CN210469881U

CN210469881U - PCB board mosaic structure and antenna device

Info

Publication number: CN210469881U
Application number: CN201921370911.8U
Authority: CN
Inventors: 陈宏亮; 李明超; 王钦源; 陈礼涛; 宋建平; 田欢
Original assignee: Comba Telecom Technology Guangzhou Ltd
Current assignee: Comba Telecom Technology Guangzhou Ltd
Priority date: 2019-08-22
Filing date: 2019-08-22
Publication date: 2020-05-05
Anticipated expiration: 2029-08-22

Abstract

The utility model relates to a PCB board mosaic structure and antenna device, PCB board mosaic structure include two PCB board modules, ground connection connecting piece and feed connecting piece. The bottom surface of PCB board module is equipped with first ground plane, and the top surface of PCB board module is equipped with the feed line. The grounding connecting piece is bridged on the bottom surfaces of the two PCB board modules and is respectively and electrically connected with the two first grounding layers. The feed connecting piece is bridged on the top surfaces of the two PCB board modules and is respectively electrically connected with the two feed lines. According to the PCB splicing structure, the two PCB modules are designed in a block type, so that the size of the board can be determined according to the actual circuit requirement, the board utilization rate of the PCB can be improved, and the cost is reduced; the first grounding layers of the two PCB modules are mutually connected through the grounding connecting piece, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB modules are connected with each other through the feed connecting piece, so that the transmission of feed signals is realized, and the feed performance of the antenna product is ensured.

Description

PCB board mosaic structure and antenna device

Technical Field

The utility model relates to a mobile communication technology field especially relates to a PCB board mosaic structure and antenna device.

Background

With the development of mobile broadband networks, communication systems are facing 5G evolution, and 5G antennas become an important development trend. The 5G antenna product is required to be more compact and smaller than the conventional 4G antenna product, so that a large amount of PCB boards are used in the 5G antenna product in the production and manufacturing process. However, the PCB board form of the conventional 5G antenna product adopts an integral design or a block design, the integral design has a low utilization rate of PCB materials and high cost, and the split design is easy to cause unstable electrical performance.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to overcome the defects of the prior art, and provide a PCB board splicing structure and an antenna device, which can improve the utilization rate of PCB board materials, reduce the cost, and ensure stable electrical performance.

The technical scheme is as follows: a PCB panel splicing structure comprising: the PCB comprises two PCB modules, wherein the bottom surfaces of the PCB modules are provided with first grounding layers, and the top surfaces of the PCB modules are provided with feed lines; the grounding connecting piece is bridged to the bottom surfaces of the two PCB board modules and is electrically connected with the two first grounding layers respectively, and the feeding connecting piece is bridged to the top surfaces of the two PCB board modules and is electrically connected with the two feeding lines respectively.

According to the PCB splicing structure, the two PCB modules are designed in a block type, so that the size of the board can be determined according to the actual circuit requirement, the board utilization rate of the PCB can be improved, and the cost is reduced; the first grounding layers of the two PCB modules are mutually connected through the grounding connecting piece, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB modules are connected with each other through the feed connecting piece, so that the transmission of feed signals is realized, and the feed performance of the antenna product is ensured.

In one embodiment, the first ground layer is provided with a first ground pad, the ground pad is located on a side portion of the PCB module adjacent to another PCB module, and the ground connector is connected with the first ground pad in a welding mode.

In one embodiment, the ground connection component includes a first conductive plate and a first electrical socket connected to the first conductive plate, the first conductive plate is located on the bottom surface of the PCB module and is connected to the first ground pad by welding, the PCB module is provided with a socket adapted to the first electrical socket, the top surface of the PCB module is further provided with a second ground plane, and the first electrical socket passes through the socket and is electrically connected to the second ground plane.

In one embodiment, the top surface of the PCB module is further provided with a second ground pad electrically connected to a second ground layer, the second ground layer is electrically connected to the first electrical board through the second ground pad, and the second ground pad is soldered to the first electrical board.

In one embodiment, the top surface of the PCB module is further provided with a feeding pad electrically connected to the feeding line, and the feeding pad and the feeding connector are welded to each other.

In one embodiment, the feeding pad is located on a side of the PCB board module adjacent to another PCB board module; the feed connecting piece is a feed connecting piece or a feed connecting core.

In one embodiment, the PCB board splicing structure further includes a metal shielding cover covering the feed connector, and the metal shielding cover is disposed on the top surface of the PCB board module.

In one embodiment, the top surface of the PCB module is further provided with a shielding pad, and the metal shielding cover is connected with the shielding pad in a welding manner.

In one embodiment, the top surface of the PCB module is further provided with a positioning hole, and the metal shielding cover is provided with a positioning column corresponding to the positioning hole, wherein the positioning column is disposed in the positioning hole.

An antenna device comprises the PCB splicing structure.

According to the antenna device, the two PCB modules are designed in a block type, so that the size of the board can be determined according to the actual circuit requirements, the board utilization rate of the PCB can be improved, and the cost is reduced; the first grounding layers of the two PCB modules are mutually connected through the grounding connecting piece, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB modules are connected with each other through the feed connecting piece, so that the transmission of feed signals is realized, and the feed performance of the antenna product is ensured.

Drawings

Fig. 1 is an exploded schematic view of a PCB splicing structure according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of one view angle of a PCB splicing structure according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of another view angle of the PCB splicing structure according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of one side surface of the PCB splicing structure according to an embodiment of the present invention when two PCB modules are butted;

fig. 5 is a schematic structural view of a PCB splicing structure according to an embodiment of the present invention, in which a pad is omitted from one side surface when two PCB modules are butted;

fig. 6 is a schematic structural view of another side surface of the PCB splicing structure according to an embodiment of the present invention when two PCB modules are butted.

Reference numerals:

10. a PCB board splicing structure; 11. a PCB board module; 111. a first ground pad; 112. a socket; 113. a second ground pad; 114. a feeding pad; 115. a shielding pad; 116. positioning holes; 12. a ground connection; 121. a first conductive plate; 122. a first electrical patch panel; 13. a feed connection; 14. a metal shielding cover; 141. and a positioning column.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1, 4 and 6, a PCB board splicing structure 10 includes: two PCB board modules 11, a ground connector 12 and a feed connector 13. The bottom surface of the PCB board module 11 is provided with a first grounding layer, and the top surface of the PCB board module 11 is provided with a feed line. The ground connector 12 is bridged to the bottom surfaces of the two PCB modules 11 and is electrically connected to the two first ground layers, respectively. The feeding connector 13 is bridged on the top surfaces of the two PCB modules 11 and is electrically connected to the two feeding lines, respectively.

In the PCB splicing structure 10, the two PCB modules 11 are designed in a block type, so that the size of the board can be determined according to the actual circuit requirements, for example, the size of one PCB module 11 is smaller than that of the other PCB module 11, thereby improving the board utilization rate of the PCB and reducing the cost; the first grounding layers of the two PCB modules 11 are mutually connected through the grounding connecting piece 12, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB board modules 11 are connected to each other through the feeding connector 13 to realize transmission of a feeding signal, so as to ensure feeding performance of the antenna product.

Further, referring to fig. 1, 4 and 6, the first ground layer is provided with a first ground pad 111, the ground pad is located on a side portion of the PCB module 11 adjacent to another PCB module 11, and the ground connector 12 is connected to the first ground pad 111 by welding. In this way, when the two PCB modules 11 are butted together, the ground connection member 12 can be easily connected to the two first ground pads 111 by welding, and the PCB assembly structure 10 is compact in structure and can be designed in a compact size. Specifically, a green oil layer is coated on the first ground layer, and a region where the green oil layer is opened to expose the first ground layer is the first ground pad 111.

Further, referring to fig. 1, 3 to 6, the ground connector 12 includes a first conductive plate 121 and a first electrical plug board 122 connected to the first conductive plate 121. The PCB module 11 is provided with a socket 112 adapted to the first electrical socket 122, the top surface of the PCB module 11 is further provided with a second ground plane, and the first electrical socket 122 penetrates through the socket 112 and is electrically connected to the second ground plane. Therefore, on one hand, the second grounding layer on the top surface of the PCB module 11 is electrically connected with the first grounding layer through the first electrical plugboard 122, so as to realize common ground arrangement and ensure stable electrical performance; on the other hand, the ground connector 12 makes the coupling structure between the two PCB board modules 11 more stable and reliable. Specifically, there are two first electrical socket plates 122, two first electrical socket plates 122 are disposed on two sides of the first conductive plate 121, and there are two corresponding sockets 112 on the PCB board module 11. The socket 112 may particularly be a groove opening in a side of the PCB board module 11 facing the other PCB board module 11. In addition, the insertion holes 112 of one of the PCB modules 11 are aligned with the insertion holes 112 of the other PCB module 11, so that the first electrical socket 122 can be inserted conveniently.

In one embodiment, the first conductive plate 121 and the first electrical insertion plate 122 are an integrated structure, for example, a metal plate is directly bent to obtain the first conductive plate 121 and the first electrical insertion plate 122, or the metal plate is forged to obtain the first conductive plate 121 and the first electrical insertion plate 122, or the metal plate and the first electrical insertion plate are separately manufactured and finally welded together.

In one embodiment, the first conductive plate 121 is, for example, a rectangular plate, a circular plate, a polygonal plate, or the like. The first conductive plate 121 is located on the bottom surface of the PCB module 11 and is soldered to the first ground pad 111. Specifically, the first ground pads 111 are circumferentially arranged around the first conductive plate 121, that is, when the first conductive plate 121 is a rectangular plate, two first ground pads 111 correspondingly surround to form a rectangular frame around the periphery of the rectangular plate; when the first conductive plate 121 is a circular plate, the two first ground pads 111 respectively surround to form a circular ring around the periphery of the circular plate. Like this, can be convenient for realize welded connection between first ground pad 111 and the first conductive plate 121, after welded connection between first ground pad 111 and the first conductive plate 121, because the equal welded connection of circumference lateral wall of first ground pad 111 and first conductive plate 121, the bonding fastness between first ground pad 111 and the first conductive plate 121 is stronger.

Further, referring to fig. 1, fig. 4 and fig. 6, the top surface of the PCB module 11 is further provided with a second ground pad 113 electrically connected to the second ground layer. The second ground layer is electrically connected to the first electrical socket 122 through the second ground pad 113, and the second ground pad 113 is connected to the first electrical socket 122 by soldering. In this way, the ground connector 12 makes the combination structure between the two PCB modules 11 more stable and reliable. In addition, to facilitate the soldering connection of the second ground pad 113 and the first electrical interposer 122, the second ground pad 113 is disposed adjacent to the socket 112, or the socket 112 is located in the area of the second ground pad 113.

Further, referring to fig. 1, 4 and 6, the top surface of the PCB module 11 is further provided with a feeding pad 114 electrically connected to the feeding line, and the feeding pad 114 and the feeding connector 13 are welded to each other. Thus, on the one hand, the feeding connector 13 electrically connects the feeding pads 114 of the two PCB board modules 11 to each other, so as to realize the transmission of the feeding signal between the two PCB board modules 11; on the other hand, the welding mode is adopted, so that lossless transmission of high-frequency signals is facilitated, and the combined structure between the two PCB modules 11 is stable and reliable. The feeder may be a strip line or a microstrip line.

In one embodiment, referring to fig. 1 and 4, the feeding pad 114 is located on a side of the PCB module 11 adjacent to another PCB module 11. Specifically, the feeding connector 13 is a feeding connecting piece or a feeding connecting core. In this way, when two PCB board modules 11 are butted together, the feeding connector 13 can be easily connected to the two feeding pads 114 by welding, and in addition, the structure of the PCB board splicing structure 10 is compact, and a miniaturized design can be realized.

In one embodiment, referring to fig. 1, fig. 2 and fig. 4, the PCB board splicing structure 10 further includes a metal shielding cover 14 covering the feed connection 13. The metal shielding cover 14 is disposed on the top surface of the PCB module 11. Therefore, on one hand, the metal shielding cover 14 can play a shielding role on the feed connecting piece 13, and stable electrical performance is ensured; on the other hand, the metal shielding cover 14 is connected between the two PCB modules 11, which is beneficial to make the combination structure of the PCB splicing structure 10 more stable and reliable.

If the feeder is a strip line, the metal shielding cover 14 is covered outside the feeder connector 13 to ensure stable electrical performance; if the feed line is embodied as a microstrip line, it may not be necessary to provide the metal shield cover 14 above the feed connection 13.

In one embodiment, referring to fig. 1, 4 and 5, the top surface of the PCB module 11 is further provided with a shielding pad 115. The metal shield cover 14 is soldered to the shield pad 115. In this way, after the metal shielding cover 14 is respectively connected to the shielding pads 115 on the top surfaces of the two PCB modules 11 by welding, the joining structure of the PCB splicing structure 10 is more stable and reliable.

Further, referring to fig. 1, 4 and 5, two shielding pads 115 are disposed on the top surface of each PCB module 11, the two shielding pads 115 are disposed at intervals, and the two shielding pads 115 on the top surface of one PCB module 11 and the two shielding pads 115 on the top surface of the other PCB module 11 are disposed in a one-to-one correspondence manner. One of the shielding pads 115 and the corresponding shielding pad 115 on the top surface of one of the PCB board modules 11 are all connected to one side of the metal shielding cover 14 by soldering, and the other shielding pad 115 and the corresponding shielding pad 115 on the top surface of one of the PCB board modules 11 are all connected to the other side of the metal shielding cover 14 by soldering. Thus, on the one hand, the metallic shielding cover 14 has a good shielding effect on the feed connection 13 located inside it; on the other hand, after the two side portions of the metal shielding cover 14 are respectively and correspondingly welded on the shielding bonding pads 115, the combination structure of the PCB board splicing structure 10 is more stable and reliable, the structure of the PCB board splicing structure 10 is compact, and the miniaturization design can be realized.

Specifically, the shielding pad 115 has a long bar shape, and the metal shielding cover 14 has a rectangular shape. This facilitates welding with the side of the metallic shield cover 14.

Further, the shield pad 115 is disposed to be grounded, and specifically, the shield pad 115 is electrically connected to the first ground pad 111 or the second ground pad 113. In this embodiment, the shielding pad 115 and the second grounding pad 113 are located on the top surface of the PCB module 11, the shielding pad 115 is electrically connected to the second grounding pad 113, and the second grounding pad 113 is electrically connected to the first grounding layer through the grounding connector 12, so that the metal shielding cover 14 is grounded to achieve a good shielding effect. Of course, as an alternative, the shielding pad 115 may also be directly electrically connected to the first ground layer by using a metalized via, so that the shielding pad 115 does not need to be electrically connected to the second ground pad 113.

In one embodiment, referring to fig. 1, fig. 4 and fig. 5, for the same PCB module 11, two shielding pads 115 and two second ground pads 113 are disposed on the top surface thereof, and the two second ground pads 113 are correspondingly disposed between the two shielding pads 115 and spaced apart from the two shielding pads 115, respectively. Optionally, the shielding pad 115 and the adjacent second ground pad 113 are the same copper layer disposed on the top surface of the PCB module 11, and a green oil layer is laid on the copper layer, and the shielding pad 115 and the second ground pad 113 are obtained by windowing the green oil layer.

In one embodiment, referring to fig. 1, 4 to 6, the feeding pad 114, the second grounding pad 113 and the shielding pad 115 are all located on a side of the top surface of the PCB module 11 adjacent to another PCB module 11, so that after the two PCB modules 11 are connected to each other through the feeding connector 13, the grounding connector 12 and the metal shielding cover 14, the resulting PCB splicing structure 10 is stable and reliable in structure, compact in overall structure, and capable of implementing a miniaturized design.

In one embodiment, referring to fig. 1, 4 to 6, the top surface of the PCB module 11 is further provided with a positioning hole 116, the metal shielding cover 14 is provided with a positioning post 141 corresponding to the positioning hole 116, and the positioning post 141 is disposed in the positioning hole 116. The positioning holes 116 may be oval holes, circular holes, rectangular holes, triangular holes, and the like. Optionally, two sides of the metal shielding cover 14 are respectively provided with a positioning post 141, and a positioning hole 116 corresponding to the positioning post 141 is disposed on the top surface of one of the PCB module 11. Or, two positioning pillars 141 are disposed on both sides of the metal shielding cover 14, and positioning holes 116 corresponding to the positioning pillars 141 are disposed on the top surfaces of the two PCB board modules 11.

In one embodiment, the PCB module 11 may be a single-layer board or a multi-layer board, which is not limited herein. For example, the PCB module 11 is a 2-layer circuit board or a 3-layer circuit board, and for the feeder of the inner layer circuit of the multilayer board, a metalized via is adopted to be switched to the feeder on the top surface of the multilayer board, and the feeder connection 13 is adopted for feeding connection. For another example, one of the PCB modules 11 may be a 2-layer circuit board, and the other PCB module 11 may also be a 3-layer circuit board, as long as the two PCB modules 11 have the same board thickness, so that the two PCB modules 11 can be ensured to be well butted.

In an embodiment, referring to fig. 1, 4 to 6, a PCB board splicing structure 10 includes: two PCB board modules 11, a ground connector 12 and a feed connector 13. The bottom surface of the PCB board module 11 is provided with a first grounding layer, and the top surface of the PCB board module 11 is provided with a feed line. The ground connector 12 is bridged to the bottom surfaces of the two PCB modules 11 and is electrically connected to the two first ground layers, respectively. The feeding connector 13 is bridged on the top surfaces of the two PCB modules 11 and is electrically connected to the two feeding lines, respectively. The first ground layer is provided with a first ground pad 111, the ground pad is located on a side portion of the PCB module 11 adjacent to another PCB module 11, and the ground connector 12 is connected to the first ground pad 111 by welding. The ground connection member 12 includes a first conductive plate 121 and a first electrical insertion plate 122 connected to the first conductive plate 121. The PCB module 11 is provided with a socket 112 adapted to the first electrical socket 122, the top surface of the PCB module 11 is further provided with a second ground plane, and the first electrical socket 122 penetrates through the socket 112 and is electrically connected to the second ground plane. The number of the first electrical socket plates 122 is two, two first electrical socket plates 122 are disposed on both sides of the first conductive plate 121, and the number of the insertion holes 112 on the PCB module 11 is two. The socket 112 may particularly be a groove opening in a side of the PCB board module 11 facing the other PCB board module 11. In addition, the insertion holes 112 of one of the PCB modules 11 are aligned with the insertion holes 112 of the other PCB module 11, so that the first electrical socket 122 can be inserted conveniently.

The first ground pads 111 are circumferentially arranged around the first conductive plate 121, that is, the first conductive plate 121 is a rectangular plate, and two first ground pads 111 correspondingly surround to form a rectangular frame around the periphery of the rectangular plate. The top surface of the PCB module 11 is further provided with a second ground pad 113 electrically connected to a second ground layer. The second ground layer is electrically connected to the first electrical socket 122 through the second ground pad 113, and the second ground pad 113 is connected to the first electrical socket 122 by soldering.

The top surface of the PCB module 11 is further provided with a feeding pad 114 electrically connected to the feeding line, and the feeding pad 114 and the feeding connector 13 are welded to each other. The feed connecting piece 13 is a feed connecting piece or a feed connecting core. The PCB board splicing structure 10 further includes a metal shielding cover 14 covering the feed connector 13. The metal shielding cover 14 is disposed on the top surface of the PCB module 11.

The top surface of the PCB module 11 is also provided with a shielding pad 115. The metal shield cover 14 is soldered to the shield pad 115. The number of the shielding pads 115 on the top surface of each PCB module 11 is two, two shielding pads 115 are disposed at intervals, and the two shielding pads 115 on the top surface of one PCB module 11 and the two shielding pads 115 on the top surface of the other PCB module 11 are disposed in a one-to-one correspondence. One of the shielding pads 115 and the corresponding shielding pad 115 on the top surface of one of the PCB board modules 11 are all connected to one side of the metal shielding cover 14 by soldering, and the other shielding pad 115 and the corresponding shielding pad 115 on the top surface of one of the PCB board modules 11 are all connected to the other side of the metal shielding cover 14 by soldering.

For the same PCB module 11, two shielding pads 115 and two second ground pads 113 are disposed on the top surface of the PCB module, and the two second ground pads 113 are correspondingly disposed between the two shielding pads 115 and spaced from the two shielding pads 115, for example. Optionally, the shielding pad 115 and the adjacent second ground pad 113 are the same copper layer disposed on the top surface of the PCB module 11, and a green oil layer is laid on the copper layer, and the shielding pad 115 and the second ground pad 113 are obtained by windowing the green oil layer. The top surface of the PCB module 11 is further provided with a positioning hole 116, the metal shielding cover 14 is provided with a positioning column 141 corresponding to the positioning hole 116, and the positioning column 141 is disposed in the positioning hole 116. The positioning holes 116 may be oval holes, circular holes, rectangular holes, triangular holes, and the like. Optionally, two sides of the metal shielding cover 14 are respectively provided with a positioning post 141, and a positioning hole 116 corresponding to the positioning post 141 is disposed on the top surface of one of the PCB module 11. Or, two positioning pillars 141 are disposed on both sides of the metal shielding cover 14, and positioning holes 116 corresponding to the positioning pillars 141 are disposed on the top surfaces of the two PCB board modules 11.

In summary, the PCB splicing structure 10 according to the above embodiment has at least the following advantages:

1. in the PCB splicing structure 10, the two PCB modules 11 are designed in a block type, so that the size of the board can be determined according to the actual circuit requirements, for example, the size of one PCB module 11 is smaller than that of the other PCB module 11, thereby improving the board utilization rate of the PCB and reducing the cost; the first grounding layers of the two PCB modules 11 are mutually connected through the grounding connecting piece 12, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB board modules 11 are connected to each other through the feeding connector 13 to realize transmission of a feeding signal, so as to ensure feeding performance of the antenna product.

2. Welding connection can be convenient for realize between first ground pad 111 and the first conductive plate 121, and behind welding connection between first ground pad 111 and the first conductive plate 121, because the equal welded connection of circumference lateral wall of first ground pad 111 and first conductive plate 121, the bonding fastness between first ground pad 111 and the first conductive plate 121 is stronger. The ground connection 12 makes the coupling structure between the two PCB panel modules 11 more stable and reliable.

3. The metal shielding cover 14 can shield the feed connecting piece 13, so that stable electrical performance is ensured; the metal shielding cover 14 is connected between the two PCB modules 11, which is beneficial to making the combination structure of the PCB splicing structure 10 more stable and reliable.

4. The feeding pad 114, the second grounding pad 113 and the shielding pad 115 are all located on the top surface of the PCB module 11 at one side adjacent to another PCB module 11, so that after the two PCB modules 11 are connected to each other through the feeding connector 13, the grounding connector 12 and the metal shielding cover 14, the obtained PCB board splicing structure 10 is stable and reliable in structure, compact in overall structure and capable of realizing a miniaturized design.

In one embodiment, referring to fig. 1 and 4, an antenna device includes the PCB board splicing structure 10.

The antenna device can be a 4G antenna or a 5G antenna, and the two PCB modules 11 are designed in a block mode, so that the size of the board can be determined according to the actual circuit requirements, for example, the size of one PCB module 11 is smaller than that of the other PCB module 11, the board utilization rate of the PCB can be improved, and the cost can be reduced; the first grounding layers of the two PCB modules 11 are mutually connected through the grounding connecting piece 12, so that common grounding is realized, and stable electrical performance can be ensured; the feeder lines of the two PCB board modules 11 are connected to each other through the feeding connector 13 to realize transmission of a feeding signal, so as to ensure feeding performance of the antenna product.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A PCB board mosaic structure which characterized in that includes:

the PCB comprises two PCB modules, wherein the bottom surfaces of the PCB modules are provided with first grounding layers, and the top surfaces of the PCB modules are provided with feed lines;

the grounding connecting piece is bridged to the bottom surfaces of the two PCB board modules and is electrically connected with the two first grounding layers respectively, and the feeding connecting piece is bridged to the top surfaces of the two PCB board modules and is electrically connected with the two feeding lines respectively.

2. The PCB board splicing structure of claim 1, wherein the first grounding layer is provided with a first grounding pad, the grounding pad is positioned on the side part of the PCB board module adjacent to the other PCB board module, and the grounding connector is connected with the first grounding pad in a welding way.

3. The PCB splicing structure of claim 1, wherein the ground connector comprises a first conductive plate and a first electrical socket connected to the first conductive plate, the first conductive plate is located on the bottom surface of the PCB module and is connected to the first ground pad by welding, a socket adapted to the first electrical socket is provided on the PCB module, a second ground layer is further provided on the top surface of the PCB module, and the first electrical socket passes through the socket and is electrically connected to the second ground layer.

4. The PCB board splicing structure of claim 3, wherein the top surface of the PCB board module is further provided with a second ground pad electrically connected with a second ground layer, the second ground layer is electrically connected with the first electrical board through the second ground pad, and the second ground pad is connected with the first electrical board by welding.

5. The PCB board splicing structure of claim 1, wherein the top surface of the PCB board module is further provided with a feeding pad electrically connected with the feeding line, and the feeding pad and the feeding connector are welded to each other.

6. The PCB board splicing structure of claim 5, wherein the feed pad is located on a side of the PCB board module adjacent to another PCB board module; the feed connecting piece is a feed connecting piece or a feed connecting core.

7. The PCB board splicing structure of claim 1, further comprising a metal shielding cover covering the feed connection member, wherein the metal shielding cover is disposed on the top surface of the PCB board module.

8. The PCB board splicing structure of claim 7, wherein the top surface of the PCB board module is further provided with a shielding pad, and the metal shielding cover is connected with the shielding pad in a welding manner.

9. The PCB board splicing structure of claim 7, wherein the top surface of the PCB board module is further provided with a positioning hole, the metal shielding cover is provided with a positioning column corresponding to the positioning hole, and the positioning column is arranged in the positioning hole.

10. An antenna device, comprising the PCB panel splicing structure according to any one of claims 1 to 9.