pre-device illustrated in fig. 2 is not limiting and may include more or fewer components than those illustrated, or some components may be combined, or a different arrangement of components. The various components shown in fig. 8 are implemented in hardware, software, or a combination of both hardware and software, including one or more signal processing and/or application specific integrated circuits.

The memory 21 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Illustratively, the software components stored in the memory 21 include an operating system, a communications module (or set of instructions), a Global Positioning System (GPS) module (or set of instructions).

Processor 22 and other control circuitry, such as control circuitry in radio frequency circuitry 24, may be used to control the operation of customer premises equipment 10. The processor 22 may be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, and the like.

The processor 22 may be configured to implement a control algorithm that controls the use of the antenna in the customer premises equipment 10. For example, the processor 22 may be configured to control the radio frequency components 24 to select multiple antennas to form multiple transceiver antenna groups, and further, to select a target antenna group within the multiple transceiver antenna groups to transmit and/or receive antenna signals.

The I/O subsystem 26 couples input/output peripheral devices on the customer premises equipment 10, such as keypads and other input control devices, to the peripheral device interface 23. The I/O subsystem 26 optionally includes a touch screen, buttons, levers, touch pads, keypads, keyboards, tone generators, accelerometers (motion sensors), ambient and other sensors, light emitting diodes and other status indicators, data ports, and the like. Illustratively, a user may control the operation of the client front-end device 10 by supplying commands via the I/O subsystem 26, and may receive status information and other output from the client front-end device 10 using the output resources of the I/O subsystem 26. For example, a user pressing button 261 may turn on the customer premises device or turn off the customer premises device.

The rf component 24 may be the rf component in any of the foregoing embodiments, wherein the rf circuit in the rf component 24 is further configured to process rf signals of a plurality of different frequency bands. Such as satellite positioning radio frequency circuitry for receiving satellite positioning signals at 1575MHz, WiFi and bluetooth transceiver radio frequency circuitry for handling the 2.4GHz and 5GHz bands of IEEE802.11 communications, cellular telephone transceiver radio frequency circuitry for handling wireless communications in cellular telephone bands such as 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz bands, and Sub-6G bands. The Sub-6G frequency band may specifically include a 2.496GHz-6GHz frequency band and a 3.3GHz-6GHz frequency band.

Illustratively, the radio frequency circuitry may also include a baseband processor. The baseband processor may provide network information to the processor 22. The network information may include raw and processed information associated with wireless performance metrics of the Received antenna signals, such as Received Power, transmitted Power, Reference Signal Received Power (RSRP), Reference Signal Received Quality (RSRQ), Received Signal Strength Indicator (RSSI), Signal to Noise Ratio (SNR), Rank of MIMO channel matrix (Rank), carrier to Interference plus Noise Ratio (RS-CINR), frame error rate, bit error rate, channel quality measurement based on signal quality data such as Ec/lo or c/No data, information on whether a response (reply) corresponding to a request from a mobile terminal is being received from a base station, information on whether a network access procedure is successful, and the like.

The processor 22 may analyze the received network information and, in response, the processor 22 (or, if desired, a baseband processor, a radio frequency transceiver) may issue control commands for controlling the radio frequency assembly 24. For example, the processor 22 may issue a control command to control the multiple transceiver antenna groups of the radio frequency assembly 24 to be in an operating state in sequence, and further determine a target transceiver antenna group from the multiple transceiver antenna groups to control the target transceiver antenna group to transmit and receive an antenna signal. Wherein, the transceiver antenna group comprises a plurality of antennas.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the concept of the embodiments of the present application, and these embodiments are within the scope of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the appended claims.

Claims

1. A radio frequency assembly, comprising:

the antenna group is arranged on the antenna plate and comprises N antennas;

the switching circuit is arranged on the antenna board and used for selectively conducting radio frequency paths between any M antennas and the M second radio frequency connection points in a one-to-one correspondence mode; wherein M is more than or equal to 2 and less than N, and N, M are positive integers.

2. The radio frequency assembly according to claim 1, wherein the radio frequency board and the antenna board are stacked in a first direction, and the first direction is a thickness direction of the radio frequency board.

3. The radio frequency assembly of claim 2, wherein the radio frequency board comprises first and second oppositely disposed surfaces, wherein the radio frequency circuitry is disposed on the first surface, and wherein the antenna board comprises third and fourth oppositely disposed surfaces, wherein the antenna group is disposed on the fourth surface, and wherein the second surface is disposed proximate to the third surface.

4. The radio frequency assembly of claim 1, wherein the radio frequency board includes a first side edge along which each of the first radio frequency connection points is disposed, and the antenna board includes a second side edge along which each of the second radio frequency connection points is disposed, wherein the first side edge is disposed adjacent to and in parallel spaced relation to the second side edge.

5. The radio frequency component according to claim 1, wherein the antenna board further has N third radio frequency connection points, wherein the switch circuit includes M first terminals and N second terminals, the M first terminals are connected to the M second radio frequency connection points in a one-to-one correspondence, the N second terminals are connected to the N third radio frequency connection points in a one-to-one correspondence, and the N third radio frequency connection points are further connected to the N antennas in a one-to-one correspondence.

6. The radio frequency component according to claim 5, wherein M is 8 and N is 4, wherein the switch circuit includes four single-pole double-throw switches, a first end of each single-pole double-throw switch is connected to one of the second radio frequency connection points, and two second ends of each single-pole double-throw switch are respectively connected to two of the third radio frequency connection points in a one-to-one correspondence manner.

7. The RF assembly of claim 5, wherein when the third RF connection point is connected to the antenna in a buckle connection manner, the antenna board comprises an antenna single board and a substrate, wherein,

the third radio frequency connecting point and the antenna group are respectively arranged on the antenna single board,

the second radio frequency connection point, the switch circuit and the radio frequency board are respectively arranged on the substrate.

8. The radio frequency component according to claim 7, wherein the antenna single board comprises a plurality of antenna sub-boards, and each antenna sub-board is provided with at least one antenna.

9. The radio frequency assembly according to claim 1, wherein the radio frequency board is further provided with M buckling wire seats, and the M buckling wire seats are disposed adjacent to the M first radio frequency connection points in a one-to-one correspondence manner, and are used for fixedly connecting the radio frequency traces between the first radio frequency connection points and the second radio frequency connection points.

10. A communication device, comprising: the radio frequency assembly of any one of claims 1-9.