CN110635291A - Radio frequency backboard and backboard assembly - Google Patents
Radio frequency backboard and backboard assembly Download PDFInfo
- Publication number
- CN110635291A CN110635291A CN201910252673.9A CN201910252673A CN110635291A CN 110635291 A CN110635291 A CN 110635291A CN 201910252673 A CN201910252673 A CN 201910252673A CN 110635291 A CN110635291 A CN 110635291A
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- Prior art keywords
- radio frequency
- strip line
- ground
- pad
- holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a radio frequency backplane and a backplane assembly. The radio frequency backboard comprises a printed board, a radio frequency link is arranged on the printed board, the radio frequency link comprises an inner bonding pad, an outer bonding pad and a strip line, the inner bonding pad and the outer bonding pad are insulated and separated, the strip line is connected with the inner bonding pad, the outer bonding pad is connected with an upper reference ground and a lower reference ground, the inner bonding pad is used for being connected with an inner conductor of a radio frequency connector, the outer bonding pad is used for being connected with an outer conductor, the strip line of two adjacent radio frequency links is provided with parallel sections, at least two rows of strip line ground holes are arranged between the parallel sections, each row of strip line ground holes are parallel to the parallel sections of the strip line, two adjacent rows of strip line ground holes are arranged, and the strip line ground holes of one row are staggered with the strip line. According to the invention, at least two rows of strip line ground holes are arranged between the two strip line parallel sections and are arranged in a staggered manner, so that an effective backflow path is increased, the interference of an electromagnetic coupling effect on adjacent signals is reduced, and the isolation degree between high-frequency signals in the printed circuit board is improved.
Description
Technical Field
The invention relates to a radio frequency backplane and a backplane assembly.
Background
In order to solve the problem of integrated interconnection of high-frequency signals in a limited space in a system and change the current situation that radio-frequency signals between modules are transmitted only by means of coaxial cable components, a radio-frequency backboard transmission technology is provided. The technology realizes the function of transmitting radio frequency signals in the printed circuit board. Radio frequency signals have space transmission characteristics, and the development of the technology is always puzzled by the isolation between adjacent signals in a printed board. In order to reduce the electromagnetic coupling effect between adjacent signals, in the prior art, a stripline model is adopted to transmit high-frequency signals within 18GHz, a single row of ground holes for isolation are uniformly distributed between the adjacent signals, and the ground holes are connected with an upper reference ground and a lower reference ground.
As shown in fig. 1 and fig. 2, an rf backplane of the prior art is provided with an inner pad 1011, an outer pad 1012, a signal hole 103, and a strip line 102, wherein the outer pad is in the same layer as an upper reference ground 1051 and is connected to a lower reference ground 1052 through a ground hole located in a pad region, and the inner pad 1011 and the strip line 102 are electrically connected through the signal hole 103, and the inner pad and the outer pad are insulated and separated. The radio frequency backboard is connected with the coaxial connector through the inner welding disc and the outer welding disc, and mode conversion of radio frequency signals from a coaxial structure to a strip line structure is achieved. In order to solve the impedance matching of radio frequency signals, the line width is adjusted to ensure the impedance requirement of 50 omega through the material parameters and the structure parameters of the strip line. In order to improve the isolation between adjacent radio frequency signal links and reduce the electromagnetic coupling interference between the signals, ground holes 104 with uniform size and uniform interval are distributed on a link channel, and the ground holes 104 are connected with an upper reference ground and a lower reference ground, so that the radio frequency signals are ensured to have a relatively complete current loop.
However, as the frequency of the radio frequency signal increases, the wavelength of the electromagnetic wave is shorter when the radio frequency signal reaches the millimeter wave frequency band, and a denser ground hole is needed to ensure the isolation index between signals. And there is the printing board processing risk in adopting the single ground hole distribution mode of high density, and the printing board is broken the wall easily, seriously reduces the structural strength of printing board.
Disclosure of Invention
The invention aims to provide a radio frequency backboard, which aims to solve the problem that in the prior art, for radio frequency signals with higher frequency, single-row ground holes between adjacent signals are difficult to meet the isolation; the invention also aims to provide a backboard assembly using the radio frequency backboard, so as to solve the problem that in the prior art, for radio frequency signals with higher frequency, single-row ground holes between adjacent signals are difficult to meet the isolation.
In order to achieve the above purpose, the technical scheme of the radio frequency backplane of the present invention is:
the radio frequency backboard comprises a printed board, wherein at least two radio frequency links are arranged on the printed board, each radio frequency link comprises an inner bonding pad, an outer bonding pad and a strip line, the inner bonding pad and the outer bonding pad are insulated and separated, the strip lines are connected with the inner bonding pads, the outer bonding pads are connected with the upper reference ground and the lower reference ground of the printed board, the inner bonding pads are used for being connected with inner conductors of a radio frequency connector, the outer bonding pads are used for being connected with outer conductors of the radio frequency connector, the strip lines of two adjacent radio frequency links are provided with parallel sections which are parallel to each other, at least two rows of strip line ground holes are arranged between the parallel sections of the two strip lines on the printed board, the strip line ground holes of each row are parallel to each other and are parallel to the parallel sections of the strip lines, two adjacent rows of strip line ground holes are arranged, and the strip line ground holes of one row are staggered with the strip line.
The radio frequency backboard has the beneficial effects that: according to the invention, at least two rows of strip line ground holes are arranged between two strip line parallel sections, and at least two rows of adjacent strip line ground holes are arranged in a staggered manner in the parallel direction, so that an effective backflow path is increased for each radio frequency link, the interference of an electromagnetic coupling effect on adjacent signals is reduced, the structural strength of a printed circuit board is ensured, and the isolation between high-frequency signals in the printed circuit board is effectively improved.
Furthermore, in two rows of strip line ground holes staggered in the parallel direction, the strip line ground holes in one row and two adjacent strip line ground holes in the other row are arranged in an equilateral triangle. The ground holes arranged in an equilateral triangle are more uniformly distributed, and the isolation between high-frequency signals in the printed circuit board is better.
Furthermore, the distance between the centers of two adjacent strip line ground holes in each row is twice the diameter of the strip line ground holes, namely, a gap of one strip line ground hole is just formed between the two strip line ground holes, and the gaps can be mutually filled through staggered arrangement, so that the isolation is improved.
Further, one side of the inner pad extending away from the strip line is surrounded by a pad ground hole, and the outer pad is in the same layer with one of the upper reference ground and the lower reference ground and is connected with the other reference ground through the pad ground hole. The side of the welding disc is also provided with the ground hole, so that the isolation between high-frequency signals in the printed circuit board can be effectively improved.
Furthermore, the pad ground holes are divided into two layers, and the two layers of pad ground holes are arranged in a staggered mode in the parallel direction. The staggered bonding pad ground holes can increase the effective backflow path of the radio frequency link and reduce the interference of the electromagnetic coupling effect on adjacent signals.
Furthermore, in two adjacent rows of pad ground holes which are arranged in a staggered manner, any two adjacent pad ground holes which are positioned on the inner side and one pad ground hole which is positioned on the outer side are arranged in an equilateral triangle manner. The ground holes arranged in an equilateral triangle are more uniformly distributed, and the isolation between high-frequency signals in the printed circuit board is better.
Furthermore, two rows of strip line ground holes are formed in the two sides of the strip line on the printed board respectively and are symmetrical relative to the strip line, and the strip line ground holes are symmetrically arranged relative to the strip line, so that the loss of radio-frequency signals can be reduced.
In order to achieve the purpose, the technical scheme of the back plate assembly is as follows:
the backboard component comprises a radio frequency backboard and a radio frequency connector arranged on the radio frequency backboard, wherein the radio frequency backboard comprises a printed board, at least two radio frequency links are arranged on the printed board, each radio frequency link comprises an inner bonding pad, an outer bonding pad and a strip line, the inner bonding pad and the outer bonding pad are insulated and separated, the strip line is connected with the inner bonding pad, the outer bonding pad is connected with an upper reference ground and a lower reference ground of the printed board, the inner bonding pad is used for being connected with an inner conductor of the radio frequency connector, the outer bonding pad is used for being connected with an outer conductor of the radio frequency connector, the strip lines of two adjacent radio frequency links are provided with parallel sections which are parallel to each other, at least two rows of strip line ground holes are arranged between the parallel sections of the two strip lines on the printed board, the strip line ground holes of each row are parallel to each other and are parallel to the parallel sections of, the strip line ground holes of one row are staggered with the strip line ground holes of the other row in the parallel direction of the two rows.
The back plate assembly has the beneficial effects that: according to the invention, at least two rows of strip line ground holes are arranged between two strip line parallel sections, and at least two rows of adjacent strip line ground holes are arranged in a staggered manner in the parallel direction, so that an effective backflow path is increased for each radio frequency link, the interference of an electromagnetic coupling effect on adjacent signals is reduced, the structural strength of a printed circuit board is ensured, and the isolation between high-frequency signals in the printed circuit board is effectively improved.
Furthermore, in two rows of strip line ground holes staggered in the parallel direction, the strip line ground holes in one row and two adjacent strip line ground holes in the other row are arranged in an equilateral triangle. The ground holes arranged in an equilateral triangle are more uniformly distributed, and the isolation between high-frequency signals in the printed circuit board is better.
Furthermore, the distance between the centers of two adjacent strip line ground holes in each row is twice the diameter of the strip line ground holes, namely, a gap of one strip line ground hole is just formed between the two strip line ground holes, and the gaps can be mutually filled through staggered arrangement, so that the isolation is improved.
Further, one side of the inner pad extending away from the strip line is surrounded by a pad ground hole, and the outer pad is in the same layer with one of the upper reference ground and the lower reference ground and is connected with the other reference ground through the pad ground hole. The side of the welding disc is also provided with the ground hole, so that the isolation between high-frequency signals in the printed circuit board can be effectively improved.
Furthermore, the pad ground holes are divided into two layers, and the two layers of pad ground holes are arranged in a staggered mode in the parallel direction. The staggered bonding pad ground holes can increase the effective backflow path of the radio frequency link and reduce the interference of the electromagnetic coupling effect on adjacent signals.
Furthermore, in two adjacent rows of pad ground holes which are arranged in a staggered manner, any two adjacent pad ground holes which are positioned on the inner side and one pad ground hole which is positioned on the outer side are arranged in an equilateral triangle manner. The ground holes arranged in an equilateral triangle are more uniformly distributed, and the isolation between high-frequency signals in the printed circuit board is better.
Furthermore, two rows of strip line ground holes are formed in the two sides of the strip line on the printed board respectively and are symmetrical relative to the strip line, and the strip line ground holes are symmetrically arranged relative to the strip line, so that the loss of radio-frequency signals can be reduced.
Drawings
FIG. 1 is a schematic structural diagram of a RF backplane of the prior art;
FIG. 2 is a cross-sectional view of a prior art RF backplane;
FIG. 3 is a schematic structural diagram of an RF backplane in an embodiment of a backplane assembly of the present invention;
FIG. 4 is a front view of the RF backplane of FIG. 3;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
FIG. 6 is a partial enlarged view of the portion B in FIG. 4;
description of reference numerals: 11-inner pads; 12-an outer pad; 2-a strip line; 3-a signal hole; 4-ground hole; 41-pad ground hole; 42-stripline ground via; 1011-inner pads; 1012-outer pads; 102-a strip line; 103-signal hole; 104-ground hole; 1051-above reference ground; 1052-lower reference ground.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
As shown in fig. 3 and 4, the backplane assembly of the present invention includes a radio frequency backplane and a radio frequency connector disposed on the radio frequency backplane, the radio frequency backplane includes a printed board, two radio frequency links are disposed on the printed board, each radio frequency link includes an inner pad 11, an outer pad 12, a signal hole 3, a strip line 2 and a ground hole 4, the strip lines 2 of the two radio frequency links are disposed in parallel, wherein the outer pad 12 is on the same layer as an upper reference ground and is connected to a lower reference ground through a pad ground hole 41 located in a pad area, the inner pad 11 and the strip line 2 are electrically connected through the signal hole 3, and the inner pad and the outer pad are insulated and separated from each other. In other embodiments, the outer pad may also be layered with the lower reference ground and then communicate with the upper reference ground through a ground hole. The radio frequency backboard is connected with an inner conductor of the radio frequency connector through the inner bonding pad 11 and is connected with an outer conductor of the radio frequency connector through the outer bonding pad 12, so that the mode conversion of a radio frequency signal from a coaxial structure to a strip line structure is realized, and then the impedance requirement of 50 omega is ensured by adjusting the line width according to the material parameters and the structure parameters of the strip line 2, so as to solve the impedance matching problem of the radio frequency signal.
In order to improve the isolation between adjacent radio frequency signal links and reduce the electromagnetic coupling interference between the signals, in this embodiment, ground holes 4 having the same size and uniform distribution are arranged around the two radio frequency links. Specifically, as shown in fig. 3 and 4, the ground hole 4 includes a land ground hole 41 provided to be arranged around the inner land 11 and a strip line ground hole 42 arranged on both sides of the strip line 2. Because the high-density single-row ground hole distribution mode is adopted, the processing risk of the printed board exists, the printed board is easy to break the wall, and therefore in order to improve the isolation degree of adjacent radio frequency signals under the condition of ensuring the structural strength of the printed board, in the embodiment, two rows of strip line ground holes 42 which are parallel to each other and parallel to strip lines are arranged between two strip lines 2, the two rows of strip line ground holes 42 are arranged in a staggered mode in the parallel direction, effective backflow paths are increased for each radio frequency link after the strip line ground holes 42 are arranged in the staggered mode, the interference of the electromagnetic coupling effect on the adjacent signals is reduced, and the isolation degree between the high-frequency signals in the printed board can be effectively improved while the structural strength of the printed board is ensured. In other embodiments, three rows of stripline grounding holes may be disposed between two striplines, and the three rows of stripline grounding holes are disposed alternately in the parallel direction, or only two rows of the three rows of stripline grounding holes are disposed alternately. As shown in fig. 5, in two adjacent rows of strip line ground holes 42 arranged in a staggered manner, any two adjacent ground holes in the same row and one strip line ground hole 42 in the other row are arranged in an equilateral triangle, and the strip line ground holes 42 arranged in the equilateral triangle are distributed more uniformly, so that the isolation between high-frequency signals in the printed circuit board is better. In other embodiments, the spacing between adjacent rows or the spacing between adjacent stripline holes in each row may be adjusted as desired. In this embodiment, the distance between the centers of two adjacent ground holes in each row of ground holes is twice the radius of the ground holes, that is, a gap of one strip line ground hole 42 is exactly formed between two strip line ground holes 42, and then the gaps can be mutually filled through staggered arrangement, so that the isolation is improved. In other embodiments, the diameter of the ground hole can be adjusted as needed. In this embodiment, the stripline ground vias located between the two striplines 2 and the stripline ground vias located outside the two striplines 2 are symmetrically distributed with respect to the respective corresponding striplines 2, and the symmetrically distributed stripline ground vias 42 can reduce the loss of the radio frequency signal.
As shown in fig. 4 and 6, the land holes 41 are arranged around the side of each inner land 11 in a C-shape, and the opening of the C-shape surrounded by the land holes 41 faces the strip line 2. In order to enhance the isolation performance, the pad ground holes 41 are also provided with an inner row and an outer row, any two adjacent pad ground holes 41 on the inner side are arranged in an equilateral triangle with one pad ground hole 41 on the outer side, and the pad ground holes 41 on both ends of the C-shaped opening are adjacent to the strip line ground holes 42 on the end of each row. The ground hole is also arranged in the pad area, so that the isolation between high-frequency signals in the printed circuit board can be effectively improved. In other embodiments, the pad holes may be arranged in only one row or in multiple rows. In other embodiments, when two rows of pad ground holes are provided, the pad ground holes on the inner side and the pad ground holes on the outer side may not be arranged in an equilateral triangle, but the distance between the pad ground holes on the inner side, the distance between the pad ground holes on the outer side, or the distance between the pad ground holes on the inner side and the pad ground holes on the outer side may be adjusted as required.
The ground hole diameter in the embodiment is preferably 0.2mm ~ 0.3.3 mm, when a 40GHz radio frequency signal is transmitted, the isolation index between signals is actually measured to be better than-80 dB, and in other embodiments, a larger or smaller ground hole diameter can be selected according to the requirement or the printed board processing technology.
This embodiment is through including pad 11, outer pad 12 and 2 sides of stripline evenly arrange the ground hole 4 that the size is the same, the distribution is even to the ground hole 4 of subregion evenly sets up two rows, under the prerequisite of guaranteeing printed board structural strength, can satisfy the system electromagnetic compatibility index, has reduced the interference between the radio frequency signal in the printed board, is showing the isolation that has improved between the adjacent signal link, has solved the electromagnetic compatibility technical problem of high frequency signal transmission in the printed board.
In the specific embodiment of the radio frequency backplane of the present invention, the structure of the radio frequency backplane in this embodiment is the same as that of the radio frequency backplane in the backplane assembly, and details are not repeated herein.
Claims (8)
1. Radio frequency backplate, including the printing board, be equipped with two at least radio frequency links on the printing board, the radio frequency link includes interior pad, outer pad and stripline, and interior, outer pad are insulating to be separated, and the stripline is connected with interior pad, and outer pad is connected with the last ground of referring to of printing board and lower ground of referring to, and interior pad is used for being connected with the inner conductor of radio frequency connector, and outer pad is used for being connected its characterized in that with the outer conductor of radio frequency connector: the strip lines of two adjacent radio frequency links are provided with parallel sections which are parallel to each other, at least two rows of strip line ground holes are arranged between the parallel sections of the two strip lines on the printed board, and the strip line ground holes of each row are parallel to each other and parallel to the parallel sections of the strip lines; there are two adjacent rows of strip line ground holes, where the strip line ground holes of one row are staggered with the strip line ground holes of the other row in the parallel direction of the two rows.
2. The radio frequency backplane of claim 1, wherein: in two rows of strip line ground holes staggered in the parallel direction, the strip line ground holes in one row and two adjacent strip line ground holes in the other row are arranged in an equilateral triangle.
3. The radio frequency backplane of claim 2, wherein: the distance between the centers of two adjacent stripline ground holes in each row is twice of the diameter of the stripline ground holes.
4. The radio frequency backplane of claim 1, 2 or 3, wherein: the side of the inner bonding pad extending away from the strip line is surrounded by a bonding pad ground hole, and the outer bonding pad is in the same layer with one reference ground of the upper reference ground and the lower reference ground and is connected with the other reference ground through the bonding pad ground hole.
5. The radio frequency backplane of claim 4, wherein: the pad ground holes are arranged in two layers, and the two layers of pad ground holes are arranged in a staggered mode in the parallel direction.
6. The radio frequency backplane of claim 5, wherein: in two adjacent rows of pad ground holes which are arranged in a staggered manner, any two adjacent pad ground holes which are positioned on the inner side and one pad ground hole which is positioned on the outer side are arranged in an equilateral triangle manner.
7. The radio frequency backplane of claim 1, wherein: two rows of strip line ground holes are respectively arranged on two sides of the strip line on the printed board and are symmetrical about the strip line.
8. Backplate subassembly, including radio frequency backplate and the radio frequency connector of setting on the radio frequency backplate, its characterized in that: the radio frequency backplane is as set forth in any one of the preceding claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910252673.9A CN110635291B (en) | 2019-03-29 | 2019-03-29 | Radio frequency backboard and backboard assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910252673.9A CN110635291B (en) | 2019-03-29 | 2019-03-29 | Radio frequency backboard and backboard assembly |
Publications (2)
| Publication Number | Publication Date |
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| CN110635291A true CN110635291A (en) | 2019-12-31 |
| CN110635291B CN110635291B (en) | 2021-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910252673.9A Active CN110635291B (en) | 2019-03-29 | 2019-03-29 | Radio frequency backboard and backboard assembly |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112616243A (en) * | 2020-12-10 | 2021-04-06 | 智英科技股份有限公司 | Multi-socket panel device with anti-crosstalk shielding structure |
| CN114867197A (en) * | 2022-04-25 | 2022-08-05 | 中国电子科技集团公司第二十九研究所 | Radio frequency substrate interconnection structure and radio frequency electronic equipment |
| CN117638495A (en) * | 2024-01-23 | 2024-03-01 | 成都瑞迪威科技有限公司 | Phased array antenna subarray with high isolation |
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| CN101286606A (en) * | 2007-04-11 | 2008-10-15 | 大殷电子株式会社 | Modularized socket with shielding function |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112616243A (en) * | 2020-12-10 | 2021-04-06 | 智英科技股份有限公司 | Multi-socket panel device with anti-crosstalk shielding structure |
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| CN117638495A (en) * | 2024-01-23 | 2024-03-01 | 成都瑞迪威科技有限公司 | Phased array antenna subarray with high isolation |
| CN117638495B (en) * | 2024-01-23 | 2024-04-26 | 成都瑞迪威科技有限公司 | Phased array antenna subarray with high isolation |
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| CN110635291B (en) | 2021-02-05 |
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