CN115765762B - Radio frequency assembly and communication device - Google Patents
Radio frequency assembly and communication device Download PDFInfo
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- CN115765762B CN115765762B CN202211395252.XA CN202211395252A CN115765762B CN 115765762 B CN115765762 B CN 115765762B CN 202211395252 A CN202211395252 A CN 202211395252A CN 115765762 B CN115765762 B CN 115765762B
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- 238000004891 communication Methods 0.000 title claims abstract description 50
- 238000012545 processing Methods 0.000 claims abstract description 9
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- 230000035945 sensitivity Effects 0.000 description 6
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The embodiment of the application relates to a radio frequency assembly and communication equipment; the radio frequency assembly comprises a radio frequency board provided with M first radio frequency connection points; the radio frequency circuit is arranged on the radio frequency board and is used for supporting the receiving and transmitting processing of radio frequency signals; the antenna board is provided with M second radio frequency connection points and N third radio frequency connection points, each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner, the N third radio frequency connection points are used for being connected with N antennas in a one-to-one correspondence manner, the radio frequency board and the antenna board are stacked in a first direction, and the first direction is the thickness direction of the radio frequency board; the switch circuit is used for selecting and conducting radio frequency channels between the M antennas and the M second radio frequency connection points in a one-to-one correspondence mode, so that the occupied area of the radio frequency board can be saved, the insertion loss caused by radio frequency wiring on the radio frequency board can be effectively reduced, and the communication performance of the radio frequency assembly can be improved.
Description
Technical Field
The embodiment of the application relates to the technical field of radio frequency antennas, in particular to a radio frequency assembly and communication equipment.
Background
The current wireless communication network technology is developed day by day, the communication system is rapidly upgraded from 2G to 3G/4G/5G with higher bandwidth, and the service content brought to people is more and more abundant along with the improvement of the bandwidth. At present, a New air interface (NR) system of a 5G mobile communication system proposes a Radio frequency system architecture requirement for supporting a four antenna group, that is, a Radio frequency system architecture requirement for selecting four antennas from multiple antennas to perform communication.
In general, each device of the radio frequency system of the four antenna groups is disposed on a radio frequency board to implement 5G communication, but the radio frequency system disposed on the radio frequency board has large insertion loss and low communication performance.
Disclosure of Invention
The embodiment of the application provides a radio frequency assembly and communication equipment, which can effectively reduce the insertion loss brought by radio frequency wiring on a radio frequency board so as to improve the communication performance of the radio frequency assembly.
A radio frequency assembly comprising:
the radio frequency board is provided with M first radio frequency connection points,
the radio frequency circuit is arranged on the radio frequency board and is correspondingly connected with each first radio frequency connection point respectively and used for supporting the receiving and transmitting processing of radio frequency signals; the first radio frequency connection point is a welding point;
the antenna board is provided with M second radio frequency connection points, each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner, and the N third radio frequency connection points are used for being connected with N antennas in a one-to-one correspondence manner;
the switch circuit is arranged on the antenna board, a plurality of first ends of the switch circuit are respectively connected with the M second radio frequency connection points in a one-to-one correspondence manner, and a plurality of second ends of the switch circuit are respectively connected with the N antennae in a one-to-one correspondence manner; the switch circuit is used for selectively conducting radio frequency channels between the arbitrary M antennas and the M second radio frequency connection points in one-to-one correspondence respectively; wherein M is more than or equal to 2 and less than N, and N, M are positive integers; the radio frequency board and the antenna board are stacked in a first direction, and the first direction is the thickness direction of the radio frequency board.
A communication device, comprising: such as the radio frequency assembly described above.
The radio frequency assembly and the communication device comprise: the radio frequency board is provided with M first radio frequency connection points; the radio frequency circuit is arranged on the radio frequency board and is correspondingly connected with each first radio frequency connection point respectively and used for supporting the receiving and transmitting processing of radio frequency signals; the antenna board is provided with M second radio frequency connection points, and each second radio frequency connection point is connected with one first radio frequency connection point in a one-to-one correspondence manner; the antenna group is arranged on the antenna board and comprises N antennas; the switch circuit is arranged on the antenna board, a plurality of first ends of the switch circuit are respectively connected with the M second radio frequency connection points in a one-to-one correspondence manner, and a plurality of second ends of the switch circuit are respectively connected with the N antennae in a one-to-one correspondence manner; the switch circuit is used for selectively conducting radio frequency channels between the arbitrary M antennas and the M second radio frequency connection points in one-to-one correspondence respectively; the radio frequency assembly can be prevented from adopting only one radio frequency board to bear the radio frequency circuit, the switch circuit and the N antennas, so that the first radio frequency connection points equal to the total number of the antennas are prevented from being arranged on the radio frequency board, only M first radio frequency connection points are required to be arranged on the radio frequency board, the occupied area of the radio frequency board is saved, meanwhile, the length of a radio frequency wiring on the radio frequency board can be reduced, the insertion loss brought by the radio frequency wiring on the radio frequency board can be effectively reduced, and the sensitivity and the communication performance of the radio frequency assembly can be improved. In addition, the switching circuit and the antenna group are arranged on the antenna board, so that the flexibility of the layout of the antenna group on the antenna board can be improved, the logic control of selecting M antennas from N antennas for communication can be realized, the assembly complexity of the radio frequency assembly is reduced, and the realizability is strong.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of an RF assembly according to an embodiment;
FIG. 2 is a second schematic diagram of an RF device according to an embodiment;
FIG. 3 is a schematic structural diagram of an RF front-end module according to an embodiment;
FIG. 4 is a schematic structural diagram of an RF board and an antenna board in an RF assembly according to an embodiment;
FIG. 5 is a third schematic block diagram of an RF assembly according to one embodiment;
FIG. 6 is a schematic diagram of a RF assembly according to one embodiment;
FIG. 7 is a schematic diagram of a RF assembly according to an embodiment;
fig. 8 is a block diagram of a communication device of an embodiment.
Detailed Description
In order to facilitate an understanding of the embodiments of the present application, the embodiments of the present application will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. However, embodiments of the present application may be embodied in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first radio frequency connection point may be referred to as a second radio frequency connection point, and similarly, a second radio frequency connection point may be referred to as a first radio frequency connection point, without departing from the scope of the present application. The first radio frequency connection point and the second radio frequency connection point are both radio frequency connection points, but they are not the same radio frequency connection point.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise. In the description of the present application, the meaning of "several" means at least one, such as one, two, etc., unless explicitly defined otherwise.
Related art radio frequency components of MIMO (Multiple-In Multiple-Out) architecture generally include a radio frequency transceiver, a radio frequency front-end module, a radio frequency switch, and Multiple antennas that support MIMO all disposed on a radio frequency board. The radio frequency single board is generally provided with a radio frequency connector and a wire buckling seat which is arranged adjacent to the radio frequency connector for each antenna. For example, if the rf assembly includes eight antennas, eight rf connectors and eight wire holders are required. The radio frequency connector occupies more area of the radio frequency single board. However, considering the problem of the welding yield of the radio frequency single board, the area of the radio frequency single board cannot be infinitely enlarged, and the current industry is generally controlled to 60mm by 60mm, so that the number of devices (such as a radio frequency connector, a wire buckling seat and an antenna) arranged on the radio frequency single board is limited to a certain extent, and it is difficult to select 4 antenna groups from more antennas (such as 10 antennas) to perform 5G communication.
Based on the above-mentioned research, this embodiment provides a radio frequency antenna board to improve above-mentioned problem, can realize switching between the multiple antennas, simultaneously, can also save the area occupied by radio frequency board, effectively reduce the loss of inserting that brings of radio frequency wiring on the radio frequency board, in order to improve the sensitivity and the communication performance of radio frequency subassembly.
As shown in fig. 1, an embodiment of the present application provides a radio frequency assembly. In one embodiment, the radio frequency components include a radio frequency board 10, an antenna board 20, a radio frequency circuit 110, a switching circuit 210, and an antenna group 220.
The radio frequency board 10 may also be referred to as a radio frequency board. The radio frequency board 10 may be a multi-layer PCB board. The PCB can select the Rogers RO5880 with smaller dielectric constant as a dielectric substrate so as to reduce the interference of the dielectric substrate on the antenna. Further, the Rogers RO5880 may be doped with a material such as glass fiber, which increases the hardness of the dielectric substrate without changing the original electrical properties. M first radio frequency connection points J are provided on the radio frequency board 10. The first radio frequency connection point J may be understood as an electrical connection point, for example, may be a soldered point, or may be a mounting point of a patch connector. Each first rf connection point J may be connected to the rf circuit 110 disposed on the rf board 10 through an rf trace or a microstrip trace. Specifically, the connection mode between the first radio frequency connection point J and the radio frequency wiring may be a welded connection or may be a connection through a radio frequency connection seat. In the embodiment of the present application, the specific form of the first radio frequency connection point J is not limited to the above-described illustration.
As shown in fig. 2, the radio frequency circuitry 110 may include satellite positioning radio frequency circuitry for receiving satellite positioning signals of 1575MHz, wiFi and bluetooth transceiver radio frequency circuitry for handling 2.4GHz and 5GHz bands of IEEE802.11 communications, and cellular telephone transceiver radio frequency circuitry for handling wireless communications of cellular telephone bands (such as bands of 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, and Sub-6G bands). The Sub-6G frequency band may specifically include a 2.496GHz-6GHz frequency band, and a 3.3GHz-6GHz frequency band.
Specifically, the rf circuit 110 may include an rf transceiver 111 and a plurality of rf front-end modules 113 connected to the rf transceiver 111. As shown in fig. 3, in particular, the plurality of rf front-end modules 113 may include at least one transceiver module 1131 and a plurality of receiver modules 1132 to support the amplification filtering process for rf signal reception and transmission. In the embodiment of the present application, at least one transceiver module 1131 is included in the plurality of rf front-end modules 113. By way of example, the transceiver module 1131 may include a power amplifier, a low noise amplifier, a filter, a duplexer, a radio frequency switch, and the like. For example, the transceiver module 1131 may receive the radio frequency signal sent by the radio frequency transceiver 111, perform power amplification, filtering, and other processes on the radio frequency signal, and transmit the radio frequency signal to the antenna to implement transmission processing on the radio frequency signal, and correspondingly, the transceiver module 1131 may also receive the radio frequency signal received by each antenna, perform filtering, low noise amplification, and transmit the radio frequency signal to the radio frequency transceiver 111 to implement reception processing on the radio frequency signal. The receiving module 1132 may include a low noise amplifier, a filter, a duplexer, a radio frequency switch, and the like. For example, the receiving module 1132 may receive the radio frequency signal received by each antenna, filter the radio frequency signal, amplify the radio frequency signal with low noise, and transmit the radio frequency signal to the radio frequency transceiver 111 to implement receiving processing of the radio frequency signal.
The antenna board 20 may be a multi-layer PCB, and may be made of the same material as the rf board 10 or different material from the rf board 10. The number of antenna plates 20 may be one or a plurality. When the number of the antenna board 20 is plural, the number of the devices provided on the antenna board 20 can be adaptively adjusted. The antenna board 20 is provided with M second radio frequency connection points K, where the second radio frequency connection points K may be understood as electrical connection points, for example, may be soldered points, or may be mounting points of a patch connector. Each second rf connection point K is connected to one first rf connection point J in a one-to-one correspondence, that is, the M second rf connection points K are electrically connected to the M first rf connection points J in a one-to-one correspondence, so as to realize electrical connection between the rf board 10 and the antenna board 20.
Specifically, the first radio frequency connection point J may be connected to the second radio frequency connection point K through a radio frequency wiring. Optionally, the first radio frequency connection point J may also be connected to the second radio frequency connection point K through an interposer.
In the embodiment of the present application, the materials of the rf board 10 and the antenna board 20 are not limited to the above-mentioned examples, but may be other materials.
The antenna group 220 is disposed on the antenna board 20, and includes N antennas a, each of which is configured to transmit and receive radio frequency signals. Wherein M is more than or equal to 2 and less than N, and N, M is a positive integer. Specifically, each antenna a of the antenna group 220 may be a directional antenna or a non-directional antenna. Illustratively, each antenna may be formed using any suitable type of antenna. For example, each antenna may include an antenna with a resonating element formed from the following antenna structure: at least one of an array antenna structure, a loop antenna structure, a patch antenna structure, a slot antenna structure, a helical antenna structure, a strip antenna, a monopole antenna, a dipole antenna, and the like. For example, the N antennas may be a 5G antenna, a 4G antenna, a WiFi antenna, a bluetooth antenna, etc. for receiving and transmitting antenna signals in corresponding frequency bands. The number N of antennas a may be 3, 4, 6, 8, 10, etc. to meet the communication requirements of the client front-end.
The switching circuit 210 is disposed on the antenna board 20. Specifically, the first ends of the switch circuit 210 are respectively connected to the M second radio frequency connection points K in a one-to-one correspondence manner, and the second ends of the switch circuit 210 are respectively connected to the N antennas a in a one-to-one correspondence manner. The switch circuit 210 may be configured to selectively turn on radio frequency paths between the M antennas a and the M second radio frequency connection points K in a one-to-one correspondence. The second rf connection points K may be connected to the switch circuit 210 disposed on the antenna board 20 through rf traces and/or microstrip traces, and the switch circuit 210 may be connected to the antenna group 220 disposed on the antenna board 20 through rf traces and/or microstrip traces.
It should be noted that the number of M may be set according to the multiple-input multiple-output (Multiple Input Multiple Output, MIMO) technology that the radio frequency component needs to support. For example, if the client front-end equipment needs to support 2×2mimo, 2 antennas are required to be selected from N antennas as a target transceiver antenna group to realize the transceiver of the radio frequency signal; if the client front-end equipment needs to support 4×4mimo, four antennas are required to be selected from the N antennas as a target transceiver antenna group to realize the transceiver of the radio frequency signal, and so on.
In this embodiment, by setting the rf board 10 and the antenna board 20, and setting the rf circuit 110 on the rf board 10, and setting the switch circuit 210 and the antenna group 220 on the antenna board 20, it is possible to avoid that the rf assembly only adopts one rf board 10 to carry the rf circuit 110, the switch circuit 210 and the N antennas a, so as to avoid setting the first rf connection points equal to the total number of antennas on the rf board 10, and only needs to set M first rf connection points J on the rf board 10, so as to save the occupied area of the rf board 10, and simultaneously, also reduce the length of the rf trace on the rf board 10, so as to effectively reduce the insertion loss caused by the rf trace on the rf board 10, and further improve the sensitivity and communication performance of the rf assembly. In addition, the switch circuit 210 and the antenna group 220 are arranged on the antenna board 20, so that the flexibility of the layout of the antenna group 220 on the antenna board 20 can be improved, the logic control of selecting M antennas A from N antennas A for communication can be realized, the assembly complexity of the radio frequency component is reduced, and the realizability is strong.
Further, by fixing the first rf connection point J provided on the rf board 10, in the use process, the antenna board 20 can be defined according to the communication requirement (e.g. communication environment, product requirement) of the rf system, without repeatedly providing the rf board 10 with different first rf connection points J, so that the cost and technical difficulty for making the rf board 10 can be reduced.
In one embodiment, the antenna board 20 is further provided with N third radio frequency connection points Q. The M first ends of the switch circuit 210 are connected to the M second radio frequency connection points K in a one-to-one correspondence, the N second ends of the switch circuit 210 are connected to the N third radio frequency connection points Q in a one-to-one correspondence, and the N third radio frequency connection points Q are also connected to the N antennas a in a one-to-one correspondence. The third rf connection point Q may be understood as an electrical connection point, for example, a soldering point, a mounting point of a patch connector or a wire holder, or the like. Each third rf connection point Q is connected to a second end of the switch circuit 210 and the antenna a in a one-to-one correspondence. That is, the N antennas a may be connected to the second terminal of the switch circuit 210 through the third rf connection point Q to achieve the electrical connection between the switch circuit 210 and the antenna group 220.
Specifically, the connection mode of the third radio frequency connection point Q and the antenna a includes one of a buckle connection and a welding connection. The third radio frequency connection point Q may be a welding point, and may be a welding connection with the antenna a. The third radio frequency connection point Q may also be a buckle connection point, and may be electrically connected to the antenna a through a buckle seat. When the connection mode of the third radio frequency connection point Q and the antenna A is buckle connection, the connection flexibility can be improved, and meanwhile, the assembly difficulty in the production process can be effectively reduced.
In one embodiment, the switch circuit 210 includes a plurality of switch units 211, wherein a first end of the switch unit 211 is connected to a second rf connection point K, and a plurality of second ends of the switch unit 211 are respectively connected to N third rf connection points Q in a one-to-one correspondence. The switching unit 211 may be at least one of a single pole double throw switch, a double pole double throw switch, a multiple pole multiple throw switch, for example. The types of the switch units 211 are different, the number of the switch units 211 included in the switch circuit 210, the connection relation between the switch units 211 and each antenna a and the second radio frequency connection point K, and the switching on logic between the switch units 211 are also different, so that the radio frequency component can conduct the radio frequency paths of the M antennas a at the same time and define the M antennas a conducted at the same time as a transceiver antenna group.
In the embodiment of the present application, for convenience of explanation, m=4 and n=8 are taken as examples. That is, the antenna group 220 includes 8 antennas a, four first radio frequency connection points J are disposed on the radio frequency board 10, and four second radio frequency connection points K are disposed on the antenna board 20. Specifically, the rf circuit 110 disposed on the rf board 10 may include an rf transceiver 111 and four rf front-end modules 113, and the switch circuit 210 disposed on the antenna board 20 includes four single pole double throw switches. The first end of each single-pole double-throw switch is connected with a second radio frequency connection point K, and the two second ends of each single-pole double-throw switch are respectively connected with two antennas A in a one-to-one correspondence manner.
Specifically, the rf transceiver 111 may obtain network information of each transceiver antenna group, and analyze the network to determine the target transceiver antenna group. The network information may include, among other things, raw and processed information associated with radio performance metrics of the received radio frequency signals, such as received power, reference signal received quality, received signal strength indication, signal-to-noise ratio, and the like. The network information is exemplified as the received power. The rf transceiver 111 may sort the magnitude of the signal-to-noise ratio Si of the rf signal received by each of the transceiver antenna groups, where i identifies the identification information of the transceiver antenna groups, e.g., the signal-to-noise ratio of the first transceiver antenna group is S1, and takes the transceiver antenna group with the largest signal-to-noise ratio as the target transceiver antenna group.
Specifically, after the rf transceiver 111 determines the target transceiver antenna group, four antennas a (e.g., A1, A2, A4, A6) in the target transceiver antenna group may be controlled to be in a working state, so as to implement the control of receiving and transmitting the rf signal. In addition, in order to improve throughput of the rf system, the rf system may also control each switch of the switch circuit 210, so that the rf system can support a 1T4R (1transmitting 4receiving) function that one transmission signal is transmitted between four antennas a in the target transceiver antenna group, that is, only one transmission signal will perform SRS (Sounding Reference Switching, sounding reference signal) switching in 4 reception channels (four antennas a).
In this embodiment, the switch circuit 210 is disposed on the antenna board 20, that is, the selection logic control of the antenna a is received on the antenna board 20, and the antenna board 20 can carry the selection of each antenna a and the expansion of the third radio frequency connection point Q (which can also be understood as an antenna interface), so that the length of the overall radio frequency trace in the radio frequency assembly can be reduced by the trace length of the (N-M) x-distance L, for example, the trace length of the (8-4) x-distance L. The distance L is the distance between the first radio frequency connection point J and the second radio frequency connection point K, so that the insertion loss of the corresponding length can be reduced, and the communication performance of the radio frequency assembly can be improved.
As shown in fig. 4, in one embodiment, the rf board 10 and the antenna board 20 are stacked in a first direction, and the first direction may also be understood as a thickness direction of the rf board 10, that is, the first direction is perpendicular to a plane where the setting surface of the rf circuit 110 is located. Specifically, the rf board 10 and the antenna group 220 may at least partially overlap in the first direction. When the radio frequency board 10 and the antenna board 20 are stacked in the first direction, the area of the radio frequency component on the plane where the setting surface of the radio frequency board 10 is located can be further reduced, and thus the occupied area of the radio frequency component in the communication device can be reduced. For example, the antenna board 20 may completely overlap the radio frequency board 10, and the occupied area of the antenna board 20 and the radio frequency board 10 may be minimized.
Alternatively, the rf board 10 and the antenna board 20 may be stacked in contact with each other or may be stacked at intervals when stacked in the first direction. Wherein, the interval of interval stack can also fill buffer material to realize the effect of shock attenuation. The buffer material does not interfere with the radio frequency signal by an electric field or a magnetic field.
With continued reference to fig. 4, in one embodiment, the rf board 10 includes a first surface 101 and a second surface 102 disposed opposite to each other, where the first surface 101 and the second surface 102 may also be understood as two surfaces of the rf board 10 in a thickness direction, and may be used to dispose the rf circuit 110.
The antenna plate 20 comprises a third surface 201 and a fourth surface 202 arranged opposite to each other, wherein the third surface 201 and the fourth surface 202 can also be understood as two surfaces of the antenna plate 20 in the thickness direction, which can be used for arranging the antenna group 220. It should be noted that, in the embodiment of the present application, the layered structure of the antenna board 20 may be defined according to the type of the antenna a, and the radiator of the antenna a may be correspondingly disposed in the corresponding layered structure of the antenna board 20.
In one embodiment, in particular, the radio frequency circuit 110 is disposed on the first surface 101. The antenna group 220 is disposed on the fourth surface 202. The second surface 102 is disposed near the third surface 201, that is, the rf circuit 110 may be disposed on the bottom surface of the rf assembly, and the antenna assembly 220 may be disposed on the top surface of the rf assembly, so that radiation of the antenna a on the rf signal may be facilitated, and radiation performance of the antenna a may be improved.
In one embodiment, a recess for accommodating the rf circuit 110 may be further formed on the rf board 10, and the rf circuit 110 is disposed in the recess, that is, the highest surface of the rf circuit 110 may be flush with the first surface 101. This may reduce the footprint of the radio frequency circuit 110 in the first direction. It should be noted that, the highest surface of the rf circuit 110 may be understood as an upper surface of a device having the highest height in the rf circuit 110.
In one embodiment, the rf board 10 includes a first side edge 103, and each first rf connection point J is disposed along the first side edge 103. Specifically, the first side edge 103 may be understood as a side edge of the first surface 101 of the radio frequency board 10. The antenna board 20 comprises a second side edge 104, each second radio frequency connection point K being arranged along the second side edge 104, wherein the second side edge 104 may also be understood as a side edge of the fourth surface 202 of the antenna board 20. In the embodiment of the application, the first side edge 103 and the second side edge 104 may be disposed adjacent to each other at a parallel interval, so that the distances between the first radio frequency connection point J and the second radio frequency connection point K are the same, the lengths of radio frequency wires between the first radio frequency connection point J and the second radio frequency connection point K are the same, and the insertion losses caused by the radio frequency wires are also consistent, that is, the insertion losses on the receiving links of the M antennas a are consistent, and the communication performance of the M antennas a can also be kept stable.
Specifically, when the rf board 10 and the antenna board 20 are stacked in the first direction, the first side edge 103 and the second side edge 104 may be aligned in the first direction, so that the long paths of the rf wires for connecting the first rf connection point J and the second rf connection point K may be kept consistent, so that the insertion loss of the rf wires on the rf receiving path and/or the rf transmitting path where the antennas a are located may be kept consistent, and in addition, when the first side edge 103 and the second side edge 104 are aligned in the first direction, the length of the rf wires for connecting between the first rf connection point and the second rf connection point K may be further shortened, so as to further reduce the insertion loss on the rf receiving path and/or the rf transmitting path, and further improve the sensitivity and communication performance of the rf assembly.
Referring to fig. 2, in one embodiment, when the radio frequency board 10 and the antenna board 20 are not stacked in the first direction, for example, the first surface 101 of the radio frequency board 10 is disposed coplanar with the third surface 201 of the antenna board 20, the first side edge 103 is disposed adjacent to and parallel to the second side edge 104, that is, the distance between the first side edge 103 and the second side edge 104 is smaller than the distance between the first side edge 103 and either side edge of the antenna board 20. When the distance between the first side edge 103 and the second side edge 104 is shortest, the distance between the radio frequency wires for connecting the first radio frequency connection point J and the second radio frequency connection point K can be correspondingly shortened, and therefore insertion loss can be reduced, and performance of the radio frequency assembly can be improved.
As shown in fig. 5, in one embodiment, when the rf board 10 and the antenna board 20 are not stacked in the first direction, for example, the first surface 101 of the rf board 10 is disposed perpendicular to the third surface 201 of the antenna board 20, and the first side edge 103 and the second side edge 104 are disposed adjacent and parallel to each other, the length of the rf trace used for connecting the first rf connection point and the second rf connection point K can be further shortened, so as to further reduce the insertion loss on the rf receiving path and/or the rf transmitting path, and further improve the sensitivity and the communication performance of the rf assembly.
As shown in fig. 5, in one embodiment, the antenna board 20 includes a plurality of antenna sub-boards 20a. The size and shape of each antenna board and the number of switches and antennas A arranged on each antenna sub-board can be the same or different. Specifically, a plurality of antenna sub-boards 20a may be disposed around the radio frequency board 10. Alternatively, the plurality of antenna sub-boards 20a may be distributed on two sides of the radio frequency board 10, or may be distributed on the same side of the radio frequency board 10.
The size and shape of each antenna sub-board 20a and the relative position with respect to the rf board 10 are not limited, and may be set according to practical requirements.
In this embodiment, by arranging the switches and the antennas a on different antenna sub-boards 20a in a distributed manner, the area of each antenna sub-board 20a is small, and each antenna sub-board 20a can be flexibly arranged in a relatively small space of the communication device, so that the design flexibility of arranging each antenna sub-board 20a in the communication device can be improved.
In one embodiment, if the connection mode of the third rf connection point Q and the antenna a is a buckle connection, the antenna board 20 may include an antenna board 20c and a substrate 20b, as shown in fig. 6. The substrate 20b may be a PCB board, where the substrate 20b may be a Router board, and the substrate 20b may be a large board for soldering the radio frequency board 10, and may be used to expand the radio frequency interface and non-cellular functions of the radio frequency board 10. Specifically, the third rf connection point Q and the antenna group 220 are respectively disposed on the antenna board 20c, and the second rf connection point K, the switch circuit 210, and the rf board 10 are respectively disposed on the substrate 20 b.
In this embodiment, the radio frequency board 10 and the switch circuit 210 may be disposed on the substrate 20b, that is, the switch circuit 210 may be multiplexed with the substrate 20b, so as to reduce the area of the antenna board 20c, so as to reduce the occupied space of the radio frequency component.
In one embodiment, when the antenna board 20 includes the antenna board 20c and the substrate 20b, the antenna board 20c may be divided into a plurality of antenna sub-boards 20a according to the description of the previous embodiment, where at least one antenna a may be disposed on each antenna sub-board 20a, for example, two antennas a may be disposed on each antenna sub-board 20a. The plurality of antenna sub-boards 20a in the embodiment of the present application can improve the design flexibility in which each antenna sub-board 20a is provided in the communication device.
As shown in fig. 7, in one embodiment, the radio frequency board 10 is further provided with M wire buckling seats P, where the M wire buckling seats P are disposed adjacent to the M first radio frequency connection points J in a one-to-one correspondence manner, and are used for fixing radio frequency wires for connecting between the first radio frequency connection points J and the second radio frequency connection points K.
In this embodiment of the present application, the radio frequency board 10 may use a conventional radio frequency board, without additional development, and when the number of the first radio frequency connection points J on the radio frequency board is reduced, the unused first radio frequency connection points J may support other functions, for example, support WiFi communication, etc., so as to implement multiplexing with other functions.
As shown in fig. 8, the embodiment of the application further provides a communication device. In one embodiment, a communication device includes: the radio frequency assembly of any of the preceding embodiments. The radio frequency component according to the embodiments of the present application may be applied to a communication device having a wireless communication function, where the communication device may be a handheld device, a vehicle-mounted device, a wearable device, a computing device, a customer premise Equipment (Customer Premise Equipment, CPE) or other processing device connected to a wireless modem, and various types of User Equipment (UE), such as a Mobile Station (MS), and so on. For convenience of description, the above-mentioned devices are collectively referred to as communication devices.
The communication device is provided with the radio frequency board 10 and the antenna board 20, and the radio frequency circuit 110 is arranged on the radio frequency board 10, the switch circuit 210 and the antenna group 220 are arranged on the antenna board 20, so that the radio frequency component can be prevented from adopting only one radio frequency board 10 to bear the radio frequency circuit 110, the switch circuit 210 and N antennas A, the number of radio frequency connecting seats for connecting the N antennas A on the radio frequency board 10 can be further reduced, the occupied area of the radio frequency board 10 can be saved, meanwhile, the length of radio frequency wiring on the radio frequency board 10 can be reduced, the insertion loss caused by the radio frequency wiring on the radio frequency board 10 can be effectively reduced, and the sensitivity and the communication performance of the radio frequency component can be further improved. In addition, the switch circuit 210 and the antenna group 220 are arranged on the antenna board 20, so that the flexibility of the layout of the antenna group 220 on the antenna board 20 can be improved, the logic control of selecting M antennas from N antennas for communication can be realized, the assembly complexity of the radio frequency component is reduced, and the realizability is strong.
Further, the communication device is taken as a client front-end device for illustration. In particular, the at least one customer premises equipment may further comprise a customer premises equipment comprising a housing 11, a memory 21 (which optionally includes one or more computer readable storage media), a processor 22, a peripheral interface 23, a Radio Frequency (RF) component 24, an input/output (I/O) subsystem 26. These components optionally communicate via one or more communication buses or signal lines 29. Those skilled in the art will appreciate that the customer premise equipment shown in FIG. 2 is not limiting and may include more or fewer components than shown, or certain components may be combined, or a different arrangement of components. The various components shown in fig. 8 are implemented in hardware, software, or a combination of both hardware and software, including one or more signal processing and/or application specific integrated circuits.
Memory 21 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Illustratively, the software components stored in the memory 21 include an operating system, a communication module (or set of instructions), a Global Positioning System (GPS) module (or set of instructions).
The processor 22 and other control circuitry, such as control circuitry in the radio frequency circuitry 24, may be used to control the operation of the client front end 10. The processor 22 may be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, and the like.
The processor 22 may be configured to implement a control algorithm that controls the use of the antenna in the client front end 10. For example, the processor 22 may be configured to control the radio frequency assembly 24 to select a plurality of antennas to form a plurality of transceiver antenna groups, and in turn may select a target antenna group within the plurality of transceiver antenna groups to transmit and/or receive antenna signals.
The I/O subsystem 26 couples input/output peripheral devices on the client front-end 10, such as keypads and other input control devices, to the peripheral interface 23. The I/O subsystem 26 optionally includes a touch screen, buttons, levers, touch pads, keypads, keyboards, tone generators, accelerometers (motion sensors), ambient light and other sensors, light emitting diodes and other status indicators, data ports, etc. Illustratively, a user may control the operation of the client front-end 10 by supplying commands via the I/O subsystem 26, and may use the output resources of the I/O subsystem 26 to receive status information and other outputs from the client front-end 10. For example, a user may activate the client pre-device or deactivate the client pre-device by pressing button 261.
The rf assembly 24 may be any of the foregoing embodiments, wherein the rf circuit in the rf assembly 24 may be further configured to process rf signals in a plurality of different frequency bands. Such as satellite positioning radio frequency circuitry for receiving satellite positioning signals at 1575MHz, wiFi and bluetooth transceiver radio frequency circuitry for handling the 2.4GHz and 5GHz bands of IEEE802.11 communications, cellular telephone transceiver radio frequency circuitry for handling wireless communications in cellular telephone bands such as the 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz bands, and Sub-6G bands. The Sub-6G frequency band may specifically include a 2.496GHz-6GHz frequency band, and a 3.3GHz-6GHz frequency band.
Illustratively, the radio frequency circuit may further include a baseband processor. The baseband processor may provide network information to the processor 22. The network information may include raw and processed information associated with radio performance metrics of the received antenna signals, such as received power, transmitted power, reference signal received power (Reference Signal Receiving Power, RSRP), reference signal received quality (Reference Signal Receiving Quality, RSRQ), received signal strength indication (Received Signal Strength Indicator, RSSI), signal to noise ratio (Signal to Noise Ratio, SNR), rank (Rank) of the MIMO channel matrix, carrier to interference and noise ratio (Carrier to Interference plus Noise Ratio, RS-CINR), frame error rate, bit error rate, channel quality measurements based on signal quality data (such as Ec/lo or c/No data), information as to whether a response (acknowledgement) corresponding to a request from a mobile terminal is being received from a base station, information as to whether the network access procedure was successful, and so forth.
The processor 22 may analyze the received network information and in response, the processor 22 (or, if desired, a baseband processor, radio frequency transceiver) may issue control commands for controlling the radio frequency component 24. For example, the processor 22 may issue a control command to control the plurality of transceiver antenna groups of the rf assembly 24 to be in a sequentially active state, and may determine a target transceiver antenna group from the plurality of transceiver antenna groups to control the target transceiver antenna group to transmit and receive antenna signals. Wherein, the receiving and transmitting antenna group comprises a plurality of antennas.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples represent only a few implementations of the examples of the present application, which are described in more detail and are not thereby to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the embodiments of the present application, which are all within the scope of the embodiments of the present application. Accordingly, the protection scope of the embodiments of the present application shall be subject to the appended claims.
Claims (10)
1. A radio frequency assembly, comprising:
the radio frequency board is provided with M first radio frequency connection points,
the radio frequency circuit is arranged on the radio frequency board and is correspondingly connected with each first radio frequency connection point respectively and used for supporting the receiving and transmitting processing of radio frequency signals; the first radio frequency connection point is a welding point;
the antenna board is provided with M second radio frequency connection points and N third radio frequency connection points, each second radio frequency connection point is respectively connected with one first radio frequency connection point in a one-to-one correspondence manner, the N third radio frequency connection points are used for being connected with N antennae in a one-to-one correspondence manner, the radio frequency board and the antenna board are stacked in a first direction, and the first direction is the thickness direction of the radio frequency board;
the switch circuit is arranged on the antenna board and is used for selectively conducting radio frequency channels between the M antennas and the M second radio frequency connection points in a one-to-one correspondence mode; wherein M is more than or equal to 2 and less than N, N, M are positive integers, the switch circuit comprises M first ends and N second ends, the M first ends are connected with the M second radio frequency connection points in a one-to-one correspondence manner, and the N second ends are connected with the N third radio frequency connection points in a corresponding manner.
2. The radio frequency assembly according to claim 1, wherein the antenna board comprises an antenna veneer and a substrate, the antenna veneer and the radio frequency board being disposed on the substrate, respectively.
3. The radio frequency assembly according to claim 2, wherein the third radio frequency connection point is provided on the antenna board; the second radio frequency connection point, the switch circuit and the radio frequency board are arranged on the substrate.
4. The radio frequency assembly of claim 1, wherein the radio frequency board comprises a first surface and a second surface disposed opposite each other, wherein the radio frequency circuit is disposed on the first surface, wherein the antenna board comprises a third surface and a fourth surface disposed opposite each other, wherein the N antennas are disposed on the fourth surface, and wherein the second surface is disposed proximate the third surface.
5. The radio frequency assembly of claim 1, wherein the radio frequency board includes a first side edge, each of the first radio frequency connection points being disposed along the first side edge, the antenna board including a second side edge, each of the second radio frequency connection points being disposed along the second side edge, wherein the first side edge is disposed adjacent and parallel to the second side edge at a spacing.
6. The radio frequency assembly according to claim 1, wherein m=4, n=8; the switch circuit comprises four single-pole double-throw switches, wherein the first end of each single-pole double-throw switch is connected with one second radio frequency connection point, and the two second ends of each single-pole double-throw switch are respectively connected with two third radio frequency connection points in a one-to-one correspondence manner.
7. The radio frequency assembly according to claim 1, wherein the second radio frequency connection point is a welding point and the third radio frequency connection point is a buckle connection point.
8. The radio frequency assembly according to claim 1, wherein the radio frequency board is provided with a groove, and the radio frequency circuit is disposed in the groove.
9. The radio frequency assembly according to claim 1, wherein the radio frequency board is further provided with M wire buckling seats, and the M wire buckling seats are disposed adjacent to the M first radio frequency connection points in a one-to-one correspondence manner, and are used for fixedly connecting radio frequency wires between the first radio frequency connection points and the second radio frequency connection points.
10. A communication device, comprising: the radio frequency assembly of any of claims 1-9.
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| CN202211395252.XA CN115765762B (en) | 2021-03-30 | 2021-03-30 | Radio frequency assembly and communication device |
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| CN202110338136.3A CN113067587B (en) | 2021-03-30 | 2021-03-30 | Radio frequency assembly and communication equipment |
| CN202211395252.XA CN115765762B (en) | 2021-03-30 | 2021-03-30 | Radio frequency assembly and communication device |
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| CN113067587B (en) * | 2021-03-30 | 2022-12-02 | Oppo广东移动通信有限公司 | Radio frequency assembly and communication equipment |
| CN216057092U (en) * | 2021-08-23 | 2022-03-15 | Oppo广东移动通信有限公司 | Electronic device |
| CN114785361B (en) * | 2022-04-24 | 2023-08-11 | Oppo广东移动通信有限公司 | Radio frequency system, communication control method and communication device |
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| CN113067587B (en) | 2022-12-02 |
| CN115765762A (en) | 2023-03-07 |
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