CN202695439U - LED die set with LED chip directly encapsulated on rigid-flexible circuit board - Google Patents
LED die set with LED chip directly encapsulated on rigid-flexible circuit board Download PDFInfo
- Publication number
- CN202695439U CN202695439U CN2012202506777U CN201220250677U CN202695439U CN 202695439 U CN202695439 U CN 202695439U CN 2012202506777 U CN2012202506777 U CN 2012202506777U CN 201220250677 U CN201220250677 U CN 201220250677U CN 202695439 U CN202695439 U CN 202695439U
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- China
- Prior art keywords
- led
- circuit board
- led chip
- flexible circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model relates to an LED die set with an LED chip directly encapsulated on a rigid-flexible circuit board. The LED die set comprises a flexible printed circuit with an insulating layer, a support rigid board, the LED chip and an encapsulating structure, wherein one or more circuits is/are arranged on the front side of the insulating layer; the support rigid board is combined on the back side of the flexible printed circuit so as to form the support rigid board of the rigid-flexible circuit board; the LED chip is directly encapsulated on the front side of the flexible printed circuit; and the encapsulating structure is used for encapsulating the LED chip. The LED die set can be widely used for LED lamp belts, LED Christmas lamps, LED neon lights, LED guardrail pipes, LED advertisement marks, LED panel lamps, LED fluorescent lamp tubes and the like, and has the advantages of simple and short manufacturing process, high production efficiency, low manufacturing cost, high reliability and wide application range.
Description
Technical field
The utility model relates to the LED application, is specifically related to LED module and the LED lamp band of direct packaging LED chips on soft or hard mating type wiring board.
Background technology
Occurred in recent years the electronic devices and components chip directly is contained in technology on the circuit board, still, in LED module and LED application product field, not yet appeared at LED module and the LED lamp carries product of packaged chip on the type flexible and hard combined circuit board.
The LED module of the utility model flexible and hard combined circuit board packaged chip and LED lamp band, it is the position of wanting packaging LED chips in Flexible Printed Circuit, be supported on bonding fixedly securing of hardboard, the back side of Flexible Printed Circuit, LED module and the LED lamp band performance in the processes such as transportation, carrying movement, installation is protected, greatly improve the reliability of product, and this soft or hard is in conjunction with LED module and LED lamp band applied range.
Summary of the invention
Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition term " wiring board " and " circuit board " can use interchangeably in the application, and term " circuit " and " circuit " can use interchangeably also in the application.
It will be appreciated by those skilled in the art that the led chip in the utility model can be the led chip of any type, comprise the chip that long wave led chip of all kinds, indigo plant, green light LED chip, white light LEDs are used, high-power LED chip, etc.Therefore scope of the present utility model is only limited by claims.
The utility model relates to a kind of LED module and LED lamp band of flexible and hard combined circuit board packaged chip, comprising: the wiring board of soft or hard combination is planarized structure in conjunction with the die bond position on the hardboard circuit, perhaps can become cup-like structure with mould punching; Be encapsulated in conjunction with the led chip on the hardboard circuit; With the encapsulating structure that is used for packaging LED chips.Light fixture module of the present utility model can be widely used in LED lamp band, LED Christmas lamp, LED neon light, LED guardrail pipe, LED advertisement and identifier, LED Panel light, LED fluorescent tube etc.The utility model making flow process is brief, and production efficiency is high; Production cost is low; The reliability of product is high, applied range.
According to the utility model, provide a kind of on soft or hard mating type wiring board the direct LED module of packaging LED chips, comprising: flexible circuit board, it has insulating barrier and is combined in one or more circuit on the described insulating barrier front; Be combined on the back side of described flexible circuit board and form the support hardboard of described soft or hard mating type wiring board; Directly be encapsulated in the led chip on the front of described flexible circuit board; Be used for encapsulating the encapsulating structure of described led chip.
According to an embodiment of the present utility model, described flexible circuit board has many circuits that are arranged side by side, wherein, the led chip die bond is on corresponding circuit, and a contact conductor nation of led chip is welded on the solder joint of this circuit of die bond separately surely, and another contact conductor nation of led chip is welded on the solder joint that is not used for an other circuit of die bond surely.
According to an embodiment of the present utility model, described flexible circuit board has many circuits that are arranged side by side, wherein, the led chip die bond is on corresponding circuit, and the negative wire nation of led chip is welded on the solder joint of this circuit of die bond separately surely, and the positive wire nation of led chip is welded on the solder joint that is not used for an other circuit of die bond surely.
According to an embodiment of the present utility model, described flexible circuit board is single-sided flexible circuit board, is formed with the bowl configurations for the led chip die bond on its at least one circuit, and described led chip is positioned in the described bowl configurations.
According to an embodiment of the present utility model, described support hardboard is the hardboard of being made by the plastically deformable material, also is formed with corresponding pit on position corresponding with the described bowl configurations of described flexible circuit board on the described support hardboard.
According to an embodiment of the present utility model, described bowl configurations is cup-like structure.
According to an embodiment of the present utility model, described support hardboard is the hardboard of being made by rigid material, and the position corresponding with the described bowl configurations of described flexible circuit board is provided with and avoids the hole on described support hardboard.
According to an embodiment of the present utility model, described support hardboard is the nonmetallic support hardboard that directly is combined on the described flexible circuit board, or is bonded in metallic support hardboard on the described flexible circuit board via the insulating cement adhesion coating.
According to an embodiment of the present utility model, the position that is used for the led chip die bond on the described flexible circuit board is planar structure.
According to an embodiment of the present utility model, at least one circuit in described flexible circuit board forms the breach that disconnects, wherein, described breach one end of described led chip die bond on this circuit and this circuit of an electrical leads nation of described led chip this end that is used for die bond that surely is welded on described breach, another electrical leads nation of described led chip is welded on the same circuit of the described breach other end surely.
According to an embodiment of the present utility model, described breach is crooked, so that the circuit that is used for described led chip die bond of described breach one end is configured as convex, and the same circuit of the described breach other end is configured as spill.
According to utility model, also disclosed a kind of LED module and LED lamp band of flexible and hard combined circuit board packaged chip, comprising: the wiring board of soft or hard combination; Be encapsulated in conjunction with the led chip on the hardboard circuit; With the encapsulating structure that is used for packaging LED chips.
According to an embodiment of the present utility model, described flexible and hard combined circuit board is planarized structure or becomes cup-like structure with mould punching in conjunction with the die bond position on the hardboard circuit.
According to an embodiment of the present utility model, described flexible and hard combined circuit board, it is support hardboard or the nonmetallic support hardboard of metal in conjunction with support hardboard in the circuit board.
According to an embodiment of the present utility model, on the circuit of same hardboard, one or more encapsulating structure can be set.
According to an embodiment of the present utility model, described flexible and hard combined circuit board has one or more conducting wires;
According to an embodiment of the present utility model, a circuit in conjunction with the circuit on the hardboard, the centre is provided with and disconnects mouth, disconnect the positive and negative electrode circuit of the two ends formation of mouth, the chip die bond is on the circuit that disconnects a mouthful end, the negative wire nation of chip is welded on the solder joint of this circuit of die bond surely, and the positive wire nation of chip surely is welded on and disconnects on mouthful solder joint of other end circuit.
According to an embodiment of the present utility model, two circuits in conjunction with the circuit on the hardboard, the led chip die bond is therein on circuit, and the negative wire nation of chip is welded on surely on the solder joint of this circuit of die bond, and the positive wire nation of chip is welded on the solder joint of another circuit surely.
According to an embodiment of the present utility model, many circuits in conjunction with the circuit on the hardboard, a plurality of led chip die bonds are on corresponding circuit, and respectively the negative wire nation of these chips is welded on surely on the solder joint of this circuit of die bond separately, the positive wire of each chip together nation is welded on the solder joint of another circuit that does not have die bond surely.
According to an embodiment of the present utility model, the circuit that is combined on the hardboard is many circuits, be provided with the disconnection mouth in the middle of each circuit, the two ends of disconnection mouth form positive and negative electrode circuit separately separately, and a plurality of led chips are encapsulated on the corresponding circuit solder joint in disconnection mouth two ends.
According to an embodiment of the present utility model, described LED module can be used for making LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED sign module or LED Christmas lamp, LED Panel light, LED fluorescent tube etc.
In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present utility model.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram of the Flexible Printed Circuit among the utility model one embodiment.
Fig. 2 be the utility model one embodiment prepare the back side of packaged chip position at wiring board, contraposition is pasted upper one and is supported the schematic diagram of hardboard (material of support hardboard is divided into two kinds: a kind of is plastic material, and another kind is rigid material).
Fig. 3 is the profile of the flexible and hard combined circuit board of planarized structure die bond position.
When Fig. 4 is rigid material again for supporting hardboard, avoid in advance the profile in hole the support hardboard setting of rigid material.
Fig. 5 is on the circuit of the flexible circuit board of packaged chip position, forms the floor map of cup-like structure with mould punching.
When Fig. 6 is plastic material for the material that supports hardboard, become the generalized section of cup-shaped die bond position with mould punching.
When Fig. 7 is rigid material for the material that supports hardboard, become the generalized section of cup-shaped die bond position with mould punching.
Fig. 8 is the schematic diagram on the wiring board respective lines that led chip nation is welded on surely hardboard support place of the utility model one embodiment.
Fig. 9 is the schematic diagram after the sealing of the utility model one embodiment.
Figure 10 is the LED module of flexible and hard combined circuit board packaged chip and the schematic diagram of LED lamp band wall scroll product.
Figure 11 be the led chip die bond on the planar structure-type circuit, the product profile after the encapsulation.
When Figure 12 is plastic material for the material that supports hardboard, the led chip die bond on the circuit of cup-like structure, the product profile after the encapsulation.
When Figure 13 is rigid material for the material that supports hardboard, the led chip die bond on the circuit of cup-like structure, the product profile after the encapsulation.
Embodiment
The below will be described in more detail the LED module of the novel flexible and hard combined circuit board packaged chip of this usefulness and the implementation of LED lamp band.
But, it will be appreciated by those skilled in the art that these execution modes have only enumerated some specific embodiment of the utility model, to the utility model and protection range thereof without any restriction.
For example, it is described that the fixed position of led chip nation and mode also are not limited to specific embodiment.Those of ordinary skill in the art can carry out some apparent variation and changes to these under the situation of understanding the novel basic conception of this usefulness, these all belong in the novel scope of this usefulness.The novel scope of this usefulness is only limited by claim.
Produce as shown in Figure 1 Flexible Printed Circuit (or claim " flexible circuit board ") with the method for traditional fabrication Flexible Printed Circuit, identify among its figure 1 for the insulation support layer of Flexible Printed Circuit, 2 for the circuit of Flexible Printed Circuit, Fig. 3 are the disconnection mouth that arranges in the middle of the circuit, the positive and negative electrode circuit that the two ends that disconnect mouthful form.Then according to the position of wanting packaged chip on the line, (material that supports hardboard 4 can be plastic material to contraposition stickup support hardboard 4 on the another side of insulation support layer 1, also can be rigid material), that face in the exposure of circuit 1 arranges release film, 150 ℃ to 180 ℃ lower hot pressing 90 seconds to 180 seconds, in baking box, under 120 ℃ to 160 ℃, solidified 45 minutes to 90 minutes, obtain the wiring board of soft or hard combination as shown in Figure 2, Fig. 3 is the profile of the flexible and hard combined circuit board of planarized structure die bond position.If supporting hardboard 4 is rigid materials, circuit die bond position needs again to be processed into cup-like structure, then in advance in the position of circuit die bond position correspondence, get out and avoid hole 5 or go out with mould avoiding hole 5 supporting hardboard 4 usefulness FPC drilling machines, back side contraposition stickup hot pressing, curing with Flexible Printed Circuit insulation support layer 1 fixedly secures together again, forms structure as shown in Figure 4.
If the packaging and die bonding position need to be designed to cup-like structure, then being punched in the hardboard circuit with mould will the packaged chip position, stamp out the die bond position 7 (as shown in Figure 5) of cup-like structure, when the material that supports hardboard is plastic material, support hardboard simultaneously together by mould punching, form planform as shown in Figure 6; When the support hardboard is rigid material, just form planform as shown in Figure 7.
The flexible and hard combined circuit board bond pad locations is carried out silver-plated processing, drip bonded adhesives → paste in the position of dripping bonded adhesives led chip 7 and oven dry in the die bond position of flexible and hard combined circuit board circuit, and then fixed (bonding) led chip 7 of nation, for example, according to a preferred embodiment, can be with led chip 7 die bonds on the circuit that disconnects a mouthful end, the negative wire nation of chip is welded on the solder joint of this circuit of die bond surely, and the positive wire nation of chip 7 surely is welded on and disconnects (as shown in Figure 8) → test-based examination on mouthful solder joint of other end circuit → seal up encapsulation with glue 8 (as shown in Figure 9) → solidify → solidify afterwards → test → cut into LED module and the LED lamp carries product (as shown in figure 10) of wall scroll.Wherein, Figure 11 be the led chip die bond on the planar structure-type circuit, the product profile after the encapsulation.When Figure 12 is plastic material for the material that supports hardboard, the led chip die bond on the circuit of cup-like structure, the product profile after the encapsulation.When Figure 13 is rigid material for the material that supports hardboard, the led chip die bond on the circuit of cup-like structure, the product profile after the encapsulation.
Afterwards, can carry out FQC → packing → warehouse-in.Finish the making of LED module and the LED lamp carries product of flexible and hard combined circuit board packaged chip.
Below by reference to the accompanying drawings the LED module of flexible and hard combined circuit board packaged chip and the specific embodiment of LED lamp band are described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, the scope of scope, the especially claim novel to this usefulness does not have any restriction.
Claims (10)
1. direct LED module of packaging LED chips on soft or hard mating type wiring board is characterized in that described LED module comprises:
Flexible circuit board, it has insulating barrier and is combined in one or more circuit on the described insulating barrier front;
Be combined on the back side of described flexible circuit board and form the support hardboard of described soft or hard mating type wiring board;
Directly be encapsulated in the led chip on the front of described flexible circuit board; With
Be used for encapsulating the encapsulating structure of described led chip.
According to claim 1 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described flexible circuit board has many circuits that are arranged side by side, wherein, the led chip die bond is on corresponding circuit, and a contact conductor nation of led chip is welded on the solder joint of this circuit of die bond separately surely, and another contact conductor nation of led chip is welded on the solder joint that is not used for an other circuit of die bond surely.
According to claim 1 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described flexible circuit board is single-sided flexible circuit board, be formed with the bowl configurations for the led chip die bond on its at least one circuit, described led chip is positioned in the described bowl configurations.
According to claim 3 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described support hardboard is the hardboard of being made by the plastically deformable material, and position corresponding with the described bowl configurations of described flexible circuit board on described support hardboard is formed with corresponding pit.
According to claim 3 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described bowl configurations is cup-like structure.
According to claim 3 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described support hardboard is the hardboard of being made by rigid material, and the position corresponding with the described bowl configurations of described flexible circuit board is provided with and avoids the hole on described support hardboard.
According to claim 1 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described support hardboard is the nonmetallic support hardboard that directly is combined on the described flexible circuit board, or is bonded in metallic support hardboard on the described flexible circuit board via the insulating cement adhesion coating.
According to claim 1 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: the position that is used for the led chip die bond on the described flexible circuit board is planar structure.
9. according to claim 1-8 each described on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: at least one circuit in described flexible circuit board forms the breach that disconnects, wherein, described breach one end of described led chip die bond on this circuit and this circuit of an electrical leads nation of described led chip this end that is used for die bond that surely is welded on described breach, another electrical leads nation of described led chip is welded on the same circuit of the described breach other end surely.
According to claim 9 on soft or hard mating type wiring board the direct LED module of packaging LED chips, it is characterized in that: described breach is crooked, so that the circuit that is used for described led chip die bond of described breach one end is configured as convex, and the same circuit of the described breach other end is configured as spill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506777U CN202695439U (en) | 2012-05-21 | 2012-05-21 | LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202506777U CN202695439U (en) | 2012-05-21 | 2012-05-21 | LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695439U true CN202695439U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202506777U Expired - Lifetime CN202695439U (en) | 2012-05-21 | 2012-05-21 | LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
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| Country | Link |
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| CN (1) | CN202695439U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103411143A (en) * | 2013-07-09 | 2013-11-27 | 南通亚浦照明电器制造有限公司 | LED lamp for improving lighting effect and reducing light attenuation |
| CN108550686A (en) * | 2018-06-04 | 2018-09-18 | 佛山市国星半导体技术有限公司 | A kind of conduction semi-flexible LED substrate and preparation method thereof, LED component |
| CN108695428A (en) * | 2017-04-05 | 2018-10-23 | 广州武宏科技股份有限公司 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
-
2012
- 2012-05-21 CN CN2012202506777U patent/CN202695439U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103411143A (en) * | 2013-07-09 | 2013-11-27 | 南通亚浦照明电器制造有限公司 | LED lamp for improving lighting effect and reducing light attenuation |
| CN108695428A (en) * | 2017-04-05 | 2018-10-23 | 广州武宏科技股份有限公司 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
| CN108550686A (en) * | 2018-06-04 | 2018-09-18 | 佛山市国星半导体技术有限公司 | A kind of conduction semi-flexible LED substrate and preparation method thereof, LED component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |
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| CX01 | Expiry of patent term |