CN102339404A - Novel intelligent card module and productive technology thereof - Google Patents
Novel intelligent card module and productive technology thereof Download PDFInfo
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- CN102339404A CN102339404A CN2010102316477A CN201010231647A CN102339404A CN 102339404 A CN102339404 A CN 102339404A CN 2010102316477 A CN2010102316477 A CN 2010102316477A CN 201010231647 A CN201010231647 A CN 201010231647A CN 102339404 A CN102339404 A CN 102339404A
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Abstract
The invention discloses a novel intelligent card module and a productive technology thereof; the module is formed through the adhesive bonding of a CFN (Connection Frame Number) module and a carrier tape; the productive technology thereof comprises the following steps of: (1) patching; (2) splitting the patch into the carrier tape; (3) punching; (4) testing; and (5) finishing the manufacture of cards. The productive technology has the advantages of substantially improving the production efficiency and reducing the production materials and manufacturing cost of the intelligent card modules by combining the CFN (Connection Frame Number) module and a PET (polyethylene terephthalate) circuit board.
Description
Technical field:
The present invention relates to the semiconductor microelectronics encapsulation technology, be specifically related to a kind of novel intelligent object and the production technology of this module.
Background technology:
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.In field of intelligent cards because security and multi-functional requirement display gradually, require cost reduce or constant situation under increase reliability.
But the encapsulation of conventional intelligent object generally all is to use FR4 or the G10 substrate layer as carrier band; Single face or two-sided deposited copper wire are set; Then intelligent card chip paster, routing are connected, direct moulding or UV encapsulate after waiting to finish, and realize the high reliability of smart card module.This method for packing requires corresponding carrier band can directly beat gold thread, and this carrier band all is to be produced without competition by external producer at present, and die cost is high, and unit price is expensive.This makes that the expense of intelligent object encapsulation is high, greatly reduces the market competitiveness of corresponding intelligent object.
The patent of invention of the applicant's application; Application number: 200810036653.X, it discloses a kind of miniature radio frequency module and method for packing thereof, and the technical scheme of this patent is that semi-conductor chip is attached on the carrier band; The line lead bonding of going forward side by side is packaged into ultra-thin, subminiature intelligent object at last.
How utilizing above-mentioned ultra-thin, subminiature intelligent object to be packaged into smart card module cheap, that performance is more superior is the application's problem to be solved.
Summary of the invention:
The present invention is directed to above-mentioned existing intelligent object encapsulation technology and need rely on expensive carrier band; Thereby reduce the problem of the finished product market competitiveness; And a kind of novel intelligent card module and corresponding production technology be provided; This module has very low packaging cost, and simultaneously corresponding production technology has higher production efficiency, and the finished product that forms can effectively satisfy the fiduciary level requirement of smart card industry to smart card module.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of novel intelligent card module, said smart card module comprise CFN (quad flat non-pin package) module and the carrier that is formed by the carrier band cutting, and said CFN module is bonded on the said carrier.
Said carrier comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of said substrate layer lay described copper foil circuit layer respectively.
The thickness of said CFN module is 0.33-0.50mm.
Said CFN module is installed on the said carrier through the low-temperature conductive cementing agent of environment-friendly materials, and welds mutually with connection line on the said carrier.
The quantity that said CFN module is installed is one or more.
One or more paster components and parts also can be installed on the said carrier.
Said carrier band is formed by connecting in some said carriers, and said carrier is connected to form some double carrier strip, and said double carrier strip is in turn connected into said carrier band.
Said some double carrier strip can cut into the wide standard intelligent card band of 35mm.
A kind of production technology of novel intelligent card module, said production technology comprises the steps:
(1) uses SMT automatic chip mounting equipment, CFN module and other components and parts are attached at through conductive adhesive on the carrier of PET material, be cured through 100 ℃-180 ℃ reflow ovens again;
(2) carrier of paster being accomplished is put in the automatic cutting equipment, and cutting into every width is the standard intelligent card band of 35mm;
It is die-cut that the standard intelligent card band that (3) will cut carries out the short circuit hole, makes its each contact all have independent electrical property;
(4) die-cut good band is positioned over carries out electric performance test in the needle-bar testing apparatus;
(5) band that will test completion carries out last manufacturing card, makes it become standard intelligent card.
Novel intelligent card module provided by the invention adopts on the direct bonding carrier of CFN module of quad flat non-pin package; Avoid carrier band need beat the technology of gold thread; Thereby realize need not to adopt expensive special carrier band, reduce cost of products greatly, greatly improve the competitiveness of product in market.
Novel intelligent card module provided by the invention can be applied among all kinds of smart card processing, like bank card, consumption card, mobile phone card etc. widely simultaneously; It helps the general of production equipment, the raising of product reliability, and the installation that makes things convenient for later process simultaneously.
Production technology provided by the invention owing to used many rows carrier band form in flakes, can practice thrift the production time production efficiency is significantly improved; And can general existing equipment, the present invention greatly reduces production cost, material cost particularly, but be that external producer produces without competition and is reduced to domestic manufacturer's Direct Production from original carrier band.
Description of drawings:
Further specify the present invention below in conjunction with accompanying drawing and embodiment.
Fig. 1 is a front schematic view of the present invention;
Fig. 2 is a schematic rear view of the present invention;
Fig. 3 is a cut-open view of the present invention;
Fig. 4 is the reverse side synoptic diagram of carrier band among the present invention;
Fig. 5 is the front schematic view behind the carrier band paster among the present invention;
Fig. 6 is a process chart of the present invention.
Embodiment:
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete diagram, further set forth the present invention.
Owing to during the encapsulation of conventional intelligent object, require corresponding carrier band can directly beat gold thread, moreover this carrier band all is to be produced without competition by external producer at present, and die cost is high, and unit price is expensive.Thereby make that the expense of intelligent object encapsulation is high, greatly reduce the market competitiveness of corresponding intelligent object.
To above-mentioned situation, the present invention avoids adopting the encapsulating structure of normal procedure intelligent module, and a kind of novel smart card module is provided.
Referring to Fig. 1, smart card module provided by the invention comprises CFN module 1 and carrier 2 two parts.
Wherein, CFN module 1 is a quad flat non-pin package, and its thickness is 0.33-0.50mm, is attached on the carrier band by semi-conductor chip, and the line lead bonding of going forward side by side is packaged into ultra-thin, subminiature intelligent object at last, so that the follow-up SMT that carries out processes use.
The pin of CFN module 1 and circuit 4 electrically connect, and carry out the electrical property conducting through 5 pairs of smart card module pros and cons of through hole again.
Referring to Fig. 2, smart card module front contact 6 is the standard intelligent card contact size, through slotted eye 7 its eight contacts is isolated separately.
Referring to Fig. 3, carrier 2 comprises substrate layer 2-1 and copper foil circuit layer 2-2.The material of substrate layer 2-1 is the PET material, and its color is transparent or white or other colors; The tow sides of substrate layer 2-1 all lay copper foil circuit layer 2-2, and this copper foil circuit layer 2-2 is the copper foil circuit wiring board, and electroplating technology is carried out on its surface, and adds anti-oxidation processing.
Be to form smart card module, the present invention with the low-temperature conductive cementing agent 3 of CFN module 1 through environment-friendly materials directly bonding be installed on the corresponding site of carrier 2, and weld mutually with connection line on the carrier 2.Such structure avoid conventional module package required beat gold thread technology, thereby can avoid the use of special carrier band, thereby greatly reduce production costs, also do not influence performance of products and practical ranges simultaneously.
Further, CFN module 1 can be according to the functional requirement of actual application of IC cards in the present invention, the quantity of installation optional from one to a plurality of.
In addition, the paster components and parts of one or more other types can be installed as required, like resistance, electric capacity etc. on the carrier 2.
It is of a size of standard intelligent card size: 12.6mm * 11.4mm the smart card module that is obtained by such scheme, and its thickness is 0.53mm-0.56mm.
In order to increase production efficiency, adopt web-like pan feeding and web-like discharge method in the novel intelligent card module production run.Promptly whole volume carrier band is sent into patch device automatically through track, and carries out mounting of CFN module and components and parts automatically, mounting will put in order the volume carrier band automatically through the equipment track again after finishing and see off.
Referring to Fig. 4, whole carrier band 200 is a strip, is connected to form by two double carrier strip 201.In order to improve the SMT production capacity, the width of every double carrier strip 201 is 35mm, and it is formed by connecting the mode of single carrier 202 according to two row's permutations.
Between two double carrier strip 201, be provided with dowel 203, so that when making carrier band, be used for electric plating of whole board technology.
Referring to Fig. 5, it is the front schematic view that on carrier 202, sets the carrier band 200 of CFN module 204, and it is provided with dowel 208, so that when making carrier band, be used for electric plating of whole board technology.
Article two, be provided with through hole 205 between the double carrier strip, it is used for cutting when double carrier band separates contraposition.
In the both sides of two double carrier strip equidistance be provided with registration holes 206 so that when attaching components and parts automatically, use registration holes 206 to carry out the product contraposition.
Be provided with deposited copper 207 in the centre of two double carrier strip, be used to show the model of this product intelligent card module.
The carrier band 200 that is obtained by technique scheme installs the standard intelligent card band that (as shown in Figure 5) after the components and parts cuts into double 35mm width, adds the general of equipment in man-hour with road, convenient back.
Simultaneously, again carrier band is cut into the standard intelligent card band of double 35mm width, carry out punching, test, fabrication again.
The concrete production technology of above-mentioned novel intelligent card module is (referring to Fig. 6) as follows:
At first, use SMT automatic chip mounting equipment, CFN module and other components and parts are pasted secondary on the carrier of PET material through conductive adhesive, be cured through 100 ℃-180 ℃ reflow ovens again.
Then, the carrier that paster is accomplished is put in the automatic cutting equipment, the standard intelligent card band that to cut into every width be 35mm.
Then, it is die-cut that the standard intelligent card band that has cut is carried out the short circuit hole, makes its each contact all have independent electrical property.
Follow again, die-cut good band is positioned over carries out electric performance test in the needle-bar testing apparatus.
At last, the band of testing completion is carried out last manufacturing card, make it become standard intelligent card.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the instructions just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain to be defined by appending claims and equivalent thereof.
Claims (9)
1. a novel intelligent card module is characterized in that, said smart card module comprises CFN module and the carrier that is formed by the carrier band cutting, and said CFN module is bonded on the said carrier.
2. a kind of novel intelligent card module according to claim 1; It is characterized in that; Said carrier comprises the copper foil circuit layer of substrate layer, surface process electroplating technology and the anti-oxidation processing of PET material, and the tow sides of said substrate layer lay described copper foil circuit layer respectively.
3. a kind of novel intelligent card module according to claim 1 is characterized in that the thickness of said CFN module is 0.33-0.50mm.
4. a kind of novel intelligent card module according to claim 1 and 2 is characterized in that said CFN module is installed on the said carrier through the low-temperature conductive cementing agent of environment-friendly materials, and welds mutually with connection line on the said carrier.
5. according to claim 1 or 3 described a kind of novel intelligent card modules, it is characterized in that the quantity that said CFN module is installed is one or more.
6. a kind of novel intelligent card module according to claim 1 and 2 is characterized in that, one or more paster components and parts also can be installed on the said carrier.
7. a kind of novel intelligent card module according to claim 1 is characterized in that said carrier band is formed by connecting in some said carriers, and said carrier is connected to form some double carrier strip, and said double carrier strip is in turn connected into said carrier band.
8. a kind of novel intelligent card module according to claim 7 is characterized in that, said some double carrier strip can cut into the wide standard intelligent card band of 35mm.
9. the production technology of a novel intelligent card module is characterized in that, said technology comprises the steps:
(1) uses SMT automatic chip mounting equipment, CFN module and other components and parts are attached at through conductive adhesive on the carrier of PET material, be cured through 100 ℃-180 ℃ reflow ovens again;
(2) carrier of paster being accomplished is put in the automatic cutting equipment, and cutting into every width is the standard intelligent card band of 35mm;
It is die-cut that the standard intelligent card band that (3) will cut carries out the short circuit hole, makes its each contact all have independent electrical property;
(4) die-cut good band is positioned over carries out electric performance test in the needle-bar testing apparatus;
(5) band that will test completion carries out last manufacturing card, makes it become standard intelligent card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010231647.7A CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010231647.7A CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
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| Publication Number | Publication Date |
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| CN102339404A true CN102339404A (en) | 2012-02-01 |
| CN102339404B CN102339404B (en) | 2016-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010231647.7A Active CN102339404B (en) | 2010-07-20 | 2010-07-20 | A kind of Novel intelligent card module and production technology thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610912A (en) * | 2012-04-16 | 2012-07-25 | 韦业明 | Antenna electronic shell based on metal contact and machining process of antenna electronic shell |
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
| CN106624387A (en) * | 2016-12-07 | 2017-05-10 | 诺得卡（上海）微电子有限公司 | Punching device for manufacturing smart card module |
| CN110411400A (en) * | 2019-07-19 | 2019-11-05 | 闽南理工学院 | A kind of punching control system and method for smart card module manufacture |
| CN115939074A (en) * | 2023-03-13 | 2023-04-07 | 新恒汇电子股份有限公司 | Novel double-sided flexible lead frame structure and preparation process thereof |
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| US6091137A (en) * | 1996-05-31 | 2000-07-18 | Kabushiki Kaisha Toshiba | Semiconductor device substrate and method of manufacturing the same |
| CN1337741A (en) * | 2000-08-09 | 2002-02-27 | 株式会社Kostat半导体 | Semiconductor with injectable conductive area and mfg. method thereof |
| JP2004165531A (en) * | 2002-11-15 | 2004-06-10 | Dainippon Printing Co Ltd | Double-sided wiring antenna circuit member for noncontact data carrier |
| CN1901183A (en) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | Substrate, smart card modules and methods for fabricating the same |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
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2010
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091137A (en) * | 1996-05-31 | 2000-07-18 | Kabushiki Kaisha Toshiba | Semiconductor device substrate and method of manufacturing the same |
| CN1337741A (en) * | 2000-08-09 | 2002-02-27 | 株式会社Kostat半导体 | Semiconductor with injectable conductive area and mfg. method thereof |
| JP2004165531A (en) * | 2002-11-15 | 2004-06-10 | Dainippon Printing Co Ltd | Double-sided wiring antenna circuit member for noncontact data carrier |
| CN1901183A (en) * | 2005-07-18 | 2007-01-24 | 三星电子株式会社 | Substrate, smart card modules and methods for fabricating the same |
| CN101567351A (en) * | 2008-04-25 | 2009-10-28 | 上海长丰智能卡有限公司 | Miniature radio frequency module and packaging method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013023326A1 (en) * | 2011-08-18 | 2013-02-21 | 上海长丰智能卡有限公司 | Carrier tape for novel smart card module, smart card module, module production process, and smart card |
| CN102610912A (en) * | 2012-04-16 | 2012-07-25 | 韦业明 | Antenna electronic shell based on metal contact and machining process of antenna electronic shell |
| CN102610912B (en) * | 2012-04-16 | 2015-08-05 | 韦业明 | Based on antenna electric sublayer and the processing technology thereof of hard contact |
| CN106624387A (en) * | 2016-12-07 | 2017-05-10 | 诺得卡（上海）微电子有限公司 | Punching device for manufacturing smart card module |
| CN110411400A (en) * | 2019-07-19 | 2019-11-05 | 闽南理工学院 | A kind of punching control system and method for smart card module manufacture |
| CN115939074A (en) * | 2023-03-13 | 2023-04-07 | 新恒汇电子股份有限公司 | Novel double-sided flexible lead frame structure and preparation process thereof |
| CN115939074B (en) * | 2023-03-13 | 2023-08-22 | 新恒汇电子股份有限公司 | Novel double-sided flexible lead frame structure and preparation process thereof |
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| Publication number | Publication date |
|---|---|
| CN102339404B (en) | 2016-06-15 |
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| Date | Code | Title | Description |
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| CB02 | Change of applicant information |
Address after: 201206 Shanghai City, Pudong New Area Chinese (Shanghai) Free Trade Zone gold Yulu No. 818 Applicant after: SHANGHAI INESA INTELLIGENT ELECTRONICS CO., LTD. Address before: 201206 Shanghai City, Pudong New Area Yulu No. 818 gold Applicant before: Shanghai Changfeng Intelligent Card Co., Ltd. |
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| COR | Change of bibliographic data | ||
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| GR01 | Patent grant |